JPH02154415A - Thin film coater - Google Patents
Thin film coaterInfo
- Publication number
- JPH02154415A JPH02154415A JP30908288A JP30908288A JPH02154415A JP H02154415 A JPH02154415 A JP H02154415A JP 30908288 A JP30908288 A JP 30908288A JP 30908288 A JP30908288 A JP 30908288A JP H02154415 A JPH02154415 A JP H02154415A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- envelope
- air
- wafer
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000009501 film coating Methods 0.000 claims description 18
- 238000009423 ventilation Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 abstract description 15
- 239000000428 dust Substances 0.000 abstract description 14
- 239000011248 coating agent Substances 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 21
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
レジスト膜などの薄膜の塗布に用いる回転式の薄膜塗布
装置（スピンナー）に関し、
塗布膜へのゴミの付着を減少させることを目的とし、
外囲器の被塗布基板面より上部の側壁に複数の吸気孔を
設け、前記複数の吸気孔から外囲器内部を排気するよう
に構成する。[Detailed Description of the Invention] [Summary] Regarding a rotary thin film coating device (spinner) used for coating thin films such as resist films, this invention aims to reduce the adhesion of dust to the coated film. A plurality of air intake holes are provided in the side wall above the surface of the substrate to be coated, and the interior of the envelope is configured to be exhausted from the plurality of air intake holes.
あるいは、外囲器内の液滴下ノズルの周囲に複数の通気
孔を設けた空気流入筒を付設し、且つ、外囲器における
被塗布基板面より上部の側壁に複数の吸気孔を設け、前
記複数の吸気孔より外囲器内部を排気するように構成す
る。Alternatively, an air inlet cylinder having a plurality of ventilation holes is provided around the droplet nozzle in the envelope, and a plurality of intake holes are provided in the side wall of the envelope above the surface of the substrate to be coated, and the above-mentioned The interior of the envelope is configured to be exhausted through a plurality of intake holes.
本発明はレジスト膜などの薄膜の塗布に用いる回転式の
薄膜塗布装置（スピンナー）に関する。The present invention relates to a rotary thin film coating device (spinner) used for coating thin films such as resist films.
例えば、半導体装置を製造する際、ウェハープロセスに
おいてはりソグラフィ技術が汎用されており、その場合
、ウェハーにレジスト膜パターンを形成するためのレジ
スト膜塗布がおこなわれて、それには回転式の薄膜塗布
装置（スピンナー；５ｐｉｎｎｅｔ）が使用されている
。しかし、そのスピンナ−での塗布時にレジスト膜にゴ
ミが付着しないように塗布することが重要である。For example, when manufacturing semiconductor devices, beam lithography technology is widely used in the wafer process, and in that case, a resist film is applied to form a resist film pattern on the wafer, and a rotary thin film coating device is used for this. (Spinner; 5 pinnet) is used. However, it is important to prevent dust from adhering to the resist film during coating using a spinner.
第３図は従来の薄膜塗布装置の要部概要図を示しており
、１はウェハー（被塗布基板）、２は回転支持台、３は
外囲器、４は液滴下ノズル、５は排気口、６は廃液排出
口である。Fig. 3 shows a schematic diagram of the main parts of a conventional thin film coating device, in which 1 is a wafer (substrate to be coated), 2 is a rotating support base, 3 is an envelope, 4 is a droplet nozzle, and 5 is an exhaust port. , 6 is a waste liquid outlet.
操作法はウェハー１を真空チャック方式で回転支持台２
に吸着保持した後、所要量のレジスト液を液滴下ノズル
４からウェハー１面に滴下し、次いで、回転支持台２を
最初はゆっくり回転しながら次第に回転速度を高めて、
レジスト液をウェハ−１全面に均一な厚さに塗布し、余
分のレジスト液をウェハー１より側方に振り飛ばしてそ
れを廃液排出口６より排出させる。The operation method is to place the wafer 1 on the rotary support stand 2 using a vacuum chuck method.
After holding the wafer by suction, the required amount of resist liquid is dropped from the droplet nozzle 4 onto the surface of the wafer, and then the rotating support 2 is rotated slowly at first while gradually increasing the rotation speed.
A resist solution is applied to a uniform thickness over the entire surface of a wafer 1, and the excess resist solution is shaken off to the side of the wafer 1 and discharged from a waste solution discharge port 6.
その際、外囲器３の底部に設けた排気口５から強制的に
排気しているが、その理由はウェハー１周辺の端部にし
ばしば生じている繊維状のレジスト髭がウェハー表面に
舞い戻って付着するのを防ぐため、また、振り飛ばした
レジスト液が再びウェハー面に舞い戻らないようにする
ために、そのように底部から吸引しているわけである。At this time, the air is forcibly exhausted from the exhaust port 5 provided at the bottom of the envelope 3. The reason for this is that the fibrous resist whiskers that often occur at the edges around the wafer 1 fly back to the wafer surface. This suction is performed from the bottom in order to prevent the resist solution from adhering to the wafer, and to prevent the shaken-off resist solution from returning to the wafer surface.
しかし、このような底部への強制排気はウェハー１の上
方から空気（あるいはガス）を流入させる（矢印で示す
）結果になり、そのために空気中に含まれる微細なゴミ
（塵埃）がウェハー面のレジストに付着してレジスト膜
を汚染する問題が起きる。このゴミの大きさは数μｍ以
下でサブミクロン程度のものであるが、このゴミの付着
によって付着部分に欠陥を発生させるだけでなく、広く
周囲部分にも拡大した欠陥を生じる悪い影響がある。However, such forced exhaust to the bottom results in air (or gas) flowing in from above the wafer 1 (as shown by the arrow), and as a result, fine particles (dust) contained in the air are transferred to the wafer surface. A problem arises in that it adheres to the resist and contaminates the resist film. Although the size of this dust is several micrometers or less, on the order of submicrons, the adhesion of this dust not only causes defects in the attached area, but also has a negative effect of causing defects that extend widely to the surrounding area.
且つ、最近、ウェハーが大口径化して、径８インチ程度
の大きな口径のウェハーを用いており、そのため、外囲
器内への空気の流入も増加して、−層ゴミの防止対策が
必要になってきた。In addition, recently, the diameter of wafers has become larger, and wafers with a large diameter of about 8 inches are used, which increases the amount of air flowing into the envelope, making it necessary to take measures to prevent layer dust. It has become.
本発明はそのような塗布膜（レジスト膜）へのゴミの付
着を減少させることができる薄膜塗布装置を提案するも
のである。The present invention proposes a thin film coating device that can reduce the adhesion of dust to such a coating film (resist film).
触する機会が少なくなって、それだけゴミの付着が減少
する。There are fewer opportunities to touch it, and the amount of dirt that sticks to it is reduced accordingly.
その課題は、外囲器の被塗布基板面より上部の側壁に複
数の吸気孔を設け、前記複数の吸気孔から外囲器内部を
排気するように構成した薄膜塗布装置によって解決され
る。This problem is solved by a thin film coating apparatus that is configured to provide a plurality of air intake holes in the side wall of the envelope above the surface of the substrate to be coated, and to exhaust the inside of the envelope from the plurality of air intake holes.
あるいは、外囲器内の液滴下ノズルの周囲に複数の通気
孔を設けた空気流入筒を付設し、且つ、外囲器における
被塗布基板面より上部の側壁に複数の吸気孔を設け、前
記複数の吸気孔より外囲器内部を排気するように構成し
た薄膜塗布装置によって解決される。Alternatively, an air inlet cylinder having a plurality of ventilation holes is provided around the droplet nozzle in the envelope, and a plurality of intake holes are provided in the side wall of the envelope above the surface of the substrate to be coated, and the above-mentioned This problem is solved by a thin film coating device configured to exhaust the inside of the envelope through a plurality of intake holes.
本発明は外囲器上部の側壁６手複数の吸気孔を設け、そ
こから上部に流入した空気（あるいはガス）の多くを吸
気する。そうすれば、外部から流入した空気は直接被塗
布基板（ウェハー）面へ接〔実 施 例〕
以下、図面を参照しながら実施例によって詳細に説明す
る。The present invention provides a plurality of intake holes in the side wall of the upper part of the envelope, through which most of the air (or gas) flowing into the upper part is taken in. In this way, the air flowing in from the outside comes into direct contact with the surface of the substrate (wafer) to be coated. [Example] Hereinafter, an example will be described in detail with reference to the drawings.
第１図は本発明にかかる薄膜塗布装置（１，）の要部概
要図、を示しており、ｌはウェハー、２は回転支持台、
３は外囲器、４は液滴下ノズル２，５は排気口、６は廃
、液排出口で、１１は多数の吸気孔１０を設けた外囲器
３のウェハー１より上部の側壁。FIG. 1 shows a schematic diagram of main parts of a thin film coating apparatus (1,) according to the present invention, where l is a wafer, 2 is a rotating support base,
3 is an envelope, 4 is a liquid dropping nozzle 2, 5 is an exhaust port, 6 is a waste liquid discharge port, and 11 is a side wall above the wafer 1 of the envelope 3 provided with a large number of intake holes 10.
１２は側部排気室、１３は側部排気口である。このよう
に構成して、従来の構造と同様に底部に設けた排気口５
から排気すると同時に、側部排気口１２から排気する。12 is a side exhaust chamber, and 13 is a side exhaust port. With this structure, the exhaust port 5 provided at the bottom as in the conventional structure.
At the same time, the air is exhausted from the side exhaust port 12.
そうすると、多数の吸気孔１０から外囲器１上部に流入
した空気の多くを吸気できて、その空気中に含まれるゴ
ミがウェハー面に達せずに吸気孔１０から側部排気口１
２へ排出される。図中の矢印がそ、の空気の流れを示し
ている。、排気口５からの排気量と側部排気口１３から
の排気量との比は装置の大きさと細部構成に関わりがあ
り、−概には決められないが、通常は同量程度にする。In this way, much of the air flowing into the upper part of the envelope 1 can be taken in through the large number of intake holes 10, and the dust contained in the air cannot reach the wafer surface.
It is discharged to 2. The arrows in the figure indicate the air flow. The ratio of the amount of exhaust from the exhaust port 5 to the amount of exhaust from the side exhaust port 13 is related to the size and detailed configuration of the device, and cannot be determined generally, but they are usually set to be about the same amount.
なお、操作法は従来と変わりがない。Note that the operating method is the same as before.
次に、第２図は本発明にかかる薄膜塗布装置（ＩＩ）の
要部概要図を示しており、本例はカバを設けた実施例で
ある。記号１５はカバー、１６はカバーの中心に設けた
空気流大筒、２０は空気流入筒１６の周囲に設けた多数
の通気孔で、その他の部材の記号は第１図と同一部材に
同一記号が付けであるが、本例はカバー１５を設けて外
囲器３の内部を密閉しており、しかも、上記の理由で排
気「１５より排気がおこなわれるために外囲器内に空気
を送入する必要がある。しかし、その時、空気流入部分
を設けないと、外囲器３とカバー１５との隙間から空気
が流入して逆にゴミが増加する恐れがあるために、中心
に液滴下ノズル４と組合せた空気流入筒１６を設けて比
較的清浄な空気を流入し、且つ、第１図と同じく底部に
設けた排気口５と同時に側部排気口１２から排気をおこ
なう。これらの吸気孔１０や通気孔２０の大きさは、例
えば、３〜１０ｃｍ中程度の孔にして、その多数個を側
壁］１および空気流入筒１６に設けるものである。また
、この塗布装置の構成部材は一般に有機樹脂材料で形成
している。Next, FIG. 2 shows a schematic view of the main parts of the thin film coating apparatus (II) according to the present invention, and this example is an embodiment in which a cover is provided. Symbol 15 is a cover, 16 is a large air flow tube provided in the center of the cover, 20 is a large number of ventilation holes provided around the air inlet tube 16, and the symbols for other parts are the same as in Figure 1. However, in this example, a cover 15 is provided to seal the inside of the envelope 3, and for the above-mentioned reason, air is pumped into the envelope to be exhausted from the exhaust 15. However, if an air inflow part is not provided at that time, air may flow in from the gap between the envelope 3 and the cover 15 and the amount of dust may increase. 4 is provided to allow relatively clean air to flow in, and to exhaust air from the side exhaust port 12 at the same time as the exhaust port 5 provided at the bottom as shown in FIG. 1.These air intake holes The size of the holes 10 and the ventilation holes 20 are, for example, medium-sized holes of 3 to 10 cm, and a large number of them are provided in the side wall 1 and the air inlet tube 16.The components of this coating device are generally It is made of organic resin material.
上記のような本発明にかかる薄膜塗布装置は塗布膜に付
着するゴミを著しく減少させることができる。The thin film coating apparatus according to the present invention as described above can significantly reduce dust adhering to the coating film.
且つ、上記実施例は１個の液滴下ノズル４を被塗布基板
１の中央上部にのみ位置する薄膜塗布装置で説明したが
、数個の液滴下ノズルを被塗布基板１上部の数点に配置
する薄膜塗布装置も知られており、そのような数個の液
滴下ノズルを設けた薄膜塗布装置にも本発明は適用でき
る。In addition, although the above embodiment has been described using a thin film coating apparatus in which one droplet nozzle 4 is located only at the upper center of the substrate 1 to be coated, several droplet nozzles may be arranged at several points on the top of the substrate 1 to be coated. A thin film coating apparatus is also known, and the present invention can also be applied to such a thin film coating apparatus provided with several droplet nozzles.
なお、上記例は塗布膜としてレジスト膜で説明したが、
他の塗布液、例えば、ＳＯＧ （スピンオングラス）膜
の塗布にも本考案が適用できることはいうまでもない。In addition, although the above example was explained using a resist film as a coating film,
It goes without saying that the present invention can also be applied to coating other coating liquids, such as SOG (spin-on-glass) films.
以上の説明から明らかなように本発明によれば従来の装
置に比べてゴミの付着の少ない塗布薄膜膜が得られ、Ｉ
Ｃ，ＬＳＩなど半導体装置の品質信頼性の向上に太き（
寄与することができる。As is clear from the above description, according to the present invention, a coated thin film with less dust adhesion can be obtained compared to the conventional apparatus, and
Significantly improves the quality reliability of semiconductor devices such as C, LSI (
can contribute.
第１図は本発明にかかる薄膜塗布装置（１）の要部概要
図、
第２図は本発明にかかる薄膜塗布装置（ＩＩ）の要部概
要図、
第３図は従来の薄膜塗布装置の要部概要図である。
図において、
■はウェハー（被塗布基板）、
２は回転支持台、 ３は外囲器、４は液滴下ノズ
ル、 ５は排気口、
６は廃液排出口、 １０は吸気孔、１１は側壁、
１２は側部排気室、１３は側部排気口、
１５はカバー１６は空気流入筒、 ２０は通気孔
を示している。FIG. 1 is a schematic diagram of main parts of a thin film coating device (1) according to the present invention, FIG. 2 is a schematic diagram of main parts of a thin film coating device (II) according to the present invention, and FIG. 3 is a schematic diagram of main parts of a thin film coating device (II) according to the present invention. It is a schematic diagram of the main parts. In the figure, ■ is a wafer (substrate to be coated), 2 is a rotating support, 3 is an envelope, 4 is a droplet nozzle, 5 is an exhaust port, 6 is a waste liquid outlet, 10 is an intake hole, 11 is a side wall,
12 is a side exhaust chamber, 13 is a side exhaust port,
Reference numeral 15 indicates a cover 16 for an air inflow tube, and reference numeral 20 indicates a ventilation hole.
Claims (2)
気孔を設け、前記複数の吸気孔から外囲器内部を排気す
るように構成したことを特徴とする薄膜塗布装置。(1) A thin film coating apparatus characterized in that a plurality of intake holes are provided in a side wall of the envelope above the surface of the substrate to be coated, and the interior of the envelope is exhausted from the plurality of intake holes.
設けた空気流入筒を付設し、且つ、外囲器における被塗
布基板面より上部の側壁に複数の吸気孔を設け、前記複
数の吸気孔より外囲器内部を排気するように構成したこ
とを特徴とする薄膜塗布装置。(2) An air inflow tube with a plurality of ventilation holes is provided around the droplet nozzle in the envelope, and a plurality of intake holes are provided in the side wall of the envelope above the surface of the substrate to be coated, A thin film coating apparatus characterized in that the interior of the envelope is evacuated through the plurality of intake holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30908288A JPH02154415A (en) | 1988-12-06 | 1988-12-06 | Thin film coater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30908288A JPH02154415A (en) | 1988-12-06 | 1988-12-06 | Thin film coater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02154415A true JPH02154415A (en) | 1990-06-13 |
Family
ID=17988671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30908288A Pending JPH02154415A (en) | 1988-12-06 | 1988-12-06 | Thin film coater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02154415A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360761A (en) * | 1989-07-31 | 1991-03-15 | Hitachi Ltd | Coating device |
-
1988
- 1988-12-06 JP JP30908288A patent/JPH02154415A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360761A (en) * | 1989-07-31 | 1991-03-15 | Hitachi Ltd | Coating device |
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