JPH02139148A - Vacuum suction table - Google Patents
Vacuum suction tableInfo
- Publication number
- JPH02139148A JPH02139148A JP63287252A JP28725288A JPH02139148A JP H02139148 A JPH02139148 A JP H02139148A JP 63287252 A JP63287252 A JP 63287252A JP 28725288 A JP28725288 A JP 28725288A JP H02139148 A JPH02139148 A JP H02139148A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- hose
- porous body
- work
- vacuum pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 2
- 238000003754 machining Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000002517 constrictor effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Manipulator (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
この発明は、液晶デイスプレィ素子、プリント基板等の
マスク製造装置、半導体ウェハーチャック装置等に使用
される真空吸着テーブルに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a vacuum suction table used in a mask manufacturing device for liquid crystal display elements, printed circuit boards, etc., a semiconductor wafer chuck device, and the like.
従来、マスク用フィルム、ガラス乾板等のマスクや半導
体ウェハー等のワークを加工するときにクランプする装
置として、第５図または第６図に示す真空吸着テーブル
が使用されている。2. Description of the Related Art Conventionally, a vacuum suction table shown in FIG. 5 or 6 has been used as a device for clamping a workpiece such as a mask such as a mask film or a glass dry plate or a semiconductor wafer when processing a workpiece such as a semiconductor wafer.
第５図の真空吸着テーブルは、吸気室２を有する吸着テ
ーブルｌの上面に等間隔で多数のノズル（口径１〜２舗
）４が開口して設けられ、吸気室２の排気口３に図示し
ない真空ポンプの配管を接続して吸気し、吸着テーブル
１の上面に置いたウェハー、マスク等のワークをノズル
４を介して吸着するようにしている。In the vacuum suction table shown in FIG. 5, a large number of nozzles (diameter 1 to 2) 4 are opened at equal intervals on the top surface of the suction table l having an intake chamber 2. The piping of a vacuum pump is connected to suck air, and workpieces such as wafers and masks placed on the upper surface of the suction table 1 are suctioned through the nozzle 4.
第６図の真空吸着テーブルは、吸着テーブル１の上面に
同心状に複数個の溝５を設け、この溝５に設けた４個の
ノズル（口径１〜２皿）４から吸着するようにしである
。The vacuum suction table shown in Fig. 6 has a plurality of concentric grooves 5 on the top surface of the suction table 1, and suction is carried out from four nozzles (diameter 1 to 2) 4 provided in the grooves 5. be.
従来の真空吸着テーブルのうち、第５図のものは、テー
ブルの全面積よりもサイズの小さいワークを吸着する場
合には、ワークによって塞がれないノズルからの吸気量
が多くなるため、ワークに対する吸着力が弱くなり、ワ
ークの加工中に位置ずれが生じて高精度の加工が困難に
なる。第６図のものは、ワークのサイズが小さい場合で
も強い吸着力が得られるけれども、溝の部分に局部的に
大きな吸着力を受けるので、ワークが変形して加工精度
が悪くなるという問題がある。Among the conventional vacuum suction tables, the one shown in Figure 5 has a large capacity when suctioning a workpiece whose size is smaller than the total area of the table, since the amount of air taken in from the nozzle that is not blocked by the workpiece is large. The suction force becomes weaker, and positional deviation occurs during workpiece machining, making it difficult to perform high-precision machining. The one in Figure 6 can obtain a strong suction force even when the size of the workpiece is small, but there is a problem that the groove part receives a large suction force locally, causing the workpiece to deform and reducing machining accuracy. .
このようなワークの局部的変形を防止するため、第５図
の型式のものの使用方法を改良して、真空ポンプのパワ
ーを大きくし、ワークによって塞がれないノズルがあっ
ても、ワークの位置ずれが生じない強さの吸着力が得ら
れるようにしたものが使用されている。In order to prevent such local deformation of the workpiece, we have improved the method of using the model shown in Figure 5 and increased the power of the vacuum pump, so that even if there are nozzles that are not blocked by the workpiece, the position of the workpiece can be adjusted. What is used is one that has a strong adsorption force that does not cause slippage.
しかし、真空ポンプのパワーを大きくすると、それに比
例して真空ポンプの振動が大きくなるため、配管、床等
を介して吸着テーブルに伝達される振動も大きくなり、
この振動によってワークの加工精度が悪化するという問
題が生じている。However, when the power of the vacuum pump is increased, the vibration of the vacuum pump increases proportionally, so the vibration transmitted to the suction table through piping, the floor, etc. also increases.
This vibration causes a problem in that the machining accuracy of the workpiece deteriorates.
この発明は、上記の問題を解決して、サイズの小さいワ
ークに対しても低パワーの真空ポンプで強い吸着力が均
一に作用する真空吸着テーブルを提供することを目的と
する。An object of the present invention is to solve the above-mentioned problems and provide a vacuum suction table that can apply a strong suction force evenly to small-sized workpieces using a low-power vacuum pump.
上記目的を達成するため、この発明においては、吸着テ
ーブルの上面に、多孔質体を備えた吸着部が複数個位置
し、これらの吸着部材のうち少なくとも１個の吸着部材
は、真空ポンプに連結された配管に第一の管路を介して
接続し、第一の管路に接続されない吸着部材のうち少な
くとも１個の吸着部材は、切換弁が取り付けられた第二
の管路を介して、真空ポンプに連結された配管に接続し
ている。In order to achieve the above object, in the present invention, a plurality of suction parts each having a porous body are located on the top surface of the suction table, and at least one of these suction members is connected to a vacuum pump. At least one of the adsorption members that is connected to the pipe that is connected to the pipe through the first pipe line, and that is not connected to the first pipe line, is Connected to piping connected to a vacuum pump.
この発明の真空吸着テーブルは、吸着部材の多孔質体が
有する空孔から吸気され、多孔質体の上面でワークを強
力な吸着力で吸着する。切換弁を切り換えることにより
、ワークのサイズに応じた吸着面積に変更することがで
きる。In the vacuum suction table of the present invention, air is taken in through the pores of the porous body of the suction member, and the workpiece is suctioned with a strong suction force on the upper surface of the porous body. By switching the switching valve, the suction area can be changed according to the size of the workpiece.
以下、この発明の実施例を添付図面に基づいて説明する
。Embodiments of the present invention will be described below with reference to the accompanying drawings.
第１図および第２図は、この発明の真空吸着テーブルの
一例を示し、正方形状の吸着テーブル１０に９個の吸着
部材１１・・・・・・を縦方向および横方向に等間隔で
３列に配設している。この吸着部材１１・・・・・・は
、第３図に示すように対向する一方または双方の側面と
上面とに開口する吸気穴１３を有する本体１２と、本体
１２の上部に収容された多孔質体１４とにより構成され
、多孔質体１４の上面が吸着テーブルｌＯの上面と同一
の平面またはそれよりもやや下面側に位置するように取
り付けられている。多孔質体１４としては、たとえば金
属粉末を成形して焼結した焼結体、セラミックを成形し
て焼結した焼結体、カーボングラファイトからなる多孔
質体等を使用する。特にセラミックからなる焼結体は硬
いので摩耗が少なく、ゴミ発注防止、ワークの傷発生防
止等に好ましい。FIGS. 1 and 2 show an example of a vacuum suction table of the present invention, in which nine suction members 11 are placed on a square suction table 10 at equal intervals in the vertical and horizontal directions. arranged in columns. As shown in FIG. 3, this adsorption member 11... consists of a main body 12 having an intake hole 13 that opens on one or both opposing sides and an upper surface, and a porous hole accommodated in the upper part of the main body 12. The porous body 14 is attached so that the upper surface of the porous body 14 is located on the same plane as the upper surface of the suction table 10 or slightly lower than the upper surface of the suction table IO. As the porous body 14, for example, a sintered body formed by molding and sintering metal powder, a sintered body formed by molding and sintering ceramic, a porous body made of carbon graphite, etc. are used. In particular, a sintered body made of ceramic is hard, so there is little wear, and it is preferable for preventing dust and scratches on the workpiece.
上記の各−吸着部材のうち、左縦列下段に位置する一個
の吸着部材１１ａの吸気穴には、手動切換弁３０ａと電
磁切換弁３１ａとが取り付けられたホース（第一の管路
）２０ａが結合されており、吸着部材１１ａはホース２
０ａを介して真空ポンプ４０に連結されたホース（配管
）５０に接続されている。Among the above-mentioned suction members, a hose (first conduit) 20a to which a manual switching valve 30a and an electromagnetic switching valve 31a are attached is attached to the intake hole of one suction member 11a located at the bottom of the left column. The suction member 11a is connected to the hose 2.
It is connected to a hose (piping) 50 connected to the vacuum pump 40 via Oa.
また、上記の吸着部材１１ａを除く他の吸着部材のうち
、左縦列中段の吸着部材ｌｌｂと中縦列中下段の吸着部
材１１ｃ、ｌｌｄの吸気穴は、それぞれホース２０ｂ、
２０ｃを介して直列に結合され、中縦列下段の吸着部材
ｌｉｄの吸気穴は、手動切換弁３０ｂと電磁切換弁３１
ｂとが取り付けられたホース（第二の管路）２０ｄを介
して真空ポンプ４０に連結したホース５０に接続されて
いる。In addition, among the other suction members other than the above-mentioned suction member 11a, the suction holes of the suction member llb in the middle stage of the left column and the suction members 11c and lld in the middle lower stage of the middle column are connected to the hose 20b, respectively.
The manual switching valve 30b and the electromagnetic switching valve 31
b is connected to a hose 50 connected to the vacuum pump 40 via a hose (second conduit) 20d.
さらに、上記の各吸着部材１１ａ、ｌｌｂ、１１ｃ、ｌ
ｉｄを除く他の吸着部材１１ｅ、１１ｆ。Furthermore, each of the above-mentioned adsorption members 11a, llb, 11c, l
Other adsorption members 11e and 11f except for id.
１１ｇ、ｌｌｈ、ｌｌｉの吸気穴は、それぞれホース２
０ｅ、２０ｆ、２０ｇ、２０ｈを介して直列に結合され
、右縦列下段の吸着部材１１ｉの吸気穴は、手動切換弁
３０ｃと電磁切換弁３１ｃとが取り付けられたホース（
第三の管路）２０１を介して真空ポンプ４０に連結した
ホース５０に接続されている。The intake holes of 11g, llh, and lli are connected to hose 2, respectively.
0e, 20f, 20g, and 20h are connected in series, and the intake hole of the lower adsorption member 11i in the right column is connected to a hose (to which a manual switching valve 30c and an electromagnetic switching valve 31c are attached).
It is connected to a hose 50 connected to a vacuum pump 40 via a third conduit 201.
上記構成の真空吸着テーブルは、真空ポンプ４０を作動
して各吸着部材１１の多孔質体１４が有する空孔からホ
ースを経て吸気することにより、吸着テーブル１０上の
多孔質体１４の上面に置かれたワーク（図示せず）を吸
着して加工することができる。The vacuum suction table having the above configuration is placed on the upper surface of the porous body 14 on the suction table 10 by operating the vacuum pump 40 and sucking air from the pores of the porous body 14 of each suction member 11 through the hose. It is possible to suction and process a bent workpiece (not shown).
吸着テーブル１０の単位面積当たりの多孔質体１４の空
孔の体積は、従来の１〜２閣口径のノズルを多数設けた
場合の単位面積当たりのノズルの体積に比べるとはるか
に小さいから、多孔質体１４の空孔による空気の絞り効
果は、従来のノズルの数倍ないし数１０倍となり、より
少量の吸気量で強力な吸着力が得られることになる。The volume of pores in the porous body 14 per unit area of the suction table 10 is much smaller than the volume of nozzles per unit area when a large number of conventional nozzles of 1 to 2 diameters are provided. The air constriction effect due to the holes in the mass body 14 is several to several ten times that of conventional nozzles, and a strong adsorption force can be obtained with a smaller amount of intake air.
また、上記構成の真空吸着テーブルは、吸着部材１１ａ
のホース２０ａの各切換弁３０ａ、３１ａ、吸着部材ｌ
ｉｄのホース２０ｄの各切換弁３０ｂ、３１ｂおよび吸
着部材１１ｉのホース２０１の各切換弁３Ｑｃ、３１Ｃ
を開放して使用すると、吸着テーブル１０の上面の多孔
質体１４の全面積が吸着面となるが、吸着部材１１ｉの
ホース２０ｉの各切換弁３０ｃ、３１ｃのみを閉止する
と、吸着テーブル１０の上面のうち、４個の吸着部材１
１ａ、ｌｌｂ、ｔｉｃ、ｌｉｄが占める面積だけを吸着
面として使用することができ、さらに吸着部材ｌｉｄの
ホース２０ｄの各切換弁３０ｂ、３１ｂを併せて閉止す
ると、１個の吸着部材１１ａが占める面積だけを吸着面
として使用することができる。したがって、ワークのサ
イズに応じて吸着面積を変更することにより、ワークの
サイズが吸着テーブル１０の全面積よりも小さいときに
、ワークの吸着に使用されない多孔質体による無用の吸
気を受忍する無駄な動力消費がなくなる。Further, the vacuum suction table having the above configuration has a suction member 11a.
Each switching valve 30a, 31a of the hose 20a, adsorption member l
id, each switching valve 30b, 31b of the hose 20d, and each switching valve 3Qc, 31C of the hose 201 of the adsorption member 11i.
When used with the suction table 10 open, the entire area of the porous body 14 on the top surface of the suction table 10 becomes the suction surface. However, when only the switching valves 30c and 31c of the hose 20i of the suction member 11i are closed, the top surface of the suction table 10 becomes the suction surface. Among them, four suction members 1
Only the area occupied by the suction member 1a, llb, tic, and lid can be used as the suction surface, and when the switching valves 30b and 31b of the hose 20d of the suction member lid are closed together, the area occupied by one suction member 11a is reduced. can only be used as an adsorption surface. Therefore, by changing the suction area according to the size of the workpiece, when the size of the workpiece is smaller than the total area of the suction table 10, there is no need to endure unnecessary suction by the porous body that is not used for suctioning the workpiece. Power consumption is eliminated.
上記実施例において、ホースに取り付けである手動切換
弁と電磁切換弁とは必要に応じて何れか一方を使用すれ
ばよい。また、吸着部材１１ａについては真空ポンプ４
０の駆動・停止によって吸気と吸気停止とができるので
、ホース２０ａに取り付けである手動切換弁３０ａと電
磁切換弁３１ａとは双方とも省略してもよい。In the above embodiment, either the manual switching valve or the electromagnetic switching valve attached to the hose may be used as necessary. Further, regarding the suction member 11a, the vacuum pump 4
Since intake and intake stop can be performed by driving and stopping the valve 0, both the manual switching valve 30a and the electromagnetic switching valve 31a, which are attached to the hose 20a, may be omitted.
第４図は、この発明の真空吸着テーブルの他の例を示し
、正方形状の吸着テーブル１０に１６個の吸着部材１１
・・・・・・が縦方向および横方向に等間隔で４列に配
設されている。中央部分の４個の吸着部材１］、ａ、ｌ
ｌｂ、ｌｌｃ、ｌｉｄの吸気穴は順次ホース２０ａ、２
０ｂ、２０ｃを介して結合され、最終の吸着部材ｌｉｄ
の他方の吸気穴は、手動切換弁３０ａと電磁切換弁３１
ａとが取り付けられたホース２０ｄを介して真空ポンプ
４０に連結したホース５０に接続されている。FIG. 4 shows another example of the vacuum suction table of the present invention, in which 16 suction members 11 are mounted on a square suction table 10.
... are arranged in four rows at equal intervals in the vertical and horizontal directions. Four suction members 1], a, l in the central part
The intake holes of lb, llc, and lid are sequentially connected to hoses 20a and 2.
0b, 20c, and the final adsorption member lid
The other intake hole is the manual switching valve 30a and the electromagnetic switching valve 31.
It is connected to a hose 50 connected to a vacuum pump 40 via a hose 20d to which a and a are attached.
また、上記の中央部分の吸着部材を取り囲む外縁部分の
１２個の吸着部材１１ｅ、ｌｌｆ、・・・・・・の吸気
穴は順次ホース２０ｅ、２Ｏｆ、・・・・・・を介して
結合され、最終の吸着部材ｌｉｐの他方の吸気穴は、手
動切換弁３０ｂと電磁切換弁３１ｂとが取り付けられた
ホース２０ｐを介して真空ポンプ４０に連結したホース
５０に接続されている。In addition, the intake holes of the 12 adsorption members 11e, llf, . The other suction hole of the final suction member lip is connected to a hose 50 connected to a vacuum pump 40 via a hose 20p to which a manual switching valve 30b and an electromagnetic switching valve 31b are attached.
この実施例においては、中央部分の吸着部材１１ｄのホ
ース２０ｄの各切換弁３０ａ、３１ａと外縁部分の吸着
部分ｌｉｐのホース２０ｐの各切換弁３０ｂ、３１ｂと
を開放することにより、吸着テーブル１０の上面の多孔
質体１４の全面積を吸着面として使用することができ、
外縁部分の吸着部材１１Ｐのホース２０ｐの各切換弁３
０ｂ。In this embodiment, by opening the switching valves 30a and 31a of the hose 20d of the suction member 11d at the center and the switching valves 30b and 31b of the hose 20p of the suction portion lip at the outer edge, the suction table 10 is The entire area of the upper porous body 14 can be used as an adsorption surface,
Each switching valve 3 of the hose 20p of the adsorption member 11P on the outer edge part
0b.
３１ｂを閉止することにより吸着テーブル１０の上面の
うち、中央部分の面積だけを吸着面として使用すること
ができる。By closing 31b, only the central area of the upper surface of the suction table 10 can be used as a suction surface.
この実施例においても、吸着部材ｌｉｄのホース２０ｄ
に取付である手動切換弁３０ａと電磁切換弁３１ａとを
省略してもよい。Also in this embodiment, the hose 20d of the suction member lid
The manual switching valve 30a and the electromagnetic switching valve 31a, which are attached to the main body, may be omitted.
上記各実施例で説明した吸着部材の配置は、吸着テーブ
ルをＸ−Ｙテーブルとして使用する場合に好適な例であ
るが、吸着面積の区分に応じてホースで結合する吸着部
材の個数については、上記実施例に限らず、任意に選択
することができる。The arrangement of suction members explained in each of the above embodiments is a suitable example when the suction table is used as an X-Y table, but the number of suction members to be connected with hoses depending on the division of suction area is It is not limited to the above embodiments, and can be arbitrarily selected.
また吸着テーブルが回転型テーブルである場合は、吸着
部材を同心円形状に配置するのが好ましい。Further, when the suction table is a rotary table, it is preferable to arrange the suction members in a concentric circle shape.
以上説明したように、この発明によれば多孔質体の空孔
が吸気孔になっているから、従来のノズルに比べて少量
の吸気量で強い吸着力が得られ、しかも吸着面に均一な
吸着力が作用することと相まってワークの位置ずれや変
形等がなくなり、さらに低パワーの真空ポンプを使用す
ることができるため、吸着テーブルに大きな振動が生ず
ることもなく、ワークのサイズの大小にかかわらず加工
精度の高い真空吸着テーブルが得られる。As explained above, according to the present invention, the pores of the porous body serve as suction holes, so a strong suction force can be obtained with a small amount of suction compared to conventional nozzles, and the suction surface is evenly distributed. Coupled with the suction force, there is no misalignment or deformation of the workpiece, and since a low-power vacuum pump can be used, large vibrations do not occur on the suction table, so it can be used regardless of the size of the workpiece. A vacuum suction table with high processing accuracy can be obtained.
また、この発明によれば、吸着部材の管路に取り付けで
ある切換弁の操作によって、吸着テーブルの吸着面積を
変更することができるから、小さいサイズのワークを吸
着して加工する場合には、ワークの吸着に使用されない
吸着部材の吸気を停止することにより、無用の吸気をす
る無駄がなくなる。Further, according to the present invention, the suction area of the suction table can be changed by operating the switching valve attached to the conduit of the suction member, so when processing a small workpiece by suction, By stopping the suction of suction members that are not used to suction the workpiece, unnecessary suction of air is not wasted.
第１図はこの発明の実施例を示す平面図、第２図はその
側面図、第３図は吸着部材の断面図、第４図はこの発明
の他の実施例を示す平面図、第５図および第６図はそれ
ぞれ従来の真空吸着テーブルを示し、両図（ａ）は平面
図、両図（ｂ）は側面図である。
図中、ｌＯは吸着テーブル、１１は吸着部材、１４は多
孔質体、２０ａは吸着部材１１ａのホース（第一の管路
）、２０ｄは吸着部材１１ｄのホース（第二の管路）、
３０ｂ、３１ｂはそれぞれホース２０ｄの手動切換弁、
電磁切換弁、４０は真空ポンプ、５０は真空ポンプに連
結された配管である。FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a sectional view of the suction member, FIG. 4 is a plan view showing another embodiment of the invention, and FIG. 6 and 6 respectively show a conventional vacuum suction table, with both figures (a) being a plan view and both figures (b) being a side view. In the figure, IO is an adsorption table, 11 is an adsorption member, 14 is a porous body, 20a is a hose (first pipe line) of the adsorption member 11a, 20d is a hose (second pipe line) of the adsorption member 11d,
30b and 31b are manual switching valves for the hose 20d, respectively;
40 is a vacuum pump, and 50 is a pipe connected to the vacuum pump.
Claims (1)
複数個位置し、前記吸着部材のうち少なくとも１個の吸
着部材は第一の管路を介して真空ポンプに連結された配
管に接続し、第一の管路に接続されない吸着部材のうち
少なくとも１個の吸着部材は、切換弁が取り付けられた
第二の管路を介して、前記真空ポンプに連結された配管
に接続していることを特徴とする真空吸着テーブル。(1) A plurality of suction units each having a porous body are located on the top surface of the suction table, and at least one of the suction members is connected to a pipe connected to a vacuum pump via a first pipe line. At least one of the adsorption members connected and not connected to the first pipe line is connected to the pipe connected to the vacuum pump via a second pipe line to which a switching valve is attached. A vacuum suction table characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63287252A JPH02139148A (en) | 1988-11-14 | 1988-11-14 | Vacuum suction table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63287252A JPH02139148A (en) | 1988-11-14 | 1988-11-14 | Vacuum suction table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02139148A true JPH02139148A (en) | 1990-05-29 |
Family
ID=17714993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63287252A Pending JPH02139148A (en) | 1988-11-14 | 1988-11-14 | Vacuum suction table |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02139148A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438393U (en) * | 1990-07-26 | 1992-03-31 | ||
| JPH06126676A (en) * | 1992-09-04 | 1994-05-10 | Sumitomo Metal Mining Co Ltd | Suction holder and suction lifting device |
| JPH10512817A (en) * | 1995-08-15 | 1998-12-08 | ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド | Machine and method utilizing vacuum to form and process material to specific dimensions |
| WO2001028745A1 (en) * | 1999-10-16 | 2001-04-26 | Acr Automation In Cleanroom Gmbh | Method and device for isolating plate-like substrates |
| JP2002217276A (en) * | 2001-01-17 | 2002-08-02 | Ushio Inc | Stage device |
| JPWO2004073946A1 (en) * | 2003-02-21 | 2006-06-01 | 三星ダイヤモンド工業株式会社 | Substrate processing table and substrate processing apparatus |
| JP2006347851A (en) * | 2005-06-20 | 2006-12-28 | Fujinon Corp | Sucking apparatus for optical device |
| JP2008117946A (en) * | 2006-11-06 | 2008-05-22 | Tanken Seal Seiko Co Ltd | Sucking/floating panel |
| CN106881532A (en) * | 2015-12-10 | 2017-06-23 | 武汉楚天工业激光设备有限公司 | Negative pressure absorption type potsherd cutting clamper and control method |
| JP2018003149A (en) * | 2016-07-01 | 2018-01-11 | 廣州明毅電子機械有限公司 | Electroplating equipment automatic unloader |
-
1988
- 1988-11-14 JP JP63287252A patent/JPH02139148A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438393U (en) * | 1990-07-26 | 1992-03-31 | ||
| JPH06126676A (en) * | 1992-09-04 | 1994-05-10 | Sumitomo Metal Mining Co Ltd | Suction holder and suction lifting device |
| JPH10512817A (en) * | 1995-08-15 | 1998-12-08 | ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド | Machine and method utilizing vacuum to form and process material to specific dimensions |
| WO2001028745A1 (en) * | 1999-10-16 | 2001-04-26 | Acr Automation In Cleanroom Gmbh | Method and device for isolating plate-like substrates |
| JP2002217276A (en) * | 2001-01-17 | 2002-08-02 | Ushio Inc | Stage device |
| JPWO2004073946A1 (en) * | 2003-02-21 | 2006-06-01 | 三星ダイヤモンド工業株式会社 | Substrate processing table and substrate processing apparatus |
| JP2006347851A (en) * | 2005-06-20 | 2006-12-28 | Fujinon Corp | Sucking apparatus for optical device |
| JP2008117946A (en) * | 2006-11-06 | 2008-05-22 | Tanken Seal Seiko Co Ltd | Sucking/floating panel |
| JP4681535B2 (en) * | 2006-11-06 | 2011-05-11 | 株式会社タンケンシールセーコウ | Adsorption levitation panel |
| KR101376470B1 (en) * | 2006-11-06 | 2014-03-19 | 가부시키가이샤 단켄시루세코 | Adsorptive floating panel |
| CN106881532A (en) * | 2015-12-10 | 2017-06-23 | 武汉楚天工业激光设备有限公司 | Negative pressure absorption type potsherd cutting clamper and control method |
| JP2018003149A (en) * | 2016-07-01 | 2018-01-11 | 廣州明毅電子機械有限公司 | Electroplating equipment automatic unloader |
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