JPS6023998Y2 - Heating crimp - Google Patents
Heating crimpInfo
- Publication number
- JPS6023998Y2 JPS6023998Y2 JP17162679U JP17162679U JPS6023998Y2 JP S6023998 Y2 JPS6023998 Y2 JP S6023998Y2 JP 17162679 U JP17162679 U JP 17162679U JP 17162679 U JP17162679 U JP 17162679U JP S6023998 Y2 JPS6023998 Y2 JP S6023998Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- diamond
- metal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
この考案は電子部品のＩＣ又はＬＳＩをプリント基板に
ハンダで取り付けるボンデングマシンの加熱用圧着子に
関するものである。[Detailed Description of the Invention] This invention relates to a heating crimp for a bonding machine that attaches an IC or LSI electronic component to a printed circuit board by soldering.
従来プリント基板にＩＣ等を取り付けるにはＩＣ等の端
子一本づつをプリント基板にハンダ付けしていた。Conventionally, to attach an IC or the like to a printed circuit board, each terminal of the IC or the like was soldered to the printed circuit board one by one.
本考案は従来より能率よく、かつ自動化でプリント基板
にＩＣをハンダ付する機械の堅牢でハンダの付着しない
加熱用圧着子を提供することを目的とするものである。The object of the present invention is to provide a heating crimp which is robust and does not adhere solder to a machine that solders ICs to printed circuit boards more efficiently and automatically than in the past.
図面に示す実施例について本考案を以下詳細に説明する
。The invention will be explained in detail below with reference to the embodiments shown in the drawings.
金属ベース１は熱伝導の優れた金属、例えば銅あるいは
銅合金で、熱を集中させる為第１図、第２図に示すよう
に先端に行くに従って細くなるようなテーパー形状に形
成する。The metal base 1 is made of a metal with excellent thermal conductivity, such as copper or a copper alloy, and is formed into a tapered shape that becomes thinner toward the tip, as shown in FIGS. 1 and 2, in order to concentrate heat.
長さはＩＣの種類によって異るがほぼＩＣの端子側の長
さと同じ程度である。Although the length varies depending on the type of IC, it is approximately the same as the length of the terminal side of the IC.
ベース金属１の上部にはヒーター取付穴２を形威し、こ
の取付穴２にヒーターを取り付はベース金属を加熱する
。A heater attachment hole 2 is formed in the upper part of the base metal 1, and a heater is attached to this attachment hole 2 to heat the base metal.
ベース金属１先端には角柱状のダイヤモンドを固定する
。A prismatic diamond is fixed to the tip of the base metal 1.
ダイヤモンド３は第３図Ａ−Ｂに示すように金属ベース
１との接合する部分すなわちダイヤモンドに銀ロウ４が
付着する部分に非剥離性の金属被膜５を形成する。As shown in FIGS. 3A and 3B, the diamond 3 forms a non-peelable metal coating 5 on the part where it joins with the metal base 1, that is, the part where the silver solder 4 adheres to the diamond.
固定方法は銀ロウ等のロウ材によってベース金属１とダ
イヤモンド３の金属被膜５とが接合される。The fixing method is to join the base metal 1 and the metal coating 5 of the diamond 3 with a brazing material such as silver solder.
ダイヤモンド角柱体３の先端面３ａは研磨し、溶融ハン
ダが付着しないようになっている。The tip surface 3a of the diamond prismatic body 3 is polished to prevent molten solder from adhering to it.
本考案の加熱用圧着子は以上説明したような構造になっ
ているので第４図に示すようなセラミックのプリント基
板６上にＩＣ７が並列されているこれを取り付けるのに
本考案の加熱用圧着子を使用する。Since the heating crimp of the present invention has the structure as explained above, the heating crimp of the present invention is used to attach the ICs 7 arranged in parallel on the ceramic printed circuit board 6 as shown in Fig. 4. Use children.
ＩＣ７の端子８にはあらかじめハンダが付着しており、
このハンダ部分に圧着子を第７図に示すように接触しハ
ンダを溶融させることにより、一度にＩＣ７の片側の端
子８をプリント基板６に固定することが可能である。Solder is already attached to terminal 8 of IC7,
By bringing a crimping element into contact with this solder portion as shown in FIG. 7 and melting the solder, it is possible to fix the terminals 8 on one side of the IC 7 to the printed circuit board 6 at one time.
ダイヤモンドは非常に熱伝導が優れているのでヒーター
によって加熱された金属ベースの熱を効率よくハンダに
伝動することが可能である。Since diamond has excellent thermal conductivity, it is possible to efficiently transmit the heat of the metal base heated by the heater to the solder.
又ダイヤモンドはハンダが溶ける程度に於いては、熱に
よって変形したり、摩耗することもないので常にハンダ
と接する先端面３ａは平滑面を保持することが可能であ
る。Furthermore, diamond is not deformed or worn by heat to the extent that the solder melts, so that the tip surface 3a, which is always in contact with the solder, can maintain a smooth surface.
従ってＩＣの端子との接触不良も皆無であるので接合不
良も皆無になった効果がある。Therefore, since there is no contact failure with the IC terminal, there is an effect that there is no connection failure.
又自動化することが可能になり従来より能率よくハンダ
付作業が可能で、かつ堅牢な加熱用圧着子を提供できる
効果がある。Furthermore, it is possible to automate the soldering work, making it possible to perform soldering work more efficiently than in the past, and providing a robust heating crimp.
第１図は本考案の斜視図である。
第２図は第１図Ｘ−Ｘ線断面図である。
第３図部は第２図の要部の拡大断面図である。
第４図はプリント基板の平面図である。
第５図はプリント基板に圧着子を作用させた時の側面図
である。
１・・・・・・金属ベース、２・・・・・・ヒーター取
付穴、３・・・・・・ダイヤモンド、４・・・・・田つ
材、５・・・・・・非剥離性金属被膜、６・・・・・・
プリント基板、７・・・・・・ＩＣ。
訃・・・・・端子。FIG. 1 is a perspective view of the present invention. FIG. 2 is a sectional view taken along the line XX in FIG. 1. FIG. 3 is an enlarged sectional view of the main part of FIG. 2. FIG. 4 is a plan view of the printed circuit board. FIG. 5 is a side view when the crimping element is applied to the printed circuit board. 1...Metal base, 2...Heater mounting hole, 3...Diamond, 4...Tatsu wood, 5...Non-peeling property Metal coating, 6...
Printed circuit board, 7...IC. Death...Terminal.
Claims (1)
ースとの接合部分に形威したダイヤモンドをロウ材によ
って固定したことを特徴とする加熱圧着子。A heat crimping device characterized in that a non-peelable metal coating is fixed to the tip of a metal base of the crimping device using a brazing material to form a diamond formed at the joint portion with the metal base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162679U JPS6023998Y2 (en) | 1979-12-13 | 1979-12-13 | Heating crimp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162679U JPS6023998Y2 (en) | 1979-12-13 | 1979-12-13 | Heating crimp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689261U JPS5689261U (en) | 1981-07-16 |
| JPS6023998Y2 true JPS6023998Y2 (en) | 1985-07-17 |
Family
ID=29682453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17162679U Expired JPS6023998Y2 (en) | 1979-12-13 | 1979-12-13 | Heating crimp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6023998Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314060Y2 (en) * | 1985-06-26 | 1991-03-28 |
-
1979
- 1979-12-13 JP JP17162679U patent/JPS6023998Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5689261U (en) | 1981-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6268691A (en) | Welding method by laser beam | |
| JPH0469836B2 (en) | ||
| JPS6023998Y2 (en) | Heating crimp | |
| JPH01319993A (en) | Connecting method for printed circuit board | |
| JPH07118498B2 (en) | Electrical junction | |
| JPS6023997Y2 (en) | Heating crimp | |
| JPH0438892A (en) | Chip parts mounting method and printed wiring board | |
| JP2912308B2 (en) | Soldering structure for surface mount components | |
| JP2523512Y2 (en) | Flat package type IC | |
| JP2606273B2 (en) | Heater chip for bonding | |
| JPH02151095A (en) | Mounting method of ic on board and ic mounting board | |
| JPH05343593A (en) | Connecting terminal | |
| JPH04315494A (en) | Method of connecting wire to circuit component | |
| JPH0625017Y2 (en) | LSI package lead structure | |
| JPH0365661B2 (en) | ||
| JPH0467662A (en) | Package lead pin | |
| JPH0787268B2 (en) | Mounting method of flat package type IC | |
| JPS59137174A (en) | Preliminary soldering method | |
| JPS63132464A (en) | Lead of integrated circuit | |
| JPH05121411A (en) | Formation of connecting bump on electronic component | |
| JPS6317581Y2 (en) | ||
| JPH0617129U (en) | Contact for electronic parts | |
| JPH075680Y2 (en) | Flattening jig for terminal pins | |
| JPS59114849A (en) | Manufacture of hybrid integrated circuit | |
| JPS6225900Y2 (en) |