JPH02133988A - Formation of through hole of both-side plastic film circuit board - Google Patents
Formation of through hole of both-side plastic film circuit boardInfo
- Publication number
- JPH02133988A JPH02133988A JP28829388A JP28829388A JPH02133988A JP H02133988 A JPH02133988 A JP H02133988A JP 28829388 A JP28829388 A JP 28829388A JP 28829388 A JP28829388 A JP 28829388A JP H02133988 A JPH02133988 A JP H02133988A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- copper plating
- etching
- film base
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002985 plastic film Substances 0.000 title claims abstract description 12
- 229920006255 plastic film Polymers 0.000 title claims abstract description 12
- 230000015572 biosynthetic process Effects 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 14
- 238000003486 chemical etching Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 25
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract 2
- 230000035515 penetration Effects 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
及見上魚並爪分野
この発明は、プラスチック裏のフィルム基材に化学エツ
チングで貫通孔をあけ、その貫通孔に銅メッキを施して
両面プラスチックフィルム回路基板にスルーホールを形
成するスルーホール形成方法に関する。[Detailed Description of the Invention] Field of the Invention This invention involves making through holes in a plastic film base material by chemical etching, copper plating the through holes, and making through holes in double-sided plastic film circuit boards. The present invention relates to a through hole forming method for forming a through hole.
灸來血皮４
従来、この種のスルーホール形成方法では、たとえば第
４図（Ａ）に示すようにフィルム基材１に貫通孔２をあ
け、その後同図（Ｂ）に示すように銅メッキ３を施して
から、同ＩＩ （Ｃ）に示すように液体レジスト４を塗
布し、しかる後同図（Ｄ）に示すように露光して後、同
図（Ｅ）に示すようにエツチングを行い、その後液体レ
ジスト４を除去して同図（Ｆ）に示すように導電パター
ン５をつくり、フィルム回路基板にスルーホールを形成
していた。Moxibustion blood skin 4 Conventionally, in this type of through-hole forming method, for example, as shown in FIG. 3, a liquid resist 4 is applied as shown in II (C), and then exposed as shown in (D) of the same figure, and then etched as shown in (E) of the same figure. Thereafter, the liquid resist 4 was removed to form a conductive pattern 5 as shown in FIG. 5(F), and through holes were formed in the film circuit board.
が解 しようとするａＩ！
ところが、貫通孔２を有するフィルム基材１に液体レジ
スト４を均一に塗布することははなはだ難しく、次のよ
うな課題があった。is trying to solve aI! However, it is extremely difficult to uniformly apply the liquid resist 4 to the film base material 1 having the through holes 2, and the following problems arise.
■ 第４図（Ｃ）に示すように１貫通孔２の入口エツジ
部６で液体レジスト４の厚さが表面張力によって極端に
薄くなり、いわゆる肩切れ現象を生ずる。このため、銅
エツチング時、同図（Ｅ）に示すように貫通孔２の入口
エツジ部６で残存すべき銅メッキ３まで完全に腐食し、
同図（Ｆ）に示すようにその部分で導電パターン５がな
くなってしまった。(2) As shown in FIG. 4(C), the thickness of the liquid resist 4 at the entrance edge portion 6 of the through hole 2 becomes extremely thin due to surface tension, resulting in a so-called shoulder cut phenomenon. For this reason, during copper etching, as shown in FIG.
As shown in FIG. 5(F), the conductive pattern 5 is missing at that part.
■ 液体レジスト４を塗布して後、乾燥するまでの間に
、塗布した液体レジスト４が貫通孔２を通して反対の側
まで流れたり、また貫通孔２内の液体レジスト４が流れ
出し、たとえば貫通孔２のまわりの液体レジスト４の厚
さが厚くなった。After the liquid resist 4 is applied and until it dries, the applied liquid resist 4 may flow through the through hole 2 to the opposite side, or the liquid resist 4 inside the through hole 2 may flow out, for example, into the through hole 2. The thickness of the liquid resist 4 around the area has become thicker.
そこで、この発明の目的は、両面プラスチックフィルム
回路基板のスルーホール形成方法において、上述した従
来の課題を解決し、貫通孔を有するフィルム基材にも液
体レジストを均一に塗布して信頼性を向上することにあ
る。Therefore, the purpose of this invention is to solve the above-mentioned conventional problems in a through-hole forming method for double-sided plastic film circuit boards, and to improve reliability by uniformly applying liquid resist to film substrates having through-holes. It's about doing.
課題を解決するための 段
そのため、この発明による両面プラスチックフィルム回
路基板のスルーホール形成方法は、たとえば以下の図示
実施例に示すとおり、プラスチック製のフィルム基材１
０に化学エツチングで貫通孔１３をあけ、その後銅メッ
キ１５を施して前記貫通孔１３を塞ぎ、液体レジスト１
６を塗布してからエツチングを行って後、該液体レジス
ト１６を除去して導電パターン１７をつくり、スルーホ
ールを形成することを特徴とする・
作−一一月一
そして、化学エツチングで貫通孔１３をあけることから
、その貫通孔１３の入口エツジ部１４が鈍角となり、液
体レジスト１６を塗布するとき、いわゆる肩切れ現象を
生じない、かつ、銅メッキ１５を施して貫通孔１３を塞
ぐことから、貫通孔１３を通して液体レジスト１６が行
き来できなくなる。SUMMARY OF THE INVENTION Therefore, the method for forming through holes in a double-sided plastic film circuit board according to the present invention is, for example, as shown in the illustrated embodiments below.
A through hole 13 is formed in the resist layer 1 by chemical etching, and then copper plating 15 is applied to close the through hole 13.
6 is coated and etched, and then the liquid resist 16 is removed to form a conductive pattern 17 and a through hole is formed. 13, the entrance edge 14 of the through hole 13 becomes obtuse, so that when applying the liquid resist 16, the so-called shoulder cut phenomenon does not occur, and since the through hole 13 is closed by applying copper plating 15. , the liquid resist 16 cannot go back and forth through the through hole 13.
大−」１−例一
以下１図面を参照しつつ、この発明の実施例を詳細に説
明する。Embodiments of the present invention will be described in detail with reference to the drawings.
第１図には、この発明の一実施例であるスルーホール形
成方法の工程図を示す０図中符号１０は、ポリイミド等
のプラスチック製のフィルム基材である。フィルム基材
１０には、まず第１図（Ａ）に示すように１表裏にホト
レジスト１１・１１を塗布する。ついで、露光し、同図
（Ｂ）に示すようにホトレジスト１１・１１にそれぞれ
比較的小さな円形孔１２・１２をあける。その後１両面
側からヒドラジン等で化学エツチングを行い、同図（Ｃ
）に示すようにフィルム基材１０に小さな貫通孔１３を
あける。そして、同図（Ｄ）に示すようにホトレジスト
１１・１１を除去する。すると、貫通孔１３の径は、入
口部でもつとも大きく、中間部でもっとも小さくなる。FIG. 1 shows a process diagram of a through-hole forming method according to an embodiment of the present invention. Reference numeral 10 in FIG. 1 is a film base material made of plastic such as polyimide. First, photoresists 11 are coated on the front and back sides of the film base material 10, as shown in FIG. 1(A). Then, exposure is performed to make relatively small circular holes 12, 12 in the photoresists 11, 11, respectively, as shown in FIG. After that, chemical etching with hydrazine etc. was performed from one side of both sides, and the same figure (C
), a small through hole 13 is made in the film base material 10. Then, the photoresists 11 are removed as shown in FIG. 1D. Then, the diameter of the through hole 13 is the largest at the entrance, and the smallest at the middle.
よって、貫通孔１３の内面は傾斜し、その入口エツジ部
１４・１４は鈍角となる。Therefore, the inner surface of the through hole 13 is inclined, and the entrance edges 14 are obtuse angles.
しかる後、銅メッキ１５を厚付けし、第１図（Ｅ）に示
すように貫通孔１３を塞ぐ、たとえばフィルム基材１０
の厚さが５０μｍであり１貫通孔１３の中間部の孔径も
同じく５０μｍであったとすると、銅メッキ１５の厚さ
を２５μｍとすれば１貫通孔１３を塞ぐことができる０
通常、銅厚は３５μｍ位が一般的であるから１貫通孔１
３の孔径を７０μｍ以内とすれば、だいたいその貫通孔
１３を塞ぐことができることとなる。つまり、第１図（
Ｅ）に示すように、貫通孔１３の最小径をＤとし、銅メ
ッキ１５の厚さをｔとすると、Ｄ≦２ｔ
の関係となるようにする・
そして、第１図（Ｆ）に示すように、銅メッキ１５の上
に液体ホトレジスト１６・１６を塗布する。このとき、
貫通孔１３は塞がれて両面にはわずかに凹みが見える程
度であるから、貫通孔を有しないフィルム基材上に塗布
する場合とほとんど変わりなく、ホトレジスト１６・１
６を均一に塗布することができる。なお、図から判るよ
うに、わずかな凹みの部分は液体ホトレジストがまわり
より厚く塗布されることとなるが、ポジタイプの液体ホ
トレジストを使用するから露光時にはまったく問題がな
い。After that, copper plating 15 is applied thickly to close the through holes 13 as shown in FIG.
If the thickness of copper plating 15 is 50 μm and the hole diameter at the middle part of one through hole 13 is also 50 μm, then if the thickness of copper plating 15 is 25 μm, one through hole 13 can be closed.
Normally, the copper thickness is about 35 μm, so 1 through hole 1
If the diameter of the hole 3 is within 70 μm, the through hole 13 can be roughly blocked. In other words, Figure 1 (
As shown in Fig. 1(F), the minimum diameter of the through hole 13 is D, and the thickness of the copper plating 15 is t, so that the relationship D≦2t is satisfied.As shown in Fig. 1(F), Next, liquid photoresist 16 is applied on top of the copper plating 15. At this time,
Since the through holes 13 are closed and only slight depressions are visible on both sides, the photoresist 16.1 is almost the same as when coating on a film base material without through holes.
6 can be applied uniformly. As can be seen from the figure, the liquid photoresist will be applied thicker to the slightly recessed area than the surrounding area, but since a positive type liquid photoresist is used, there will be no problem at all during exposure.
その後、露光して第１図（Ｇ）に示すようにホトレジス
ト１６・１６の一部を取り除き、エツチングを行って同
図（Ｈ）に示すように銅メッキ１５の一部をなくシ、シ
かる後同図（Ｉ）に示すようにホトレジスト１６・１６
を除去して導電パターン１７をつくり１両面プラスチッ
クフィルム回路基板にスルーホールを形成してなる。Thereafter, a portion of the photoresist 16 is removed by exposure as shown in FIG. 1(G), and a portion of the copper plating 15 is removed by etching as shown in FIG. 1(H). Afterwards, as shown in the same figure (I), photoresist 16.16
is removed to form a conductive pattern 17, and through holes are formed on a one-sided plastic film circuit board.
次に、第２図には、この発明の他の実施例であるスルー
ホール形成方法の工程図を示す、第１図に示すスルーホ
ール形成方法では両面エツチングの場合を示したが、こ
の第２図に示すスルーホール形成方法では片面エツチン
グの場合を示す、すなわち、第２図（Ａ）に示すように
フィルム基材１０にホトレジスト１１を塗布し、その後
露光して同図ＣＢ）に示すように一方のホトレジスト１
１にのみ比較的小さな円形孔１２をあける。そして、フ
ィルム基材１０を片面側からエツチングし、同図（Ｃ）
に示すように内面が傾斜する円錐状の小さな貫通孔１３
を形成して後、同図（Ｄ）に示すようにホトレジスト１
１を除去する。しかる後。Next, FIG. 2 shows a process diagram of a through-hole forming method according to another embodiment of the present invention.The through-hole forming method shown in FIG. The through hole forming method shown in the figure shows the case of single-sided etching, that is, as shown in FIG. One photoresist 1
A relatively small circular hole 12 is made only in 1. Then, the film base material 10 is etched from one side, as shown in FIG.
A small conical through hole 13 with an inclined inner surface as shown in
After forming the photoresist 1, as shown in the same figure (D),
Remove 1. After that.
銅メッキ１５を厚付けし、同図（Ｅ）に示すように貫通
孔１３を塞ぐ、すなわち、最小径である貫通孔１３の図
中下方入口部で、同図（Ｅ）に示すごとく該貫通孔１３
を塞ぐ、ついで、同図（Ｆ）に示すように、銅メッキ１
５上に液体ホトレジスト１６を塗布する。この第２図に
示す場合も１貫通孔１３のエツチングを行う側の入口エ
ツジ部１４は鈍角となるから、第１図に示した実施例の
場合と同様にいわゆる肩切れ現象を生じない・また・銅
メッキ１５で貫通孔１３を塞ぐから１貫通孔１３がない
場合とほとんど同様に、ホトレジスト１６を均一に塗布
することができる。しかる後、以下第１図に示した実施
例と同様に、第２図（Ｇ）に示すように露光し、同図（
Ｈ）に示すようにエツチングを行い、同図（Ｉ）に示す
ようにホトレジスト１６を除去して導電パターン１７を
つくり、両面プラスチックフィルム回路基板にスルーホ
ールを形成してなる。The copper plating 15 is thickened to close the through hole 13 as shown in FIG. Hole 13
Then, as shown in the same figure (F), copper plating 1
A liquid photoresist 16 is applied over the photoresist 5. In the case shown in FIG. 2 as well, the entrance edge portion 14 on the etching side of the first through hole 13 has an obtuse angle, so that the so-called cut-off phenomenon does not occur as in the case of the embodiment shown in FIG. - Since the through-holes 13 are covered with the copper plating 15, the photoresist 16 can be applied uniformly in almost the same way as when no through-holes 13 are provided. Thereafter, similarly to the embodiment shown in FIG. 1, exposure was carried out as shown in FIG.
Etching is performed as shown in FIG. 1H, and the photoresist 16 is removed to form a conductive pattern 17 as shown in FIG.
第３図には、この発明のさらに他の実施例であるスルー
ホール形成方法の工程図を示す。第３図に示す例では、
化学エツチングのレジストとしてより自着性を上げるた
め、いったんポリイミド製のフィルム基材１０上に１〜
５μｍの薄い銅メッキ１８・１８を施してから、第３図
（Ａ）に示すようにホトレジスト１１・１１を塗布する
。そして５両面エツチングの場合は、露光して同図（Ｂ
）に示すようにホトレジスト１１・１１にそれぞれ比較
的小さな円形孔１２・１２をあける。しかる後、銅エツ
チングを行い、同図（Ｃ）に示すように銅メッキ１８・
１８にも円形孔１９・１９をあける。しかして、同図（
Ｄ）に示すようにホトレジスト１１・１１を除去し、同
図（Ｅ）に示すようにエツチングを行ってフィルム基材
１０に小さな貫通孔１３をあける。その後、後の銅メッ
キの前処理としてソフトエツチングを行うと、もともと
薄い銅メッキ１８・１８がさらに薄くなる。そして、同
図ＣＦ）に示すようにその上にさらに銅メッキ１５を厚
付けし、第１図（Ｅ）の場合と同様にその貫通孔１３を
塞ぐ、すると、薄い銅メッキ１８・１８のオーバーハン
グしている部分は、液の流れ等で折れ曲がり、厚付けの
銅メッキ１５をつき難くするようなことはない、ついで
、第３図（Ｇ）に示すように、再び液体ホトレジスト１
６・１６を塗る。この第３図に示す場合も、銅メッキ１
５で貫通孔１３を塞ぐから、貫通孔１３がない場合とほ
とんど同様に、ホトレジスト１６を均一に塗布すること
ができる。そして、第３図（Ｈ）に示すように露光し、
同図ＣＩ）に示すようにエツチングを行い、同図（Ｊ）
に示すようにホトレジスト１６・１６を除去する。しか
して、両面プラスチックフィルム回路基板上に導電パタ
ーン１７をつくり、スルーホールを形成する。FIG. 3 shows a process diagram of a through-hole forming method according to still another embodiment of the present invention. In the example shown in Figure 3,
In order to improve self-adhesiveness as a chemical etching resist, 1 to 1
After applying 5 μm thin copper plating 18, 18, photoresist 11, 11 is applied as shown in FIG. 3(A). In the case of 5-sided etching, the same figure (B
), relatively small circular holes 12, 12 are made in the photoresists 11, 11, respectively. After that, copper etching is performed, and as shown in the same figure (C), copper plating 18.
Also make circular holes 19 and 19 in 18. However, the same figure (
As shown in (D), the photoresists 11 are removed, and as shown in (E) of the same figure, small through holes 13 are made in the film base material 10 by etching. Thereafter, when soft etching is performed as a pretreatment for subsequent copper plating, the originally thin copper plating 18 becomes even thinner. Then, as shown in FIG. CF), a thick layer of copper plating 15 is further applied on top of the copper plating 15, and the through hole 13 is closed in the same manner as in the case of FIG. The hanging part will not bend due to the flow of the liquid and will not make it difficult to attach the thick copper plating 15. Next, as shown in FIG.
Paint 6.16. In the case shown in Fig. 3, copper plating 1
5 closes the through hole 13, the photoresist 16 can be uniformly applied in almost the same way as when the through hole 13 is not provided. Then, it is exposed as shown in FIG. 3(H),
Etching is performed as shown in CI) in the same figure, and (J) in the same figure.
The photoresists 16 are removed as shown in FIG. A conductive pattern 17 is then formed on the double-sided plastic film circuit board to form through holes.
且１箆然困
したがって、この発明によれば、フィルム基材に化学エ
ツチングで貫通孔をあけ、その貫通孔の入口エツジ部を
鈍角とするから、エツチングを行うべく液体レジストを
塗布するとき、いわゆる肩切れ現象を生ずることがない
、また、銅メッキを施すときその銅メッキで貫通孔を塞
ぐから、その貫通孔を通しての液体レジストの行き来が
なくなる。よって、塗布した液体レジストが貫通孔を通
して反対の側にまで流れたり、また貫通孔内の液体レジ
ストが流れ出すようなことはなく、貫通孔を有するフィ
ルム基材に液体レジストを均一に塗布することができる
。そして、両面プラスチックフィルム回路基板の信頼性
を向上することができる。Therefore, according to the present invention, a through hole is formed in the film base material by chemical etching, and the entrance edge of the through hole is made obtuse, so that when applying a liquid resist for etching, the so-called There is no shoulder breakage phenomenon, and since the copper plating closes the through hole when copper plating is applied, liquid resist does not come and go through the through hole. Therefore, the applied liquid resist does not flow to the opposite side through the through-holes, or the liquid resist inside the through-holes does not flow out, and the liquid resist can be uniformly applied to the film base material having the through-holes. can. In addition, the reliability of the double-sided plastic film circuit board can be improved.
第１図（Ａ）ないしくＩ）はこの発明の一実施例である
スルーホール形成方法の工程図、第２図（Ａ）ないしく
Ｉ）はこの発明の他の実施例であるスルーホール形成方
法の工程図、第３図（Ａ）ないしくＪ）はこの発明のさ
らに他の実施例であるスルーホール形成方法の工程図で
ある。第４図（Ａ）ないしくＦ）は、従来のスルーホー
ル形成方法の工程図である。
１０・・・・・・・・・フィルム基材
１３・・・・・・・・・貫通孔
１４・・・・・・・・・入口エツジ部
１５・・・・・・・・・銅メッキ
１６・・・・・・・・・液体レジスト
１７・・・・・・・・・導電パターンFig. 1 (A) or I) is a process diagram of a through hole forming method which is an embodiment of the present invention, and Fig. 2 (A) or I) is a process diagram of a through hole forming method which is another embodiment of the present invention. Process diagrams of the method, FIGS. 3(A) to 3(J) are process diagrams of a through-hole forming method according to still another embodiment of the present invention. FIGS. 4A to 4F are process diagrams of a conventional through-hole forming method. 10...Film base material 13...Through hole 14...Inlet edge portion 15...Copper plating 16...Liquid resist 17...Conductive pattern
Claims (1)
通孔をあけ、その後銅メッキを施して前記貫通孔を塞ぎ
、液体レジストを塗布してからエッチングを行って後、
該液体レジストを除去して導電パターンをつくり、スル
ーホールを形成してなる、両面プラスチックフィルム回
路基板のスルーホール形成方法。After making a through hole in a plastic film base material by chemical etching, then applying copper plating to close the through hole, applying a liquid resist, and etching,
A method for forming through holes in a double-sided plastic film circuit board, which comprises removing the liquid resist, creating a conductive pattern, and forming through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28829388A JPH02133988A (en) | 1988-11-15 | 1988-11-15 | Formation of through hole of both-side plastic film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28829388A JPH02133988A (en) | 1988-11-15 | 1988-11-15 | Formation of through hole of both-side plastic film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02133988A true JPH02133988A (en) | 1990-05-23 |
Family
ID=17728282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28829388A Pending JPH02133988A (en) | 1988-11-15 | 1988-11-15 | Formation of through hole of both-side plastic film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133988A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002009418A (en) * | 2000-06-20 | 2002-01-11 | Toray Eng Co Ltd | Control method of penetrating hole diameter in the case of etching polyimide film base substance |
| JP2006324526A (en) * | 2005-05-19 | 2006-11-30 | Matsushita Electric Works Ltd | Wiring board and its manufacturing method |
| KR100681999B1 (en) * | 2005-02-18 | 2007-02-15 | 가부시끼가이샤 도시바 | Wiring board and method for manufacturing the same |
| JP2009060151A (en) * | 2008-12-18 | 2009-03-19 | Ibiden Co Ltd | Production process of laminated wiring board |
| JP2009060152A (en) * | 2008-12-18 | 2009-03-19 | Ibiden Co Ltd | Laminated wiring board and its production process |
| WO2013160994A1 (en) * | 2012-04-24 | 2013-10-31 | 三共化成株式会社 | Plated structure of through-hole |
| TWI461122B (en) * | 2013-01-07 | 2014-11-11 | Ecocera Optronics Co Ltd | Circuit board and method for manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956174A (en) * | 1972-06-07 | 1974-05-31 | ||
| JPS5674992A (en) * | 1979-11-24 | 1981-06-20 | Matsushita Electric Ind Co Ltd | Method of fabricating bothhside through hole flexible printed circuit board |
| JPS59108390A (en) * | 1982-12-13 | 1984-06-22 | 松下電器産業株式会社 | Method of producing flexible printed circuit board |
| JPS63177586A (en) * | 1987-01-19 | 1988-07-21 | 株式会社日立製作所 | Circuit board |
-
1988
- 1988-11-15 JP JP28829388A patent/JPH02133988A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956174A (en) * | 1972-06-07 | 1974-05-31 | ||
| JPS5674992A (en) * | 1979-11-24 | 1981-06-20 | Matsushita Electric Ind Co Ltd | Method of fabricating bothhside through hole flexible printed circuit board |
| JPS59108390A (en) * | 1982-12-13 | 1984-06-22 | 松下電器産業株式会社 | Method of producing flexible printed circuit board |
| JPS63177586A (en) * | 1987-01-19 | 1988-07-21 | 株式会社日立製作所 | Circuit board |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002009418A (en) * | 2000-06-20 | 2002-01-11 | Toray Eng Co Ltd | Control method of penetrating hole diameter in the case of etching polyimide film base substance |
| JP4523120B2 (en) * | 2000-06-20 | 2010-08-11 | 東レエンジニアリング株式会社 | Through-hole diameter control method in etching polyimide film substrate |
| KR100681999B1 (en) * | 2005-02-18 | 2007-02-15 | 가부시끼가이샤 도시바 | Wiring board and method for manufacturing the same |
| JP2006324526A (en) * | 2005-05-19 | 2006-11-30 | Matsushita Electric Works Ltd | Wiring board and its manufacturing method |
| JP4622672B2 (en) * | 2005-05-19 | 2011-02-02 | パナソニック電工株式会社 | Wiring board manufacturing method |
| JP2009060151A (en) * | 2008-12-18 | 2009-03-19 | Ibiden Co Ltd | Production process of laminated wiring board |
| JP2009060152A (en) * | 2008-12-18 | 2009-03-19 | Ibiden Co Ltd | Laminated wiring board and its production process |
| WO2013160994A1 (en) * | 2012-04-24 | 2013-10-31 | 三共化成株式会社 | Plated structure of through-hole |
| JP5753628B2 (en) * | 2012-04-24 | 2015-07-22 | 三共化成株式会社 | Through-hole plating structure |
| TWI461122B (en) * | 2013-01-07 | 2014-11-11 | Ecocera Optronics Co Ltd | Circuit board and method for manufacturing the same |
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