JPH02124243A - Working method for work and freeze holding device - Google Patents
Working method for work and freeze holding deviceInfo
- Publication number
- JPH02124243A JPH02124243A JP1116465A JP11646589A JPH02124243A JP H02124243 A JPH02124243 A JP H02124243A JP 1116465 A JP1116465 A JP 1116465A JP 11646589 A JP11646589 A JP 11646589A JP H02124243 A JPH02124243 A JP H02124243A
- Authority
- JP
- Japan
- Prior art keywords
- work
- workpiece
- water
- electronic cooling
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000001816 cooling Methods 0.000 claims abstract description 37
- 238000007710 freezing Methods 0.000 claims description 16
- 230000008014 freezing Effects 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 8
- 238000005498 polishing Methods 0.000 abstract description 12
- 239000000498 cooling water Substances 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 16
- 238000005553 drilling Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000003754 machining Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000011109 contamination Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Jigs For Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、半導体、セラミックス、プラスチック等から
なるワークの加工方法と、該ワークをワークホルダに固
定して保持するためのワーク凍結保持装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for processing a workpiece made of semiconductors, ceramics, plastics, etc., and a workpiece freeze-holding device for fixing and holding the workpiece on a workholder. .
［従来の技術］
非磁性材を研磨・研削したり、切断したり或いは穴明は
加工する場合、寸法や材質的制約からワークを機械的に
保持出来ないときには、ワークを適当な接着剤を介しワ
ークホルダに貼り付けて固定することが行なわれている
。[Prior art] When polishing, grinding, cutting, or drilling non-magnetic materials, if the workpiece cannot be held mechanically due to size or material constraints, the workpiece must be held with a suitable adhesive. This is done by pasting and fixing it on a work holder.
例えば、半導体ウェハをラップ盤等で研磨する場合、現
在、次のような保持手段が一般的に採られている。すな
わち、ウェハを保持するｈツブプレートを１５０℃程度
に加熱し、その上に熱石■塑性ワックスを塗布してから
ウェハを貼り付け、しかる後、加圧、冷却して固定する
ようにする（例えば、特公昭６２−１０７７９号公報参
照）。For example, when polishing a semiconductor wafer using a lapping machine or the like, the following holding means is currently generally used. That is, the h-tub plate that holds the wafer is heated to about 150°C, hot stone plastic wax is applied on it, the wafer is attached, and then the plate is pressurized and cooled to fix it ( For example, see Japanese Patent Publication No. 62-10779).
［発明が解決しようとする課題］
しかし、このようなワーク保持手段には、次のような問
題点が指摘される。[Problems to be Solved by the Invention] However, the following problems are pointed out in such a workpiece holding means.
（１）ワックスの接着性が必ずしも十分でない。(1) The adhesiveness of wax is not necessarily sufficient.
（２）上記一連の接着工程を経るので、ワークの取り付
けに時間と手間が掛かる。(2) Since the above-mentioned series of bonding steps are required, it takes time and effort to attach the workpiece.
（３）仕上げ後、ワックスを再加熱若しくは有機溶剤で
除去しなければならないので、取り外しにも時間と手間
が掛かる。(3) After finishing, the wax must be removed by reheating or using an organic solvent, which requires time and effort to remove.
（４）ワックスで接着面が荒らされ、ワークの汚染も心
配される。(4) The adhesive surface is roughened by the wax, and there is also concern about contamination of the workpiece.
本発明は、以上のような問題点を一挙に解消できるワー
クの加工方法と凍結保持装置とを新たに提供する。The present invention provides a new workpiece processing method and freeze-holding device that can solve the above-mentioned problems all at once.
［課題を解決するための手段］
本発明は、ワークをワークホルダに対して、両者の間に
介在される水分を凍結させて保持させるという発想の下
に創出されたものであって、ワークの一部又は全部を凍
結水に埋め込んで研磨・研削、切断、穴明は等の加工を
するワークの加工方法と、ワークを凍結水を介して保持
するワークホルダと、該ワークホルダの背面に吸熱面を
接して固着された電子冷却装置とを具備して構成される
ワーク凍結保持装置とを提供する。[Means for Solving the Problems] The present invention was created based on the idea of freezing and retaining the moisture interposed between the workpiece and the workholder. A workpiece processing method for polishing, grinding, cutting, drilling, etc. by immersing a part or all of the workpiece in frozen water, a workholder that holds the workpiece through frozen water, and a heat absorbing back surface of the workholder. A workpiece freezing and holding device is provided, which includes an electronic cooling device and an electronic cooling device that are fixed in contact with each other.
［作用］
本発明の加工方法によると、ワークの一部又は全部を凍
結水に埋め込んで加工することにより、ワックスの場合
のような着脱の不便やワークの汚染問題等から解放され
る上に、凍結水からワークに有用な冷却作用が得られる
ことや、ワークを周囲の凍結水と一体に加工できるとい
った加工面での様々な改善が実現される。[Function] According to the processing method of the present invention, by embedding part or all of the workpiece in frozen water and processing it, the workpiece is freed from the inconvenience of attachment and detachment and the problem of contamination of the workpiece, as is the case with wax. Various improvements in machining are realized, such as the ability to obtain a useful cooling effect on the workpiece from the frozen water and the ability to process the workpiece integrally with the surrounding frozen water.
また、本発明のワーク凍結保持装置によれば、次のよう
な作用が得られる。Further, according to the workpiece freezing and holding device of the present invention, the following effects can be obtained.
本装置を用いて、ワークをワークホルダの上に適当に水
を介在させて載置し、この状態でワークホルダの背面側
に固着された電子冷却装置に通電すると、短時間でワー
クをワークホルダに簡単に固定することができる。すな
わち、電子冷却装置を作動させると、ワークホルダを介
して吸熱される水が膨張しながら急速に凍結し、この凍
結水がバインダとなって両者を強固に固定するものとな
る。Using this device, a workpiece is placed on a workholder with appropriate water interposed in it, and in this state, when electricity is applied to the electronic cooling device fixed to the back side of the workholder, the workpiece can be placed on the workholder in a short time. can be easily fixed. That is, when the electronic cooling device is operated, water that absorbs heat through the work holder expands and rapidly freezes, and this frozen water acts as a binder to firmly fix the two.
そして、加工中も電子冷却装置によるワークホルダ背面
側からの吸熱を持続する。こうすれば、加工中に凍結水
が溶けてワークの固定が緩むことがないし、同時に加工
面に有利な冷却作用を与えることができる。Even during processing, the electronic cooling device continues to absorb heat from the back side of the work holder. This prevents frozen water from melting during machining and loosening the fixation of the workpiece, and at the same time provides an advantageous cooling effect to the machining surface.
一方、加工後にワークを取り外すときには、凍結水を融
解すればよい。この際、通電方向を逆転すると吸熱面と
放熱面とが相互に反転する電子冷却装置の特性を利用し
、ワークホルダを背面側から加熱するようにすれば、ワ
ークを短時間で簡単に収り外すことができる。On the other hand, when removing the workpiece after processing, it is sufficient to thaw the frozen water. At this time, if the work holder is heated from the back side by utilizing the characteristic of the electronic cooling device that the heat absorption surface and heat radiation surface are reversed when the current direction is reversed, the work can be easily stored in a short time. It can be removed.
［実施例］ 以下、本発明の実施例を図示して説明する。[Example] Hereinafter, embodiments of the present invention will be illustrated and described.
火旌凹↓
第１図〜第３図は、本発明に係る加工方法とワーク凍結
保持装置を、半導体ウェハ等を研磨する研磨装置に適用
した場合を図示している。Figures 1 to 3 illustrate the case where the processing method and workpiece freeze-holding device according to the present invention are applied to a polishing apparatus for polishing semiconductor wafers and the like.
図において１は、定盤（図示省略）に支持される円盤状
のワークホルダ（トッププレート）で、その表面１ａに
ワーク２が載置される。ワークホルダ１の背面１ｂには
、周方向に等角間隔で配した適数個の電子冷却装置３．
３がそれぞれ吸熱面４を接して固着されている。In the figure, 1 is a disk-shaped work holder (top plate) supported by a surface plate (not shown), and a work 2 is placed on its surface 1a. On the back surface 1b of the work holder 1, an appropriate number of electronic cooling devices 3 are arranged at equal angular intervals in the circumferential direction.
3 are fixed with their endothermic surfaces 4 in contact with each other.
各電子冷却装置３は、第３図に示すように、Ｎ型熱電素
子ＮとＰ型熱電素子Ｐとのカプルを、互い違いの位置に
配した導体ジャンクションＣＪ、ＨＪとの間に接続し、
これを両側からセラミック製の絶縁基板４．５で挾み込
んで、全体として扁平な平面プレート状に構成されてお
り、直流電源６から例えば図示の極性で通電すると、コ
ールド・ジャンクションＣＪ側に接合された絶縁基板４
から吸熱し、反対側のホット・ジャンクションＨＪ側に
接続された絶縁基板５から放熱するヒートポンプの機能
を営む。そして、これらの電子冷却装置３．３は、吸熱
面に当る絶縁基板４をワークホルダ１の背面１ｂに直接
接触させて（必要なら熱伝導グリスを介在させて〉固着
する一方、反対側の絶縁基板５の上にはヒートシンクく
放熱器）として水冷管８ａ、８ｂを接続するウォータジ
ャケット７を連設している。As shown in FIG. 3, each electronic cooling device 3 connects a couple of an N-type thermoelectric element N and a P-type thermoelectric element P between conductor junctions CJ and HJ arranged at alternate positions,
This is sandwiched between ceramic insulating substrates 4.5 from both sides to form a flat plate-like structure as a whole, and when energized from the DC power supply 6 with the polarity shown, it is connected to the cold junction CJ side. Insulated substrate 4
It functions as a heat pump, absorbing heat from the insulating substrate 5 connected to the hot junction HJ on the opposite side and dissipating the heat from the insulating substrate 5 connected to the hot junction HJ on the opposite side. These electronic cooling devices 3.3 are fixed by directly contacting the insulating substrate 4, which is the heat-absorbing surface, with the back surface 1b of the work holder 1 (using thermal conductive grease if necessary), while fixing the insulating substrate 4 on the opposite side. A water jacket 7 is provided on the substrate 5 as a heat sink or radiator to connect the water cooling pipes 8a and 8b.
また、各電子冷却装置３は通電方向を正逆切換自在に可
変するスイッチ９．９を回路に組み込んだ直流電源６．
６を具備している。Furthermore, each electronic cooling device 3 includes a DC power source 6.9 that has a switch 9.9 built into the circuit that can freely change the current direction to forward or reverse.
It is equipped with 6.
本装置ではワーク２を、電子冷却装置３．３を背面側に
備えたワークホルダ１の表面１ａに適当量の水Ｗｏを介
在させた状態で載置するようにする。具体的には、この
場合、ワーク２の保持面を水に濡らしてからワークホル
ダ１の表面１ａに載せれば足る。In this apparatus, the work 2 is placed on the surface 1a of the work holder 1, which is provided with the electronic cooling device 3.3 on the back side, with an appropriate amount of water Wo interposed therebetween. Specifically, in this case, it is sufficient to wet the holding surface of the work 2 with water and then place it on the surface 1a of the work holder 1.
このワーク凍結保持装置を使用して、図示矢印（ａ又は
ｂ）のように回転される砥石（１０Ａ又は１０Ｂ〉でワ
ーク２を研磨するに際しては、第２図に示すように、ウ
ォータジャケット７に水冷管８ａ、８ｂから冷却水の流
通（矢印Ｃ）を開始するととしに、その電源回路をＯＮ
（スイッチ９を丁位置に）して各電子冷却装置３を作
動する。すると、ワーク２とワークホルダ１との間に介
在さｔｒた水Ｗ。が、該ワークホルダ１を介し吸熱Ｑ
＋ ｎされて霜状に凍結し、この凍結水Ｗに下面側の一
部か埋め込まれた状態でワーク２がワークホルダ１に強
固に固定される。このような水Ｗｏの凍結は非常に短時
間のうちに行なえ、かつ凍結水Ｗによって得られる接着
強度も十分大きいことが実験的に確かめられている。When using this workpiece freezing and holding device to polish the workpiece 2 with a grindstone (10A or 10B) that is rotated as shown by the arrow (a or b), the water jacket 7 is When starting the flow of cooling water (arrow C) from the water cooling pipes 8a and 8b, turn on the power supply circuit.
(Switch 9 is placed in the D position) to operate each electronic cooling device 3. Then, water W is interposed between the work 2 and the work holder 1. However, the heat absorption Q through the work holder 1
The work 2 is firmly fixed to the work holder 1 with a part of the lower surface side embedded in this frozen water W. It has been experimentally confirmed that such freezing of water Wo can be carried out in a very short time and that the adhesive strength obtained by frozen water W is sufficiently high.
かくして、凍結保持されたワーク２の研磨中は電子冷却
装置３．３による吸熱Ｑｌｆｉを持続し、凍結水Ｗの融
解を防止する。Thus, while polishing the frozen-held workpiece 2, the heat absorption Qlfi by the electronic cooling device 3.3 is maintained to prevent the frozen water W from melting.
一方、研磨終了後は、電源回路の通電方向を図示点線の
ように逆転（スイッチ９を■位置に）して、今度は電子
冷却装置３の放熱面５と接触されることになるワークホ
ルダ１を介して凍結水Ｗを加熱Ｑ ｏ ｕ ｔする。す
ると、凍結水Ｗが瞬時に融解して、ワーク２を簡単に取
り外すことができる。On the other hand, after polishing is completed, the direction of current flow of the power supply circuit is reversed as shown by the dotted line in the figure (switch 9 is placed in the ■ position), and the work holder 1 is now brought into contact with the heat dissipation surface 5 of the electronic cooling device 3. Frozen water W is heated via Q out. Then, the frozen water W melts instantly, and the workpiece 2 can be easily removed.
このように本装置によると、ワーク２の着脱に手間が掛
からす、いずれも短時間で行なえるので作業能率が改善
する。しかも、接着面が荒れることもないし、ワーク２
が汚染される心配もない。As described above, according to the present apparatus, the workpiece 2 can be attached and detached in a short time, which does not require time and effort, thereby improving work efficiency. Moreover, the adhesive surface does not become rough, and the workpiece 2
There is no need to worry about contamination.
なお、この場合、ワークホルダ（トッププレート）１の
材質は問わないが、吸、放熱効果を高める上では熱伝導
性の良いものが好まれる。In this case, the material of the work holder (top plate) 1 does not matter, but a material with good thermal conductivity is preferred in order to enhance the heat absorption and radiation effects.
夫旌盟ユ
第４図は、本発明に係る加工方法とワーク凍結保持装置
を、半導体の単結晶インゴット等をウェハに切断する切
断装置に適用した場合を図示している。FIG. 4 shows a case where the processing method and workpiece freeze-holding device according to the present invention are applied to a cutting device that cuts a semiconductor single crystal ingot or the like into wafers.
この場合、ワークホルダ１は、前記トッププレートに相
当するベースプレートＩＡの周辺に別体のリングＩＢを
接続してなる有底筒体の容器に形成される。そし２て、
ベースプレートＩＡの上にスペーサ１１．１，１を載置
し、この上にワーク２を横架させるとともに、ワークホ
ルダ１の内部には初期状態でワーク２が浸漬される程度
に水ＷＯを貯溜させる。しかし、て、前記と同様に電子
冷却装置３の吸熱面４からワークホルダ１を介して吸熱
すると、貯溜水Ｗｏが順次凍結し、図示のように氷（凍
結水）Ｗに完全に埋め込まれた状態でワーク２が固定さ
れる。この状態で、矢印ｄのように回転するンー１２を
移動（矢印ｅ及びｆ）させて、凍結水Ｗと共にワーク２
を切断して行く。In this case, the work holder 1 is formed into a bottomed cylindrical container formed by connecting a separate ring IB around a base plate IA corresponding to the top plate. Second,
A spacer 11.1,1 is placed on the base plate IA, and the workpiece 2 is placed horizontally thereon, and water WO is stored inside the workholder 1 to the extent that the workpiece 2 is immersed in the initial state. . However, when heat is absorbed from the heat absorption surface 4 of the electronic cooling device 3 through the work holder 1 in the same manner as described above, the stored water Wo gradually freezes and is completely embedded in the ice (frozen water) W as shown in the figure. Work 2 is fixed in this state. In this state, move the rotating part 12 as shown by the arrow d (arrows e and f), and move the workpiece 2 together with the frozen water W.
Cut it out and go.
なお本装置の場合、各電子冷却装置３の放熱面５からは
放熱フィン１３を突設させて、これらをワークホルダ１
の下方部に連設しであるタンク１４の水中に没入させる
ようにしている。このような改良は、電子冷却装置３に
必要な放熱器の作動を冷却水源のない場所でも保障し、
装置をワーカプルにすることを企図したものである。In the case of this device, radiation fins 13 are provided protruding from the radiation surface 5 of each electronic cooling device 3, and these are connected to the work holder 1.
It is made to be immersed in water in a tank 14 which is connected to the lower part of the tank. Such improvements ensure the operation of the radiator required for the electronic cooling device 3 even in locations where there is no cooling water source, and
It is intended to make the device a work couple.
このような切断装置においても、本凍結保持装置は前記
研磨装置の場合と基本的に共通する利便が得られるもの
となるが、更に次のようなメリットが強調できる。すな
わち、従前のワックスでワークを埋め込み保持するもの
では、切断面でのワークの発熱を防止するため多量の冷
却水を供給する必要があったが、この装置では加工中も
電子冷却装置３を作動しておけば、その切断面Ｋにも吸
熱（冷却）効果が波及して冷却水を節約することができ
、低速切断の場合は冷却水を不要にすることも可能にな
る。また、プラスチック等の切断では、発熱による切断
面にのブレを防止することができる。Even in such a cutting device, the present freezing and holding device basically provides the same conveniences as the polishing device described above, but the following advantages can be emphasized. In other words, with the conventional device that embeds and holds the workpiece in wax, it was necessary to supply a large amount of cooling water to prevent the workpiece from generating heat at the cutting surface, but with this device, the electronic cooling device 3 is operated even during machining. If this is done, the heat absorption (cooling) effect will also spread to the cut surface K, making it possible to save cooling water, and in the case of low-speed cutting, it becomes possible to eliminate the need for cooling water. Furthermore, when cutting plastic or the like, it is possible to prevent blurring of the cut surface due to heat generation.
火施例ユ
第５図は、上記実施例２の切断方法に改良を加えた変形
実施例を示している。Example 5 FIG. 5 shows a modified example in which the cutting method of Example 2 is improved.
この場合、ワークホルダ１にスペーサ１１を介して立設
されるワーク２を、実施例２と同様、氷Ｗに埋入した状
態で保持させるととらに、氷Ｗの外周を円筒状のカラー
１５で被覆している。このカラー１５は、それ自身に剛
性をもった厚手のものでもよいし、フィルム状のもので
もよい。すなわち、前者の場合であれば、カラー１５を
そのまま水Ｗｏを貯溜する容器に利用できるし、一方後
者の場合であれば、例えばカラー１５を別途容器に内張
すした状態でその内部に貯溜した水Ｗｏを凍結させ、し
かる浸水Ｗの外周面に転着されるカラー１５を残して該
容器を除去するようにすればよい。いずれにしても、カ
ラー１５は切断に負荷を与えない易切断性で、望ましく
は内部の観察可能な透明なもの、例えば透明プラスチッ
クパイプなどが利用される。In this case, the workpiece 2 erected on the workpiece holder 1 via the spacer 11 is held in a state embedded in the ice W as in the second embodiment, and the outer periphery of the ice W is surrounded by a cylindrical collar 15. It is covered with. The collar 15 may be thick and rigid, or may be in the form of a film. That is, in the former case, the collar 15 can be used as it is as a container for storing water Wo, while in the latter case, for example, the collar 15 can be separately lined with a container and stored therein. The water Wo may be frozen, and the container may be removed, leaving the collar 15 which is transferred to the outer circumferential surface of the immersed water W. In any case, the collar 15 is easy to cut and does not impose any load on cutting, and is preferably transparent so that the inside can be observed, such as a transparent plastic pipe.
このように氷Ｗの外周を易切断性のカラー１．５で被覆
したものであれば、矢印ｇのように回転するソー１２を
移動（矢印り及びｉ）させてワーク２を氷Ｗ及びカラー
１５と一体に切断できる上、切断時に外周から図示矢印
ＣＷのように冷却水を供給しても、冷却水ＣＷが直接氷
Ｗに掛かることがなく切断面にのみに浸透して行き、ワ
ーク２を凍結保持する氷Ｗが外側から融解される不具合
が除かれる。このような改良は、前記研磨の場合につい
ても勿論適用可能である。If the outer periphery of the ice W is coated with the easily cut collar 1.5 in this way, the rotating saw 12 is moved in the direction of the arrow g (arrows up and i) to remove the ice W and the collar. In addition, even if cooling water is supplied from the outer periphery as shown by the arrow CW during cutting, the cooling water CW will not directly hit the ice W and will only penetrate into the cut surface. This eliminates the problem of the ice W that freezes and retains melting from the outside. Of course, such improvements can also be applied to the polishing described above.
また、ワーク２の切断に際し、図示のように、反切断側
でカラー１５の肉厚一部又は全部を切り残すようにすれ
ば、切断片の分離が避けられ、爾後処理も簡便となる。Further, when cutting the workpiece 2, if part or all of the wall thickness of the collar 15 is left uncut on the side opposite to the cutting side as shown in the figure, separation of cut pieces can be avoided and subsequent processing can be simplified.
なお、寸法の大きなワークを対象とする場合などでは、
ワーク２等を例えば冷凍庫で凍結してから、ワークホル
ダ１にセットしてもよい。In addition, when dealing with large-sized workpieces,
The work 2 and the like may be frozen in a freezer, for example, and then set on the work holder 1.
犬旌盟１
第６図は、本発明に係る加工方法とワーク凍結保持装置
を、セラミック薄板等に穴明は加工を施す穴明は装置に
適用した場合を図示している。Figure 6 shows a case in which the processing method and workpiece freeze-holding device according to the present invention are applied to a drilling device for drilling holes in ceramic thin plates and the like.
装置の基本構成は、前記実施例２で述べた切断装置の場
合と共通している。但し、本装置においては、タンク１
４内にファン１６を搭載して、電子冷却装置３の放熱面
５から突設される放熱フィン１３に強制送風（図示矢印
）する空冷方式を採用している。The basic configuration of the device is the same as that of the cutting device described in the second embodiment. However, in this device, tank 1
An air cooling system is adopted in which a fan 16 is mounted in the electronic cooling device 3 and forced air is blown (indicated by arrows in the figure) to the radiation fins 13 protruding from the radiation surface 5 of the electronic cooling device 3.
穴明は加工に当っては、矢印ｊのように回転する工具１
７を移動（矢印ｋ）させて、図示のように所定の位置で
氷Ｗと一体にワーク２に貫通孔Ｈを穿つ。なお、工具１
７には一般的な砥石付き穴明は工具を使用してもよいが
、図示例の場合は、工具１７に中空パイプを用いその穿
孔部位に砥粒（図示省略）を添加しながら掘り進む方式
のものを図示している。During drilling, tool 1 rotates as shown by arrow j.
7 (arrow k) to drill a through hole H in the workpiece 2 together with the ice W at a predetermined position as shown in the figure. In addition, tool 1
7, a general drilling tool with a grindstone may be used, but in the case of the illustrated example, a hollow pipe is used as the tool 17, and a method of drilling while adding abrasive grains (not shown) to the drilling site is used. Illustrating something.
かかる穴明は装置に適用した場合は、実施例１の研磨装
置や実施例２の切断装置の場合と同様、ワーク２の着脱
が至便ならしめる効果が発揮できる上に、加工上、次の
ような効果が特筆されるものとなる。第８図は、比較例
として、脆弱なセラミック薄板をボール盤等の受台１つ
に機械的に固定して穴明は加工を実施した場合の様子を
図示したものであるが、その場合、ワーク２に貫通孔Ｈ
を明けるとき、図示矢印１のように工具１７がワーク２
を突き抜ける際、貫通孔Ｈの底部周辺が欠けたり、亀裂
ＣＲを発生するｌ・ラブルを頻発していた。When such hole drilling is applied to the device, it is possible to achieve the effect of facilitating the attachment and detachment of the workpiece 2, as in the case of the polishing device of Embodiment 1 and the cutting device of Embodiment 2. The effect is noteworthy. Figure 8 shows, as a comparative example, a case where a fragile ceramic thin plate is mechanically fixed to one pedestal of a drilling machine, etc., and the holes are drilled. Through hole H in 2
When opening the workpiece 2, the tool 17 touches the workpiece 2 as shown by arrow 1.
When penetrating through the hole, the area around the bottom of the through-hole H was chipped or cracks CR were formed, which frequently occurred.
しかるに、本装置によってワーク２を凍結保持すれば、
ワーク２が氷Ｗに一体に埋め込まれた状態でワークホル
ダ１に剛体的に保持できるので、工具１７がワーク２を
突き抜けるときのカケや割れが防止できる。また、本装
置によると、例えばレーザ加工では穿孔できないような
厚板の場合にも、比較的に簡易に穴明は加工を実施でき
る特長が得られる。However, if workpiece 2 is frozen and held using this device,
Since the workpiece 2 can be rigidly held in the workpiece holder 1 while being integrally embedded in the ice W, chipping or cracking when the tool 17 penetrates the workpiece 2 can be prevented. Further, according to the present apparatus, even in the case of a thick plate that cannot be drilled by laser processing, for example, a feature can be obtained that the hole can be drilled relatively easily.
なお、必要ならワーク２を埋め込んだ氷Ｗの表面には、
実施例３で示したカラー１５と同旨のカバーを被覆する
こともできる。In addition, if necessary, the surface of the ice W in which the work 2 is embedded,
A cover having the same effect as the collar 15 shown in Example 3 can also be applied.
火旌医旦
第７図は、上記実施例４の一部を変更し７た変形実施例
を示している。FIG. 7 shows a modified embodiment in which part of the fourth embodiment is changed.
この場合、ワーク２とワークホルダ１との間にドレッサ
ー材を兼ねる「さくい」材質（快削性）のダミースペー
サ１８を介在させ、工具］−７の先端をダミースペーサ
１８にまで進入させてソー２２に貫通孔Ｈを穿つように
している。In this case, a dummy spacer 18 made of a "screw" material (free-cutting property) that also serves as a dresser material is interposed between the work 2 and the work holder 1, and the tip of the tool]-7 is advanced up to the dummy spacer 18, and the saw A through hole H is bored in 22.
このようにしたものであれば、実施例４と同じく亀裂発
生等の加工不良が回避できる上に、加工毎にダミースペ
ーサ１８を削り込む工具１７の先端がドレッシングされ
る作用効果が得られる。If this is done, machining defects such as cracking can be avoided as in the fourth embodiment, and an effect can be obtained in which the tip of the tool 17 that cuts the dummy spacer 18 is dressed every time the machining is performed.
本発明のワーク凍結保持装置は、磁気保持できない非磁
性材のワーク保持に特に有用であるが、磁性材の場合に
ついても適用可能である。また、機械的に保持できない
小寸のワーク保持には特に有用であるが、上記穴明は加
工の例に見るように、加工性の面から必ずしもワークの
大小によって適用が制約されない。The workpiece freezing and holding device of the present invention is particularly useful for holding workpieces made of non-magnetic materials that cannot be held magnetically, but is also applicable to the case of magnetic materials. Further, although it is particularly useful for holding small-sized workpieces that cannot be held mechanically, the application of the above-mentioned hole drilling is not necessarily restricted by the size of the workpiece in terms of workability, as seen in the machining example.
なお、ワークとワークホルダとに介在される水は、ワー
クの汚染防止の見地からは純水を使用するのが好ましい
力釈例えばワークが撓水性材料である場合は、濡れ性を
良くするため界面活性剤を添加することができる。その
他、水の粘度、凍結温度、凍結強度等を調整する目的で
も種々の添加剤を加えることができる。Note that it is preferable to use pure water as the water interposed between the workpiece and the workholder from the standpoint of preventing contamination of the workpiece. Activators can be added. In addition, various additives can be added for the purpose of adjusting the viscosity, freezing temperature, freezing strength, etc. of water.
また、ワークホルダに対する電子冷却装置の取付個数や
取付横道は、勿論例示のものに限らす、ホルダ及び加工
条件に応じて適宜に設計変更可能である。Furthermore, the number of electronic cooling devices to be attached to the work holder and the way in which they are attached are, of course, limited to those shown in the example, and the design can be changed as appropriate depending on the holder and processing conditions.
［発明の効果］
以上の通り、本発明の加工方法及びワーク凍結保持装置
によれば、従来の接着手段に比較して、ワークの取扱い
と加工上の双方の面で、次のような改善効果か達成され
る。[Effects of the Invention] As described above, according to the processing method and workpiece freeze-holding device of the present invention, the following improvement effects can be achieved in terms of both workpiece handling and processing compared to conventional bonding means. or achieved.
（ａ）ワークホルダとの間に介在される水を低温に凍結
することで、接着強度の大きい確実なワークの固定が約
束できる。(a) By freezing the water interposed between the work holder and the work holder at a low temperature, it is possible to securely fix the work with high adhesive strength.
（ｂ）特に、電子冷却装置を搭載したワーク保持装置を
使用すれば、ワークの着脱が該電子冷却装置のＯＮ・Ｏ
ＦＦと通電方向の切換によるワンタッチで手間を掛けず
、短時間で行なえる。(b) In particular, if a workpiece holding device equipped with an electronic cooling device is used, loading and unloading of the workpiece can be done by turning the electronic cooling device ON/OFF.
One-touch switching between FF and energizing direction can be done in a short time without any effort.
（Ｃ）ワークの接着面が荒らされることがなく、接着剤
で汚染される心配も除かれる。(C) The adhesive surface of the workpiece is not damaged and there is no need to worry about contamination with adhesive.
（ｄ）ワークの加工面に有利な冷却効果が波及するので
、冷却水を節約乃至不要にすることができ、かつ加工面
の材笛変化や熱変形を防止することができる。(d) Since the advantageous cooling effect spreads to the machined surface of the workpiece, it is possible to save or eliminate the need for cooling water, and it is possible to prevent material changes and thermal deformation of the machined surface.
（ｅ）ワーク全体を凍結水に埋め込んだ状態で加工する
ことができるので、穴明は加工の場合には、亀裂等の加
工不良を防止できる。(e) Since the entire workpiece can be processed while being embedded in frozen water, processing defects such as cracks can be prevented when drilling holes.
第１図〜第３図は本発明の第１実施例を示す。
第１図はワーク凍結保持装置の要部側面図、第２図はそ
の使用状態を示す同要部側面図、第３図は電子冷却装置
の概要を示す断面図である。第４図は本発明の第２実施
例を示すワーク凍結保持装置の要部断面図である。第５
図は本発明の第３実施例を示すワーク凍結保持装置の部
分断面図である。
第６図は本発明の第４実施例を示すワーク凍結保持装置
の要部断面図である。第７図は本発明の第５実施例を示
すワーク凍結保持装置の部分断面図である。第８図は比
較例を示すワーク保持装置の部分断面図である。
１・・・ワークホルダ
１ａ・・表面 １ｂ・・・背面２・・・ワーク
３・・・電子冷却装置４・・・吸熱面
５・・・放熱面１０Ａ、ＩＯＢ・・・砥石 １
２・・・ソー１３・・・フィン １４・・・タ
ンク１５・・・カラー １６・・・ファン１７
・・・穴明は工具 １８・・・ダミースペーサ切断
面
■」・・・貫通孔
・・・水
Ｗ・・・凍結水（氷）1 to 3 show a first embodiment of the present invention. FIG. 1 is a side view of the main parts of the workpiece freezing and holding device, FIG. 2 is a side view of the main parts showing the state of use thereof, and FIG. 3 is a cross-sectional view showing the outline of the electronic cooling device. FIG. 4 is a sectional view of a main part of a workpiece freezing and holding device showing a second embodiment of the present invention. Fifth
The figure is a partial sectional view of a workpiece freezing and holding device showing a third embodiment of the present invention. FIG. 6 is a sectional view of a main part of a workpiece freezing and holding device showing a fourth embodiment of the present invention. FIG. 7 is a partial sectional view of a workpiece freezing and holding device showing a fifth embodiment of the present invention. FIG. 8 is a partial sectional view of a workpiece holding device showing a comparative example. 1... Work holder 1a... Surface 1b... Back 2... Work 3... Electronic cooling device 4... Endothermic surface
5... Heat dissipation surface 10A, IOB... Grindstone 1
2... Saw 13... Fin 14... Tank 15... Collar 16... Fan 17
...Drilling holes are tools 18...Dummy spacer cutting surface■"...Through hole...Water W...Frozen water (ice)
Claims (2)
することを特徴とするワークの加工方法。(1) A workpiece processing method characterized by embedding part or all of the workpiece in frozen water.
、該ワークホルダの背面に吸熱面を接して固着された電
子冷却装置とを具備してなることを特徴とするワーク凍
結保持装置。(2) A workpiece freeze-holding device comprising: a workholder that holds the workpiece via freezing water; and an electronic cooling device fixed to the back surface of the workholder with its heat-absorbing surface in contact with the workpiece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10024388 | 1988-07-27 | ||
| JP63-100243 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02124243A true JPH02124243A (en) | 1990-05-11 |
Family
ID=14268806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1116465A Pending JPH02124243A (en) | 1988-07-27 | 1989-05-09 | Working method for work and freeze holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02124243A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0699504A1 (en) * | 1994-08-29 | 1996-03-06 | Shin-Etsu Handotai Company Limited | Method and apparatus for surface-grinding of workpiece |
| CN107088827A (en) * | 2017-04-27 | 2017-08-25 | 东莞市银泰玻璃有限公司 | A kind of processing technology of ground glass |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030376B2 (en) * | 1972-09-20 | 1975-09-30 | ||
| JPS62162437A (en) * | 1986-01-14 | 1987-07-18 | Mitsubishi Heavy Ind Ltd | Workpiece holding method |
-
1989
- 1989-05-09 JP JP1116465A patent/JPH02124243A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030376B2 (en) * | 1972-09-20 | 1975-09-30 | ||
| JPS62162437A (en) * | 1986-01-14 | 1987-07-18 | Mitsubishi Heavy Ind Ltd | Workpiece holding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0699504A1 (en) * | 1994-08-29 | 1996-03-06 | Shin-Etsu Handotai Company Limited | Method and apparatus for surface-grinding of workpiece |
| CN107088827A (en) * | 2017-04-27 | 2017-08-25 | 东莞市银泰玻璃有限公司 | A kind of processing technology of ground glass |
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