JPH02122704A - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPH02122704A JPH02122704A JP27567288A JP27567288A JPH02122704A JP H02122704 A JPH02122704 A JP H02122704A JP 27567288 A JP27567288 A JP 27567288A JP 27567288 A JP27567288 A JP 27567288A JP H02122704 A JPH02122704 A JP H02122704A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- main body
- heat insulating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 abstract description 13
- 239000002699 waste material Substances 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分ｗｍ＞
本発明は、恒温槽実用の圧電発振器を利用分野とｉ）、
特に、消費電力を低減した水晶発振器に関する。[Detailed description of the invention] (Industrial application wm> The present invention is applied to a piezoelectric oscillator that can be used in a thermostatic chamber i);
In particular, it relates to a crystal oscillator with reduced power consumption.
（発明の背景）
水晶発振器は、特に周波数安定度が浸れていることから
、周波数及び時間の基準源として例えば通信機器に有用
されている。近年では、通信事情の混雑や多用化により
、特に、温度変化に対して安定で消費電力の少ない恒温
槽使用の水晶発振器が望まれている（参照：実願昭６１
−２７４７号）。BACKGROUND OF THE INVENTION Crystal oscillators are useful as frequency and time reference sources, for example in communication equipment, because of their particularly excellent frequency stability. In recent years, due to the congestion and increased use of communications, there has been a demand for crystal oscillators that use a thermostatic chamber, which is stable against temperature changes and consumes less power (see: Utility Model Application No. 61).
-2747).
（従来技術）
第３図は、この種の水晶発振器の一例を示す概略構成図
である。なお、第３図（ｎ）は断面図、同図（ｈ）は分
解斜視図である。(Prior Art) FIG. 3 is a schematic configuration diagram showing an example of this type of crystal oscillator. Note that FIG. 3(n) is a sectional view, and FIG. 3(h) is an exploded perspective view.
水晶発振器は、大略、水晶振動子１を収納（７た恒温槽
２を断熱界Ｐｌ！３内に収容し、これらを発振Ｐ４筐体
４に封入してなる。水晶振動子は例えば周波数温度特性
を三次曲線とするＡＴカットとし、恒温槽体２は熱線５
が巻装されてサーミスタ６を固着する。そして、図示し
ない導ＳＳ形成された回路基板７の一方の板面に配設さ
れた出力増幅用のトランジスタ８上に密接して取着する
。回路基板７の他方の板面には、水晶振動子１を駆動す
る発振回路用や恒温槽体２の熱線５に供給する電流を制
御する温度制御用の各回路素子９を配設する「図中の点
線枠（イ）」。なお、一方の板面には熱線５の電流制御
用として図示しない固定抵抗が設けられる。A crystal oscillator is generally constructed by housing a crystal oscillator 1 (7) and a constant temperature bath 2 within an adiabatic field Pl!3, and enclosing them in an oscillation P4 housing 4.The crystal oscillator has, for example, a frequency temperature characteristic. is an AT cut with a cubic curve, and the constant temperature chamber body 2 is a hot wire 5.
is wound to fix the thermistor 6. Then, it is closely attached to an output amplifying transistor 8 disposed on one plate surface of a circuit board 7 (not shown) formed with conductive SS. On the other board surface of the circuit board 7, circuit elements 9 for an oscillation circuit that drives the crystal resonator 1 and for temperature control that controls the current supplied to the hot wire 5 of the thermostatic chamber 2 are arranged. Dotted line frame (a) in the middle. Note that a fixed resistor (not shown) is provided on one plate surface for controlling the current of the hot wire 5.
断熱容器３は四部からなる断熱基体１０と断熱容器本体
１１とからなる。断熱基体１０は半体状と１７、断熱容
器本体−１１は恒温槽２を収納する四部１２が開口面側
に形成されろ。発振器筐体４は例えば例詣からなるベー
ス１３とカバー１４とからなる。そして、ベース１３を
貫通したリード線１５が断熱基体１０の四隅部を貫通固
定し、発振器筐体４内に断熱容器３を収容する。なお、
リード綿１５は回路基板７の各導電路と接続し、図示し
ない外部回路に接続される。The heat insulating container 3 consists of a heat insulating base 10 and a heat insulating container body 11, which are made up of four parts. The heat insulating base 10 has a half body shape 17, and the heat insulating container main body 11 has four parts 12 for housing the thermostatic chamber 2 formed on the opening side. The oscillator housing 4 includes a base 13 and a cover 14, for example. Lead wires 15 passing through the base 13 penetrate and fix the four corners of the heat insulating base 10, and the heat insulating container 3 is accommodated within the oscillator housing 4. In addition,
The lead cotton 15 is connected to each conductive path on the circuit board 7, and is connected to an external circuit (not shown).
１７たがって、このようなものでは、断熱容器３を樹脂
からなる発振器筐体４に収容し、発振器筺体を第２の断
熱容器として作用させる等により消費電力を低減する。17. Therefore, in such a device, the power consumption is reduced by housing the heat insulating container 3 in the oscillator housing 4 made of resin and having the oscillator housing act as a second heat insulating container.
（従来技術の問題点）
しかしながら、この水晶発振器で（よ回路基板７を通常
ガラスエポキシ基板とする。そして、本田願人らの調べ
ではこのガラスエポキシ基板の体積により消費電力が増
加することが判明した。すなわち、ガラスエポキシ基板
はその熱伝導が小さくて熱容量が大きいことに起因し、
不要電力が消費される間層があった。(Problems with the prior art) However, in this crystal oscillator, the circuit board 7 is usually made of a glass epoxy board. According to research by Ganto Honda et al., it was found that power consumption increases due to the volume of this glass epoxy board. In other words, this is due to the fact that the glass epoxy substrate has low thermal conductivity and high heat capacity.
There was an interlayer where unnecessary power was consumed.
（考案の目的）
本考案は、消費電力が少ない恒温槽使用の水晶発振器を
提供することを目的とする。(Purpose of the invention) The object of the invention is to provide a crystal oscillator using a constant temperature oven and which consumes less power.
（発明の解決手段）
本発明は、回路基板を基板本体と該基板本体から延出し
た基板腕部とからなる形成し、水晶振動子を収容１７た
恒温槽と各回路素子とを前記基板本体の両生板面に取着
し、基板腕部をリード線により接続して回路基板の体積
を小さくしたことを解決手段とする。以下、本発明の一
実施例を説明する。(Means for Solving the Invention) The present invention provides a circuit board consisting of a board main body and a board arm extending from the board main body, and a constant temperature chamber 17 containing a crystal resonator and each circuit element in the board main body. The solution is to reduce the volume of the circuit board by attaching it to both sides of the circuit board and connecting the board arms with lead wires. An embodiment of the present invention will be described below.
（考案の実施例）
第１図は、本考案の一実施例を示す水晶発振器の図で、
同図（ａ）は一部破断図、同図（ｂ）は断面図、同図（
Ｃ）は分解斜視図である。なお、前従来例図と同一部分
には同番号を付与してその説明（よ簡略する。(Embodiment of the invention) Fig. 1 is a diagram of a crystal oscillator showing an embodiment of the invention.
Figure (a) is a partially cutaway view, figure (b) is a sectional view, figure (
C) is an exploded perspective view. In addition, the same numbers are given to the same parts as in the previous conventional example diagram, and the explanation thereof will be simplified.
水晶発振器は、前述したようにＡＴカットの水晶ｒＭ動
子１を恒温槽２に収納して回路基板に１６に配設して断
熱容器３内に収容し、これらを発振！ｆｆ体４に封入し
てなる。As mentioned above, the crystal oscillator is constructed by storing an AT-cut crystal rM oscillator 1 in a constant temperature bath 2, disposing it on a circuit board 16, and housing it in a heat insulating container 3, and then oscillating them! It is enclosed in ff body 4.
回路基板１６はガラスエポキシ材とし、矩形状の基板本
体１７とその間部から放射状に延出した基板腕部１８
（ａ、ｂ、ｃＳｄ）とからなる。そして、基板本体１７
上の一方の主板面にトランジスタ８を配設し、その上に
恒温槽２を密接して取着する。ｔな、他方の主板面には
発振回路用や温度制御用の各回路素子９を配設する。な
お、一方の板面には電流制御用の図示しない固定抵抗が
設けられる。そして、基板本体１７を断熱容器本体１１
の凹部１２に相当する断熱基体１０の中央部に、基板腕
部１８をその隅部に位置させ、凹部１２に恒温槽３を収
納する。また、基板腕部１８の先端側はベース１３のリ
ード端子１５ （ａＳｂ。The circuit board 16 is made of glass epoxy material, and includes a rectangular board body 17 and board arms 18 extending radially from the space between the rectangular board body 17.
(a, b, cSd). Then, the board body 17
A transistor 8 is disposed on one of the upper main plate surfaces, and a thermostatic chamber 2 is closely attached thereon. On the other main plate surface, circuit elements 9 for oscillation circuits and temperature control are arranged. Note that a fixed resistor (not shown) for current control is provided on one plate surface. Then, the substrate body 17 is attached to the heat insulating container body 11.
At the center of the heat insulating base 10 corresponding to the recess 12 , the substrate arm 18 is located at the corner thereof, and the constant temperature bath 3 is housed in the recess 12 . Further, the lead terminal 15 (aSb) of the base 13 is connected to the tip side of the board arm portion 18.
ｃｄ）を貫通して図示しない導電路と電気的に接続して
固定する。そして、断熱容器本体１１を断熱基体１０外
周に当接して恒温槽２等を凹部１２に収容し、断熱容器
３を樹脂からなる発振器筐体により封入する。なお、発
振器筐体４はカバー１４に設けた突起１９とベースに設
けた孔２０とを嵌合して形成される。cd) and is electrically connected to a conductive path (not shown) and fixed. Then, the heat insulating container body 11 is brought into contact with the outer periphery of the heat insulating base 10, the thermostatic chamber 2 and the like are accommodated in the recess 12, and the heat insulating container 3 is enclosed in an oscillator housing made of resin. The oscillator housing 4 is formed by fitting a projection 19 provided on the cover 14 into a hole 20 provided on the base.
このようなものでは、基板本体１７の四隅部から腕部を
延出してリード端子１５と接続するようにしたので、前
述した回路基板７と比較して各辺の不要部分を削除して
その体積を減する。したがって、回路基板の熱容量を小
さくして消費電力の無駄を省くことができる。第２図は
従来例と比較した本実施例の消費電流特性で約１０ｍＡ
節約できろ。なお、第２図の曲線（イ）は本実施例、同
曲線（〜）は従来例である。In this type of device, the arms extend from the four corners of the board body 17 and are connected to the lead terminals 15, so compared to the circuit board 7 described above, unnecessary parts on each side are removed and the volume increases. Reduce. Therefore, it is possible to reduce the heat capacity of the circuit board and eliminate wasteful power consumption. Figure 2 shows the current consumption characteristics of this embodiment compared to the conventional example, which is about 10 mA.
You can save money. Note that the curve (a) in FIG. 2 is for this embodiment, and the curve (-) is for the conventional example.
（他の事項）
なお、上記実施例では水晶発振器を例にとって本考案を
説明したが、例えばニオブ、タンタル等からなる圧電発
振器にも適用できることはいうまでもない。また、回路
基板はガラスエポキシ材としたが、熱容量はその大きさ
に比例するので例えばセラミック材であっても本発明は
適用される。(Other Matters) In the above embodiments, the present invention has been explained using a crystal oscillator as an example, but it goes without saying that it can also be applied to a piezoelectric oscillator made of niobium, tantalum, etc., for example. Although the circuit board is made of glass epoxy material, the present invention is also applicable to ceramic materials, for example, since the heat capacity is proportional to the size of the circuit board.
また、本実施例では、一方の板面に恒温槽体、他方の板
面に回路素子９を配設（７たが、必要に応じて一方の板
面回路素子９を配設してもよい。また、発振器筐体は樹
脂とｊ７て第２の断熱容器を形成したが、例えば金属材
であってもそれなりの効果を奏する。また、トランジス
タ８の発熱を利用するため、トランジスタ８に恒温槽体
２を取着して断熱容器３の四部１２に収容したが、凹部
１２には恒温槽２のみ、あるいは他の発熱体を収容した
としてもよい。要は回路基板１を基板本体１７と基板腕
部１８とから形成し、回路基板の体積を小さくして消費
電力を低減したものは本発明の技術的範囲に基本的に属
する。In addition, in this embodiment, the thermostatic chamber body is provided on one board surface, and the circuit element 9 is provided on the other board surface (7), but the circuit element 9 may be provided on one board surface as necessary. In addition, although the oscillator housing is made of resin to form the second heat insulating container, for example, a metal material can also have a certain effect.Furthermore, in order to utilize the heat generated by the transistor 8, the transistor 8 is placed in a constant temperature oven. Although the body 2 is attached and housed in the four parts 12 of the heat insulating container 3, the concave part 12 may house only the constant temperature oven 2 or another heat generating body. A device formed from the arm portion 18 to reduce power consumption by reducing the volume of the circuit board basically falls within the technical scope of the present invention.
（発明の効果）
本発明は、回路基板を基板本体と該基板本体から延出し
た基板腕部とからなる形成し、水晶振動子を収容した恒
温槽と各回路素子とを前記基板本体の両生板面に取着し
、基板腕部をリード線により接続して回路基板の体積を
小さくしたので、消費電力が少ない恒温槽使用の水晶発
振器を提供できろ。(Effects of the Invention) The present invention provides a circuit board consisting of a board main body and a board arm extending from the board main body, and a constant temperature bath containing a crystal resonator and each circuit element are connected to each other in an ambidextrous state of the board main body. By attaching it to the board surface and connecting the board arms with lead wires to reduce the volume of the circuit board, we can provide a crystal oscillator that consumes less power and uses a constant temperature oven.
第１図（ｎ）は本発明の一実施例を説明する水晶発振器
の一部破断図、同図（ｂ）は同断面図、同図（Ｃ）は分
解斜視図、第２図は本発振器の効果を説明する消費電流
特性図である。
子、１
凹部、
一
２ 恒温槽、３ 断熱容器、
熱線、６ サーミスタ、７、
■・ランジスタ、９ 回路素
１１ 樹脂カバー １２・
１４ 発振器カバー １５
基板本体、１８ 基板腕部、
孔。
水晶振動子、
発振器筐体、５
回路基板、８
０ 樹脂基体、
１３ ベース、
ド端子、１７
突起、２０
第
■
閲（ｂ）
第１！！１
（Ｃ）
糸１ｔｈ１１寺聞
令FIG. 1(n) is a partially cutaway view of a crystal oscillator illustrating an embodiment of the present invention, FIG. 1(b) is a sectional view thereof, FIG. 1(C) is an exploded perspective view, and FIG. FIG. 3 is a current consumption characteristic diagram illustrating the effect of FIG. 1 recess, 12 thermostat, 3 heat insulating container, heat wire, 6 thermistor, 7, transistor, 9 circuit element 11 resin cover 12, 14 oscillator cover 15 board body, 18 board arm, hole. Crystal resonator, oscillator housing, 5 circuit board, 8 0 resin base, 13 base, terminal, 17 protrusion, 20 Part ■ Review (b) Part 1! ! 1 (C) Thread 1th 11 Temple Monryo
Claims (1)
回路基板と、前記基板本体の一方の表面に取着される水
晶振動子を収容した恒温槽と、前記基板本体の他方の板
面に取着される回路素子と、前記回路基板の他方の板面
側に設けられる断熱基体と、前記断熱基体の外周部に当
接して断熱容器を形成するとともに前記恒温槽を収容す
る凹部を有する断熱容器本体と、前記断熱容器を収容す
るベースとカバーとからなる発振器筐体とを具備した圧
電発振器。A circuit board consisting of a board main body and a board arm extending from the board main body, a constant temperature chamber housing a crystal resonator attached to one surface of the board main body, and the other board surface of the board main body. a circuit element attached to the circuit board; a heat insulating base provided on the other board side of the circuit board; and a recess that contacts the outer periphery of the heat insulating base to form a heat insulating container and housing the thermostatic oven. A piezoelectric oscillator comprising a heat insulating container body, and an oscillator housing consisting of a base and a cover that accommodate the heat insulating container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27567288A JPH02122704A (en) | 1988-10-31 | 1988-10-31 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27567288A JPH02122704A (en) | 1988-10-31 | 1988-10-31 | Piezoelectric oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122704A true JPH02122704A (en) | 1990-05-10 |
Family
ID=17558739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27567288A Pending JPH02122704A (en) | 1988-10-31 | 1988-10-31 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122704A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005195580A (en) * | 2004-01-07 | 2005-07-21 | Schlumberger Technology Bv | Method and system featuring frequencies of crystal resonator |
| WO2015137204A1 (en) * | 2014-03-11 | 2015-09-17 | 日本電波工業株式会社 | Oven-controlled crystal oscillator |
-
1988
- 1988-10-31 JP JP27567288A patent/JPH02122704A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005195580A (en) * | 2004-01-07 | 2005-07-21 | Schlumberger Technology Bv | Method and system featuring frequencies of crystal resonator |
| WO2015137204A1 (en) * | 2014-03-11 | 2015-09-17 | 日本電波工業株式会社 | Oven-controlled crystal oscillator |
| JP2015173309A (en) * | 2014-03-11 | 2015-10-01 | 日本電波工業株式会社 | Crystal oscillator with thermostatic bath |
| US10256825B2 (en) | 2014-03-11 | 2019-04-09 | Nihon Dempa Kogyo Co., Ltd. | Oven controlled crystal oscillator |
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