JPH08237031A - Piezoelectric oscillator - Google Patents

Abstract

PURPOSE: To improve the performance without losing advantages of small size and low power consumption of the piezoelectric oscillator using a small sized low power consumption constant temperature oven in which only a piezoelectric vibrator is located. CONSTITUTION: The oscillator adopts a method that an oscillation circuit component 3 is set close to a constant temperature oven 2 and connected thermally thereto via a heat-conducting member 6, and since the oscillation circuit component 3 is set on a board 4 on which other components are mounted, the heat of the constant temperature oven 2 is lost considerably by the board. In order to solve it, only a part at which the oscillation circuit component 3 is mounted is surrounded by a slit in the board on which the oscillation circuit component 3 and other components are mounted, only the part of the oscillation circuit component 3 is heated and the diffusion of the heat to the other parts is prevented by the presence of the slit.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】恒温槽を使用した圧電発振器の構
造に関する。TECHNICAL FIELD The present invention relates to a structure of a piezoelectric oscillator using a thermostatic chamber.

【０００２】[0002]

【従来の技術】従来より、周囲の温度変化による発振周
波数への影響を避けるために恒温槽を使用した圧電発振
器が広く利用されている。恒温槽を使用した圧電発振器
には、圧電振動子と発振回路を恒温槽に入れた大型の高
性能タイプと、圧電振動子のみを恒温槽に入れた小型の
簡易なタイプがある。近年小型でより高性能な圧電発振
器が要求されている。2. Description of the Related Art Conventionally, a piezoelectric oscillator using a thermostatic chamber has been widely used in order to avoid the influence of ambient temperature change on the oscillation frequency. Piezoelectric oscillators that use a constant temperature bath are classified into a large-scale high-performance type in which a piezoelectric vibrator and an oscillation circuit are placed in a constant temperature bath, and a small and simple type in which only a piezoelectric vibrator is placed in the constant temperature bath. In recent years, there has been a demand for a piezoelectric oscillator having a small size and higher performance.

【０００３】[0003]

【発明が解決しようとする課題】近年小型、低消費電力
でより高性能な圧電発振器の要求が高まり、発振回路の
周囲の温度変化による影響を軽減するために、発振回路
部品を恒温槽の発熱体に接近させて導熱材を介して熱的
に接続すると良好な結果が得られるが、発振回路部品は
他の部品も取り付けられている大型の基板に組み込まれ
ているため、恒温槽の熱が大幅に基板部に奪われてしま
い、発熱体の温度が保てないか、または発熱体の消費電
力が大幅に増大して小型化、低消費電力化できない課題
がある。In recent years, there has been an increasing demand for a piezoelectric oscillator of small size, low power consumption and higher performance, and in order to reduce the influence of the temperature change around the oscillation circuit, the oscillation circuit component is heated in a constant temperature bath. Good results can be obtained by bringing them close to the body and thermally connecting them via a heat conductive material, but since the oscillator circuit components are built into a large board on which other components are also attached, There is a problem in that the temperature of the heating element cannot be maintained because it is largely taken by the substrate portion, or the power consumption of the heating element is significantly increased, and downsizing and low power consumption cannot be achieved.

【０００４】[0004]

【課題を解決する手段】発振回路部品と他の部品が取り
付けられた基板の中で、発振回路部品の取付られている
部分のみをスリットで囲み、発振回路部品の部分のみ加
熱し、その熱の他の部分への拡散をスリットで防止する
ことで課題を解決した。In a board on which an oscillator circuit component and other components are attached, only a portion where the oscillator circuit component is attached is surrounded by a slit, and only the oscillator circuit component portion is heated, The problem was solved by preventing the diffusion to other parts with a slit.

【０００５】[0005]

【実施例】図２に、本発明の基板４のスリット５の実施
例を示す下から見た平面図である。このスリット５で囲
まれた中に発振回路部品３を配置する。図１に、本発明
の実施例の側面図を示す。図２に示した基板上のスリッ
ト５で囲まれた部分に発振用回路部品３が配置され、図
１に示すように発振用回路部品３の上に発熱体を具備し
た恒温槽２が取り付けられている。恒温槽２の中に圧電
振動子１が装着されており、恒温槽２の熱により周囲の
温度変化に関わらず一定の温度に保たれている。恒温槽
２と基板４及び発振用回路部品３の間には、導熱材６が
充填され、恒温槽２の熱が発振回路部品３に伝わり易く
出来ている。EXAMPLE FIG. 2 is a plan view from below showing an example of the slit 5 of the substrate 4 of the present invention. The oscillator circuit component 3 is arranged inside the slit 5. FIG. 1 shows a side view of an embodiment of the present invention. The circuit part 3 for oscillation is arranged in the portion surrounded by the slit 5 on the substrate shown in FIG. 2, and the thermostatic chamber 2 having a heating element is mounted on the circuit part 3 for oscillation as shown in FIG. ing. The piezoelectric vibrator 1 is mounted in the constant temperature bath 2 and is kept at a constant temperature by the heat of the constant temperature bath 2 regardless of the ambient temperature change. A heat-conducting material 6 is filled between the constant-temperature bath 2, the substrate 4, and the oscillation circuit component 3 so that the heat of the constant-temperature bath 2 can be easily transferred to the oscillation circuit component 3.

【０００６】恒温槽２の熱を発振用回路部品３に伝える
ことにより、従来の圧電振動子１のみの温度を一定にし
て、発振回路部品３は周囲温度に放置された場合に比べ
て、発振回路の温度特性分の影響が軽減されるので、圧
電発振器としての周囲の温度による周波数の変動が著し
く少なくできた。By transmitting the heat of the constant temperature bath 2 to the oscillation circuit component 3, the temperature of only the conventional piezoelectric vibrator 1 is kept constant, and the oscillation circuit component 3 oscillates as compared with the case where it is left at the ambient temperature. Since the influence of the temperature characteristic of the circuit is reduced, the frequency fluctuation due to the ambient temperature of the piezoelectric oscillator can be significantly reduced.

【０００７】発振回路部品の基板部分を基板に固定接続
して置くために、ブリッジ部７を残す。このブリッジ部
７を通して、発振回路への電源の供給や、発振回路から
の出力の引き出し等が行われる。また導熱材としては、
導熱性接着剤、又は導熱性コンパウンド等が使用でき
る。さらに、恒温槽は熱筒と発熱体からなり、熱筒の周
囲に発熱体が配置されている構造になっている。なお発
振回路部品に使用されるのは、チップ部品が主であるが
ディスクリート部品でも差し支えない。The bridge portion 7 is left so that the board portion of the oscillator circuit component is fixedly connected to the board. Power is supplied to the oscillation circuit and output from the oscillation circuit is performed through the bridge unit 7. Also, as the heat conductive material,
A heat conductive adhesive or a heat conductive compound can be used. Further, the constant temperature bath comprises a heating cylinder and a heating element, and the heating element is arranged around the heating cylinder. Chip components are mainly used for oscillator circuit components, but discrete components may also be used.

【０００８】[0008]

【発明の効果】本発明によって、圧電振動子のみを熱筒
の中に入れて温度を一定に保つだけでなく、基板に取り
付けた発振回路部品の周囲をスリットで囲み基板の他の
部分への熱の拡散を防止したので、発振回路部品にのみ
熱を導熱材を介して効率よく供給して、発振回路部品の
周囲の温度変化の影響を著しく軽減できるので、圧電振
動子を恒温槽に入れる方式の小型低消費電力型の圧電発
振器においても、小型低消費電力の特徴を損なうことな
く周波数温度特性を非常に向上させることができた。According to the present invention, not only is the piezoelectric vibrator placed in a heating cylinder to keep the temperature constant, but the surroundings of the oscillator circuit component mounted on the substrate are surrounded by slits to the other parts of the substrate. Since the heat is prevented from diffusing, heat can be efficiently supplied only to the oscillation circuit components via the heat conducting material, and the influence of temperature changes around the oscillation circuit components can be significantly reduced, so put the piezoelectric vibrator in a thermostatic chamber. Even in the small-sized and low power consumption type piezoelectric oscillator, the frequency temperature characteristic could be greatly improved without deteriorating the characteristics of the small size and low power consumption.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の発振回路部品と熱筒等の関係を示す実
施例の側面図である。FIG. 1 is a side view of an embodiment showing the relationship between an oscillator circuit component of the present invention and a heating cylinder or the like.

【図２】本発明のスリットの実施例を示す下から見た平
面図である。FIG. 2 is a plan view from below showing an embodiment of the slit of the present invention.

【符号の説明】[Explanation of symbols]

１ 圧電振動子 ２ 恒温槽 ３ 発振回路部品 ４ 基板 ５ スリット ６ 導熱材 1 Piezoelectric vibrator 2 Constant temperature bath 3 Oscillation circuit parts 4 Substrate 5 Slit 6 Thermal material

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 圧電振動子を恒温槽に入れて発振回路部
品を恒温槽外近傍の基板に配置した圧電発振器におい
て、 該発振回路部品に供給された熱が、該基板の他の部分へ
の拡散を防止するために、該基板の該発振回路部品の部
分の周囲をスリットで囲んだことを特徴とする圧電発振
器。1. In a piezoelectric oscillator in which a piezoelectric vibrator is placed in a thermostatic chamber and an oscillation circuit component is arranged on a substrate near the outside of the thermostatic chamber, the heat supplied to the oscillation circuit component is transferred to other parts of the substrate. A piezoelectric oscillator, characterized in that, in order to prevent diffusion, the periphery of the portion of the oscillator circuit component of the substrate is surrounded by a slit. 【請求項２】 該発振回路部品に効率よく恒温槽発熱体
の熱を供給するために、該恒温槽発熱体と該基板の該発
振回路部品の間に、導熱材を充填したことを特徴とする
特許請求の範囲第１項記載の圧電発振器。2. A heat-conducting material is filled between the constant-temperature bath heating element and the oscillation-circuit component of the substrate in order to efficiently supply the heat of the constant-temperature bath heating element to the oscillation circuit component. The piezoelectric oscillator according to claim 1.