JPH0210884A - Thick film lithography method - Google Patents
Thick film lithography methodInfo
- Publication number
- JPH0210884A JPH0210884A JP63161631A JP16163188A JPH0210884A JP H0210884 A JPH0210884 A JP H0210884A JP 63161631 A JP63161631 A JP 63161631A JP 16163188 A JP16163188 A JP 16163188A JP H0210884 A JPH0210884 A JP H0210884A
- Authority
- JP
- Japan
- Prior art keywords
- lithography
- shape
- thick film
- pattern
- program
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000001459 lithography Methods 0.000 title abstract 11
- 230000001133 acceleration Effects 0.000 claims abstract description 3
- 238000001514 detection method Methods 0.000 claims 1
- 239000011345 viscous material Substances 0.000 claims 1
- 238000010924 continuous production Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、厚膜ＩＣ等を形成する際に、利用できる厚膜
描画方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thick film drawing method that can be used when forming thick film ICs and the like.
従来の技術
従来の厚膜描画装置にて、厚膜ＩＣを形成する際には、
回路基板上の厚膜パターンを接着検出すること無く入力
されたＮＣプログラムに基づいて描画する様に構成され
ている。その為、連続生産に入る前に第５図に示す様に
、あらかじめ作成したＮＣプログラムを厚；漠描画装置
に入力し、又マニュアル操作にて吐出圧を調整し回路基
板に厚膜回路を描画形成し、形成された厚膜回路の形状
を、顕微鏡等で、目視によって確認し、基準描画パター
ンデータとの形状の差異があった場合には、上記のプロ
グラム及び吐出圧をマニュアルにて補正する。次いで、
補正したプログラムと吐出圧に基づいて回路基板に厚膜
回路を描画形成し、再度形状の差異を確認するという動
作を所定の形状が得られるまで繰シ返し、所定の形状が
得られると連続生産に入っている。Conventional technology When forming thick film ICs using conventional thick film writing equipment,
It is configured to draw a thick film pattern on a circuit board based on an input NC program without detecting adhesion. Therefore, before starting serial production, as shown in Figure 5, a previously created NC program is input into a thick film drawing device, and the discharge pressure is manually adjusted to draw thick film circuits on the circuit board. Visually check the shape of the formed thick film circuit using a microscope, etc., and if there is a difference in shape from the standard drawing pattern data, manually correct the above program and discharge pressure. . Then,
Based on the corrected program and discharge pressure, a thick film circuit is drawn and formed on the circuit board, and the difference in shape is confirmed again. This operation is repeated until the desired shape is obtained. Once the desired shape is obtained, continuous production begins. It's in.
発明が解決しようとする課題
しかしながら上記方法では、品種切替の度に描画確認、
補正を何度か入手で行なう必要があり、連続生産に入る
までに時間と手間を要するとともに、描画した回路基板
を無駄にしなければならないという問題点があった。Problems to be Solved by the Invention However, in the above method, drawing confirmation is required every time the product type is changed.
There was a problem in that it was necessary to carry out correction several times, which required time and effort before starting serial production, and the printed circuit board had to be wasted.
本発明は、上記従来の問題点に鑑み、厚膜回路の基準描
画パターンデータとの形状の差異を検出して、描画プロ
グラムを補正し、かつプログラムによって吐出圧を自動
コントロールし直ちに連続生産に移行できる厚膜描画方
法を提供することを目的とする。In view of the above-mentioned conventional problems, the present invention detects the difference in shape from the standard drawing pattern data of thick film circuits, corrects the drawing program, automatically controls the discharge pressure according to the program, and immediately starts continuous production. The purpose of this invention is to provide a thick film drawing method that is possible.
課題を解決するための手段
本発明は、上記目的を達成する為に、回路基板に所定の
厚膜素子パターンを形成する際に、回路非形成部位に、
厚膜描画を行なうのに先だって、テストパターンの形状
を認識して、あらかじめ設定された基準描画パターンデ
ータに対し、形状の差異を検出結果に基づいて、描画プ
ログラムを補正して描画することを特徴とする。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides, when forming a predetermined thick film element pattern on a circuit board, a circuit-free area.
Prior to thick film writing, the shape of the test pattern is recognized, and the drawing program is corrected and drawn based on the results of detecting differences in shape with respect to preset standard drawing pattern data. shall be.
作 用
本発明によれば、回路基板の回路非形成部位にテストパ
ターンを描画し、あらかじめ設定された基準描画パター
ンデータとの形状の差異を検出して、描画プログラムを
補正するので、人手による目視確認、プログラム補正及
び、吐出圧調整作業が不要となるとともに不良回路基板
も発生せず、プログラムを自動補正する事によって自動
品種切替が可能となる。According to the present invention, a test pattern is drawn on a non-circuit-forming portion of a circuit board, and a difference in shape from preset standard drawing pattern data is detected to correct the drawing program, so that manual visual inspection is not required. There is no need for confirmation, program correction, or discharge pressure adjustment work, and no defective circuit boards occur, and automatic product type switching is possible by automatically correcting the program.
実施例
以下本発明の一実施例を第１図〜第４図を参照しながら
説明する。EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 4.
第２図において、１は回路基板で、２点鎖線で示す回路
形成領域と回路非形成部３で構成される。In FIG. 2, reference numeral 1 denotes a circuit board, which is composed of a circuit formation area and a circuit non-formation area 3 shown by two-dot chain lines.
第３図で示す抵抗描画装置は、ペース５上にＸ軸モータ
６にてＸ方向に移動可能な移動テープ／Ｌ／７が設けら
れるとともに、この移動テープｌＶ７をＹ軸モータ８に
てＹ方向に移動可能に構成され、このテーブルの一端に
装着された描画ヘッド９が水平方向の任意の位置に移動
し得る様に構成され、さらに２軸モータ１０にて、高さ
位置を任意に調整可能に構成されている。前記描画ヘッ
ド９には一対のノズ／Ｌ／１１が設けられ、さらにその
側部に認識装置１２が取付られている。又図示しない制
御部に品種に応じて入力されたＮＣプログラムによって
描画ヘッド９が自動的に移動するとともに、ノズル１１
から抵抗ペーストが吐出され、所定の抵抗体が描画形成
されるように構成されている。The resistance drawing device shown in FIG. 3 is provided with a moving tape /L/7 that can be moved in the X direction by an X-axis motor 6 on a pace 5, and a moving tape /L/7 that can be moved in the The drawing head 9 attached to one end of this table can be moved to any position in the horizontal direction, and the height position can be adjusted arbitrarily using a two-axis motor 10. It is composed of The drawing head 9 is provided with a pair of nozzles /L/11, and a recognition device 12 is attached to the side thereof. In addition, the drawing head 9 is automatically moved according to an NC program input to a control unit (not shown) according to the product type, and the nozzle 11 is moved automatically.
A resistor paste is discharged from the resistor, and a predetermined resistor is drawn and formed.
第４図は、プログラマブル吐出圧コントロール機構部を
示し、１３は図示しない制御部の１構成要素の吐出圧コ
ントローラであシ、１４は図示しない制御部の１構成要
素の吐出ＯＮ、ＯＦＦタイミングコントローラである。FIG. 4 shows a programmable discharge pressure control mechanism, where 13 is a discharge pressure controller that is one component of the control section (not shown), and 14 is a discharge ON/OFF timing controller that is one component of the control section (not shown). be.
１６は吐出圧コントローラ１３により制御される比例制
御弁で、１６は吐出ＯＮ、ＯＦＦタイミングコントロー
ラ１４で制御される電磁弁、１７は内部にペースト材料
を有し、吐出圧コントローラ、及び、吐出ＯＮ。16 is a proportional control valve controlled by the discharge pressure controller 13; 16 is a solenoid valve controlled by the discharge ON/OFF timing controller 14; and 17 is a discharge pressure controller and a discharge ON valve having a paste material therein.
ＯＦＦタイミングコントローラによりペーストを吐出す
るノズルであり、プログラムによって設定された吐出圧
で抵抗体が描画形成されるように構成されている。This is a nozzle that discharges paste using an OFF timing controller, and is configured to draw and form a resistor at a discharge pressure set by a program.
第３図の抵抗描画装置において、品種切替により最初に
回路基板１に抵抗描画を行なう場合には、第１図に示す
ように、品種に応じた基準描画パターンデータを作成し
、品種に応じたＮＣプログラムを作成し、このデータ及
びプログラムを制御部に入力する。次にプログラムにそ
って描画ヘッド９が動作を開始する。まず前記テストパ
ターン４が所定の位置に位置決めされた回路基板１上に
描画される。このテストパターン４は、図示例では回路
非形成部３の任意の位置に描画される。In the resistor drawing device shown in FIG. 3, when first drawing a resistor on the circuit board 1 due to product type switching, standard drawing pattern data corresponding to the product type is created as shown in FIG. Create an NC program and input this data and program to the control unit. Next, the drawing head 9 starts operating according to the program. First, the test pattern 4 is drawn on the circuit board 1 positioned at a predetermined position. In the illustrated example, this test pattern 4 is drawn at an arbitrary position of the circuit-free portion 3.
次に認識装置１２にて、テストパターン４を認識して、
認識したデータを処理し、基準描画パターンデータに対
しての形状の差異を検出する。そして検出した形状（膜
厚、描画幅、描画長さ、描き始め形状、描き終シ形状）
の差異に応じて、制御部に入力されているプログラム（
加速度、吐出圧。Next, the recognition device 12 recognizes the test pattern 4,
The recognized data is processed to detect differences in shape with respect to standard drawing pattern data. Then, the detected shape (film thickness, drawing width, drawing length, drawing start shape, drawing end shape)
The program input to the control unit (
Acceleration, discharge pressure.
吐出ＯＮ、ＯＦＦタイミング、描画長さ）が自動的に補
正される。Ejection ON/OFF timing, drawing length) are automatically corrected.
そしてこの補正されたプログラムに基づいて、回路基板
１上の回路形成部２に形状の差異を発生することなく適
正な描画パターンで抵抗描画が行なわれ、抵抗体が形成
される。Then, based on this corrected program, resistance drawing is performed with an appropriate drawing pattern without producing any difference in shape on the circuit forming portion 2 on the circuit board 1, and a resistor is formed.
又、補正されたプログラムによって、回路非形成部３に
描画させ、その抵抗体の形状を、再度認識し、認識した
データを処理し、適正な描画形状になるようにプログラ
ムを補正することを繰り返し、所定の描画パターンにな
った時に回路基板１上の回路形成部２に形状の差異を発
生することなく適正な描画パターンで抵抗描画を行なう
事も可能である。In addition, the corrected program is used to draw on the non-circuit forming part 3, the shape of the resistor is recognized again, the recognized data is processed, and the program is repeatedly corrected so that the drawn shape is appropriate. It is also possible to perform resistance drawing with an appropriate drawing pattern without causing any difference in shape in the circuit forming portion 2 on the circuit board 1 when a predetermined drawing pattern is obtained.
上記実施例では、厚膜抵抗を形成する例だけを示したが
、その他の厚膜体を描画形成する場合にも適用できる事
はいうまでもない。In the above embodiment, only an example of forming a thick film resistor was shown, but it goes without saying that the present invention can also be applied to forming other thick film bodies by drawing.
又テストパターンの形状や配置位置も、描画すべきパタ
ーンや、形状の差異の検出方法に応じて都合の良いよう
に、任意に決定すればよい。Further, the shape and arrangement position of the test pattern may be arbitrarily determined depending on the pattern to be drawn and the method for detecting the difference in shape.
さらに上記実施例では、品種切替して最初の描画時だけ
テストパターンを形成して、基準描画パターンデータと
の形状の差異を検出するようにしたが、形状の差異の検
出を適当な時間間隔で行なうようにしてもよい。Furthermore, in the above embodiment, a test pattern is formed only during the first drawing after changing the product type, and the difference in shape from the standard drawing pattern data is detected. You may do so.
発明の効果
本発明の厚膜描画方法によれば、以上のように回路基板
の回路非形成部にテストパターンを描画し、基準描画パ
ターンデータとの形状の差異を検出して、プログラムを
補正するので、手間を要せず、かつ不良回路基板を発生
せずに、適正な描画が可能であり、プログラムの自動補
正によって、自動品種切替が可能となる等大なる効果を
発揮する。Effects of the Invention According to the thick film drawing method of the present invention, a test pattern is drawn on a non-circuit area of a circuit board as described above, and a difference in shape from the reference drawing pattern data is detected to correct the program. Therefore, proper drawing can be performed without requiring any effort and without generating defective circuit boards, and automatic correction of the program enables automatic product type switching, which has great effects.
第１図〜第４図は本発明の一実施例を示し、第１図は厚
膜描画開始工程のフローチャート図、第２図はテストパ
ターンを示す回路鋸板の平面図、第３図は描画装置の概
略構成を示す斜視図、第４図はプログラマブル吐出圧コ
ントロール機構部の斜視図、第５図は従来の厚膜描画開
始工程のフローチャート図である。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
３−８＄１神Ａ昏
４−−−テスにハ゛ミーソ
区
！？
派
閥
Ｕつ
踪1 to 4 show an embodiment of the present invention, FIG. 1 is a flowchart of the thick film drawing start process, FIG. 2 is a plan view of a circuit saw board showing a test pattern, and FIG. 3 is a drawing FIG. 4 is a perspective view of a programmable discharge pressure control mechanism, and FIG. 5 is a flowchart of a conventional thick film drawing start process. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3-8 $1 God A 4 --- Tess is in the spotlight! ? Faction U disappears
Claims (3)
て、厚膜描画を行なうのに先だって、回路非形成部にテ
ストパターンを描画し、テストパターンの形状を認識し
て、あらかじめ設定された基準描画パターンデータに対
し、形状の差異を検出し、この検出結果に基づいて、描
画プログラムを補正して、描画することを特徴とする厚
膜描画方法。(1) In a thick film drawing method in which a viscous substance is discharged from a nozzle, a test pattern is drawn on a non-circuit area before thick film drawing, the shape of the test pattern is recognized, and a preset standard is set. A thick film drawing method characterized by detecting a difference in shape in drawing pattern data, correcting a drawing program based on the detection result, and drawing.
始め形状，描き終り形状としたことを特徴とする特許請
求の範囲第１項記載の厚膜描画方法。(2) The thick film drawing method according to claim 1, wherein the pattern data includes film thickness, drawing width, drawing length, drawing start shape, and drawing end shape.
，吐出のオン，オフのタイミングを制御可能に構成した
特許請求の範囲第１項記載の厚膜描画方法。(3) The thick film drawing method according to claim 1, wherein the nozzle acceleration, discharge pressure, and discharge on/off timing can be controlled by pattern data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161631A JPH0210884A (en) | 1988-06-29 | 1988-06-29 | Thick film lithography method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161631A JPH0210884A (en) | 1988-06-29 | 1988-06-29 | Thick film lithography method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210884A true JPH0210884A (en) | 1990-01-16 |
Family
ID=15738858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161631A Pending JPH0210884A (en) | 1988-06-29 | 1988-06-29 | Thick film lithography method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210884A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6737207B2 (en) | 2000-04-25 | 2004-05-18 | Nikon Corporation | Method for evaluating lithography system and method for adjusting substrate-processing apparatus |
| JP2008160105A (en) * | 2006-12-20 | 2008-07-10 | Palo Alto Research Center Inc | Printing method of smooth microscale profile |
-
1988
- 1988-06-29 JP JP63161631A patent/JPH0210884A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6737207B2 (en) | 2000-04-25 | 2004-05-18 | Nikon Corporation | Method for evaluating lithography system and method for adjusting substrate-processing apparatus |
| US6879380B2 (en) | 2000-04-25 | 2005-04-12 | Nikon Corporation | Method for evaluating lithography system, method for adjusting substrate-processing apparatus, lithography system, and exposure apparatus |
| JP2008160105A (en) * | 2006-12-20 | 2008-07-10 | Palo Alto Research Center Inc | Printing method of smooth microscale profile |
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