JPH018549Y2 - - Google Patents
Info
- Publication number
- JPH018549Y2 JPH018549Y2 JP1981120146U JP12014681U JPH018549Y2 JP H018549 Y2 JPH018549 Y2 JP H018549Y2 JP 1981120146 U JP1981120146 U JP 1981120146U JP 12014681 U JP12014681 U JP 12014681U JP H018549 Y2 JPH018549 Y2 JP H018549Y2
- Authority
- JP
- Japan
- Prior art keywords
- packaging case
- plastic sheet
- integrated circuit
- integrated circuits
- static electricity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004806 packaging method and process Methods 0.000 claims description 19
- 239000002985 plastic film Substances 0.000 claims description 15
- 229920003023 plastic Polymers 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は集積回路を複数個並べて収納するため
の包装ケースに関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a packaging case for storing a plurality of integrated circuits side by side.
（従来の技術及びその問題点）
集積回路の輸送時に筒状の包装ケースに複数個
収納することが行なわれている。この筒状の包装
ケースは、従来アルミニウムまたはプラスチツク
を、所定の断面形状の口金から溶融押出して形成
する、いわゆる異形押出成形品であつた。しかし
ながら、アルミニウム製の包装ケースは極めて高
価であり、またプラスチツク製の包装ケースの場
合は、集積回路が静電気により障害を発生し易い
ので静電防止処理が必要とされるが、異形押出成
形した後の包装ケースに静電防止剤等を塗布する
ことは、包装ケースが複雑な形状のために難かし
い。また、商品名等を印刷する場合に、包装ケー
スが筒状なのでその外面に印刷しなければなら
ず、外部の部品との摩擦により印刷が剥離し易い
欠点があつた。さらに、プラスチツクの異形押出
では肉厚を薄く成形すると成形時に変形して正確
な断面形状の製品が得られないため、薄肉化がで
きず高価になるうらみがあつた。(Prior Art and its Problems) When transporting integrated circuits, a plurality of integrated circuits are stored in a cylindrical packaging case. This cylindrical packaging case has conventionally been a so-called profile extrusion molded product formed by melt-extruding aluminum or plastic through a mouthpiece having a predetermined cross-sectional shape. However, aluminum packaging cases are extremely expensive, and plastic packaging cases require antistatic treatment because the integrated circuits are easily damaged by static electricity. It is difficult to apply antistatic agents to packaging cases because of their complex shapes. Furthermore, when printing the product name, etc., it must be printed on the outer surface of the packaging case because it is cylindrical, and there is a drawback that the printing is likely to peel off due to friction with external parts. Furthermore, in profile extrusion of plastics, if the wall thickness is thinned, the product will deform during molding and it will not be possible to obtain a product with an accurate cross-sectional shape, making it impossible to make the wall thickness thinner and resulting in higher costs.
（問題点を解決するための手段）
本考案は以上のような問題点を静電防止処理し
た透明な一枚のプラスチツクシートを折り曲げて
相対する端部同志を接着して筒状体とすることで
解決したものであり、以下、添付図面により詳細
に説明する。(Means for solving the problem) The present invention solves the above-mentioned problems by bending a single transparent plastic sheet that has been treated to prevent static electricity and gluing the opposing ends together to form a cylindrical body. The problem will be explained in detail below with reference to the accompanying drawings.
第１図は本考案の集積回路用包装ケースの使用
状態の一例を示す斜視図であり、第２図は第１図
の−断面図である。 FIG. 1 is a perspective view showing an example of the usage state of the packaging case for integrated circuits of the present invention, and FIG. 2 is a sectional view taken along the line taken from FIG. 1.
本考案は第１図および第２図に示すように、静
電防止処理した透明な一枚のプラスチツクシート
１を折り曲げて相対する端部１１，１２同志を接
着した筒状体２からなる集積回路用包装ケースで
ある。プラスチツクシート１は、ポリ塩化ビニー
ル、ポリスチレン、ポリカーボネート等のプラス
チツクからなるものであればよく、筒体を形成し
た時に充分な強度を保ち得るように、硬質または
半硬質のシートの厚さが0.15mm乃至0.8mmのもの
が好ましい。また、収納した集積回路の状態を外
部から確認できるように透明なプラスチツクシー
トを使用する。包装する集積回路は発生する静電
気などにより回路内部で絶縁破壊が起り不良とな
ることがあるので、包装ケースが静電気を発生し
ないように、包装ケースを形成するプラスチツク
シートにあらかじめ静電防止剤を練込みまたは塗
布し、静電防止処理を施しておき、包装した集積
回路４のリード線４１を容器内面との接触により
短絡させて集積回路内部に電位差が生じないよう
にする。ここでフラツトなプラスチツクシート
は、滑性の大きい静電防止剤を押出成形法に比べ
て多量に原料に練込みできるカレンダー法により
成形することができるので、練込みにより静電防
止効果の高い包装ケースを得られるという利点が
ある。また、プラスチツクシート１にあらかじめ
印刷３を施して、筒体を形成する時に印刷３が内
面に位置しプラスチツクシートを介して透視し得
るようにしておけば、外部のものとの接触により
印刷３が剥離することがなく好ましい。このよう
に、静電防止処理、印刷等をフラツトなシートの
状態で行うことは複雑な筒状容器に対して行なう
よりも容易であり、製造上有利である。 As shown in FIGS. 1 and 2, the present invention is an integrated circuit consisting of a cylindrical body 2 made by bending a transparent plastic sheet 1 treated to prevent static electricity and gluing opposing ends 11 and 12 together. This is a packaging case for The plastic sheet 1 may be made of plastic such as polyvinyl chloride, polystyrene, polycarbonate, etc., and the thickness of the rigid or semi-rigid sheet is 0.15 mm in order to maintain sufficient strength when forming a cylinder. Preferably, the diameter is between 0.8 mm and 0.8 mm. In addition, a transparent plastic sheet is used so that the status of the stored integrated circuits can be checked from the outside. Since static electricity generated in integrated circuits to be packaged can cause dielectric breakdown inside the circuit, resulting in defects, the plastic sheet that forms the packaging case is coated with an antistatic agent in advance to prevent the packaging case from generating static electricity. The lead wires 41 of the packaged integrated circuit 4 are short-circuited by contact with the inner surface of the container to prevent a potential difference from occurring inside the integrated circuit. Here, flat plastic sheets can be molded using the calendar method, which allows a large amount of highly slippery antistatic agents to be kneaded into the raw material compared to extrusion molding methods. The advantage is that you can get a case. Furthermore, if the printing 3 is applied to the plastic sheet 1 in advance so that the printing 3 is located on the inner surface and can be seen through the plastic sheet when forming the cylinder, the printing 3 can be removed by contact with an external object. It is preferable because it does not peel off. As described above, it is easier to perform antistatic treatment, printing, etc. on a flat sheet than on a complicated cylindrical container, and it is advantageous in manufacturing.
プラスチツクシート１から筒状体２を形成する
ためには、プラスチツクシート１を所定の部分１
４から折り曲げて、集積回路４のリード線４１に
応力がかからずに固定できるようにたとえば第２
図に示すような断面形状に形成する。折り曲げ部
分１４の内面には、予め溝状の折り曲げ罫線を形
成しておくのが好ましい。そして、プラスチツク
シート１の相対向する端部１１および１２を重ね
合せて接着剤、熱融着等の方法により接着して接
着部１３を形成し本考案の集積回路用包装ケース
を得る。この時接着部１３を第２図に示すよう
に、左右対称な断面形状の包装ケースの、底面以
外の左右いずれかに偏つた部分に形成しておく
と、この接着部１３を視認するだけで集積回路４
の方向性を区別することができ、包装ケースごと
機械にセツトして自動的に回路への組みつけを行
なう場合に便利である。また、第２図に示すよう
に接着部１３のプラスチツクシート端部１１，１
２に狭まれるように印刷３を形成しておけば、接
着部１３の視認がさらに容易になるとともに、印
刷３が包装ケース外部からの摩擦だけでなく収納
した集積回路４との摩擦からも保護されるので、
剥離することがなく好ましい。 In order to form the cylindrical body 2 from the plastic sheet 1, the plastic sheet 1 is cut into a predetermined portion 1.
For example, the second lead wire 41 of the integrated circuit 4 can be bent from
It is formed into a cross-sectional shape as shown in the figure. It is preferable to form groove-shaped folding lines in advance on the inner surface of the folded portion 14. Then, the opposite ends 11 and 12 of the plastic sheet 1 are overlapped and bonded together using an adhesive, heat fusion, or the like to form a bonded portion 13, thereby obtaining a packaging case for an integrated circuit according to the present invention. At this time, as shown in Fig. 2, if the adhesive part 13 is formed on a part of the packaging case with a symmetrical cross-sectional shape that is biased to either the left or right side other than the bottom surface, this adhesive part 13 can be easily recognized by visual inspection. integrated circuit 4
It is convenient when the packaging case is set in a machine and automatically assembled into a circuit. In addition, as shown in FIG.
If the print 3 is formed so as to be narrowed between the two, it becomes easier to visually recognize the adhesive part 13, and the print 3 is protected not only from friction from outside the packaging case but also from friction with the integrated circuit 4 housed inside. Because it is protected,
It is preferable because it does not peel off.
このようにして得た集積回路用包装ケースに集
積回路を収納するには、たとえば第１図に示すよ
うに、複数個の集積回路４を矢印５のように順次
挿入してから包装ケースの両端にゴム、プラスチ
ツク等のキヤツプ６を矢印７のように嵌挿して密
封すればよい。 In order to store an integrated circuit in the integrated circuit packaging case obtained in this way, for example, as shown in FIG. A cap 6 made of rubber, plastic, etc. may be inserted into the cap as shown by the arrow 7 to seal it.
（考案の効果）
以上、詳述したように本考案の集積回路用包装
ケースは静電防止処理した透明な一枚のプラスチ
ツクシート１を折り曲げて相対する端部同士を接
着した筒状体からなるので、収納した集積回路の
状態を外部から確認でき、静電気により集積回路
を破壊する恐れもなく、また、フラツトなプラス
チツクシートを筒体に形成するので薄肉化が可能
となるとともに各種サイズ、形状のケースを容易
に形成することができ、さらに、静電防止処理、
印刷等を施し易い点においても有利なものであ
る。(Effects of the invention) As detailed above, the packaging case for integrated circuits of the invention is made up of a cylindrical body made by bending a single transparent plastic sheet 1 treated to prevent static electricity and gluing the opposing ends together. Therefore, the status of the stored integrated circuit can be checked from the outside, and there is no risk of damaging the integrated circuit due to static electricity.Furthermore, since the flat plastic sheet is formed into a cylindrical body, it is possible to make the wall thinner, and it can be manufactured in various sizes and shapes. The case can be easily formed, and in addition, anti-static treatment,
It is also advantageous in that printing etc. can be easily performed.
第１図は本考案の集積回路用包装ケースの使用
状態の一例を示す斜視図であり、第２図は第１図
の−断面図である。
１……プラスチツクシート、２……筒状体、４
……集積回路。
FIG. 1 is a perspective view showing an example of the usage state of the packaging case for integrated circuits of the present invention, and FIG. 2 is a sectional view taken along the line taken from FIG. 1. 1... Plastic sheet, 2... Cylindrical body, 4
...Integrated circuit.
Claims (1)
ートを折り曲げて相対する端部同志を接着した筒
状体からなる集積回路用包装ケース。 A packaging case for integrated circuits consisting of a cylindrical body made by folding a transparent plastic sheet treated to prevent static electricity and gluing the opposite ends together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12014681U JPS5825100U (en) | 1981-08-13 | 1981-08-13 | Packaging case for integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12014681U JPS5825100U (en) | 1981-08-13 | 1981-08-13 | Packaging case for integrated circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5825100U JPS5825100U (en) | 1983-02-17 |
| JPH018549Y2 true JPH018549Y2 (en) | 1989-03-07 |
Family
ID=29914179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12014681U Granted JPS5825100U (en) | 1981-08-13 | 1981-08-13 | Packaging case for integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5825100U (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110661U (en) * | 1980-01-24 | 1981-08-27 | ||
| JPS6143733Y2 (en) * | 1981-01-14 | 1986-12-10 |
-
1981
- 1981-08-13 JP JP12014681U patent/JPS5825100U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5825100U (en) | 1983-02-17 |
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