JPH0160528U - - Google Patents
Info
- Publication number
- JPH0160528U JPH0160528U JP15599387U JP15599387U JPH0160528U JP H0160528 U JPH0160528 U JP H0160528U JP 15599387 U JP15599387 U JP 15599387U JP 15599387 U JP15599387 U JP 15599387U JP H0160528 U JPH0160528 U JP H0160528U
- Authority
- JP
- Japan
- Prior art keywords
- reaction tank
- electrode
- substrate
- electrodes
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Chemical Vapour Deposition (AREA)
Description
第1図は本考案の一実施例の断面図、第2図は
従来の装置の断面図、第3図は本考案の一実施例
の要部斜視図である。
1:反応槽、2:基板支持体、20:底板、4
:高周波電極、5:高周波電源、8:プラズマ、
9:基板。
FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional device, and FIG. 3 is a perspective view of essential parts of an embodiment of the present invention. 1: Reaction tank, 2: Substrate support, 20: Bottom plate, 4
: High frequency electrode, 5: High frequency power supply, 8: Plasma,
9: Substrate.
Claims (1)
面内にある平行対向電極間にガスを導入し、電極
間の放電によりガスを反応させて一方の電極を兼
ねる支持体の2面に支持された基板面上に成膜す
るものにおいて、反応槽が接地され、該反応槽に
絶縁して電源に接続された一方の電極が反応槽上
部よりつり下げられ、該電極と同間隔の対向面に
基板を支持する支持体は、水平方向の長さと同一
長さで反応槽下部と面接触する導電性底板によつ
て連結されたことを特徴とする薄膜形成装置。 A substrate supported on two sides of a support that doubles as one electrode by introducing gas between parallel opposing electrodes, each of which is located in a vertical plane inside a reaction tank that can be evacuated, and causing the gas to react by electric discharge between the electrodes. In cases where a film is formed on a surface, the reaction tank is grounded, one electrode is insulated from the reaction tank and connected to a power source, and is suspended from the top of the reaction tank, and the substrate is placed on the opposite surface at the same distance as the electrode. A thin film forming apparatus characterized in that the supporting body is connected by a conductive bottom plate having the same length as the horizontal length and in surface contact with the lower part of the reaction tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15599387U JPH0160528U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15599387U JPH0160528U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0160528U true JPH0160528U (en) | 1989-04-17 |
Family
ID=31434123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15599387U Pending JPH0160528U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0160528U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009063629A1 (en) * | 2007-11-14 | 2009-05-22 | Emd Corporation | Plasma processing apparatus |
-
1987
- 1987-10-12 JP JP15599387U patent/JPH0160528U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009063629A1 (en) * | 2007-11-14 | 2009-05-22 | Emd Corporation | Plasma processing apparatus |
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