JPH0160528U - - Google Patents

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Publication number
JPH0160528U
JPH0160528U JP15599387U JP15599387U JPH0160528U JP H0160528 U JPH0160528 U JP H0160528U JP 15599387 U JP15599387 U JP 15599387U JP 15599387 U JP15599387 U JP 15599387U JP H0160528 U JPH0160528 U JP H0160528U
Authority
JP
Japan
Prior art keywords
reaction tank
electrode
substrate
electrodes
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15599387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15599387U priority Critical patent/JPH0160528U/ja
Publication of JPH0160528U publication Critical patent/JPH0160528U/ja
Pending legal-status Critical Current

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  • Chemical Vapour Deposition (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の断面図、第2図は
従来の装置の断面図、第3図は本考案の一実施例
の要部斜視図である。 1:反応槽、2:基板支持体、20:底板、4
:高周波電極、5:高周波電源、8:プラズマ、
9:基板。
FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional device, and FIG. 3 is a perspective view of essential parts of an embodiment of the present invention. 1: Reaction tank, 2: Substrate support, 20: Bottom plate, 4
: High frequency electrode, 5: High frequency power supply, 8: Plasma,
9: Substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空排気可能な反応槽内部のそれぞれほぼ鉛直
面内にある平行対向電極間にガスを導入し、電極
間の放電によりガスを反応させて一方の電極を兼
ねる支持体の2面に支持された基板面上に成膜す
るものにおいて、反応槽が接地され、該反応槽に
絶縁して電源に接続された一方の電極が反応槽上
部よりつり下げられ、該電極と同間隔の対向面に
基板を支持する支持体は、水平方向の長さと同一
長さで反応槽下部と面接触する導電性底板によつ
て連結されたことを特徴とする薄膜形成装置。
A substrate supported on two sides of a support that doubles as one electrode by introducing gas between parallel opposing electrodes, each of which is located in a vertical plane inside a reaction tank that can be evacuated, and causing the gas to react by electric discharge between the electrodes. In cases where a film is formed on a surface, the reaction tank is grounded, one electrode is insulated from the reaction tank and connected to a power source, and is suspended from the top of the reaction tank, and the substrate is placed on the opposite surface at the same distance as the electrode. A thin film forming apparatus characterized in that the supporting body is connected by a conductive bottom plate having the same length as the horizontal length and in surface contact with the lower part of the reaction tank.
JP15599387U 1987-10-12 1987-10-12 Pending JPH0160528U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15599387U JPH0160528U (en) 1987-10-12 1987-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15599387U JPH0160528U (en) 1987-10-12 1987-10-12

Publications (1)

Publication Number Publication Date
JPH0160528U true JPH0160528U (en) 1989-04-17

Family

ID=31434123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15599387U Pending JPH0160528U (en) 1987-10-12 1987-10-12

Country Status (1)

Country Link
JP (1) JPH0160528U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063629A1 (en) * 2007-11-14 2009-05-22 Emd Corporation Plasma processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063629A1 (en) * 2007-11-14 2009-05-22 Emd Corporation Plasma processing apparatus

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