JPH0154438B2 - - Google Patents
Info
- Publication number
- JPH0154438B2 JPH0154438B2 JP15576481A JP15576481A JPH0154438B2 JP H0154438 B2 JPH0154438 B2 JP H0154438B2 JP 15576481 A JP15576481 A JP 15576481A JP 15576481 A JP15576481 A JP 15576481A JP H0154438 B2 JPH0154438 B2 JP H0154438B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- stainless steel
- bath
- steel material
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 61
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 26
- 239000010931 gold Substances 0.000 claims description 26
- 229910052737 gold Inorganic materials 0.000 claims description 26
- 229910001220 stainless steel Inorganic materials 0.000 claims description 26
- 239000010935 stainless steel Substances 0.000 claims description 26
- 230000004913 activation Effects 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 3
- 235000011149 sulphuric acid Nutrition 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000005868 electrolysis reaction Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Description
〔産業上の利用分野〕
本発明は、ステンレス鋼素材に対して密着性に
優れた金メツキを施す方法に関する。
〔従来の技術〕
一般に、ステンレス鋼からなる装飾品あるいは
電子部品などの表面に密着性の良い金メツキを施
すには、素材表面に形成されている不働態皮膜を
除去し、表面を活性化させる必要がある。
このため、従来にあつては、ステンレス鋼素材
を金属網上に載置して、または塩化ビニール製の
孔あきバスケツト内に多数個のステンレス鋼素材
と共に電極を入れてから、常温で金属濃度の低い
塩化ニツケルメツキ浴（ウツド浴）中に浸漬し、
前記金属網または電極に通電していた。この場合
塩化ニツケルメツキ浴中で初めに陽極電解を行
い、次いで同一浴で陰極電解を行い、又は陰極電
解のみで活性化と同時に薄いニツケル皮膜を形成
するためのストライクメツキを行つて、その後に
電解によるニツケルメツキを行い、そして電解ま
たは無電解による金メツキを行つている。
〔発明が解決しようとする問題点〕
しかしながら、上記のように常温で金属濃度の
低いウツド浴で電解で行うメツキ方法では、次の
ような問題があつた。
ウツド浴の電解では常温でしかも金属濃度が低
いために水素ガスを非常に多く発生するので電流
効果が悪く、ステンレス鋼素材の表面の十分な活
性化およびストライクメツキができず、金メツキ
後に剥離の原因となることが多い。
また、電子部品等の小物計量物（被処理物）の
場合には、ウツド浴内で、バスケツト内の電極に
接触させつつメツキ面の全面をもれなく他方の電
極に対抗させるようにするために、バスケツトを
回転させながら活性化やストライクメツキを行な
わなければならない。この場合にもバスケツト内
の全部の被処理物の全面に均一に電流が流れにく
いために、均一な厚みのメツキがつきにくい。し
かも部品形状によつては、部品（被処理物）同志
がからみ合い、からみ合つた部品には均一な厚み
のメツキを施すことができない。また、線状のバ
ネ（線径が0.1〜0.5mm）等のように、バスケツト
の孔からその端部が突出する場合には、この突出
部分に電流が集中するので、突出部分が溶解して
形状が不良となつたりする。
このように、ステンレス鋼素材に金メツキをす
るときの前工程で、ウツド浴中での電解によつて
ステンレス鋼素材に活性化と同時にストライクメ
ツキを行おうとしても、メツキ面の全面を均一に
行えないとか、形状不良を起こしやすい等の問題
があつた。また電解によるニツケルメツキでも電
流を使用するので、同様な問題があつた。
本発明は、かかる活性化やストライクメツキ等
の際の電流の使用によつて生じた従来の問題点に
鑑みなされたもので、電流を使用することなく、
かつ網状のバスケツト等に入れて浴内に浸漬した
ステンレス鋼素材のメツキ面の全面を容易に活性
化でき、そしてニツケルメツキ後も密着性の良い
金メツキを得ることができる金メツキ方法を提供
することを目的とする。
〔問題点を解決するための手段〕
上記従来の問題点を解決するために、本発明
は、ステンレス鋼素材に金メツキを施すにあた
り、HClを５〜50wt％、H2SO4を５〜50wt％、
及び水を若干含有し、液温を50〜90℃とした活性
化浴にステンレス鋼素材を２〜４分間浸漬し、次
いで、水洗いをせずに無電解ニツケルメツキ浴で
ニツケルメツキを行い、その後電解又は無電解メ
ツキによつて金メツキを施すものである。
〔作用〕
上記構成の本発明の金メツキ方法においては、
ステンレス鋼素材をHCl、H2SO4の混酸からなる
活性化浴に浸漬することにより、素材表面の不働
態皮膜が除去される。次いで、水洗いをせずに無
電解ニツケルメツキ浴で、ニツケルメツキを行つ
た後、電解又は無電解メツキによつて金メツキを
施すものである。尚、この場合、水洗いを行つて
からストライクメツキを行うと素材表面が不働態
化して密着不良を起こすので、活性化処理後、水
洗いをせずに、直ちにストライクメツキを行う。
この方法によつて得られた金メツキは、はんだ
ぬれ性および密着性に優れたものとなつている。
上記においてHClとH2SO4との混酸にする理由
は、HClを単独に用いるよりもH2SO4を添加した
方が、ステンレス鋼素材表面の部分的な腐食（肌
荒れ）が少なく且つ強力に活性化できることによ
る。またHClを５〜50wt％、H2SO4を５〜50wt
％の組成範囲にする理由は、腐食が少なく且つ活
性化を良好にするためである。そしてステンレス
鋼素材中のニツケル、クロムの含有量に対応して
上記活性化浴のHCl、H2SO4の濃度を上記範囲内
で選定することができる。例えば、含有量が多い
場合には濃度を高くするようにする。さらに活性
化浴の液晶を50〜90℃に特定する理由は、常温に
て浸漬するよりも加熱した方が反応が早くなるの
で、ステンレス鋼素材のニツケル、クロムの含有
量に対応して全面均一に且つ短時間に活性化でき
るようにするためである。さらに無電解ニツケル
メツキ浴のPHを3.0〜4.0の範囲にした理由は、PH
が3.0未満の場合は素材表面へのニツケルの析出
が弱く密着が悪くなり、PHが4.0を越えると素材
表面が不活性となるためである。
〔実施例〕
被処理物であるステンレス鋼素材として、
SUS301CPSおよびSUS304CSP（板厚0.2mm、幅２
mm、長さ20mmの板バネ）、SUS301WPAおよび
SUS304WPA（線経0.2φ長さ10mmの密着巻バネ）
の４種類に付き、各80個ずつ準備した。これらの
ステンレス鋼素材の前処理としては、トリクレン
洗浄後にアルカリ液による電解脱脂を行ない次い
で水洗する、通常の処理をした。
先ず活性化浴は、HClを20wt％、H2SO4を
20wt％、及び水を残部として含み、液温を70℃
に調整した。
この活性化浴に、網状のバスケツトに入れた被
処理物であるステンレス鋼素材の上記４種類の各
10個を、３分間浸漬せしめ、表面の不働態化酸化
物皮膜を除去し活性化した。
このとき、バスケツト内にてステンレス鋼素材
が重なつたり接しているときは、バスケツトを振
らしてメツキ面に液が触れるようにした。
次いで、無電解ニツケルメツキ浴で、ストライ
クニツケルメツキを行つた。
尚、この無電解ニツケルメツキ浴は硫酸ニツケ
ル20ｇ／、次亜リン酸ナトリウム25ｇ／、乳
酸25ｇ／、プロピオン酸３ｇ／、及び安定剤
（鉛）を若干含み（市販品のメツキ液でも良い）、
液温を約90℃とし、且つPHを3.5に調整した液と
し、この無電解ニツケルメツキ浴に2.5分浸漬し
て、極薄（1μ以下）のニツケル層を形成させた。
次に、以上の工程により無電解ニツケルメツキ
がなされた素材を、直ちに、シアンアルカリ系
浴、具体的にはKAu（CN）24ｇ／、KCN4ｇ／
、K4Fe（CN）630ｇ／、K2Ni（CN）41.8ｇ／
からなり、液温を40℃に調整した浴に浸漬し、電
流密度を2.5A／ｄm2とした条件において金メツ
キを0.3μm施した。
以上のようにして金メツキを施したものについ
て折り曲げ試験を行つた。この折り曲げ試験は、
金メツキを施したメツキ部品90゜折り曲げて、こ
の折り曲げ部分を50倍の顕微鏡を用いて観察し、
折り曲げ部分の金メツキの剥離が生ずる折り曲げ
回数にて評価するものであり、サンプルとして前
記金メツキしたメツキ部品の10個を用いた。この
結果を次表に示す。
また、上記無電解ニツケルメツキ浴において、
PHを3.0およびPHを4.0に調整した液にて、それぞ
れ上記と同様に、４種類のステンレス鋼素材の各
10個ずつにニツケル層を形成させ、この素材を直
ちにシアンアルカリ系メツキ浴にて金メツキを施
したメツキ部品についての結果も実施例として次
表に示す。
なお、参考のために、無電解ニツケルメツキ浴
のPHを3.0〜4.0の範囲外とした場合のものについ
ても４種類のステンレス鋼素材の各10個ずつに同
一試験を行い、その結果を参考例として同表中に
併記した。
表において、不良とは金メツキの剥離があつた
ことを示し、OKとは金メツキの剥離がなかつた
ことを示している。上記表において、確認のため
に、PH5.5で金メツキの剥離を生じた無電解ニツ
ケルメツキ浴の同一液をPH3.4に下げて同一条件
にてメツキすると、剥離するような密着不良は全
く発生しなかつた。
[Industrial Application Field] The present invention relates to a method for applying gold plating with excellent adhesion to a stainless steel material. [Prior art] Generally, in order to apply gold plating with good adhesion to the surface of decorative items or electronic parts made of stainless steel, the passive film formed on the surface of the material is removed and the surface is activated. There is a need. Therefore, in the past, the stainless steel material was placed on a metal mesh or the electrode was placed in a perforated basket made of vinyl chloride together with many stainless steel materials, and then the metal concentration was reduced at room temperature. Immerse in a low nickel chloride bath (Utsud bath),
The metal mesh or electrode was energized. In this case, anodic electrolysis is first performed in a nickel chloride plating bath, followed by cathodic electrolysis in the same bath, or strike plating is performed to form a thin nickel film at the same time as activation with cathodic electrolysis alone, followed by electrolysis. Nickel plating is performed, followed by electrolytic or electroless gold plating. [Problems to be Solved by the Invention] However, the above-mentioned plating method performed electrolytically in a mud bath with a low metal concentration at room temperature has the following problems. In mud bath electrolysis, a large amount of hydrogen gas is generated at room temperature and the metal concentration is low, so the current effect is poor, and the surface of the stainless steel material cannot be sufficiently activated and strike plated, causing peeling after gold plating. It is often the cause. In addition, in the case of small objects to be weighed (workpieces) such as electronic parts, in order to make sure that the entire surface of the plating surface is opposed to the other electrode while being in contact with the electrode in the basket in the mud bath, Activation and strikes must be performed while rotating the basket. In this case as well, it is difficult for the current to flow uniformly over the entire surface of all the objects to be processed in the basket, making it difficult to achieve plating with a uniform thickness. Furthermore, depending on the shape of the parts, the parts (workpieces) may become entangled with each other, and entangled parts cannot be plated with a uniform thickness. In addition, if the end of a wire spring (wire diameter 0.1 to 0.5 mm) protrudes from the hole in the basket, the current will concentrate on this protruding part, causing the protruding part to melt. The shape may become defective. In this way, even if you try to activate the stainless steel material by electrolysis in a wet bath and strike plating it at the same time in the pre-process when gold plating the stainless steel material, it will not be possible to uniformly cover the entire surface of the plating surface. There were problems such as not being able to do this, or being prone to shape defects. Also, nickel plating by electrolysis uses electric current, so a similar problem occurred. The present invention was devised in view of the conventional problems caused by the use of electric current during such activation, strike plating, etc.
To provide a gold plating method capable of easily activating the entire plating surface of a stainless steel material placed in a mesh basket or the like and immersed in a bath, and capable of obtaining gold plating with good adhesion even after nickel plating. With the goal. [Means for Solving the Problems] In order to solve the above-mentioned conventional problems, the present invention uses 5 to 50 wt% of HCl and 5 to 50 wt% of H 2 SO 4 when gold plating a stainless steel material. %,
The stainless steel material is immersed for 2 to 4 minutes in an activation bath containing a small amount of water and water at a temperature of 50 to 90°C, and then nickel plated in an electroless nickel plating bath without rinsing with water, followed by electrolysis or nickel plating. Gold plating is applied using electroless plating. [Function] In the gold plating method of the present invention having the above configuration,
By immersing a stainless steel material in an activation bath consisting of a mixed acid of HCl and H 2 SO 4 , the passive film on the surface of the material is removed. Next, nickel plating is performed in an electroless nickel plating bath without washing with water, and then gold plating is applied by electrolytic or electroless plating. In this case, if strike plating is performed after washing with water, the surface of the material becomes passivated and poor adhesion occurs, so strike plating is performed immediately after the activation treatment without washing with water. The gold plating obtained by this method has excellent solder wettability and adhesion. The reason for using a mixed acid of HCl and H 2 SO 4 in the above is that adding H 2 SO 4 causes less local corrosion (roughness) on the surface of the stainless steel material than using HCl alone, and makes it stronger. Depends on what can be activated. Also , HCl is 5-50wt%, H2SO4 is 5-50wt%
% composition range is to reduce corrosion and improve activation. The concentrations of HCl and H 2 SO 4 in the activation bath can be selected within the above range depending on the content of nickel and chromium in the stainless steel material. For example, if the content is large, the concentration should be increased. Furthermore, the reason why the temperature of the liquid crystal in the activation bath is specified at 50 to 90℃ is that the reaction is faster when heated than when immersed at room temperature, so it is uniform across the entire surface in accordance with the nickel and chromium content of the stainless steel material. This is to enable activation in a short time. Furthermore, the reason for setting the pH of the electroless nickel plating bath in the range of 3.0 to 4.0 is that the PH
If the pH is less than 3.0, the precipitation of nickel on the material surface will be weak and the adhesion will be poor, and if the pH exceeds 4.0, the material surface will become inactive. [Example] As the stainless steel material to be treated,
SUS301CPS and SUS304CSP (plate thickness 0.2mm, width 2
mm, leaf spring with a length of 20 mm), SUS301WPA and
SUS304WPA (close wound spring with wire diameter 0.2φ and length 10mm)
We prepared 80 pieces of each of the four types. These stainless steel materials were pre-treated in the usual way, including washing with trichlene, followed by electrolytic degreasing with an alkaline solution, and then washing with water. First, the activation bath contains 20wt% HCl and H 2 SO 4 .
Contains 20wt% and water as the balance, liquid temperature is 70℃
Adjusted to. In this activation bath, each of the above four types of stainless steel materials, which are the objects to be treated, are placed in a mesh basket.
10 pieces were immersed for 3 minutes to remove the passivation oxide film on the surface and activate it. At this time, if the stainless steel materials overlapped or were in contact with each other in the basket, the basket was shaken so that the liquid came into contact with the plating surface. Next, strike nickel plating was performed in an electroless nickel plating bath. In addition, this electroless nickel plating bath contains 20 g of nickel sulfate, 25 g of sodium hypophosphite, 25 g of lactic acid, 3 g of propionic acid, and some stabilizer (lead) (a commercially available plating solution may also be used).
The solution was adjusted to a temperature of approximately 90°C and a pH of 3.5, and was immersed in this electroless nickel plating bath for 2.5 minutes to form an extremely thin (less than 1μ) nickel layer. Next, the material subjected to electroless nickel plating through the above steps is immediately heated in a cyan-alkali bath, specifically KAu(CN) 2 4g/KCN 4g/
, K 4 Fe(CN) 6 30g/, K 2 Ni(CN) 4 1.8g/
It was immersed in a bath whose liquid temperature was adjusted to 40°C, and gold plating was applied to a thickness of 0.3 μm at a current density of 2.5 A/dm 2 . A bending test was conducted on the gold plated product as described above. This bending test
The gold-plated plated part was bent 90 degrees and the bent part was observed using a 50x microscope.
The evaluation was based on the number of bending times at which the gold plating on the bent portions peeled off, and 10 of the gold-plated parts were used as samples. The results are shown in the table below. Further, in the electroless nickel plating bath,
Using liquids adjusted to PH 3.0 and PH 4.0, each of the four types of stainless steel materials was tested in the same manner as above.
The results for plated parts in which a nickel layer was formed on each of 10 pieces and this material was immediately gold plated in a cyan-alkali plating bath are also shown in the following table as an example. For reference, we conducted the same test on 10 pieces each of 4 types of stainless steel materials when the pH of the electroless nickel plating bath was outside the range of 3.0 to 4.0, and the results were used as a reference example. Also listed in the same table. In the table, "defective" indicates that the gold plating has peeled off, and "OK" indicates that there was no peeling of the gold plating. In the above table, for confirmation, when the same solution of the electroless nickel plating bath that caused the gold plating to peel off at pH 5.5 was lowered to pH 3.4 and plated under the same conditions, no adhesion failure such as peeling occurred. I didn't.
以上のように本発明によれば、ステンレス鋼素
材に金メツキを施すにあたり、HClとH2SO4との
混酸からなる活性化浴において活性化処理を行
い、次いで、水洗いをせずに無電解ニツケルメツ
キを行つた後、金メツキをすることとしたので、
特にスイツチ接点、コネクタ、線状ばね等の小物
軽量物のステンレス鋼素材についても従来のメツ
キ方法で発生したような活性化不足、均一被覆性
不足、形状不良等の不具合が解消され、密着性の
良い安定した品質の金メツキ部品を得ることがで
きる。
As described above, according to the present invention, when gold plating is applied to a stainless steel material, activation treatment is performed in an activation bath consisting of a mixed acid of HCl and H 2 SO 4 , and then electroless treatment is performed without washing with water. After performing the nickel plating, I decided to do the gold plating.
In particular, problems such as lack of activation, lack of uniform coverage, poor shape, etc. that occurred with conventional plating methods have been resolved for small and lightweight stainless steel materials such as switch contacts, connectors, and wire springs, and the adhesion has been improved. You can get gold-plated parts of good and stable quality.
Claims (1)
を５〜50wt％、H2SO4を５〜50wt％、及び水を
若干含有し、液温を50〜90℃とした活性化浴にス
テンレス鋼素材を２〜４分間浸漬して活性化し、
次いで、水洗いをせずにPH3.0〜4.0の無電解ニツ
ケルメツキ浴でニツケルメツキを行い、その後電
解又は無電解メツキによつて金メツキを施すこと
を特徴とするステンレス鋼素材に対する金メツキ
方法。 ２ 前記無電解ニツケルメツキ浴でニツケルメツ
キを行つた後、電解ニツケルメツキを行い、その
後前記金メツキを施すことを特徴とする特許請求
の範囲第１項記載のステンレス鋼素材に対する金
メツキ方法。[Claims] 1. In gold plating of stainless steel material, HCl
The stainless steel material is activated by immersing it in an activation bath containing 5 to 50 wt% of H2SO4 , 5 to 50 wt% of H2SO4 , and some water at a liquid temperature of 50 to 90°C for 2 to 4 minutes,
A method for gold plating a stainless steel material, characterized in that nickel plating is then performed in an electroless nickel plating bath of pH 3.0 to 4.0 without washing with water, and then gold plating is applied by electrolytic or electroless plating. 2. The method of gold plating a stainless steel material according to claim 1, characterized in that after performing nickel plating in the electroless nickel plating bath, electrolytic nickel plating is performed, and then the gold plating is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15576481A JPS5858296A (en) | 1981-09-30 | 1981-09-30 | Method for plating stainless steel blank with gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15576481A JPS5858296A (en) | 1981-09-30 | 1981-09-30 | Method for plating stainless steel blank with gold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5858296A JPS5858296A (en) | 1983-04-06 |
| JPH0154438B2 true JPH0154438B2 (en) | 1989-11-17 |
Family
ID=15612893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15576481A Granted JPS5858296A (en) | 1981-09-30 | 1981-09-30 | Method for plating stainless steel blank with gold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858296A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219495A (en) * | 1983-05-28 | 1984-12-10 | Masami Kobayashi | Stainless steel article provided with solderability |
| JP5392016B2 (en) * | 2009-11-10 | 2014-01-22 | 新日鐵住金株式会社 | Conductive stainless steel material and manufacturing method thereof |
| JP6053573B2 (en) * | 2013-02-28 | 2016-12-27 | 株式会社神戸製鋼所 | Manufacturing method of Ag plating electrode member |
| CN105283583B (en) * | 2013-06-13 | 2018-09-07 | 东洋钢钣株式会社 | The manufacturing method of gold-plated covering stainless steel material and gold-plated covering stainless steel material |
| JP6574568B2 (en) * | 2014-12-12 | 2019-09-11 | 東洋鋼鈑株式会社 | Method for producing metal plating coated stainless steel |
| CN111926360B (en) * | 2020-07-16 | 2021-10-08 | 成都四威高科技产业园有限公司 | Stainless steel surface gold plating method |
-
1981
- 1981-09-30 JP JP15576481A patent/JPS5858296A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5858296A (en) | 1983-04-06 |
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