JPS59219495A - Stainless steel article provided with solderability - Google Patents
Stainless steel article provided with solderabilityInfo
- Publication number
- JPS59219495A JPS59219495A JP9338583A JP9338583A JPS59219495A JP S59219495 A JPS59219495 A JP S59219495A JP 9338583 A JP9338583 A JP 9338583A JP 9338583 A JP9338583 A JP 9338583A JP S59219495 A JPS59219495 A JP S59219495A
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- plating
- solderability
- plated
- hoop material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
ステンレス鋼は、その表面に強固な不動態化皮膜が存在
するだめ、半田づけか困難であり、従来より直接半田づ
けをすることは不可能視されていた。DETAILED DESCRIPTION OF THE INVENTION Stainless steel is difficult to solder due to the presence of a strong passivation film on its surface, and conventionally it has been considered impossible to solder it directly.
しかし、ステンレス鋼表面の不動態化皮膜を弗酸あるい
は弗酸と硝酸の混酸で除去し、この直後に半田づけする
と、辛うじて半田づけできるが、弗酸の残留があって、
半田個所あるいはその周辺を腐蝕させるので、半田づけ
後に水洗を必要とし、実用性にとぼしい。However, if you remove the passivation film on the stainless steel surface with hydrofluoric acid or a mixed acid of hydrofluoric acid and nitric acid, and then solder immediately after that, you can barely solder, but there will be residual hydrofluoric acid.
Since it corrodes the solder area or its surroundings, it requires washing with water after soldering, making it impractical.
また、弗酸、硝酸の混酸で前処理を行ない、ステンレス
鋼表面に、銅メッキを施し、その上に錫あるいは半田メ
ッキを施し、更に表面を平滑化するためスキンパス仕上
を行なって、半田性を付与したステンレス鋼帯は作成さ
れているが、この方法によると工程が複雑であり、生産
コストが高く、かつ、経時変化によシ表面に酸化物が発
生し、半田性を阻害する素材表面となるＱ
その他、ステンレス鋼に半田性を付与する方法として電
子部品の打抜き材料に、Ｎｉメッキを施すことも試みら
れたが、Ｎ１の経時変化により半田性は極端に低下する
ので、事前に酸処理をしない限り、使用不能に近いもの
であった。In addition, the stainless steel surface is pretreated with a mixed acid of hydrofluoric acid and nitric acid, and then copper plating is applied, followed by tin or solder plating, and a skin pass finish is applied to smooth the surface to improve solderability. Stainless steel strips have been produced using this method, but the process is complicated, production costs are high, and oxides are generated on the surface of the material due to aging, which inhibits solderability. NaruQ Another attempt has been made to apply Ni plating to the punched material for electronic parts as a method of imparting solderability to stainless steel, but as the solderability deteriorates dramatically due to changes in N1 over time, acid treatment is required beforehand. It was nearly unusable unless something was done.
この発明の発明者は、ステンレス鋼にＮ１の薄づけメッ
キを施し、その直後に、Ａｕ 、 、 Ａｇ 、 Ｐｄ
の一種または、これらの合金の極薄メッキを行なうこと
により、従来困離とされていたステンレス鋼への半田づ
けが容易に、かつ、強固にできることを実験的に発見し
た。The inventor of this invention applied thin plating with N1 to stainless steel, and immediately thereafter plated with Au, Ag, Pd.
It has been experimentally discovered that soldering to stainless steel, which had previously been considered difficult, can be done easily and firmly by applying ultra-thin plating with one of these or an alloy thereof.
この発明の方法によれば、メッキ金属の付着量は極く微
量であり、貴金属を使用するといえども、厚くメッキす
る半田メッキよシもコストが安く、また特にＡｕに関し
ては、その卓越した耐蝕性から、経時変化がなく、表面
酸化物を形成しないので半田作業に対する信頼性の優れ
た、半田可能なステンレス鋼製品を開発したものである
。According to the method of this invention, the amount of plating metal deposited is extremely small, and even though precious metals are used, the cost is lower than that of thick solder plating, and especially when it comes to Au, it has excellent corrosion resistance. From this, we have developed a solderable stainless steel product that does not change over time and does not form surface oxides, so it has excellent reliability in soldering operations.
ステンレス鋼が不銹鋼と称せられるのは鉄とＣｒが合金
化され、その表面に不動態化皮膜が生成されているから
である。Stainless steel is called a stainless steel because it is alloyed with iron and Cr, and a passivation film is formed on its surface.
この発明は、不動態化皮膜を生成するＣｒの表面に、Ａ
ｕその他の金属をメッキして覆い、再び不動態化皮膜の
生成を不可能とすることにより、ステンレス鋼に容易に
半田づけを笥能とした発明である。In this invention, A
This invention makes it possible to easily solder stainless steel by plating and covering it with other metals to make it impossible to generate a passivation film again.
先ず、実施例に示す特殊な前処理方法により、ステンレ
ス鋼表面の不動態化皮膜のみを除去しＮｉの薄づけメッ
キを施し、その直後にＡＩ」その他の金属をメッキする
。（以下、メッキする金属の種類はＡｕを例にして説明
する。First, by a special pretreatment method shown in the example, only the passivation film on the stainless steel surface is removed and a thin Ni plating is applied, and immediately thereafter, AI and other metals are plated. (Hereinafter, the type of metal to be plated will be explained using Au as an example.
（この発明に用いるＡｕノソキの厚さは、００６μ以下
０００１μ以内が好ましい。）
ステンレス鋼表面のＣｒ原子は、この前処理により、そ
の表面の不動態化皮膜が完全に除去され、活性の強い状
態となるが、この活性力の強いＣｒ表面にＮｉ、：Ａｕ
が選択的にメッキされ、ＮｉおよびＡｕがＣｒ原子を包
み覆った状態となる。(The thickness of the Au plate used in this invention is preferably 0.06μ or less and 0.001μ or less.) Through this pretreatment, the passivation film on the surface of the Cr atoms on the stainless steel surface is completely removed, and the Cr atoms are in a highly active state. However, on this highly active Cr surface, Ni, :Au
is selectively plated, and Ni and Au surround and cover the Cr atoms.
従って、Ｃｒの活性化が抑えられ、鉄と反応できないの
で、ステンレス特有の不動態化皮膜を再生成することが
できない。Therefore, the activation of Cr is suppressed and it cannot react with iron, making it impossible to regenerate the passivation film unique to stainless steel.
この現象は下記の実験により立証されだ０即ち、５ＵＳ
−４５０（Ｃｒ−１８％ Ｆｅ−８０％その他）のス
テンレス鋼フープ材を、この発明の方法によりＮｉおよ
びＡｕを極薄メッキし、これを塩水噴霧機にセントしＪ
ＩＳ−Ｚ２３７１の規格によシ耐蝕性テストを行なつ、
た結果、この試料は６時間で赤錆の発生が始まシ、１２
時間で全面赤錆に覆われた。This phenomenon was proved by the following experiment.
-450 (Cr-18% Fe-80% others) stainless steel hoop material was plated with Ni and Au very thinly by the method of this invention, and sent to a salt spray machine.
Corrosion resistance test according to IS-Z2371 standard,
As a result, red rust started to appear on this sample after 6 hours.
Over time, it was completely covered in red rust.
この発錆速度は、鉄と同じ速度の早期発錆現象であり、
５ＵＳ−４３［１に含まれるＣｒのステンレス鋼での合
金効果、す力わち、不動態化皮膜の生成機能を失った状
態となっており、合金中のＣｒの表面に選択的にＮｉと
Ａｕがメッキされただめ、鉄分のみが塩水噴霧の雰囲気
に晒された状態であることが判明した。This rusting rate is an early rusting phenomenon that is the same rate as iron.
The alloying effect of Cr contained in 5US-43[1 in stainless steel, that is, the ability to form a passivation film, has been lost, and the surface of Cr in the alloy is selectively exposed to Ni and Ni. It was found that while the Au was plated, only the iron was exposed to the salt spray atmosphere.
これに反し、メッキを施さない５ＵＳ−４３０の素材は
、強固な不動態化皮膜が存在するため、塩水噴霧試験で
２４０時間経過しても発錆しなかった。On the other hand, the unplated material 5US-430 did not rust even after 240 hours in the salt spray test due to the presence of a strong passivation film.
この現象から判断できるように、Ａｕ 、その他の金属
をステンレス鋼に極く微量メッキすると、Ｃｒの表面に
選択的にメッキされてＣｒの活性化を抑制し、不動態化
皮膜を再生成させず、この表面に半田づけすると点在、
あるいは網目状に存在するＣｒ上のＮ１とＡｕと不動態
化皮膜のないｌｉ’ｌ ｅあるいはＩｉ’ｅ−Ｎｉ合金
上に容易に、かつ、強固に半田づけが可能となった。As can be seen from this phenomenon, when very small amounts of Au or other metals are plated on stainless steel, they are selectively plated on the surface of Cr, suppressing the activation of Cr and preventing the regeneration of the passivation film. , when soldered on this surface, it is dotted,
Alternatively, it has become possible to easily and firmly solder N1 and Au on Cr existing in a network shape and a Li'le or Ii'e-Ni alloy without a passivation film.
まだ、この発明によって得られたステンレス鋼製品が再
び不動態化皮膜を生成し、半田性を阻害するか否かをテ
ストするため、ステンレス業界において一般に行なわれ
ている、不動態化皮膜生成法である、硝酸浸漬法を試み
た。However, in order to test whether the stainless steel products obtained by this invention would generate a passivation film again and inhibit solderability, a passivation film production method commonly used in the stainless steel industry was used. I tried the nitric acid immersion method.
この方法は、ステンレス鋼を切削加工などして地はだが
露出した場合、錆の発生を防ぐために、早期に不動態化
皮膜を生成させる方法であるＯ
すなわち、硝酸（６８％）１５ｖ係の溶液にこの発明に
よって得られた５Ｏ８−３０４フープ材の試料を２０分
間浸漬し、水洗、乾燥後、半田槽によるフラックスなし
の半田性テストをしたが、硝酸浸漬前と何等変らない優
れた半田性があり、不動態化皮膜は、この強制的な方法
でも再生成せず、Ｃｒの活性化が完全に抑制されている
ことが判明した。This method is a method to generate a passivation film at an early stage to prevent the occurrence of rust when the bare surface of stainless steel is exposed by cutting. A sample of the 5O8-304 hoop material obtained according to the present invention was immersed for 20 minutes, washed with water, dried, and then tested for solderability without flux in a solder bath. As a result, it showed excellent solderability that was no different from that before immersion in nitric acid. It was found that the passivation film was not regenerated even by this forced method, and the activation of Cr was completely suppressed.
実施例１
５ＵＳ−３０４の厚さ０．２ ｗｎ 、幅４０ｍ＋ｎ、
長さ８００ｍのステンレス鋼フープ材を次の工程■乃至
■を経て、Ｎｉの薄づけメッキを行ない、その直後に、
Ａｕの極薄メッキを行なった。Example 1 5US-304 thickness 0.2wn, width 40m+n,
A stainless steel hoop material with a length of 800 m is subjected to the following steps ① to ②, and then thinly plated with Ni, and immediately after that,
Ultra-thin Au plating was performed.
■アルカリ脱脂工程
市販されているアルカリ脱脂液をステンレス槽中で７０
〜８０°Ｃに加温し、上記ステンレス銅帯を逐次この槽
中を通過させて一次脱脂を行ない、次に４０〜６０℃の
アルカリ浴中でステンレス鋼板を陽極とし該ステンレス
鋼フープ材を陰極として６ボルトの電圧を印加して直流
電解脱脂を行なった。■Alkaline degreasing process A commercially available alkaline degreasing solution was heated in a stainless steel tank for 70 minutes.
The stainless steel copper strip is heated to ~80°C and sequentially passed through this bath for primary degreasing, and then placed in an alkaline bath at 40~60°C with the stainless steel plate as the anode and the stainless steel hoop material as the cathode. DC electrolytic degreasing was performed by applying a voltage of 6 volts.
■化学研摩工程
続いてこのステンレス鋼フープ材を、塩酸（３５係溶液
）２０容量係、硫酸（８５係溶液）１０容量係、クエン
酸（粉末）１００重量％酢酸（９０％溶液）１容量係及
び硝酸（６８％溶液）５容量係よりなる混酸に、ポリエ
チレンクリコールアルキルエーテル、ポリエチレングリ
コール脂肪酸エステルなどの非イオンまたはアミノ酸類
の両性界面活性剤０２２重量％びアミン系腐食抑制剤（
例えばライオンアーマ社製アーモヒブ−２８） ０．１
重量％を加えた浴中を通過させ、このステンレス鋼フー
プ材表面の酸化物及び不純物を除去した。■Chemical polishing process This stainless steel hoop material is then polished by 20 volumes of hydrochloric acid (35% solution), 10 volumes of sulfuric acid (85% solution), 1 volume of citric acid (powder), 100% by weight acetic acid (90% solution). and nitric acid (68% solution) in a mixed acid consisting of 5 parts by volume, 22% by weight of an amphoteric surfactant of nonionic or amino acids such as polyethylene glycol alkyl ether, polyethylene glycol fatty acid ester, and an amine corrosion inhibitor (
For example, Lion Armor's Armohib-28) 0.1
% by weight was added to remove oxides and impurities on the surface of this stainless steel hoop material.
■電解活性化工程
燐酸（８５％溶液）１ｏ、容量１％、硫酸（８５％溶液
）１００重量％クエン酸（粉末）５重量％、酢酸（９０
係溶液）１重量％に、上記と同様の非イオンまたは両性
界面活性剤０２２重量％よび腐食抑制剤０１重量％を加
えた浴を６０°Ｃに加温し、ステンレス鋼フープ材に（
−）電流を、チタン白金メツキ板に（＋）電流を通じ４
ボルトにセットして浴中を通過させてステンレス鋼フー
プ材の表面の活性化を行なった。■Electrolytic activation process Phosphoric acid (85% solution) 10, volume 1%, sulfuric acid (85% solution) 100% by weight, citric acid (powder) 5% by weight, acetic acid (90% by weight)
A bath prepared by adding 22% by weight of a nonionic or amphoteric surfactant similar to the above and 1% by weight of a corrosion inhibitor to 1% by weight of the related solution) was heated to 60°C, and a stainless steel hoop material (
-) current is passed through the (+) current to the titanium platinum plated plate.
The surface of the stainless steel hoop material was activated by setting it on a bolt and passing it through the bath.
■Ｎ１メッキ工程
硫酸Ｎｉ３００ｇ／Ａ、塩化Ｎｉ４０．！７／Ｃ硼酸’
ｖｏ＆／ｌのメッキ浴で、液温５０’Ｃにセットし、ス
テンレス鋼フープ材に（−）電流を、ニッケル板に（＋
）電流を通じ、６Ａ／Ｄｍ２の電流密度で１５秒間Ｎｌ
薄づけメッキを施しだ。■N1 plating process Ni sulfate 300g/A, Ni chloride 40. ! 7/C boric acid'
In a vo&/l plating bath, set the liquid temperature to 50'C, apply (-) current to the stainless steel hoop material and (+) current to the nickel plate.
) current for 15 seconds at a current density of 6A/Dm2.
It has been thinly plated.
■ＡｕＡｕメッキ
層エン酸１２０Ｅ／／ｌ、クエン酸ソーダ１２０ｇ／ｌ
、 スルファミン酸ニッケル３０９／ｌ、シアン化金カ
リ８ｇ／ｌのメッキ浴中で電流密度１２ Ａ、／ Ｄｍ
２〜５ Ａ／ Ｄｍ２の範囲でメッキ液温ろ５°Ｃで、
ステンレス鋼フープ材に（−）電流を、チタン白金メツ
キ板に（＋）電流を通じ２秒間Ａｕメッキを行なった。■AuAu plating layer Enoic acid 120E//l, Sodium citrate 120g/l
, a current density of 12 A,/Dm in a plating bath of nickel sulfamate 309/l and potassium gold cyanide 8 g/l.
Plating solution temperature 5°C in the range of 2 to 5 A/Dm2,
Au plating was performed for 2 seconds by passing a (-) current to the stainless steel hoop material and a (+) current to the titanium-platinum plated plate.
その結果、ステンレス鋼フープ材の両側に００１μの厚
さのＡｕメッキ層が形成され、この発明のステンレス鋼
フープ材が得られた。As a result, Au plating layers with a thickness of 001 μm were formed on both sides of the stainless steel hoop material, and the stainless steel hoop material of the present invention was obtained.
なお、Ａｕメッキ層の厚さ０．０１μについては、実測
値ではなく、Ａｕの付着量を面積で除した平均値であり
、目視したところ、ステンレス鋼単体の色調とＡｕ単体
の色調との中間の色調を呈している。Note that the thickness of the Au plating layer of 0.01μ is not an actual measurement value, but an average value obtained by dividing the amount of Au deposited by the area, and when visually observed, the color tone is between the color tone of stainless steel alone and the color tone of Au alone. It has a color tone of
一実施例２
ｓｕｓ−ｇ ０４の線径０１−のステンレス鋼線材でボ
ビン巻きされたものを、実施例１と同じ工程■乃至■を
経て、連続的にＮ１およびＡｕの極薄メッキを行なった
。Example 2 A bobbin-wound stainless steel wire rod of sus-g 04 with a wire diameter of 01- was subjected to the same steps (1) to (2) as in Example 1, and was continuously plated with N1 and Au in an extremely thin layer. .
実施例６
ＳＵＳ−１５３１の厚さ０．１ ｒｒｒｍ、幅２Ｄｗｎ
、長さ７００ｍのステンレス鋼フープ材を、下記の工程
■乃至■を経て、Ｎ１の薄づけメッキを行ない１その直
後にＡｇの極薄メッキを行なった。Example 6 SUS-1531 thickness 0.1 rrrm, width 2Dwn
A stainless steel hoop material having a length of 700 m was subjected to thin N1 plating through the following steps 1 to 2, and immediately after that, very thin Ag plating was applied.
■アルカリ脱脂工程 ■化学研摩工程 ■電解活性化工程 ■Ｎ１メソキ工程 以上いずれも実施例１と同様に行なった。■Alkaline degreasing process ■Chemical polishing process ■Electrolytic activation process ■N1 Mesoki process All of the above were conducted in the same manner as in Example 1.
■アルカリ中和工程
シアン化カリウム（粉末）５重量％の溶液中を通過させ
アルカリ中和を行なった。(2) Alkali neutralization step Alkali neutralization was carried out by passing through a 5% by weight solution of potassium cyanide (powder).
■Ａｇ極薄メッキ工程
シアン化銀６重量係、シアン化鋼１５重量係、シアン化
カリウム６０重量％のメッキ液中で液温２５°Ｃにセッ
トし、ステンレス鋼フープ材に（−）電流を、銀陽極板
に（＋）電流を通じ、１２Ａ／Ｄｍ２の電流密度で２秒
間ストライクメッキを連続的に施した。■Ag ultra-thin plating process Set the solution temperature to 25°C in a plating solution containing 6 weight percent silver cyanide, 15 weight percent cyanide steel, and 60 weight percent potassium cyanide, and apply a (-) current to the stainless steel hoop material. A (+) current was passed through the anode plate, and strike plating was continuously performed for 2 seconds at a current density of 12 A/Dm2.
実施例４
ＳＵＳ−３０４厚す０．２５ ｍｍ、幅５０ ｍ＋ｎ、
長さ７００ｍのステンレス鋼フープ材を、次の工程■乃
至■を経て、Ｎｉの薄づけ・メッキを行ない、その直後
にＰｄの極薄メッキを行なった。Example 4 SUS-304 thickness 0.25 mm, width 50 m+n,
A stainless steel hoop material with a length of 700 m was thinned and plated with Ni through the following steps (1) to (2), and immediately after that, extremely thin plated with Pd was applied.
■アルカリ脱脂工程 ■化学研摩工程 − ■電解活性化工程 ■Ｎ１メノキ工程 上記工程はいずれも実施例１と同様に行なった。■Alkaline degreasing process ■Chemical polishing process − ■Electrolytic activation process ■N1 Menoki process All of the above steps were performed in the same manner as in Example 1.
■ＰｄＰｄメッキ
層ｄのメタル分として１５９／ｌの中性メッキ液で、液
温を４５°Ｃにセットし、チタン白金板に（＋）電流を
、ステンレス鋼フープ材に（−）電流を通じ、５ Ａ／
Ｄ ｍ２の電流密度でろ秒間メッキを′施したー。■With a neutral plating solution of 159/l as the metal content of the PdPd plating layer d, the solution temperature was set at 45°C, and a (+) current was passed through the titanium platinum plate and a (-) current was passed through the stainless steel hoop material. 5 A/
Plating was carried out at a current density of D m2 for 2 seconds.
その結果、ステンレス鋼フープ材の表面に０、 ［）
０７μｍの厚さのＰｄメッキが形成され、この発明のス
テンレス鋼フープ材が得られた。As a result, 0, [) on the surface of the stainless steel hoop material.
A Pd plating with a thickness of 0.07 μm was formed to obtain the stainless steel hoop material of the present invention.
なお、Ｐｄメッキ層の厚さ０．００７μｍについては実
測値でなり、Ｐｄの付着量を面積で除した平均値であり
、目視したところ、ステンレス鋼単体の色調と、Ｐｄ単
体の色調との中間の色調を呈している。The thickness of the Pd plating layer, 0.007 μm, is an actual measurement value, and is an average value obtained by dividing the amount of Pd deposited by the area. Visually, the color tone is between the color tone of stainless steel alone and the color tone of Pd alone. It has a color tone of
実施例５
ＳＵＳ−３０４線径１０胡のステンレス鋼線材を次の工
程を経て、Ｎｉ薄づけメッキを行ないＰｄ −Ｎｉ合金
の極薄メッキを行なった。Example 5 A stainless steel wire rod of SUS-304 wire having a wire diameter of 10 mm was subjected to the following steps, and Ni thin plating was performed to perform ultra-thin plating of Pd--Ni alloy.
■アルカリ脱脂工程 ■化学研摩工程 ■電解活性化工程 ■Ｎｉメノメッキ 以上、いずれも実施例１と同様に行なった。■Alkaline degreasing process ■Chemical polishing process ■Electrolytic activation process ■Ni Meno plating The above steps were carried out in the same manner as in Example 1.
■Ｐｄ−Ｎｉ合金メンキ工程
スルファミン酸８％−１Ｐｄメタル分２０９／７、Ｎｉ
メタル分１０ｇ＃の中性溶液で、電流密度８ Ａ／ Ｄ
ｍ２〜６ Ａ／Ｄ ｍ” （７）範囲テ、メッキ液温
６０℃で、ステンレス鋼フープ材に（−）電流を、チタ
ン白金メツキ板に（＋）電流を通じ、３秒間、Ｐｄ−Ｎ
ｉ合金メッキを行なった。■Pd-Ni alloy Menki process sulfamic acid 8%-1Pd metal content 209/7, Ni
Current density 8 A/D in neutral solution with metal content 10g#
m2 to 6 A/D m” (7) At a plating solution temperature of 60°C, a (-) current was applied to the stainless steel hoop material and a (+) current was applied to the titanium-plated plate, and the Pd-N was applied for 3 seconds.
i-alloy plating was performed.
その結果、ステンレス鋼表面に、約ｏｏ１μのＰｄ−Ｎ
ｉ合金メッキが施され、この発明のステンレス鋼フープ
材が得られた。As a result, about oo1μ of Pd-N was deposited on the stainless steel surface.
i-alloy plating was applied to obtain the stainless steel hoop material of the present invention.
なお、メッキ層の厚さ０．０１μについては、実測値で
はなく、Ｐｄ −Ｎｉ合金の付着量を面積で除した平均
値であり、目視龜だところ、ステンレス鋼単体の色調と
Ｐｄ−Ｎｉ合金の色調との中間の色調を呈している。The thickness of the plating layer, 0.01μ, is not an actual value, but an average value obtained by dividing the amount of Pd-Ni alloy deposited by the area. It has a color tone that is intermediate between that of .
この発明によるステンレス鋼フープ材の、物理的および
化学的性能テストを次の通シ行なった。The stainless steel hoop material according to the present invention was subjected to the following physical and chemical performance tests.
■物理的性能
◎基盤目剥離テスト
この発明によるＮ１とＡｕメッキを施したＳＵＳ’−３
０４のフープ材に、経緯幅１諭の基盤目をカッターで傷
っけ、粘着テープで剥離テストを行なったがＡｕおよび
Ｎ１の剥離は認められなかった。■ Physical performance ◎ Base grain peeling test SUS'-3 with N1 and Au plating according to this invention
04 hoop material was scratched with a cutter at a base line with a width of 1 length, and a peel test was performed using adhesive tape, but no peeling of Au or N1 was observed.
◎折曲げテスト
上記の試料を１８０度折曲げ、粘着テープで剥離テスト
を行なったが、ＡａおよびＮｉの剥離がなく、更に折曲
げを繰り返えし破断させてテストしたが、破断面のＡｕ
およびＮｉの剥離もないことが認められた。◎Bending test The above sample was bent 180 degrees and a peel test was performed using adhesive tape, but there was no peeling of Aa and Ni.
It was also observed that there was no peeling of Ni.
化学的性能
◎高温多湿テスト
この発明による極薄ＮｉとＡｕメッキを施しだＳＵＳ＋
−５１６−Ｌのフープ材をＭＩＬ−８ＴＤ−２０２Ｄ−
１０６Ｃ（Ｄ規格である９８％湿度、６５°Ｃの雰囲気
で、７日間テスト後、半田性のテス、トを行なったが、
半田性は何等低下せず、良好な半田性が得られた。Chemical performance ◎ High temperature and high humidity test SUS+ with ultra-thin Ni and Au plating according to this invention
-516-L hoop material MIL-8TD-202D-
After testing for 7 days in an atmosphere of 106C (D standard, 98% humidity, 65°C), solderability was tested.
Good solderability was obtained without any deterioration in solderability.
◎熱衝撃テスト
この発明による極薄Ｎｉ、！：Ａｕメッキを施しだＳＵ
Ｓ’−１０４の線径０．２ ｇの線材を＋８５℃に３０
分間、−１５℃に６０分間のサイクルを５回繰り返えし
た後、半田づけしたがテスト前の試料と同様、良好な半
田性が得られた。◎Thermal shock test Ultra-thin Ni according to this invention! :Au plated SU
A wire rod of S'-104 with a wire diameter of 0.2 g was heated to +85℃ for 30 minutes.
After repeating the cycle of heating to -15° C. for 60 minutes five times, soldering was performed, and good solderability was obtained, similar to the sample before the test.
以上の方法によって得られたステンレス鋼製品の半田性
を次の方法によりテストした。The solderability of the stainless steel products obtained by the above method was tested by the following method.
■ソルダーテストによる方法
ＮｉとＡｕの極薄メッキを施しだＳＯ８−６０４の試料
をテスト機にセットし、半田の「ぬれｊ現象を電気的に
検知したが、半田の表面張力による浸漬初期の反発現象
が少なく、極めて良好な「ぬれ」性を計測し、同一条件
でテストしたリン青銅への半田性よりも優れていること
が判明した０
■半田槽によるテスト
錫６：鉛４の半田を半田槽に溶かし、温度２６０℃にセ
ットし、この発明による極薄ＮｉとＡｕメッキしだ５Ｕ
Ｓ−４５０ＸＳＵＳ−３０４、５ＵＳ−３１６、５Ｏ８
−６３１の各製品を、表面をトリクロルエタンで清浄し
、７ラソクスなしの状態で、ろ秒および５秒の浸漬時間
で半田したが、いずれも良好な半田性を示し、すべて９
５係以上の「半田のり」を認めた。■Method using solder test A sample of SO8-604 coated with ultra-thin Ni and Au plating was set in a test machine, and the "wetting phenomenon" of the solder was electrically detected. We measured very good "wettability" with few phenomena, and it was found that it was superior to the solderability to phosphor bronze tested under the same conditions0 ■Test in a solder bath Soldering tin 6:lead 4 solder Melt it in a tank, set the temperature to 260℃, and apply the ultra-thin Ni and Au plating according to this invention to 5U.
S-450XSUS-304, 5US-316, 5O8
The surface of each product of 631 was cleaned with trichloroethane and soldered in the absence of 7 lasox with a dipping time of 5 seconds and a dipping time of 5 seconds, and all showed good solderability.
``Solder paste'' was approved for 5th grade and above.
■電気半田ゴテによるテスト
市販の電気半田ゴテで、ヤニ入り半田線（錫６：鉛４）
を用い、極薄ＮｉとＡｕメッキした５ＵＳ−３０４のフ
ープ材と、同じく極薄Ｎ】とＡｕメッキした５ＵＳ−１
１６−Ｌのω０．２ ｒｍｈの線材とを半田づけしだが
、半田性の優れた接合を認め、組成の異々るステンレス
鋼の半田も何等支障のないことを発見した。■Test using an electric soldering iron Using a commercially available electric soldering iron, solder wire containing resin (6 parts tin: 4 parts lead)
5US-304 hoop material plated with ultra-thin Ni and Au, and 5US-1 hoop material plated with ultra-thin N and Au.
16-L wire rod of ω0.2 rmh was soldered, and a bond with excellent solderability was observed, and it was discovered that stainless steel solder of a different composition had no problem.
■５ＵＳ−３０４のフープ材に、この発明による極薄Ｎ
１とＡｇメッキした試料と、５ＵＳ−４６０に極薄Ｎｉ
とＡｕメッキしたフープ材とを、電気半田ゴテを用いヤ
ニ入シ半田線で半田したが、良好な半田性が得られた。■Ultra-thin N made from this invention on 5US-304 hoop material
1 and Ag-plated sample, and 5US-460 with ultra-thin Ni plated sample.
The material and the Au-plated hoop material were soldered with a resin-cored solder wire using an electric soldering iron, and good solderability was obtained.
■引張強度テスト
極薄Ｎ１とＡｕメッキした５ＵＳ−６０４のフープ材２
枚を、錫６：鉛４の半田で半田づけしたものの引張り強
度は＋２０℃で鉄の３、２〜４．５ Ｋｐ ／−に対し
３〜４．１ Ｋｇ／ ｍＡであったが、＋１００℃に於
いては鉄の１３〜２、４ Ｋｑ ／−に対し１．４〜２
．６ Ｋ９７ ｍＡと鉄よシも優れた引張シ強度を示し
た。■Tensile strength test Ultra thin N1 and Au plated 5US-604 hoop material 2
The tensile strength of the sheets soldered with a tin 6:lead 4 solder was 3 to 4.1 Kg/mA at +20℃ compared to 3.2 to 4.5 Kp/- for iron at +100℃. 1.4 to 2 compared to 13 to 2,4 Kq/- for iron.
．． It also showed excellent tensile strength of 6K97 mA and steel.
■ステンレス鋼フープ材に、Ｎｉの薄づけメッキを施し
た後、Ａｕ、 Ａｇ、 ＰｄＸＰｄ −Ｎｉ ＸＡｕ−
Ａｇ、 Ａｕ−Ｐｄ、 Ａｕ−Ｃｕを各々極薄メッキし
、２週間放置後これらの単独、またはこれ等の２〜６種
の製品の結合半田づけをしたが、Ａｕが最も半日性に優
れ、Ａｇ 、 Ａｕ −Ａｇ。■After thin Ni plating is applied to stainless steel hoop material, Au, Ag, PdXPd -Ni XAu-
Ag, Au-Pd, and Au-Cu were each plated extremely thinly, and after being left for two weeks, these products were soldered alone or two to six of these products were soldered together. Ag, Au-Ag.
Ａｕ−Ｃｕ、 Ａｕ−Ｐｄ、 Ｐｄ、 Ｐｄ−Ｎｉの順
に半田性が劣って行くことが判った。It was found that the solderability deteriorated in the order of Au-Cu, Au-Pd, Pd, and Pd-Ni.
以上説明したように、この発明のステンレス鋼製品はス
テンレス鋼の持つ抜群の耐蝕性と、銅合金に比し、ばね
性、クリープ特性、および強度に優れ、かつ、安価であ
るところから、最大の欠点であった半田性をこれに付与
したことによシ、広範な産業分野に応用が曲けるもので
ある。As explained above, the stainless steel products of the present invention have the outstanding corrosion resistance of stainless steel, superior spring properties, creep properties, and strength compared to copper alloys, and are inexpensive, so they have the greatest potential. By adding solderability, which had been a drawback, it can be applied to a wide range of industrial fields.
すなわち、半田を必要とする部品であるコネクター、ソ
ケット、スイッチ、端子、バッテリーホルダー、スプリ
ング、ファクシミリ用細線などにその利用が可能となり
、工業上、極めて有意義々発明である。That is, it can be used for parts that require soldering, such as connectors, sockets, switches, terminals, battery holders, springs, and facsimile thin wires, and is an extremely significant invention from an industrial perspective.
手続補正書
昭和５９年３月１２日
特許庁長官若杉和夫 殿
１事件の表示
特願昭５．８−０９ろろ８５号
２発明の名称
半田性を付与したステンレス鋼製品
ろ補正をする者
事件との関係 特許出願人
自発補正
５補正の対象
１−
（１）明細書第９ページ第４行目と第５行目の間に「そ
の結果、ステンレス鋼フープ材の両側に約０．０５μの
厚さのニッケルメッキ層が形成された。なお、このニッ
ケルメッキ層の厚さ０、０５μについては実測値ではな
く、ニッケルの付着量を面積で除した平均値であり、目
視したところ、ステンレス鋼単体の色調とニッケル単体
の色調との中間の色調を呈している。」を挿入します。Procedural amendment March 12, 1980 Kazuo Wakasugi, Commissioner of the Japan Patent Office 1 Display of the case Patent application No. 85, 1985 2 Name of the invention Stainless steel product imparted with solderability Case of person who corrects the filter Relationship with Patent Applicant Voluntary Amendment 5 Subject of Amendment 1 - (1) Between the 4th and 5th lines of page 9 of the specification, "As a result, approximately 0.05 μm of A nickel plating layer with a thickness of 0.05 μm was formed.The thickness of the nickel plating layer of 0 and 0.5μ is not an actual value, but an average value obtained by dividing the amount of nickel deposited by the area. The color tone is intermediate between that of nickel alone and that of nickel alone.'' is inserted.
（２）明細書第１３ページ第４行目及び第９行目の［ス
テンレス鋼フー７’材ｊをｒステンレス鋼線材」と補正
します。(2) Correct the statement in the 4th and 9th lines of page 13 of the specification to read [stainless steel 7' material j to r stainless steel wire rod].
Claims (1)
の直後に、Ａｕ、 Ａｇ、 Ｐｄのうちの一種またはＡ
ｕ、Ａｇ、Ｐｄのうちの一種の合金の極薄メッキを施し
、メッキすべき上記金属または合金の何着量は、ステン
レス鋼の色調と、上記金属捷たは、その合金の色調との
中間の色調を呈する程度の極く微量であることを特徴と
する、半田性を付与したステンレス鋼製品。Thin N1 plating is applied to the stainless steel surface, and immediately after that, one of Au, Ag, Pd or A is applied.
The amount of the metal or alloy to be plated is between the color tone of stainless steel and the color tone of the metal or its alloy. A stainless steel product with solderability, which is characterized by a very small amount of solderability that exhibits a color tone of .
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9338583A JPS59219495A (en) | 1983-05-28 | 1983-05-28 | Stainless steel article provided with solderability |
| DE8484105991T DE3465115D1 (en) | 1983-05-28 | 1984-05-25 | Solderable stainless steel article and method for making same |
| EP84105991A EP0127857B1 (en) | 1983-05-28 | 1984-05-25 | Solderable stainless steel article and method for making same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9338583A JPS59219495A (en) | 1983-05-28 | 1983-05-28 | Stainless steel article provided with solderability |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4539684A Division JPS59219483A (en) | 1984-03-12 | 1984-03-12 | Method for providing solderability to stainless steel article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59219495A true JPS59219495A (en) | 1984-12-10 |
Family
ID=14080839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9338583A Pending JPS59219495A (en) | 1983-05-28 | 1983-05-28 | Stainless steel article provided with solderability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59219495A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195991A (en) * | 1985-02-27 | 1986-08-30 | Hitachi Ltd | Electronic parts structure and its manufacture |
| JPH02104694A (en) * | 1988-10-13 | 1990-04-17 | Tsuyoshi Nishimura | Plated wire and production thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858296A (en) * | 1981-09-30 | 1983-04-06 | Olympus Optical Co Ltd | Method for plating stainless steel blank with gold |
-
1983
- 1983-05-28 JP JP9338583A patent/JPS59219495A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858296A (en) * | 1981-09-30 | 1983-04-06 | Olympus Optical Co Ltd | Method for plating stainless steel blank with gold |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195991A (en) * | 1985-02-27 | 1986-08-30 | Hitachi Ltd | Electronic parts structure and its manufacture |
| JPH02104694A (en) * | 1988-10-13 | 1990-04-17 | Tsuyoshi Nishimura | Plated wire and production thereof |
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