JPH0143477B2 - - Google Patents

Info

Publication number: JPH0143477B2
Authority: JP; Japan
Prior art keywords: component; conductor; solder; components; circuit board
Prior art date: 1980-05-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP6924980A

Other languages

English (en)

Japanese (ja)

Other versions

JPS56165396A (en

Inventor

Hayato Takasago

Yoichiro Oonishi

Toshio Sugiura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-05-23

Filing date

1980-05-23

Publication date

1989-09-20

1980-05-23 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

1980-05-23 Priority to JP6924980A priority Critical patent/JPS56165396A/ja

1981-12-18 Publication of JPS56165396A publication Critical patent/JPS56165396A/ja

1989-09-20 Publication of JPH0143477B2 publication Critical patent/JPH0143477B2/ja

Status Granted legal-status Critical Current

Links

229910000679 solder Inorganic materials 0.000 claims description 62
239000004020 conductor Substances 0.000 claims description 47
238000000034 method Methods 0.000 claims description 27
239000003990 capacitor Substances 0.000 claims description 9
238000005304 joining Methods 0.000 claims description 6
238000002844 melting Methods 0.000 claims description 5
238000001035 drying Methods 0.000 claims description 4
230000008018 melting Effects 0.000 claims description 4
238000010438 heat treatment Methods 0.000 claims description 3
239000000155 melt Substances 0.000 claims description 2
239000000126 substance Substances 0.000 claims 1
239000000853 adhesive Substances 0.000 description 12
230000001070 adhesive effect Effects 0.000 description 12
239000000758 substrate Substances 0.000 description 12
238000005476 soldering Methods 0.000 description 7
238000004519 manufacturing process Methods 0.000 description 6
238000007796 conventional method Methods 0.000 description 5
230000000694 effects Effects 0.000 description 4
238000003780 insertion Methods 0.000 description 4
230000037431 insertion Effects 0.000 description 4
238000013461 design Methods 0.000 description 3
239000010410 layer Substances 0.000 description 3
239000000919 ceramic Substances 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000004806 packaging method and process Methods 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
230000001680 brushing effect Effects 0.000 description 1
238000012937 correction Methods 0.000 description 1
238000007599 discharging Methods 0.000 description 1
239000003792 electrolyte Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000003779 heat-resistant material Substances 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
239000000463 material Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
229910052573 porcelain Inorganic materials 0.000 description 1
238000003825 pressing Methods 0.000 description 1
239000002344 surface layer Substances 0.000 description 1
229910052715 tantalum Inorganic materials 0.000 description 1
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
230000008016 vaporization Effects 0.000 description 1
238000009834 vaporization Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1

Landscapes

Electric Connection Of Electric Components To Printed Circuits (AREA)

JP6924980A 1980-05-23 1980-05-23 Method of mounting part on circuit board Granted JPS56165396A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP6924980A JPS56165396A (en)	1980-05-23	1980-05-23	Method of mounting part on circuit board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP6924980A JPS56165396A (en)	1980-05-23	1980-05-23	Method of mounting part on circuit board

Publications (2)

Publication Number	Publication Date
JPS56165396A JPS56165396A (en)	1981-12-18
JPH0143477B2 true JPH0143477B2 (pt)	1989-09-20

Family

ID=13397273

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP6924980A Granted JPS56165396A (en)	1980-05-23	1980-05-23	Method of mounting part on circuit board

Country Status (1)

Country	Link
JP (1)	JPS56165396A (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS58147193A (ja) *	1982-02-26	1983-09-01	株式会社東芝	回路基板装置

1980
- 1980-05-23 JP JP6924980A patent/JPS56165396A/ja active Granted

Also Published As

Publication number	Publication date
JPS56165396A (en)	1981-12-18

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