JPH0142907Y2 - - Google Patents
Info
- Publication number
- JPH0142907Y2 JPH0142907Y2 JP1984168481U JP16848184U JPH0142907Y2 JP H0142907 Y2 JPH0142907 Y2 JP H0142907Y2 JP 1984168481 U JP1984168481 U JP 1984168481U JP 16848184 U JP16848184 U JP 16848184U JP H0142907 Y2 JPH0142907 Y2 JP H0142907Y2
- Authority
- JP
- Japan
- Prior art keywords
- layered
- conductor
- insulating substrate
- fuse element
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Fuses (AREA)
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
本考案は温度ヒユーズの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in temperature fuses.
ヒユーズエレメントに低融点可溶合金を用いた
合金型温度ヒユーズにおいては、保護すべき電気
機器が過電流により発熱すると、その発生熱によ
つてヒユーズエレメントを溶断し、電気機器への
通電を遮断する。合金型温度ヒユーズとして、絶
縁基板の片面上に一対の層状導体を設け（例え
ば、導電性ペイントのスクリーン印刷・焼付けに
よる）、層状導体間にヒユーズエレメントを橋設
し、各層状導体にリード導体（銅線）をハンダ付
けし、絶縁基板の片面上に絶縁層をコートしたも
のが公知である。この温度ヒユーズにおけるヒユ
ーズエレメントへの熱の主なる伝達経路はリード
導体→リード導体と層状導体との接触面→層状導
体→ヒユーズエレメントの経路であり、リード導
体先端とヒユーズエレメントとの間の距離をでき
るだけ短くすることが熱伝達速度の高速化に有利
である（層状導体の断面積がリード導体の断面積
に較べて一段と小さく、リード導体をヒユーズエ
レメントに近づけることが熱伝達抵抗の低減に有
利）。しかしながらリード導体の断面積が大きい
ために、機器のヒートサイクル下、リード導体と
絶縁層との接触面に作用する熱応力歪が大であ
り、ヒートサイクル中にその接触面が剥離し易
く、リード線先端をヒユーズエレメントに余り近
づけると、温度ヒユーズで作動時に、溶融エレメ
ントがその剥離部分に沿つて噴出するおそれがあ
る。 In alloy type temperature fuses that use a low melting point fusible alloy for the fuse element, when the electrical equipment to be protected generates heat due to overcurrent, the generated heat melts the fuse element and cuts off the power to the electrical equipment. . For an alloy-type thermal fuse, a pair of layered conductors are provided on one side of an insulating substrate (e.g., by screen printing/baking conductive paint), a fuse element is bridged between the layered conductors, and a lead conductor ( It is well known to solder copper wires and coat an insulating layer on one side of an insulating substrate. The main transmission path of heat to the fuse element in this temperature fuse is from the lead conductor → the contact surface between the lead conductor and the layered conductor → the layered conductor → the fuse element, and the distance between the tip of the lead conductor and the fuse element is Making it as short as possible is advantageous in increasing the heat transfer rate (the cross-sectional area of the layered conductor is much smaller than that of the lead conductor, and placing the lead conductor closer to the fuse element is advantageous in reducing heat transfer resistance) . However, because the cross-sectional area of the lead conductor is large, the thermal stress strain that acts on the contact surface between the lead conductor and the insulating layer during the heat cycle of the device is large, and the contact surface is likely to peel off during the heat cycle. If the wire tip is placed too close to the fuse element, there is a risk that the molten element will spray out along the peeled portion when the temperature fuse is activated.
本考案の目的は、リード線先端とヒユーズエレ
メントとの間隔を充分に確保しつつヒユーズエレ
メントへの熱伝達性能を向上させ得る基板型温度
ヒユーズを提供することにある。 An object of the present invention is to provide a substrate-type temperature fuse that can improve heat transfer performance to the fuse element while ensuring a sufficient distance between the lead wire tip and the fuse element.
本考案に係る温度ヒユーズは絶縁基板の片面上
に縦方向に延びる一対の層状導体を設け、これら
層状導体の先端間に低融点合金からなる温度ヒユ
ーズエレメントを橋設し、各層状導体の後端部に
は縦方向スリツトを層状導体と絶縁基板とにわた
つて設け、上記スリツトに嵌入される中間垂直片
部と該垂直片部上端に連設されていて上記層状導
体に接触される上側片部と上記垂直片部下端に連
設されていて絶縁基板の他面に露出される下側片
部とからなる耳部を先端に備えた各リード導体を
上記垂直片部において上記スリツトに嵌着し、各
耳部の上側片部と各層状導体とをハンダ付けし、
絶縁基板の片面上には絶縁層を設けけたことを特
徴とする構成である。 The temperature fuse according to the present invention has a pair of layered conductors extending vertically on one side of an insulating substrate, a temperature fuse element made of a low melting point alloy is bridged between the tips of these layered conductors, and a rear end of each layered conductor. A vertical slit is provided across the layered conductor and the insulating substrate, and an intermediate vertical piece is fitted into the slit, and an upper piece is connected to the upper end of the vertical piece and comes into contact with the layered conductor. and a lower piece connected to the lower end of the vertical piece and exposed on the other surface of the insulating substrate. Each lead conductor is fitted into the slit at the vertical piece. , solder the upper piece of each ear and each layered conductor,
This structure is characterized in that an insulating layer is provided on one side of the insulating substrate.
以下、図面により本考案の実施例を説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本考案の一実施例を示す平面説明図、
第２図は第１図の点線枠内を示す拡大斜視図であ
る。第１図並びに第２図において、１は絶縁基
板、２，２は絶縁基板の片面上に設けた一対の層
状導体であり、縦方向に延びている。７はこれら
層状導体の先端間に橋設した温度ヒユーズエレメ
ントであり、低融点合金を使用している。３は層
状導体の後端部に設けた縦方向スリツトであり、
第３図にも示すように層状導体２と絶縁基板１と
にわたつて設けてある。４，４はリード導体、５
はリード導体先端に設けた耳部であり、第４図に
も示すように中間垂直片部５１と、該中間垂直片
部の上端に連接された上側片部５２と、同中間垂
直片部の下端に連設された下側片部５３とから構
成してあり、各リード導体４の耳部５を中間垂直
下部５１において上記の各スリツト３に嵌入し、
各耳部５の上側片部５２を各層状電極２に接触さ
せ、両者間をハンダ付けし、各耳部の下側片部５
３を絶縁基板１の他面に露出させてある。８は絶
縁基板の片面上に設けた絶縁層である。 FIG. 1 is a plan view showing an embodiment of the present invention;
FIG. 2 is an enlarged perspective view showing the area within the dotted line frame in FIG. In FIGS. 1 and 2, 1 is an insulating substrate, and 2, 2 is a pair of layered conductors provided on one side of the insulating substrate, extending in the vertical direction. 7 is a temperature fuse element bridged between the tips of these layered conductors, and is made of a low melting point alloy. 3 is a vertical slit provided at the rear end of the layered conductor;
As shown in FIG. 3, it is provided across the layered conductor 2 and the insulating substrate 1. 4, 4 is a lead conductor, 5
is an ear provided at the tip of the lead conductor, and as shown in FIG. The ear part 5 of each lead conductor 4 is fitted into each of the above-mentioned slits 3 at the intermediate vertical lower part 51.
The upper piece 52 of each ear 5 is brought into contact with each layered electrode 2, and the lower piece 52 of each ear is soldered together.
3 is exposed on the other surface of the insulating substrate 1. 8 is an insulating layer provided on one side of the insulating substrate.
上記温度ヒユーズは保護すべき機器に取付けて
使用し、機器の発生熱は、リード線の直線部→耳
部→層状導体→ヒユーズエレメントの経路でヒユ
ーズエレメントに伝達されると共に、露出した耳
部部分５３も熱を受熱し、耳部→層状導体→ヒユ
ーズエレメントの経路で伝達され、従来に較べ
て、露出耳部の受熱分だけそれだけ多くの熱を受
熱する。しかも、層状導体に設けたスリツトが縦
方向であり、横方向スリツトとは異なり、リード
線直線部からの熱の流れ方向に沿うものであつて
熱の流れを遮断しないこと、耳部の上側片部の全
裏面が層状導体に接触していること等のために熱
伝達を迅速に行い得る。従つて、耳部とヒユーズ
エレメントとの間の層状導体部分の長さが長くて
も、良好な熱伝達性能を保証できる。 The above temperature fuse is used by being attached to the equipment to be protected, and the heat generated by the equipment is transferred to the fuse element through the straight part of the lead wire → ear → layered conductor → fuse element, and the exposed ear part 53 also receives heat, which is transmitted through the path of the ear section → layered conductor → fuse element, and the exposed ear section receives more heat than in the past. Moreover, the slits provided in the layered conductor are vertical, and unlike horizontal slits, they are along the direction of heat flow from the straight part of the lead wire and do not block the flow of heat, and the upper part of the ear part Because the entire back surface of the section is in contact with the layered conductor, heat transfer can be carried out quickly. Therefore, even if the length of the layered conductor portion between the ear and the fuse element is long, good heat transfer performance can be guaranteed.
上述した通り本考案に係る温度ヒユーズにおい
ては、温度ヒユーズエレメントが絶縁基板と絶縁
層とによつて挾さまれていても、温度ヒユーズエ
レメントへの熱伝達を充分な受熱量で迅速に行い
得、作動減度に優れている。 As described above, in the temperature fuse according to the present invention, even if the temperature fuse element is sandwiched between the insulating substrate and the insulating layer, heat can be quickly transferred to the temperature fuse element with a sufficient amount of heat received. Excellent operating reduction.
第１図は本考案の一実施例を示す平面説明図、
第２図は第１図の点線枠内を示す拡大斜視図、第
３図は本考案ヒユーズのスリツトを示す斜視説明
図、第４図は本考案において使用するリード導体
を示す斜視説明図である。
１……絶縁基板、２……層状導体、３……スリ
ツト、４……リード導体、５１……垂直片部、５
２……上側片部、４３……下側片部、７……ヒユ
ーズエレメント、８……絶縁層。
FIG. 1 is a plan view showing an embodiment of the present invention;
Fig. 2 is an enlarged perspective view showing the area within the dotted line frame in Fig. 1, Fig. 3 is a perspective explanatory view showing the slit of the fuse of the present invention, and Fig. 4 is a perspective explanatory view showing the lead conductor used in the present invention. . DESCRIPTION OF SYMBOLS 1...Insulating substrate, 2...Layered conductor, 3...Slit, 4...Lead conductor, 51...Vertical piece, 5
2... Upper piece, 43... Lower piece, 7... Fuse element, 8... Insulating layer.
Claims (1)
導体を設け、これら層状導体の先端間に低融点合
金からなる温度ヒユーズエレメントを橋設し、各
層状導体の後端部には縦方向スリツトを層状導体
と絶縁基板とにわたつて設け、上記スリツトに嵌
入される中間垂直片部と該垂直片部上端に連設さ
れていて全裏面が上記層状導体に接触される上側
片部と上記垂直片部下端に連設されていて絶縁基
板の他面に露出される下側片部とからなる耳部を
先端に備えた各リード導体を上記垂直片部におい
て上記スリツトに嵌着し、各耳部の上側片部と各
層状導体とをハンダ付けし、絶縁基板の片面上に
絶縁層を設けたことを特徴とする温度ヒユーズ。 A pair of layered conductors extending vertically is provided on one side of the insulating substrate, a temperature fuse element made of a low melting point alloy is bridged between the tips of these layered conductors, and a vertical slit is provided at the rear end of each layered conductor. an intermediate vertical piece provided across the layered conductor and the insulating substrate and fitted into the slit; an upper piece connected to the upper end of the vertical piece and whose entire back surface is in contact with the layered conductor; and the vertical piece. Each lead conductor is provided with an ear at its tip consisting of a lower piece connected to the lower end and exposed on the other surface of the insulating substrate, and each lead conductor is fitted into the slit at the vertical piece. 1. A temperature fuse characterized by soldering the upper side of the board to each layered conductor and providing an insulating layer on one side of an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168481U JPH0142907Y2 (en) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168481U JPH0142907Y2 (en) | 1984-11-05 | 1984-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182375U JPS6182375U (en) | 1986-05-31 |
| JPH0142907Y2 true JPH0142907Y2 (en) | 1989-12-14 |
Family
ID=30726250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168481U Expired JPH0142907Y2 (en) | 1984-11-05 | 1984-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0142907Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5738877U (en) * | 1980-08-09 | 1982-03-02 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58186570U (en) * | 1982-06-04 | 1983-12-12 | ロ−ム株式会社 | Circuit board lead terminal attachment device |
-
1984
- 1984-11-05 JP JP1984168481U patent/JPH0142907Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5738877U (en) * | 1980-08-09 | 1982-03-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6182375U (en) | 1986-05-31 |
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