JPH01263150A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH01263150A JPH01263150A JP9040588A JP9040588A JPH01263150A JP H01263150 A JPH01263150 A JP H01263150A JP 9040588 A JP9040588 A JP 9040588A JP 9040588 A JP9040588 A JP 9040588A JP H01263150 A JPH01263150 A JP H01263150A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- acid
- weight
- polycarbonate resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title abstract description 11
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 13
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 13
- 229920000098 polyolefin Polymers 0.000 claims abstract description 12
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 6
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000002952 polymeric resin Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 11
- 238000002156 mixing Methods 0.000 abstract description 10
- 229920000642 polymer Polymers 0.000 abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 3
- 229920001577 copolymer Polymers 0.000 abstract description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920002292 Nylon 6 Polymers 0.000 abstract 1
- 150000001335 aliphatic alkanes Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 1
- -1 alkane compounds Chemical class 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920006122 polyamide resin Polymers 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- NRIMHVFWRMABGJ-UHFFFAOYSA-N bicyclo[2.2.1]hepta-2,5-diene-2,3-dicarboxylic acid Chemical compound C1C2C(C(=O)O)=C(C(O)=O)C1C=C2 NRIMHVFWRMABGJ-UHFFFAOYSA-N 0.000 description 1
- 239000006085 branching agent Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- ILUAAIDVFMVTAU-UHFFFAOYSA-N cyclohex-4-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CC=CCC1C(O)=O ILUAAIDVFMVTAU-UHFFFAOYSA-N 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002689 maleic acids Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、熱安定性及び耐薬品性の優れた樹脂組成物に
関するものＣ′ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a resin composition C' having excellent thermal stability and chemical resistance.
［従来の技術］
ポリカーボネート樹脂は、耐熱性やｆｒ４ 衝撃性に優
れており、日常生活用品、事務機器等の各種機械部品、
電気電子部品等に多く使用されている。[Conventional technology] Polycarbonate resin has excellent heat resistance and FR4 impact resistance, and is used for various mechanical parts such as daily necessities and office equipment.
It is widely used in electrical and electronic parts.
しかしながら、ポリカーボネート樹脂は耐薬品性が悪く
、応力存在下である種の溶剤と接触するとクラックを生
じ易いという欠点を有する。However, polycarbonate resin has poor chemical resistance and is prone to cracking when it comes into contact with certain solvents in the presence of stress.
ポリカーボネート樹脂にポリアミド樹脂を溶融混合して
ポリカーボネート樹脂の耐薬品性を改良する試みは、特
開昭５９−６８３６８Ｍに開示され、この２元樹脂組成
物は、改善された耐薬品性を示す旨記載されている。し
かしながら、ポリカーボネート樹脂とポリアミド樹脂を
溶融混合すると、ポリカーボネート樹脂が分解し、成形
自体（へめで困難であり、成形品が得られたとしても、
成形品が変色したり成形品に銀条が発生することから、
この２元樹脂組成物は、到底使用に耐えるものではなか
った。An attempt to improve the chemical resistance of a polycarbonate resin by melt-mixing a polyamide resin with a polycarbonate resin is disclosed in JP-A-59-68368M, which states that this binary resin composition exhibits improved chemical resistance. has been done. However, when polycarbonate resin and polyamide resin are melt-mixed, the polycarbonate resin decomposes and the molding itself (it is dull and difficult, and even if a molded product is obtained,
This may cause the molded product to change color or cause silver streaks to appear on the molded product.
This binary resin composition was completely unusable.
本発明者は、上記２元樹脂組成物について鋭意研究を重
ねた結果、この２元樹脂に特定量の変性ポリオレフィン
を配合することにより、その熱安定性が飛躍的に改善さ
れることを知り、本発明に到達した。As a result of intensive research on the above-mentioned binary resin composition, the present inventor found that by blending a specific amount of modified polyolefin into this binary resin, its thermal stability can be dramatically improved, We have arrived at the present invention.
［発明の目的］
本発明の目的は、熱安定性、耐薬品性の優れた樹脂組成
物を提供することにある。[Object of the Invention] An object of the present invention is to provide a resin composition with excellent thermal stability and chemical resistance.
［発明の構成］
本発明は、ポリカーボネート（δ（脂（Ａ）２５〜８９
Φ量％、脂肪族ポリアミド（Ｂ）１０〜７４重量％及び
変性オレフィン重合体（Ｃ）１〜４０重♀％よりなる樹
脂組成物に係るもので必る。[Structure of the invention] The present invention provides polycarbonate (δ (fat (A)) 25 to 89
% by weight, 10 to 74% by weight of aliphatic polyamide (B), and 1 to 40% by weight of modified olefin polymer (C).
本発明において使用するポリカーボネート樹脂（Ａ）は
、２価フェノールよりＭ４される平均分子量１０．００
０〜ｉｏｏ、ｏｏｏ 、好ましくは１５，０００〜６０
．０００のポリカーボネートであり、通常２価フェノー
ルとカーボネート前駆体との溶液法又は溶融法で製造さ
れる。２価フェノールの代表的な例を上げるとヒスフェ
ノールＡ［２，２−ビス（４−ヒト［１キシフエニルプ
ロパン）］、ビス（４−ヒドロキシフェニル）メタン、
１，１−ビス（４−ヒドロキシフェニル）エタン、２，
２−ビス（４−ヒドロキシ−３−メチルフェニル）プロ
パン等がおる。好ましい２価フェノールはビス（４−ヒ
ト」］キシフェニル）アルカン系化合物、特にビスフェ
ノール八である。２価フェノールは単独で、又は２種以
上混合して使用することかできる。また、前記カーボネ
ート前駆体としてはカルボニルハライド、カーボネート
又はハロホルメート等をあげることかできる。代表的な
例としては、ホスゲン、ジフェニルカーボネート、２（
曲フェノールのジハロホルメート及びこれらの混合物が
あげられる。ポリカーボネート樹脂の製造に際しては、
適当な分子量調節剤１分岐剤、触媒等も使用できる。The polycarbonate resin (A) used in the present invention has an average molecular weight of 10.00 obtained by M4 from dihydric phenol.
0 to ioo, ooo, preferably 15,000 to 60
．． 000 polycarbonate, and is usually produced by a solution method or melt method using dihydric phenol and a carbonate precursor. Representative examples of dihydric phenols include hisphenol A [2,2-bis(4-human[1-xyphenylpropane)], bis(4-hydroxyphenyl)methane,
1,1-bis(4-hydroxyphenyl)ethane, 2,
Examples include 2-bis(4-hydroxy-3-methylphenyl)propane. Preferred dihydric phenols are bis(4-human"]xyphenyl)alkane compounds, especially bisphenol 8. Dihydric phenols can be used alone or in combination of two or more. Further, examples of the carbonate precursor include carbonyl halide, carbonate, haloformate, and the like. Typical examples include phosgene, diphenyl carbonate, 2(
Mention may be made of dihaloformates of bent phenols and mixtures thereof. When manufacturing polycarbonate resin,
Appropriate molecular weight regulators, branching agents, catalysts, etc. can also be used.
また、本発明において使用する脂肪族ポリアミド樹脂（
Ｂ）は、３６環以上のラクタム、重合可能なω−アミノ
酸、脂肪族二塩基酸と脂肪族ジアミン等の重縮合で製造
される。具体的な例を挙げると、ε−カプロラクタム、
アミノカプロン酸、エナントラクタム、７−アミンへブ
タン酸、１１−アミノウンデカン酸、９−アミノノナン
酸、α−ピロリドン、α−ピペリドン等の重合体、更に
はへキサメチレンジアミン、ノナメチレンジアミン。In addition, the aliphatic polyamide resin used in the present invention (
B) is produced by polycondensation of a lactam having 36 or more rings, a polymerizable ω-amino acid, an aliphatic dibasic acid, an aliphatic diamine, and the like. Specific examples include ε-caprolactam,
Polymers such as aminocaproic acid, enantholactam, 7-amine hebutanoic acid, 11-aminoundecanoic acid, 9-aminononanoic acid, α-pyrrolidone, α-piperidone, and further hexamethylene diamine and nonamethylene diamine.
ウンデカメチレンジアミン、ドデカメヂレンジアミン等
の脂肪族ジアミンと、アジピン酸、セバシン酸、ドデカ
ンニ塩基酸、ゲルタール酸等の脂肪族ジカルボン酸とを
重縮合させて得られる重合体又は共重合体等がある。例
えば、ナイロン４，６゜７、 ８． １１． １２．
６・６，６・９．６・１０，６・１１．６・１２．６／
６・６．６／１２等が挙げられる。Polymers or copolymers obtained by polycondensing aliphatic diamines such as undecamethylene diamine and dodecamethylene diamine with aliphatic dicarboxylic acids such as adipic acid, sebacic acid, dodecane dibasic acid, and geltaric acid. There is. For example, nylon 4,6°7, 8. 11. 12.
6・6,6・9.6・10,6・11.6・12.6/
6.6.6/12 etc. are mentioned.
変性オレフィン重合体（Ｃ）は、エチレン、プロピレン
、１−ブテン、イソブチレン等のモノオレフィン、ブタ
ジェン、イソプレン及び１，３−ペンタジェン等の共役
ジオレフィンより選ばれた１種以上の化合物が、重合又
は共重合した形態を示すオレフィン重合体を、不飽和カ
ルボン酸又はその誘導体とのイ］加反応により変性した
変性オレフィン重合体、又は前記オレフィン化合物重合
体が、不飽和カルボン酸又はその誘導体をランダム共重
合したものである。The modified olefin polymer (C) is a polymerized or A modified olefin polymer obtained by modifying an olefin polymer in a copolymerized form by an addition reaction with an unsaturated carboxylic acid or a derivative thereof, or the olefin compound polymer is a random copolymer of an unsaturated carboxylic acid or a derivative thereof. It is polymerized.
ここで使用する不飽和カルボン酸又はその誘導体の例と
してはマレイン酸、フマル酸、イタコン酸、ハロゲン化
マレイン酸、シス−４−シクロヘキセン−１，２−ジカ
ルボン酸、エンドーシスーヒシクロ［２，２，１］ −
］５−ペンテン２，３−ジカルボン酸やこれらジカルボ
ン酸の酸無水物エステル。Examples of unsaturated carboxylic acids or derivatives thereof used here include maleic acid, fumaric acid, itaconic acid, halogenated maleic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, endocycyclo[2,2 ,1] −
] 5-pentene 2,3-dicarboxylic acid and acid anhydride esters of these dicarboxylic acids.
アミド、イミド等並びにアクリル酸、メタクリル１２等
やこれらモノカルボン酸のエステル、アミド等が挙げら
れる。これらは、１種のみならず、２種以上混合しても
使用できる。これらの中では、不飽和ジカルボン酸又は
その誘導体が好ましく、とりわけ無水マレイン酸が好ま
しい。Examples include amides, imides, acrylic acid, methacryl 12, and esters and amides of these monocarboxylic acids. These can be used not only alone, but also as a mixture of two or more. Among these, unsaturated dicarboxylic acids or derivatives thereof are preferred, and maleic anhydride is particularly preferred.
ポリカーボネート樹脂（Ａ）の配合割合は、２５〜８９
重量％であり、好ましくは３０〜７７重量％である。The blending ratio of polycarbonate resin (A) is 25 to 89
% by weight, preferably 30 to 77% by weight.
ポリアミド樹脂（Ｂ）の配合割合は、１０〜７４重量％
であり、好ましくは２０〜６７重弔％で必る。脂）１ｔ
５族ポリアミド（Ｂ）の配合割合か１０重量％未満ては
耐薬品性改良効果が十分でなく、７４中単％を越えろと
、脂肪族ポリアミドの吸湿によりＸ１法安定１’Ｌか悪
くなる。The blending ratio of polyamide resin (B) is 10 to 74% by weight
and preferably 20 to 67%. fat) 1t
If the blending ratio of Group 5 polyamide (B) is less than 10% by weight, the effect of improving chemical resistance will not be sufficient, and if it exceeds 74% by weight, the X1 method stability will deteriorate by 1'L due to moisture absorption of the aliphatic polyamide.
変性オレフィン重合体（Ｃ）の配合Ａ’Ｊ合は１〜４０
重量％であり、好ましくは２〜３０重量％、更に好まし
くは３〜２０ｆｆｌ ｆｆｉ％である。変性オレフィン
重合体（Ｃ）の配合割合か、１重量％未満では熱安定性
改良効果が十分でなく成形品に鍜条か発生したり、成形
品が変色したりする。゛また、４０中量％を越えると機
械的強度が低下するようになる。Blending A'J ratio of modified olefin polymer (C) is 1 to 40
% by weight, preferably 2 to 30% by weight, more preferably 3 to 20ffl%. If the blending ratio of the modified olefin polymer (C) is less than 1% by weight, the effect of improving thermal stability will not be sufficient and the molded product may develop streaks or discolor.゛Moreover, if the content exceeds 40% by weight, the mechanical strength will decrease.
本発明の樹脂組成物は、これら３種の成分をりンブラー
、ブレンダー、ナウターミキｔＪ−、バンバリーミキサ
−２混練ロール、押出機等の如き混合機により混合して
製造することができる。本発明の組成物は、樹脂組成物
の特性を損なわない範囲内で、上記配合物以外に、酸化
防止剤、難燃剤。The resin composition of the present invention can be produced by mixing these three components using a mixer such as a gumbler, blender, Nauta Miki tJ-, Banbury mixer 2 kneading roll, extruder, or the like. The composition of the present invention may contain an antioxidant and a flame retardant in addition to the above-mentioned ingredients within a range that does not impair the properties of the resin composition.
帯電防止剤、紫外線吸収剤等を含有してもよい。It may also contain antistatic agents, ultraviolet absorbers, and the like.
本発明の組成物は、任意の成形方法、例えば射出成形、
押出成形、圧縮成形１回転成形等に適用でき、成形時の
熱安定性、得られた成形品の耐薬品［（口よ極めて良好
である。The composition of the present invention can be formed by any molding method, such as injection molding,
It can be applied to extrusion molding, compression molding, single rotation molding, etc., and has excellent thermal stability during molding and chemical resistance of the obtained molded product.
し実施例］ 次に実施例を、挙げて本発明の詳細な説明する。Examples] Next, the present invention will be described in detail by way of examples.
なあ、実施例にあける評価は、下記の方法によった。Incidentally, the evaluations in the examples were conducted according to the following method.
（１）成形品の外観の護衛
射出成形機で成形した見本板の第１シヨツト目と第１５
シヨツト目を目視で比較した。評価は下記の方法で行な
った。(1) Guarding the appearance of the molded product The 1st and 15th shots of the sample plate molded with the injection molding machine
The shots were compared visually. The evaluation was performed using the following method.
（２）耐薬品性試験
見本板をシンナー（日本ビーケミカル（Ｉ木製：Ｔ−８
００）に２３℃×３分浸漬後、未浸漬の見本板と比較し
た。評価は２段階で実施した。(2) Apply chemical resistance test sample board to thinner (Nippon B Chemical (I Wooden: T-8)
00) at 23° C. for 3 minutes and then compared with a sample plate that had not been immersed. The evaluation was conducted in two stages.
（３）引張試験
＾５ＴＩ（Ｄ−６３８に従って実施
実施例１〜６及び比較例１〜５
ポリカーボネート樹脂を１２０°Ｃにて５時間以上、ポ
リアミド樹脂を１０５℃にて５時間以上乾燥後、変性オ
レフィン重合体と共に第１表に示す配合割合で混合し、
３０ｍ…φベント式押出機（ナカタニｌ木ＶＳ Ｋ−３
０）を用い、シリンダー温度２５０〜２６０℃にてペレ
ット化した。このペレットを１０５°Ｃで５時間以上乾
燥後、射出成形機（日ｌ１ＩＪ−１２０ＳＡ）を用い、
下記に示す成形条件にて成形し、物性試験片及び見本板
（５０ｘ ８０ｘ ２ｍｍ）を作成した。ｊｑられた試
験片と見本板を用いて引張試験及び耐薬品性試験を実施
した。結果は第１表に示した。(3) Tensile test^5TI (According to D-638 Examples 1 to 6 and Comparative Examples 1 to 5 Polycarbonate resin was dried at 120°C for 5 hours or more, polyamide resin was dried at 105°C for 5 hours or more, and then denatured. Mixed with an olefin polymer at the blending ratio shown in Table 1,
30m...φ vent type extruder (Nakatani luki VS K-3
0) at a cylinder temperature of 250 to 260°C. After drying the pellets at 105°C for more than 5 hours, using an injection molding machine (Japanese l1IJ-120SA),
It was molded under the molding conditions shown below to create physical property test pieces and sample plates (50 x 80 x 2 mm). A tensile test and a chemical resistance test were conducted using the prepared test piece and sample plate. The results are shown in Table 1.
成形条件
０実施例１〜５及び比較例２〜４；
シリンダー温度２５０’Ｑ
Ｑ実施例６及び比較例５；
シリンダー温度２６０’Ｇ
Ｏ比較例１； シリンダー温度２８０°Ｃ金型温
度はいずれも７０’Ｃ
手続補正書
昭和６３年６月力日
！を寺ｎ午庁長宮殿
１、事ｆ１の表示
特願昭 ６３−９０４０５号
２、発明の名称
樹脂組成物
帝人化成株式会社
（１）明ｍ書第２頁第１３行〜第１４行に「変性ポリオ
レフィン」とあるを「変性オレフィン重合体」と訂正す
る。Molding conditions 0 Examples 1 to 5 and Comparative Examples 2 to 4; Cylinder temperature 250'Q Q Example 6 and Comparative Example 5; Cylinder temperature 260'GO Comparative Example 1; Cylinder temperature 280°C All mold temperatures 70'C Procedural amendment dated June 1986! Indication of Temple Ngo Director's Palace 1, Matter F1 Patent Application No. 63-90405 No. 2, Name of Invention Resin Composition Teijin Kasei Co., Ltd. (1) Book M, Page 2, Lines 13 to 14: `` "Modified polyolefin" should be corrected to "Modified olefin polymer."
（２）同第３頁第１０行に「上げる」とあるを「あげる
」と訂正する。(2) On page 3, line 10, the word "raise" is corrected to "raise."
（３）同第３頁第１１行〜第１２行に［［２，２−ビス
（４−ヒドロキシフェニルプロパン）コとあるを「［２
，２−ビス（４−ヒドロキシフェニル）プロパン］と訂
正する。(3) On page 3, lines 11 to 12, [[2,2-bis(4-hydroxyphenylpropane)] is replaced with [[2,2-bis(4-hydroxyphenylpropane)].
, 2-bis(4-hydroxyphenyl)propane].
以上that's all
Claims (1)
肪族ポリアミド樹脂１０〜７４重量％（Ｃ）変性オレフ
ィン重合体１〜４０重量％よりなる樹脂組成物(A) 25-89% by weight of polycarbonate resin (B) 10-74% by weight of aliphatic polyamide resin (C) 1-40% by weight of modified olefin polymer Resin composition
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9040588A JPH01263150A (en) | 1988-04-14 | 1988-04-14 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9040588A JPH01263150A (en) | 1988-04-14 | 1988-04-14 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01263150A true JPH01263150A (en) | 1989-10-19 |
Family
ID=13997675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9040588A Pending JPH01263150A (en) | 1988-04-14 | 1988-04-14 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01263150A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716033A (en) * | 1980-07-02 | 1982-01-27 | Mitsubishi Chem Ind Ltd | Expandable thermoplastic resin composition |
| JPS6375057A (en) * | 1986-09-19 | 1988-04-05 | Showa Denko Kk | Resin mixture |
| JPH01165660A (en) * | 1987-12-22 | 1989-06-29 | Showa Denko Kk | Resin composition |
-
1988
- 1988-04-14 JP JP9040588A patent/JPH01263150A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716033A (en) * | 1980-07-02 | 1982-01-27 | Mitsubishi Chem Ind Ltd | Expandable thermoplastic resin composition |
| JPS6375057A (en) * | 1986-09-19 | 1988-04-05 | Showa Denko Kk | Resin mixture |
| JPH01165660A (en) * | 1987-12-22 | 1989-06-29 | Showa Denko Kk | Resin composition |
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