JPH01234434A - Bulk molding compound composition and molded article produced therefrom - Google Patents
Bulk molding compound composition and molded article produced therefromInfo
- Publication number
- JPH01234434A JPH01234434A JP5923888A JP5923888A JPH01234434A JP H01234434 A JPH01234434 A JP H01234434A JP 5923888 A JP5923888 A JP 5923888A JP 5923888 A JP5923888 A JP 5923888A JP H01234434 A JPH01234434 A JP H01234434A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- specific gravity
- molding compound
- acid
- bulk molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 76
- 239000004412 Bulk moulding compound Substances 0.000 title claims abstract description 17
- 230000005484 gravity Effects 0.000 claims abstract description 44
- 229920006337 unsaturated polyester resin Polymers 0.000 claims abstract description 17
- 239000002253 acid Substances 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 28
- 239000000945 filler Substances 0.000 abstract description 12
- 239000002562 thickening agent Substances 0.000 abstract description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract description 8
- 239000003365 glass fiber Substances 0.000 abstract description 8
- 239000012779 reinforcing material Substances 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000006082 mold release agent Substances 0.000 abstract description 6
- 239000000395 magnesium oxide Substances 0.000 abstract description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 abstract description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract description 4
- 235000021355 Stearic acid Nutrition 0.000 abstract description 2
- 238000007667 floating Methods 0.000 abstract description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 abstract description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000008117 stearic acid Substances 0.000 abstract description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 239000003677 Sheet moulding compound Substances 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- -1 ships Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- KFIRODWJCYBBHY-UHFFFAOYSA-N 3-nitrophthalic acid Chemical compound OC(=O)C1=CC=CC([N+]([O-])=O)=C1C(O)=O KFIRODWJCYBBHY-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000212342 Sium Species 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical compound C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000005068 transpiration Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920001567 vinyl ester resin Chemical group 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は軽那−成形物を与える成形材ネ゛1としての低
比重のバルクモールディングコンパウンド組成物および
その組成物を賦型成形した低比重の成形物に関するもの
である。Detailed Description of the Invention [Industrial Field of Application] The present invention provides a low specific gravity bulk molding compound composition as a molding material 1 for producing a lightweight molded product, and a low specific gravity bulk molding compound composition formed by shape molding the composition. This invention relates to a molded article.
[従来の技術]
不飽和ポリエステル樹脂をマトリックスとして、架橋剤
、重合開始剤、増粘剤、充填剤、補強剤、その他の添加
剤とからなる成形用組成物は通常バルクモールディング
コンパラント(以下BMCと略す)、シートモールデイ
ングコンパウンド(以下、SHCと略す)として成形材
料に調製される。これらBMC、SMCは圧縮成形、射
出成形などによる成形が容易であり、成形品は耐熱性、
耐食性、機械的強度などの特性に優れていることから、
住宅建材、船舶、車輌部材、工業部品、電気部品などの
あらゆる分野に使用されている。[Prior Art] A molding composition comprising an unsaturated polyester resin as a matrix, a crosslinking agent, a polymerization initiator, a thickener, a filler, a reinforcing agent, and other additives is usually called a bulk molding comparant (hereinafter referred to as BMC). It is prepared into a molding material as a sheet molding compound (hereinafter abbreviated as SHC). These BMC and SMC are easy to mold by compression molding, injection molding, etc., and the molded products have heat resistance,
Due to its excellent properties such as corrosion resistance and mechanical strength,
It is used in all fields such as housing construction materials, ships, vehicle parts, industrial parts, and electrical parts.
特に、最近は、例えば車輌部材においては、エネルギー
節減を目的として軽量化の検討が行なわれ、また、食堂
、旅館、ホテルなどの業種において、大量に取り扱われ
る食器類、配膳盆、トレイなどのプラスチ・ンク化によ
る軽量化とともにそれらの機械的強度の向上による作業
効率の改善か求められている。In particular, in recent years, efforts have been made to reduce the weight of vehicle components in order to save energy, and in industries such as restaurants, inns, and hotels, plastics are being used for tableware, serving trays, trays, etc. that are handled in large quantities.・There is a need to improve work efficiency by reducing the weight by increasing the weight of the cylinders and by increasing their mechanical strength.
従来よりBMC、SMCにおいて下館ポリエステル、エ
ポキシ樹脂をマトリックスとして粒径10〜250 p
−のガラス中空球あるいは有機質中空球を充填すること
によって軽量な成形物が得られることは公知である。し
かしながら、これらの多量の充填は樹脂の粘度の上昇を
伴ない、しかも球体が破壊されることから、それらを賦
型成形してなる成形品は実質的に水に浮上する程の軽量
化は達成されていない。Conventionally, in BMC and SMC, particle size is 10 to 250 p using Shimodate polyester or epoxy resin as a matrix.
It is known that lightweight molded articles can be obtained by filling glass hollow spheres or organic hollow spheres. However, filling a large amount of these resins increases the viscosity of the resin and destroys the spheres, so it is not possible to achieve a weight reduction of molded products made by molding them to the extent that they practically float on water. It has not been.
また、自動車の外板などに使用され得る軽量繊維強化樹
脂板体として外表面層がSMCで成形され、他の層の一
部かガラス中空球を充填したSMCより成形されてなる
軽量繊維樹脂板が特開昭62−17:1249号公報に
提案されている。SMCはその総量に対してガラス繊維
か60重量%以上充填されているが、これにガラス中空
球が充填されることから、粘度の上昇を伴ない、ガラス
繊維に対する樹脂の含浸が不充分となるという問題かあ
り、故にガラス中空球の充填量は制約され、好適な条件
においてガラス中空球の充填されてなるSMCによる成
形物の比重は1.1〜1.6であって、実質的に水に浮
上するような軽量成形物は得られない。Also, as a lightweight fiber-reinforced resin board that can be used for the outer panels of automobiles, the outer surface layer is molded from SMC, and some of the other layers are molded from SMC filled with glass hollow spheres. is proposed in Japanese Patent Application Laid-open No. 1249/1983. SMC is filled with 60% by weight or more of glass fiber based on the total amount of SMC, but since it is filled with glass hollow spheres, the viscosity increases and resin impregnation into the glass fiber becomes insufficient. Therefore, the amount of glass hollow spheres filled is limited, and under suitable conditions, the specific gravity of the SMC molded product filled with glass hollow spheres is 1.1 to 1.6, which is essentially water. It is not possible to obtain a lightweight molded product that floats on the surface.
一方、有機質中空球の充填されてなるBMClSMCよ
り賦型成形されてなる成形物は特性としての耐熱性に劣
るという問題がある。On the other hand, molded products formed by molding BMClSMC filled with organic hollow spheres have a problem of poor heat resistance.
[発明の解決しようとする課題]
本発明はSMC、BM(:の低比重化における上記の如
き問題点に鑑みなされたものであり、本発明者等はBM
G組成物について、その賦型成形物が実質的に水に浮上
し得る低比重の成形物を与え得るBMG組成物について
種々研究、検討を行なった。[Problem to be solved by the invention] The present invention was made in view of the above-mentioned problems in reducing the specific gravity of SMC, BM (:
Regarding the G composition, various studies and examinations were conducted on the BMG composition that can provide a molded product with a low specific gravity that can substantially float on water.
その結果、不飽和ポリエステル樹脂をマトリックスとす
るBMC80組成物いて、特定の処理を施こしたガラス
中空球はBMG組成物中に多量に充填させることができ
て、低比重のBMC80組成物られ、そのBMG組成物
を賦型成形することによって実用上支障のない強度を有
し、しかも比重1.1〜0.85の水に浮上する低比重
の成形物が得られるという事実を見い出し本発明を完成
するのに至ったものである。As a result, a BMC80 composition with an unsaturated polyester resin as a matrix, glass hollow spheres subjected to specific treatment can be filled in a large amount in a BMG composition, and a low specific gravity BMC80 composition can be obtained. The present invention was completed after discovering the fact that by molding a BMG composition, it is possible to obtain a low specific gravity molded product that has a strength that does not pose a problem in practical use and that floats on water with a specific gravity of 1.1 to 0.85. This is what I came to do.
したがって本発明は、従来技術によっては得ることので
きなかった。低比重のBMG組成物およびその成形物を
賦型成形してなる低比重の成形物を新規に提供すること
を目的とするものである。Therefore, the present invention could not be obtained using the prior art. The object of the present invention is to provide a new low-specific gravity molded product obtained by molding a low-specific gravity BMG composition and a molded product thereof.
[課題を解決するための手段]
即ち1本発明は、不飽和ポリエステル樹脂をマトリック
スとするモールディングコンパウンド組成物において、
該組成物はガラス中空球を含有し、該ガラス中空球は有
効比重0.3〜0.4であって少なくとも1回酸処理さ
れてなり、且つ組成物の総量に15〜45重量%含有す
る低比重のバルクモールディングコンパウンド組成物お
よびその組成物を賦型成形してなる成形物を提供するも
のである。[Means for Solving the Problems] That is, 1 the present invention provides a molding compound composition having an unsaturated polyester resin as a matrix,
The composition contains glass hollow spheres, the glass hollow spheres have an effective specific gravity of 0.3 to 0.4, are acid-treated at least once, and contain 15 to 45% by weight of the total composition. The present invention provides a bulk molding compound composition having a low specific gravity and a molded article obtained by molding the composition.
本発明の不飽和ポリエステル樹脂をマトリックスとする
BMC80組成物ける不飽和ポリエステル樹脂としては
、α、β−不悠和二塩基准またはその酸無水物、あるい
は芳香族飽和二塩基酸またはその酸無水物とグリコール
類との重縮合によって得られる不飽和ポリエステル樹脂
またはこれらの併用、あるいは部分変性したものなどの
公知のものや市仄品を使用できる。The unsaturated polyester resin used in the BMC80 composition having the unsaturated polyester resin of the present invention as a matrix is α,β-unionized dibasic acid or its acid anhydride, or aromatic saturated dibasic acid or its acid anhydride. Known or commercially available unsaturated polyester resins obtained by polycondensation of polyester and glycols, combinations thereof, or partially modified products can be used.
上記のα、β−不飽和二塩基酸としては例えば、マイレ
ン酸、フマル酸、シトラコン酸、イタコン醜、クロルマ
レイン酸およびこれらのエステル等があり、芳香族飽和
二塩基酸としては例えば、フタル酸、イソフタル酸、テ
レフタル酸、ニトロフタル酸およびこれらのエステル等
がある。またそれらの酸無水物としては例えば無水マレ
イン酸、無水フタル酸、テトラヒドロ無水フタル酸、エ
ンドメチレンテトラヒドロフタル酸、ハロゲン化無水フ
タル酸およびこれらのエステル等がある。Examples of the above α,β-unsaturated dibasic acids include maleic acid, fumaric acid, citraconic acid, itacone, chlormaleic acid, and esters thereof, and examples of the aromatic saturated dibasic acids include phthalic acid. , isophthalic acid, terephthalic acid, nitrophthalic acid and their esters. Examples of the acid anhydrides include maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic acid, halogenated phthalic anhydride, and esters thereof.
上記の他に、脂肪族あるいは脂環飽和二塩基酸も併用さ
れ、かかる脂肪族あるいは脂環飽和二塩基酸としては、
シュウ酸、マロン酸、コハク酸、アジピン酸、セバシン
醜、アゼライン酸、グルタル酸、ヘキサヒドロ無水フタ
ル酸およびこれらのエステル等が例示される。さらに、
部分変性した不飽和ポリエステルとして不飽和ポリエス
テルの末端をビニル変性したもの、およびエポキシ骨格
の末端をビニル変性したビニルエステル等を例示し得る
。In addition to the above, aliphatic or alicyclic saturated dibasic acids are also used, and such aliphatic or alicyclic saturated dibasic acids include:
Examples include oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, glutaric acid, hexahydrophthalic anhydride, and esters thereof. moreover,
Examples of partially modified unsaturated polyesters include unsaturated polyesters whose ends are modified with vinyl, and vinyl esters whose ends of epoxy skeletons are modified with vinyl.
グリコール類としては、エチレングリコール、プロピレ
ングリコール、ジエチレングリコール、ジプロピレング
リコール、1,3−ブタンジオール、1,4−ブタンジ
オール、ネオペンチルグリコール、トリメチレングリコ
ール、トリエチレングリコール、テトラエチレングリコ
ール、1.5−ベンタンジオール、1,6−ヘキサンジ
オール、ビスフェノールジオキシジエチルエーテル、エ
チレングリコールカーボネート等が挙げられ、これらは
単独あるいは併用して使用される。Glycols include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, trimethylene glycol, triethylene glycol, tetraethylene glycol, 1.5 Examples include -bentanediol, 1,6-hexanediol, bisphenoldioxydiethyl ether, and ethylene glycol carbonate, which may be used alone or in combination.
不飽和ポリエステル樹脂は架橋剤としての七ツマー1一
般的にはスチレンに希釈されて液状とされるが、かかる
モノマーとしてはビニルケトン・、α−メチルスチレン
、クロルスチレン、ジクロルスチレン、ビニルナフタレ
ン、エチルビニルエーテル、メチルビニルケトン、メチ
ルアクリレート等も単独あるいは併用して使用される。Unsaturated polyester resin is generally diluted with styrene to form a liquid as a crosslinking agent, but such monomers include vinyl ketone, α-methylstyrene, chlorostyrene, dichlorostyrene, vinylnaphthalene, and ethyl. Vinyl ether, methyl vinyl ketone, methyl acrylate, etc. are also used alone or in combination.
不飽和ポリエステル樹脂は重合硬化に際して収線を伴な
うことから1通常低収縮剤か配合されるか1本発明の1
m組成物においても低収縮剤として、例えばポリエチレ
ン、ポリスチレン、ポリ塩化ビニル、ポリ酢酸ビニル、
ポリ(メタ)アクリレート、 SBSエラストマー、飽
和ポリエステル系ウレタンオリゴマー等が使用される。Since unsaturated polyester resins are accompanied by condensation lines during polymerization and curing, 1. Is a low shrinkage agent usually added? 1.
Also in the m composition, as a low shrinkage agent, for example, polyethylene, polystyrene, polyvinyl chloride, polyvinyl acetate,
Poly(meth)acrylate, SBS elastomer, saturated polyester urethane oligomer, etc. are used.
また、硬化剤として、一般の有機過酸化物、例えばベン
ゾイルパーオキサイド、クメンハイドロパーオキサイド
、ラウロイルパーオキサイド、アセチルパーオキサイド
、アセチルパーオキサイド、ジ−t−ブチルパーオキサ
イド、t−ブチルパーベンゾエート等が使用され、さら
に必要によりジメチルアニリン、ナフテン醜コバルト等
の促進剤も併用され得る。In addition, general organic peroxides such as benzoyl peroxide, cumene hydroperoxide, lauroyl peroxide, acetyl peroxide, acetyl peroxide, di-t-butyl peroxide, t-butyl perbenzoate, etc. can be used as curing agents. Further, if necessary, accelerators such as dimethylaniline and naphthenic cobalt may also be used in combination.
本発明のSMC組成物は、上記の不飽和ポリエステル樹
脂をマトリックスとして、ガラス中空球、充填剤、増粘
剤、補強材、内部離型剤、その他所望の添加剤を含有す
る。The SMC composition of the present invention uses the above unsaturated polyester resin as a matrix, and contains glass hollow spheres, a filler, a thickener, a reinforcing material, an internal mold release agent, and other desired additives.
特に重要なことはガラス中空球を含有することであり、
ガラス中空球はガードナーカップ法によって測定される
有効比重が0.3〜0.4であって、少なくとも1回酸
処理されたものを使用する。上記の有効比重の例えば0
.4は嵩比重0.22g/ccに相当する。而して、一
般に中空球はBM(: 、 SMC組成物の調製および
それらの成形に際して約50%の破壊を伴なうとされて
いるが、有効比重0.3以下の中空球であると実質的に
破壊率か高くなり、一方0.4以上の中空球であると低
比重化と成形物の強度の維持との両立性が困難となる。What is especially important is that it contains glass hollow spheres,
The glass hollow spheres used have an effective specific gravity of 0.3 to 0.4 as measured by the Gardner cup method and have been acid-treated at least once. For example, the effective specific gravity above is 0
.. 4 corresponds to a bulk specific gravity of 0.22 g/cc. Generally speaking, hollow spheres are said to be destroyed by about 50% during the preparation of BM (SMC) compositions and their molding, but hollow spheres with an effective specific gravity of 0.3 or less are substantially destroyed. On the other hand, if the hollow sphere is 0.4 or more, it becomes difficult to achieve both low specific gravity and maintenance of the strength of the molded product.
ガラス中空球の粒子径は1〜150 JLの範囲にある
ものの混在物であって、かかる粒子径の範囲において粒
度分布としては粒子径の平均値か40〜70jLの正規
春型ななしているのか好ましい。粒子径か特定範囲にて
揃えてなるガラス中空球の使用はSMC組成物に均質に
含有されるが、その組成物よりなる成形物は強・度は低
いものとなる。本発明における上記の如き粒子径の範囲
の混在物の使用は、例えば、粒子径の大きいものの間に
粒子径の小さいものが適度に充填された状態となり、し
かも酸処理されてなることとの相剰的作用によって、従
来にない多量、即ち、BMG組成物の総量に15〜45
重量%の含有が可ス七となるものと推測される。この結
果として、低比重のSMC組成物およびそれよりなる低
比重の成形物が得られ、且つ上記粒子径の範囲の混在は
恰もコンクリートにおけるセメントに対する砂と砂利と
の併用による強度向上効果が得られると同様に、低比重
の成形物において実用上の使用で充分なる強度が維持さ
れるものと推測される。The particle size of the glass hollow spheres is a mixture of particles in the range of 1 to 150 JL, and within this particle size range, the particle size distribution is preferably an average particle size or a normal spring shape of 40 to 70 JL. . The use of glass hollow spheres with particle diameters within a specific range allows them to be homogeneously contained in the SMC composition, but molded articles made from the composition will have low strength and strength. The use of inclusions in the above particle size range in the present invention is compatible with the fact that, for example, particles with a small size are appropriately packed between particles with a large size, and are treated with an acid. Due to the additive effect, an unprecedentedly large amount, i.e. 15-45%, is added to the total amount of BMG composition.
It is estimated that the content by weight is about 7. As a result, a low specific gravity SMC composition and a low specific gravity molded product made from the same are obtained, and the mixture of the above particle size ranges is similar to the strength improvement effect of using sand and gravel in combination with cement in concrete. Similarly, it is presumed that a molded product with a low specific gravity maintains sufficient strength for practical use.
ガラス中空球はBMG組成物の調製および組成物を用い
て成形する際に約50%は破壊されるとされているが、
本発明のBMC組成物において総量の15重量%以下の
含有では低比重の成形物は得難くなる。一方、45重量
%を越える含有は組成物の調製において粘度の上昇を伴
ない実質的にその調製は極めて困難となる。ガラス中空
球はその有効比重と含有される量との関係において、有
効比重が0.3側にシフトされているものであれば多量
に、0.4側にシフトされているものであれば少量に含
有され得るが、BMC組成物の調製の容易性、成形物の
実用上の軽量性、強度などに鑑みて好ましくは30〜4
0重量%である。ガラス中空球の酸処理は適度な濃度に
希釈して、調製された酸、例えば塩醜などによって侵清
処理した後、乾繰させる。また、酸処理されたものにシ
ラン処理、ボラン処理を施こしたものを使用することも
できる。It is said that about 50% of glass hollow spheres are destroyed during the preparation of the BMG composition and when molded using the composition.
If the BMC composition of the present invention contains less than 15% by weight of the total amount, it will be difficult to obtain a molded article with a low specific gravity. On the other hand, if the content exceeds 45% by weight, the viscosity increases during the preparation of the composition, making it substantially difficult to prepare the composition. Regarding the relationship between the effective specific gravity and the amount of glass hollow spheres contained, if the effective specific gravity is shifted to the 0.3 side, the amount is large, and if the effective specific gravity is shifted to the 0.4 side, the amount is small. However, in view of the ease of preparation of the BMC composition, the practical lightness of the molded product, the strength, etc., it is preferably 30 to 4.
It is 0% by weight. The acid treatment of the glass hollow sphere is performed by diluting it to an appropriate concentration and infiltrating it with a prepared acid, such as salt, and then drying it. Furthermore, it is also possible to use acid-treated materials that have been subjected to silane treatment or borane treatment.
充填剤としては、例えば炭酸カルシウム、水酸化アルミ
ニウム、三酸化アンチモン、酸化チタン、硫酸バリウム
、マイカ、アルミナ、タルク、シリカ粉、クレー、珪砂
等の各種無機物か使用される。かかる充填剤の形状はB
MC組成物より、なる成形物の表面形状を考慮して適宜
の粒度の微粉末を選択し得る。充填剤は不飽和ポリエス
テル樹脂100重量部に対して10〜20重量部の割合
であるのが好ましいか、適当な量のガラス中空球によっ
てこれを代替することもてきる。As the filler, various inorganic substances such as calcium carbonate, aluminum hydroxide, antimony trioxide, titanium oxide, barium sulfate, mica, alumina, talc, silica powder, clay, and silica sand are used. The shape of such filler is B
From the MC composition, a fine powder having an appropriate particle size can be selected in consideration of the surface shape of the molded product. The filler is preferably present in a proportion of 10 to 20 parts by weight based on 100 parts by weight of the unsaturated polyester resin, or may be replaced by an appropriate amount of glass hollow spheres.
増粘剤はSMC、BMCには不可欠のものとされていて
、周期率の■族aのアルカリ土類金属の酸化物、水酸化
物が有効であり、不飽和ポリエステルの有する水酸基、
カルボキシル基あるいはエステル結合等と化学的に結合
して分子量を増大させ、これによって増粘するというこ
とか知られている。本発明のBMG組成物においても酸
化マグネシウム、水酸化マグネシウム、酸化カルシウム
、水酸化カルシウム等を使用し得るものとして挙げるこ
とができる。その他に酸化バリウム、酸化ベリリウム、
金属アルコキシド類、ポリイソシアネート等も例示でき
る。かかる増粘剤は不飽和ポリエステル樹脂100重量
部に対して0.5〜5重量部を用いる。Thickeners are considered indispensable for SMC and BMC, and oxides and hydroxides of alkaline earth metals in group A of periodicity are effective;
It is known that it increases the molecular weight by chemically bonding with carboxyl groups or ester bonds, thereby increasing the viscosity. Also in the BMG composition of the present invention, magnesium oxide, magnesium hydroxide, calcium oxide, calcium hydroxide, etc. can be used. In addition, barium oxide, beryllium oxide,
Examples include metal alkoxides and polyisocyanates. Such a thickener is used in an amount of 0.5 to 5 parts by weight per 100 parts by weight of the unsaturated polyester resin.
強化材としては、通常ガラス繊維のロービングまたはチ
ョツプドストランドを長さ0.1〜50+mmに切断し
て用いられるが、本発明のBMG組成物においてもEガ
ラス、Cガラス、Aガラス等のいずれからなるガラス繊
維をも用い得て、不飽和ポリエステル樹脂100重量部
に対して10〜50重量部が使用される。かかるガラス
繊維は表面処理剤、例えばシラン処理、ポラン処理され
たものが好ましい。As the reinforcing material, glass fiber rovings or chopped strands are usually cut into lengths of 0.1 to 50+ mm, but in the BMG composition of the present invention, any of E glass, C glass, A glass, etc. Glass fibers consisting of 10 to 50 parts by weight per 100 parts by weight of unsaturated polyester resin may also be used. Such glass fibers are preferably treated with a surface treatment agent such as silane treatment or poran treatment.
内部離型剤としては、一般にステアリン酸。The internal mold release agent is generally stearic acid.
ステアリン酩亜鉛、ステアリン酸カルシウム、有機リン
酸エステル等が好適なものとして知られている。本発明
のBMG組成物においても、かかる離型剤を使用し得る
。Zinc stearate, calcium stearate, organic phosphate esters, etc. are known as suitable ones. Such mold release agents may also be used in the BMG compositions of the present invention.
その他所望の添加剤としては、例えば顔料、難燃剤、難
燃助剤等の成形物の特性を向上させるに有用なものか使
用される。Other desired additives include those useful for improving the properties of molded products, such as pigments, flame retardants, and flame retardant aids.
本発明のBMG組成物の調製方法は従来公知の方法を採
用し得て特に限定されない。不飽和ポリエステル樹脂、
硬化剤、ガラス中空球、充填剤、増粘剤、補強材、内部
離型剤、その他所望の添加剤等を各々所要量計量し、例
えばニーダ−、インテンシブルミキサ−等の通常8MC
の調製に際して用いられる混練機によって混練すること
によって行なわれる。The method for preparing the BMG composition of the present invention is not particularly limited and may be any conventionally known method. unsaturated polyester resin,
Weigh out the required amounts of hardening agent, glass hollow spheres, filler, thickener, reinforcing material, internal mold release agent, and other desired additives, etc., and mix them in a typical 8MC machine such as a kneader or intensive mixer.
This is done by kneading with a kneader used in the preparation of.
混練されたペースト状のBMC組成物は直ちに成形機に
より賦型成形することができる。また所望の成形時期に
成形するための保存方法として、例えばポリエチレン、
ポリプロピレン、ポリエステル、セロファン等のフィル
ムによって包装する。かかるフィルムによる包装によっ
て組成物の樹脂成分であるスチレン等の蒸散な防止する
。さらに長期保存のためにはハイドロキノン等の重合禁
止剤を配合してフィルム包装下に保存するのか好ましい
。The kneaded paste-like BMC composition can be immediately shaped and molded using a molding machine. In addition, as a preservation method for molding at a desired molding time, for example, polyethylene,
Packed with a film of polypropylene, polyester, cellophane, etc. Packaging with such a film prevents transpiration of styrene, etc., which is a resin component of the composition. Furthermore, for long-term storage, it is preferable to add a polymerization inhibitor such as hydroquinone and store under film packaging.
本発明の低比重の成形物を得るためのBMCMl成物を
賦型成形するための成形方法も特別に限定されるもので
はない。通常のプレス成形機により、所望成形物の得ら
れる金型内にBMG組成物を@、霞し、加熱加圧するこ
とによって行なうことかできる。かかる賦型成形に際し
ての成形条件としては、一般に金型温度は120〜17
0℃、成形圧力は70〜150kg/cm2.成形時間
は1〜10分である。また、賦型成形に際し、成形物の
表面のパターン付与、転写フィルムからの転写あるいは
他の樹脂よりなる被覆層の形成などを、インモールドコ
ート、真空成形などによって、あるいはクロス、不織布
等の印刷物による表面被覆を一体的に行なうこともてき
る。The molding method for shaping the BMCMl composition to obtain the low specific gravity molded product of the present invention is also not particularly limited. This can be carried out by applying a mist to the BMG composition in a mold for obtaining a desired molded product using a conventional press molding machine, and heating and pressurizing the mixture. The molding conditions for such shape molding generally include a mold temperature of 120 to 17
0°C, molding pressure 70-150kg/cm2. The molding time is 1 to 10 minutes. In addition, during shape molding, patterning on the surface of the molded product, transfer from a transfer film, or formation of a coating layer made of other resin can be done by in-mold coating, vacuum forming, etc., or by printing with cloth, nonwoven fabric, etc. It is also possible to perform surface coating integrally.
成形物は1〜15m■の厚さであるのか好適であるが、
151I11以上の厚さであってもよく、このような厚
物の成形は通常成形時間は長くなるか、本発明のBMG
組成物はガラス中空球を含有することから、ガラス中空
球か断熱作用を与え、樹脂の硬化時の発熱の放散を抑制
し、このため長時間の成形を要しない。It is preferable that the molded product has a thickness of 1 to 15 m.
The thickness of the BMG of the present invention may be 151I11 or more, and molding of such a thick material usually takes a long time, or
Since the composition contains glass hollow spheres, the glass hollow spheres provide a heat insulating effect and suppress the dissipation of heat generated during curing of the resin, thereby eliminating the need for long molding.
かくして賦型成形された成形物は極めて軽く、比重1.
1〜0.85の低比重の成形物であって実質的に水に浮
上する。しかも実用上充分な強度を有している。したか
って、例えば日用品としての食器類、トレイなどの軽量
化か実現され、営業用に食器類、トレイ等が大量に使用
される業界において作業効率の向上が期待される。The molded product thus formed is extremely light, with a specific gravity of 1.
It is a molded product with a low specific gravity of 1 to 0.85 and substantially floats on water. Moreover, it has sufficient strength for practical use. Therefore, for example, the weight of daily necessities such as tableware, trays, etc. can be reduced, and work efficiency is expected to be improved in industries where large quantities of tableware, trays, etc. are used for commercial purposes.
また、低比重の程度を若干緩和され得るとするならば賦
型成形に際して例えばガラス繊維の織布あるいは不織布
等の強化材との一体成形によって、強度のさらに高めら
れた低比重の構造材としての成形物とすることもできる
。In addition, if the degree of low specific gravity can be alleviated to some extent, it is possible to use it as a low specific gravity structural material with even higher strength by integrally molding it with reinforcing material such as glass fiber woven fabric or nonwoven fabric during shape molding. It can also be made into a molded product.
[実施例]
実施例1
下記組成の混合物をニーダ−にて混練してBMC80組
成物製した。以下、部は重量部を示す。[Examples] Example 1 A mixture having the following composition was kneaded in a kneader to prepare a BMC80 composition. Hereinafter, parts refer to parts by weight.
充填剤(水酸化アルミニウム) ・・・12部
硬化剤 (t−プチルトベシリエイト)
・・・ 0.5部内部離型剤(ステア1酸亜鉛)
・・・ 1.5部増粘剤(酸化マヴネシウム)
・・・ 0.4部得られたBMG組成物を用いて
プレス成形機により金型温度:150℃、成形厚カニ
90kg/cm2、成形時間=3分の条件にて成形して
200mm X200mm X 2.5部mmc7)
平板を得た。Filler (aluminum hydroxide)...12 parts Hardening agent (t-butyl tobesylate)
... 0.5 part internal mold release agent (zinc stearate)
... 1.5 parts thickener (mavnesium oxide)
... 0.4 parts of the obtained BMG composition was molded using a press molding machine at a mold temperature of 150°C and a molding thickness of
Molded under the conditions of 90kg/cm2 and molding time = 3 minutes, 200mm x 200mm x 2.5 parts mmc7)
I got a flat plate.
この成形された平板の比重は0.95であり、面熱性試
験において200°Cにおいても変形は認められなかっ
た。また耐衝撃性としてのシャルピー衝撃強度は5.5
kg1cm/cm’ であった。The specific gravity of this molded flat plate was 0.95, and no deformation was observed in the surface heat property test even at 200°C. In addition, the Charpy impact strength as impact resistance is 5.5.
kg1cm/cm'.
実施例2
実施例1と同様にして下記組成のBMC80組成物製し
た。Example 2 A BMC80 composition having the following composition was prepared in the same manner as in Example 1.
硬化剤 (t−ブチルパーペン・ノエイト)
・・・ o 、 5 部内部ft型剤(ステア1
酸亜鉛) ・・・2部増粘剤 (酸化マツ)シウム)
・・・ 0.5部・・・ 9
部
得られたBMC80組成物いて実施例1と同様によるプ
レス成形により平板を成形した。Hardening agent (t-butylpapene noate)
... o, 5 internal ft type agent (stair 1
Zinc acid) ... 2 parts thickener (Pine oxide) Sium)
... 0.5 part... 9
The obtained BMC80 composition was press-molded in the same manner as in Example 1 to form a flat plate.
この成形された平板の比重は0.87であり、耐熱性試
験において180°Cにおいても変形は認められなかっ
た。またシャルピー衝撃強度は5.2kgf/ cm2
であった。The specific gravity of this molded flat plate was 0.87, and no deformation was observed in the heat resistance test even at 180°C. Also, Charpy impact strength is 5.2kgf/cm2
Met.
実施例3
実施例1と同様にして下記組成のBMC80組成物A製
した。Example 3 A BMC80 composition A having the following composition was prepared in the same manner as in Example 1.
充填剤(炭酸カルシウム) ・・・37部硬化剤
(t−プチルバーペンリエイト) −
0・5 部内部敲型剤(ステアリン酸亜鉛) ・・弓
、5部増粘剤(酸化マジネシウム) ・・・0
.5部・・・7.5部
得られたBMC80組成物いて実施例1と同様によるプ
レス成形により平板を成形した。Filler (calcium carbonate): 37 parts Hardening agent
(t-butylbarpenreate) -
0.5 parts Internal molding agent (zinc stearate) ・・bow, 5 parts thickening agent (magnesium oxide) ・・0
.. 5 parts...7.5 parts The obtained BMC80 composition was press-molded in the same manner as in Example 1 to form a flat plate.
この成形された平板の比重は1.03であり、耐熱性試
験において210℃においても変形は認められなかった
。またシャルピー衝撃強度は6.7kgf−caI/c
m2であった。The specific gravity of this molded flat plate was 1.03, and no deformation was observed in the heat resistance test even at 210°C. Also, Charpy impact strength is 6.7kgf-caI/c
It was m2.
比較例1
実施例1と同様にして下記組成のBMG80組成物製し
た。Comparative Example 1 A BMG80 composition having the following composition was prepared in the same manner as in Example 1.
充填剤(炭酸カルシウム) ・・・40 部硬
化剤 (t−プチルバーベシ・jエイト)
・・・ 0.51内rite型剤(ステアリン
酸亜鉛) ・・・1.5部増粘剤(酸化マグネシウム)
・・・0.5部補強材[長さ約6mmガラス繊維
、・・・7.5部(“’G5O8MA4980“: 旭
〕?イバークラス社製) ]得られたBMC80組成物
いて実施例1と同様によるプレス成形により平板を成形
した。Filler (calcium carbonate)...40 parts Hardening agent (t-butyl verbesi j-eight)
...0.51 rite type agent (zinc stearate) ...1.5 parts thickener (magnesium oxide)
... 0.5 part reinforcing material [glass fiber with a length of about 6 mm, ... 7.5 parts ("'G5O8MA4980": Asahi]? Manufactured by Iverclas Co., Ltd.]] The obtained BMC80 composition was the same as Example 1. A flat plate was formed by press molding in the same manner.
この成形された平板の比重は1.79であった。The specific gravity of this molded flat plate was 1.79.
比較例2
下記組成物をニーグーにて混練してBMC80組成物製
した。Comparative Example 2 A BMC80 composition was prepared by kneading the following composition in a Nigu machine.
(“ト35” :旭硝子社製)]
充填剤(水酸化アルミニウム) ・・・4部硬(1[
(t−プチルバーベシリエ朴) ・
・・ 0.5部増粘剤(酸化マグネシウム) ・・
・0.4部得られたB)10組成物はペースト状となり
得す、樹脂のガラス中空球、充填剤、補強材等への密着
が充分性なわれず、パサパサの状態であった。この組成
物を実施例1と同様によるプレス成形により平板を成形
したが、クラックが発生じ、実用的には難点を有するも
のであった。(“To35”: manufactured by Asahi Glass Co., Ltd.)] Filler (aluminum hydroxide)... 4 parts hard (1 [
(T-Petyl Barbecillie Park) ・
... 0.5 part thickener (magnesium oxide) ...
- 0.4 parts of the obtained composition B)10 could be in the form of a paste, but the adhesion of the resin to the glass hollow spheres, fillers, reinforcing materials, etc. was not sufficient, and it was in a dry state. This composition was press-molded into a flat plate in the same manner as in Example 1, but cracks occurred and this was a problem in practical use.
[発明の効果]
本発明の低比重のBMC80組成物不飽和ポリエステル
樹脂をマトリックスとしてガラス中空球を比較的多量に
含有することに特徴があり、賦形成形することによって
得られる成形物は極めて低比重であって、実質的に水に
浮上するという効果を有している。かかる低比重の成形
物は、従来のBMC80組成物得ることができなかった
ものであり、特に低比重であるとともに充分な強度と耐
熱性とを有することから、軽量化の求められていた種々
なる分野において応用され得るという効果も認められる
。[Effects of the Invention] The low specific gravity BMC80 composition of the present invention is characterized by containing a relatively large amount of glass hollow spheres using an unsaturated polyester resin as a matrix, and the molded product obtained by shaping it has an extremely low density. It has a specific gravity and has the effect of essentially floating on water. Such a low specific gravity molded product could not be obtained from the conventional BMC80 composition, and because it has a particularly low specific gravity and sufficient strength and heat resistance, it can be used in various applications where weight reduction is required. It is also recognized that the method can be applied in various fields.
5丁−糸ジdネ山11況、−ト 昭和6:3年4J1−’1″2.「15-cho-Itoji dneyama 11 situation,-to Showa 6: 3rd year 4J1-’1″2.
Claims (1)
クモールディングコンパウンド組成物において、該組成
物はガラス中空球を含有し、該ガラス中空球は有効比重
0.3〜0.4であって少なくとも1回酸処理されてな
り、且つ組成物の総量に15〜45重量%含有する低比
重のバルクモールディングコンパウンド組成物。 2、請求項1記載のガラス中空球が粒径1〜150μの
混在物である低比重のバルクモールディングコンパウン
ド組成物。 3、請求項1記載のバルクモールディングコンパウンド
組成物を賦型成形してなる低比重の成形物。 4、請求項3記載の成形物が比重1.1〜0.85であ
る低比重の成形物。[Scope of Claims] 1. A bulk molding compound composition having an unsaturated polyester resin as a matrix, wherein the composition contains glass hollow spheres, and the glass hollow spheres have an effective specific gravity of 0.3 to 0.4. A bulk molding compound composition having a low specific gravity, which has been acid-treated at least once in the composition, and contains 15 to 45% by weight of the total composition. 2. A low specific gravity bulk molding compound composition comprising the glass hollow spheres according to claim 1 having a particle size of 1 to 150 microns. 3. A low specific gravity molded product obtained by molding the bulk molding compound composition according to claim 1. 4. A molded article according to claim 3 having a specific gravity of 1.1 to 0.85.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5923888A JPH01234434A (en) | 1988-03-15 | 1988-03-15 | Bulk molding compound composition and molded article produced therefrom |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5923888A JPH01234434A (en) | 1988-03-15 | 1988-03-15 | Bulk molding compound composition and molded article produced therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01234434A true JPH01234434A (en) | 1989-09-19 |
Family
ID=13107604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5923888A Pending JPH01234434A (en) | 1988-03-15 | 1988-03-15 | Bulk molding compound composition and molded article produced therefrom |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01234434A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0476894A2 (en) * | 1990-09-17 | 1992-03-25 | Minnesota Mining And Manufacturing Company | Method of fabricating optical recording drums |
US5338578A (en) * | 1993-01-21 | 1994-08-16 | Gencorp Inc. | Method for achieving a smooth powder coated finish on a low density compression-molded plastic article |
JP2001247756A (en) * | 2000-03-02 | 2001-09-11 | Showa Highpolymer Co Ltd | Unsaturated polyester resin composition |
JP4404539B2 (en) * | 2002-10-21 | 2010-01-27 | 株式会社小糸製作所 | Lamp reflector |
JP2010065150A (en) * | 2008-09-11 | 2010-03-25 | Kyocera Chemical Corp | Thermosetting molding material and molded item with low specific gravity |
CN108219414A (en) * | 2017-12-20 | 2018-06-29 | 安徽鑫普瑞复合材料有限公司 | A kind of high intensity low density SMC moulding compounds and its manufacturing method |
-
1988
- 1988-03-15 JP JP5923888A patent/JPH01234434A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0476894A2 (en) * | 1990-09-17 | 1992-03-25 | Minnesota Mining And Manufacturing Company | Method of fabricating optical recording drums |
US5342682A (en) * | 1990-09-17 | 1994-08-30 | Minnesota Mining And Manufacturing Company | Method of molding optical recording drums |
US5338578A (en) * | 1993-01-21 | 1994-08-16 | Gencorp Inc. | Method for achieving a smooth powder coated finish on a low density compression-molded plastic article |
JP2001247756A (en) * | 2000-03-02 | 2001-09-11 | Showa Highpolymer Co Ltd | Unsaturated polyester resin composition |
JP4404539B2 (en) * | 2002-10-21 | 2010-01-27 | 株式会社小糸製作所 | Lamp reflector |
JP2010065150A (en) * | 2008-09-11 | 2010-03-25 | Kyocera Chemical Corp | Thermosetting molding material and molded item with low specific gravity |
CN108219414A (en) * | 2017-12-20 | 2018-06-29 | 安徽鑫普瑞复合材料有限公司 | A kind of high intensity low density SMC moulding compounds and its manufacturing method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1885538B1 (en) | Low-density, class a sheet molding compounds containing divinybenzene | |
JPH10511124A (en) | Method for producing fiber-reinforced composite material and molded product thereof | |
US5549969A (en) | Enhanced surface for glass fiber reinforced plastics | |
JPH09241496A (en) | Unsaturated polyester resin composition and sheet-like molding material | |
JPH01234434A (en) | Bulk molding compound composition and molded article produced therefrom | |
KR101278482B1 (en) | Conductive unsaturated polyester resin composition for sheet molding compound, preparing method thereof and thermosetting resin composition comprising the same | |
CN108070058A (en) | A kind of carbon fibre reinforced composite unsaturated polyester resin compositions | |
JP4727441B2 (en) | Black vinyl ester resin molding material | |
JP2018087274A (en) | Resin molding material and molding thereof | |
EP0926188A2 (en) | Polyester resin-based compositions having improved thickening behavior | |
JP3294809B2 (en) | Lightweight laminate | |
JP4245994B2 (en) | Flame retardant unsaturated polyester resin composition | |
KR920002236B1 (en) | Material for producing fiber-reinforced thermosetting resin molding | |
JP2020079358A (en) | Thermosetting resin composition and cured product thereof | |
JPH07126504A (en) | Unsaturated polyester resin composition | |
JPH09176331A (en) | High-strength sheet molding compound of unsaturated polyester resin and its molding | |
JPH03150244A (en) | Natural stone-like artificial marble and production thereof | |
JPS59176313A (en) | Composite reinforced unsaturated polyester resin molding | |
JPS61235457A (en) | Fiber-reinforced thermosetting resin molding material | |
JP2004250594A (en) | Sheet molding compound and method for producing resin molding | |
JPH03150251A (en) | Artificial marble and frp reinforced molded article thereof | |
JP2000053850A (en) | Unsaturated polyester resin composition, sheet molding compound using the same and resin molded article | |
Panda et al. | Special additives to unsaturated polyester | |
JP2004075702A (en) | Vibration-damping resin composition having engine oil resistance and vibration-damping resin molded article for structural use using the same | |
JPS5936661B2 (en) | Unsaturated polyester resin composition |