JPH01205869A - Laser soldering device - Google Patents

Laser soldering device

Info

Publication number
JPH01205869A
JPH01205869A JP63028134A JP2813488A JPH01205869A JP H01205869 A JPH01205869 A JP H01205869A JP 63028134 A JP63028134 A JP 63028134A JP 2813488 A JP2813488 A JP 2813488A JP H01205869 A JPH01205869 A JP H01205869A
Authority
JP
Japan
Prior art keywords
laser beam
laser
solder
joined
preheating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63028134A
Other languages
Japanese (ja)
Inventor
Susumu Moriuchi
森内　進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP63028134A priority Critical patent/JPH01205869A/en
Publication of JPH01205869A publication Critical patent/JPH01205869A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Abstract

PURPOSE:To improve a soldering quality and to reduce cost by providing a preheating means heating a part to be joined of a body to be worked in a laser soldering device. CONSTITUTION:A laser beam leading path 2, condensing lens 4 and the nozzle 5 for injection are respectively provided on a laser beam oscillator 1 and the hot blast generator 12 as for a preheating means and a panel heater 15 are arranged as well. A laser beam 3 is projected on the body IC11 to the worked and the part to be joined of a printed board 14 via the lens 4 and nozzle 5. In this case, preheating is given to the body IC11 to be worked and board 14 by the heat conduction of the hot blast 13 of the generator 12 and heater 15. The rapid heating by the laser beam 3 is thus eliminated and the generations of defective solder ball, defective solder wetting, etc., can be prevented. Consequently the soldering quality is improved and the cost is reduced with the reduction in defect amending works.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、レーザ光を熱源として被加工物のハンダ付け
を行うレーザハンダ付け装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser soldering device that uses laser light as a heat source to solder workpieces.

［従来の技術］ 従来、レーザ光をハンダ溶融のための熱源として利用す
るレーザハンダ付け方法が知られている。該方法に用い
られるレーザハンダ付け装置は、一般に、レーザ発生源
と、該発生源から発生されるレーザ光をハンダと被加工
物とで構成される被接合部位に照射するためのレーザ射
出部とを備えており、通常、上記被接合部位に予めハン
ダを印刷または塗布後レーザ光を照射して、ハンダを溶
融し、被加工物のハンダ付けを行うものである。[Prior Art] Conventionally, a laser soldering method is known in which laser light is used as a heat source for melting solder. The laser soldering device used in this method generally includes a laser generation source, and a laser emission part for irradiating the laser beam generated from the generation source to a part to be joined consisting of solder and a workpiece. Usually, solder is printed or applied on the parts to be joined in advance and then irradiated with laser light to melt the solder and solder the workpieces.

［発明が解決しようとしている問題点］従来のレーザハ
ンダ付装置によるハンダ付では、ハンダ溶融の際にハン
ダ中に含まれるフラックスや溶剤が、レーザ光の照射に
よる急加熱により急激な沸腸を起こし、ハンダポールの
発生等の不良を発生させていた。また、被加工物の熱伝
導が不十分であることから、いもハンダを含むハンダ濡
れ性不良等のような問題が発生していた。[Problem to be solved by the invention] When soldering with a conventional laser soldering device, the flux and solvent contained in the solder when melting the solder cause rapid boiling due to rapid heating due to laser beam irradiation. , which caused defects such as the formation of solder poles. Furthermore, since the heat conduction of the workpiece is insufficient, problems such as poor wettability of solder including potato solder have occurred.

そこで、本発明は、上記の被接合部のみのレーザ急加熱
により発生するハンダボール不良、あるいは被加工物へ
のレーザ光からの熱伝導が不十分なために発生するハン
ダ濡れ不良の発生を防止した新しいレーザハンダ付け装
置を提供するものである。Therefore, the present invention prevents the occurrence of solder ball defects caused by rapid laser heating of only the parts to be joined, or solder wetting defects caused by insufficient heat conduction from the laser beam to the workpiece. The present invention provides a new laser soldering device.

［問題点を解決するための手段］ 本発明は、レーザ発生手段と、当該レーザ発生手段から
発生されるレーザ光を、ハンダと被加工物の被接合部位
とに照射するためのレーザ射出部とを具備し、かつ少な
くとも前記被接合部位を予熱するための予熱手段とを有
していることを特徴とするレーザハンダ付け装置に要旨
が存在する。[Means for Solving the Problems] The present invention includes a laser generating means, and a laser emitting section for irradiating solder and a part to be joined of a workpiece with a laser beam generated from the laser generating means. The object of the present invention is to provide a laser soldering apparatus characterized by comprising: and a preheating means for preheating at least the part to be joined.

［作用］ 本発明は、レーザハンダ付け装置内に、被加工物の被接
合部の予熱を行う予熱手段を設けている。[Operation] According to the present invention, a preheating means for preheating the welding portion of the workpiece is provided in the laser soldering device.

従って、本発明によりレーザ光を被接合部位に照射して
、この被接合部位を急加熱する際に、被接合部位より発
生するハンダポール、および被接合部位のレーザ光から
の熱伝達不足により発生するハンダ濡れ不良の発生を防
止することができ、高品質なハンダ付けを行うことがで
きるようになった。Therefore, according to the present invention, when a laser beam is irradiated to a part to be joined and the part to be joined is rapidly heated, solder poles are generated from the part to be joined and heat transfer from the laser beam to the part to be joined is insufficient. It is now possible to prevent the occurrence of poor solder wetting, and it is now possible to perform high-quality soldering.

［実施例］ （実施例１） 以下、第１図に示す実施例装置をもとに本発明の詳細な
説明する。[Example] (Example 1) Hereinafter, the present invention will be described in detail based on the example apparatus shown in FIG.

第１図において、ｌはレーザ発生源たるレーザ光発振器
、２はレーザ光は発振器ｌより発生したレーザ光を導く
ためのレーザ光導光路、３はレーザ光の光路を示してい
る。４はレーザ光の集光レンズであり、５はレーザ射出
部たるレーザ光射出ノズルであり、このノズルによって
レーザがＪ［ｔｌされる。６はハンダ付の際に発生する
フラックスおよび溶剤の蒸気煙を除去するためのエアー
であり、７はこのエアー６を導くためのエアー管である
。８はクリームハンダであり、被加工物たるＩＣの被接
合部位であるＩＣのリード９とＩＣ搭載用のプリント基
板（被加工物）１４の基板ランド（接合部位）１０との
間に配されている。１２は予熱手段たる熱風発生機であ
り、この熱風発生ａ１２より発生した８風１３はＩＣの
リード９を予熱することとなる。なお、この熱風は、前
記したクリームハンダ８およびプリント基板１４の基板
ランドｌＯ以外の部分をも予熱することもできる。予熱
手段は熱風発生機のみでも十分であるが、本例では他に
パネルヒータ１５をも設けである。このようなパネルヒ
ータ１５を設けた場合には、発明の効果は一層向上する
。なお、このパネルヒータ１５も上記のクリームハンダ
８およびプリント基板１４を予熱することができる。In FIG. 1, 1 indicates a laser beam oscillator as a laser generation source, 2 a laser beam guide path for guiding the laser beam generated from the oscillator 1, and 3 an optical path of the laser beam. 4 is a condensing lens for the laser beam, and 5 is a laser beam emitting nozzle which is a laser emitting part, and the laser is J[tl by this nozzle. 6 is air for removing flux and solvent vapor generated during soldering, and 7 is an air pipe for guiding this air 6. 8 is cream solder, which is placed between the IC lead 9, which is the part to be joined of the IC to be processed, and the board land (joint part) 10 of the printed circuit board (workpiece) 14 for mounting the IC. There is. 12 is a hot air generator serving as a preheating means, and the 8 air 13 generated by this hot air generation a12 preheats the leads 9 of the IC. Note that this hot air can also preheat the cream solder 8 and the portions of the printed circuit board 14 other than the board lands IO. Although a hot air generator alone is sufficient as the preheating means, in this example, a panel heater 15 is also provided. When such a panel heater 15 is provided, the effects of the invention are further improved. Note that this panel heater 15 can also preheat the cream solder 8 and printed circuit board 14 described above.

以上の構成の実施例の装置において、レーザ光発振器ｌ
から発根されたレーザ光３は、レーザ光導光路２を通過
した後、集光レンズ４によって集光され、レーザ光射出
ノズル５を経て、クリームハンダ８および被加工物ＩＣ
ＩＩおよびプリント基板１４のそれぞれの被接合部位、
すなわちＩＣのリード９、基板ランド１０．に照射され
る。被接合部位には、適量のハンダ８が予め配されてい
る。このハンダ８をレーザ光３によって加熱溶融して、
被加工物ＩＣＩＩおよびプリント基板１４の被接合部位
すなわちＩＣリード９と基板ランド１０とのハンダ付け
を行う、熱風発生機１２からは１３の熱風を放出し、ま
た、１５のヒータからは熱伝達により、被加工物ＩＣＩ
　１およびプリント基板１４に予熱を与えることもでき
る。In the apparatus of the embodiment having the above configuration, the laser beam oscillator l
The laser beam 3 emitted from the laser beam passes through the laser beam guide path 2, is condensed by a condensing lens 4, passes through a laser beam injection nozzle 5, and is directed to the cream solder 8 and the workpiece IC.
II and the respective bonded parts of the printed circuit board 14,
That is, IC leads 9, board lands 10. is irradiated. An appropriate amount of solder 8 is placed in advance on the part to be joined. This solder 8 is heated and melted by the laser beam 3,
The hot air generator 12 emits hot air 13, which performs soldering between the workpiece ICII and the part to be joined on the printed circuit board 14, that is, the IC lead 9 and the board land 10, and the heater 15 emits hot air by heat transfer. , workpiece ICI
1 and the printed circuit board 14 can also be preheated.

上記実施例の効果として、熱風発生機１２および／また
はパネルヒータ１５により被加工物の被接合部位を予熱
することによって、予熱することなくレーデ光３により
急加熱を行っていた従来のハンダ付け方式において発生
していたハンダポール不良が防止できた。As an effect of the above-mentioned embodiment, the conventional soldering method in which the parts to be joined of the workpieces are preheated by the hot air generator 12 and/or the panel heater 15, and rapid heating is performed by the Rede light 3 without preheating. We were able to prevent solder pole defects that occurred in

また、いもハンダ（ハンダ濡れ）不良を防止でき、ＩＣ
の信頼性、レーザー光からの熱の伝達を良好たらしめる
ことができた。なお、本例では、クリームハンダ８にも
予熱が加わるため、クリームハンダ中に含まれるハンダ
付けの際、有害である溶剤も蒸気化放出が可能である。In addition, it can prevent solder defects (solder wetting) and IC
The reliability of the laser beam and the transfer of heat from the laser beam were improved. In this example, since the cream solder 8 is also preheated, harmful solvents contained in the cream solder can also be vaporized and released during soldering.

また、熱風発生ｆｉ１２およびパネルヒーター１５の両
者を並行使用することにより早期予熱が可能となること
から、レーザ実装と並行して予熱を行うことができる。Further, since early preheating is possible by using both the hot air generation fi 12 and the panel heater 15 in parallel, preheating can be performed in parallel with laser mounting.

なお、第１図にてパネルヒーター１５を用いているが、
用途に応じてホットプレートあるいはニクロム線ヒータ
−、熱風、ランプ加熱方式などを用いてもよい、また、
熱風発生＠１２についても同様に種々変更が可能である
。すなわち、本発明における予熱の主たる目的は、ハン
ダポールおよびハンダ濡れ不良の発生を防止することに
あるので、被接合部位の予熱が満たされる熱エネルギー
条件を見つけ出し、その条件に適した予熱方式を取るこ
とにより、高品質なハンダ付を行い得るようにするもの
である。Although the panel heater 15 is used in Fig. 1,
Depending on the application, a hot plate, nichrome wire heater, hot air, lamp heating method, etc. may be used.
Similarly, various changes can be made to the hot air generation @12. That is, the main purpose of preheating in the present invention is to prevent the occurrence of poor solder pole and solder wetting, so the thermal energy conditions that satisfy the preheating of the parts to be joined are found, and a preheating method suitable for that condition is adopted. This makes it possible to perform high quality soldering.

［発明の効果Ｊ 以上説明したように、レーザ装置内に被接合部位への予
熱を行うための予熱手段を設けることにより、ハンダポ
ールおよびいもハンダを含むハンダ濡れ不良を防止でき
るようになった。これにより高品質なハンダ付けを得る
ことができるため、今まで必要とされていたハンダ付け
不良修正作業を低減することができ、ハンダ付け実装コ
ストを下げることが可能となった。[Effect of the Invention J As explained above, by providing a preheating means for preheating the parts to be joined in the laser device, it is now possible to prevent poor wetting of solder including solder poles and potato solder. This makes it possible to obtain high-quality soldering, which makes it possible to reduce the amount of work needed to correct soldering defects, which was previously required, and to lower soldering mounting costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明の実施例に係るレーザハンダ付装置の
概念的斜視図である。 ｌ・・・レーザ光発振器、２・・・レーザ光導光路。 ３・・・レーザ光の光路、４・・・集光レンズ、５・・
・レーザ光射出ノズル、６・・・エアー、７・・・エア
ー管。 ８・・・クリームハンダ、９・・・被接合部位（ＩＣの
リード）、１０・・・被接合部位（基板ランド）。 １１・・・被加工物（ＩＣ）、１２・・・予熱手段（熱
風発生機）、４３・・・熱風、１４・・・被加工物（プ
リント基板）、１５・・・パネルヒータ。FIG. 1 is a conceptual perspective view of a laser soldering device according to an embodiment of the present invention. 1... Laser light oscillator, 2... Laser light guide path. 3... Optical path of laser beam, 4... Condensing lens, 5...
・Laser beam emission nozzle, 6...air, 7...air tube. 8... Cream solder, 9... Part to be joined (IC lead), 10... Part to be joined (board land). 11... Workpiece (IC), 12... Preheating means (hot air generator), 43... Hot air, 14... Workpiece (printed circuit board), 15... Panel heater.

Claims (1)

【特許請求の範囲】[Claims] レーザ発生手段と、当該レーザ発生手段から発生される
レーザ光を、ハンダと被加工物の被接合部位とに照射す
るためのレーザ射出部とを具備し、かつ少なくとも前記
被接合部位を予熱するための予熱手段を有していること
を特徴とするレーザハンダ付け装置。comprising a laser generating means and a laser emitting section for irradiating the solder and a part to be joined of the workpiece with a laser beam generated from the laser generating means, and for preheating at least the part to be joined. A laser soldering device characterized by having a preheating means.
JP63028134A 1988-02-09 1988-02-09 Laser soldering device Pending JPH01205869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63028134A JPH01205869A (en) 1988-02-09 1988-02-09 Laser soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63028134A JPH01205869A (en) 1988-02-09 1988-02-09 Laser soldering device

Publications (1)

Publication Number Publication Date
JPH01205869A true JPH01205869A (en) 1989-08-18

Family

ID=12240300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63028134A Pending JPH01205869A (en) 1988-02-09 1988-02-09 Laser soldering device

Country Status (1)

Country Link
JP (1) JPH01205869A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452073A (en) * 1990-06-15 1992-02-20 Matsushita Electric Ind Co Ltd Light beam soldering method
JPH04253564A (en) * 1991-02-04 1992-09-09 Matsushita Electric Ind Co Ltd Local soldering method by light beam or the like
US6998572B2 (en) * 2001-09-28 2006-02-14 Matsushita Electric Industrial Co., Ltd. Light energy processing device and method
JP2007059825A (en) * 2005-08-26 2007-03-08 Eco & Engineering Co Ltd Hybrid type light converging heater and connecting method for solar battery element using same
US7265315B2 (en) * 2004-06-10 2007-09-04 Mitsubishi Denki Kabushiki Kaisha Method of joining terminals by soldering
CN105458445A (en) * 2014-09-11 2016-04-06 大族激光科技产业集团股份有限公司 Laser tin soldering device and soldering method
CN106513893A (en) * 2016-12-30 2017-03-22 中源智人科技（深圳）股份有限公司 Laser tin soldering mechanism with preheating device and process with tin soldering mechanism
CN107931764A (en) * 2017-11-28 2018-04-20 深圳市吉百顺科技有限公司 A kind of ceramics scolding tin nozzle and its production technology
CN111940899A (en) * 2020-07-31 2020-11-17 深圳市润安科技发展有限公司 Efficient and accurate welding method and system for anti-tension-bending component in wrist strap
CN112008177A (en) * 2019-05-29 2020-12-01 发那科株式会社 Welding device for welding by laser and robot device provided with welding device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452073A (en) * 1990-06-15 1992-02-20 Matsushita Electric Ind Co Ltd Light beam soldering method
JPH04253564A (en) * 1991-02-04 1992-09-09 Matsushita Electric Ind Co Ltd Local soldering method by light beam or the like
US6998572B2 (en) * 2001-09-28 2006-02-14 Matsushita Electric Industrial Co., Ltd. Light energy processing device and method
US7265315B2 (en) * 2004-06-10 2007-09-04 Mitsubishi Denki Kabushiki Kaisha Method of joining terminals by soldering
JP2007059825A (en) * 2005-08-26 2007-03-08 Eco & Engineering Co Ltd Hybrid type light converging heater and connecting method for solar battery element using same
JP4588580B2 (en) * 2005-08-26 2010-12-01 有限会社エコ＆エンジニアリング Hybrid condensing heater and method for connecting solar cell elements using the same
CN105458445A (en) * 2014-09-11 2016-04-06 大族激光科技产业集团股份有限公司 Laser tin soldering device and soldering method
CN105458445B (en) * 2014-09-11 2018-09-18 大族激光科技产业集团股份有限公司 A kind of laser soldering apparatus and welding method
CN106513893A (en) * 2016-12-30 2017-03-22 中源智人科技（深圳）股份有限公司 Laser tin soldering mechanism with preheating device and process with tin soldering mechanism
CN107931764A (en) * 2017-11-28 2018-04-20 深圳市吉百顺科技有限公司 A kind of ceramics scolding tin nozzle and its production technology
CN112008177A (en) * 2019-05-29 2020-12-01 发那科株式会社 Welding device for welding by laser and robot device provided with welding device
JP2020192586A (en) * 2019-05-29 2020-12-03 ファナック株式会社 Solder device for soldering with laser light and robot device including the same
CN112008177B (en) * 2019-05-29 2024-04-26 发那科株式会社 Welding device for welding by laser and robot device provided with welding device
CN111940899A (en) * 2020-07-31 2020-11-17 深圳市润安科技发展有限公司 Efficient and accurate welding method and system for anti-tension-bending component in wrist strap

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