KR101935518B1 - Laser soldering repair process, laser soldering process and laser soldering system - Google Patents

Laser soldering repair process, laser soldering process and laser soldering system Download PDF

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Publication number
KR101935518B1
KR101935518B1 KR1020160017192A KR20160017192A KR101935518B1 KR 101935518 B1 KR101935518 B1 KR 101935518B1 KR 1020160017192 A KR1020160017192 A KR 1020160017192A KR 20160017192 A KR20160017192 A KR 20160017192A KR 101935518 B1 KR101935518 B1 KR 101935518B1
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South Korea
Prior art keywords
soldering
laser beam
laser
substrate
cleaning
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KR1020160017192A
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Korean (ko)
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KR20170095593A (en
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정대호
정태오
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주식회사 이오테크닉스
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Priority to KR1020160017192A priority Critical patent/KR101935518B1/en
Priority to PCT/KR2016/009771 priority patent/WO2017142150A1/en
Priority to TW105129929A priority patent/TWI664042B/en
Publication of KR20170095593A publication Critical patent/KR20170095593A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process

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  • Engineering & Computer Science (AREA)
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  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser soldering repair process, a laser soldering process, and a laser soldering system are disclosed. In the laser soldering repair process, a repair process is performed using a laser in a repair region where a soldering process is not performed among soldering regions on a substrate, and a laser cleaning process is performed by irradiating a repair laser beam onto the repair region of the substrate Providing a solder ball in a cleaned repair area of the substrate, and heating the solder ball to irradiate the solder ball with a soldering laser beam to attach the solder ball to the repair area.

Description

[0001] The present invention relates to a laser soldering repair process, a laser soldering process, and a laser soldering process,

The present invention relates to laser soldering, and more particularly to a laser soldering repair process. To a laser soldering process and a laser soldering system including the same.

Generally, in a semiconductor process, a process of bonding a semiconductor chip to a substrate such as a printed circuit board (PCB) using a solder is performed. Such a process may include a soldering process in which a solder ball containing a tin component is printed on a predetermined position of a substrate, and then the solder ball is attached to the substrate by heating at a high temperature. Such a soldering process is generally referred to as a reflow soldering process, and is widely applied in the industry. Conventionally, a soldering apparatus using heat has been used, but it has a problem in that it is large in size and requires a long time for a soldering process. Accordingly, in order to solve this problem, a soldering apparatus using laser has been recently developed. A laser-based soldering apparatus can focus a laser beam on a narrow area of a substrate to melt a small-sized solder ball, and can perform a process using less power than a method using heat. Then, the solder ball can be melted in a short time using the high energy of the laser beam.

The soldering process may not be performed on a part of the substrate after the soldering process is performed using the laser. Accordingly, in order to solve this problem, it is necessary to perform a process of printing a solder ball on a region to be repaired in the substrate and then performing a soldering process using the laser, that is, a laser soldering repair process. However, since the laser soldering process and the laser soldering process are carried out separately from each other, when the substrate is transported or stored after the laser soldering process is performed first, contaminants may adhere to the surface of the substrate and become contaminated. Therefore, if the laser soldering repair process is performed in the state where the contaminants are attached to the substrate, the contaminants may act as igniters, resulting in burning or explosion of the laser beam. In order to solve the problem of contamination of such a substrate, it is possible to remove contaminants through ultrasonic cleaning before laser soldering repair process, but it is a problem that the time and cost consumed by adding a new process is increased have.

According to one embodiment of the present invention, a laser soldering repair process. A laser soldering process and a laser soldering system including the same are provided.

In one aspect of the present invention,

 In a laser soldering repair process for repairing a repair region using a laser in a solder region not subjected to a soldering process,

Performing a laser cleaning process by irradiating a cleaning laser beam to a repair region of the substrate;

Providing a solder ball in the cleaned repair area of the substrate; And

And heating the solder ball to attach the solder ball to the repair region by irradiating the solder ball with a soldering laser beam.

A laser cleaning process may be performed on the repair region of the substrate, and then a flux may be applied. The method may further include attaching the solder ball to the repair region using the soldering laser beam, and then performing a water cleaning process on the substrate.

The cleaning laser beam and the soldering laser beam may have the same wavelength. The cleaning laser beam and the soldering laser beam may have a wavelength in the near-infrared range, for example. As a specific example, the cleaning laser beam and the soldering laser beam may have a wavelength of 915 nm.

The cleaning laser beam may have a smaller output than the soldering laser beam. For example, the cleaning laser beam and the soldering laser beam may have outputs of 2W and 5W, respectively.

The cleaning laser beam and the soldering laser beam may be defocused and irradiated to the repair region.

In another aspect,

Performing a first soldering process on the soldering area on the substrate:

Performing a laser cleaning process on a repair region of the soldering region on the substrate where the soldering process is not performed; And

And performing a second soldering process on the cleaned repair region of the substrate.

The first soldering process comprising: providing a solder ball in a soldering area on the substrate; And attaching the solder ball to the soldering area by irradiating and heating the solder ball with a soldering laser beam.

The laser cleaning process may be performed by irradiating a cleaning laser beam to the repair region of the substrate.

The second soldering process comprising: providing a solder ball in a cleaned repair area on the substrate; And attaching the solder ball to the repair region by irradiating and heating the solder ball with a soldering laser beam.

And performing a water cleaning process on the substrate after the second soldering process.

The cleaning laser beam and the soldering laser beam may have the same wavelength. The cleaning laser beam may have a smaller output than the soldering laser beam. The cleaning laser beam and the soldering laser beam can be defocused and irradiated.

In yet another aspect,

1. A laser soldering system for performing a soldering process using a soldering laser beam on a soldering area of a substrate and performing a laser soldering repair process on a repair area of the soldering area of the substrate on which the soldering process is not performed,

A solder ball supply unit for supplying a solder ball to a soldering region of the substrate; And

And a laser irradiating device for irradiating the solder ball with the soldering laser beam and irradiating the repair laser beam to the repair region of the substrate.

The laser soldering system may further include a flux application unit that applies flux to a soldering region of the substrate. The laser soldering system may further include a rinse water supply unit for supplying rinse water to the substrate to perform a water cleaning process.

According to an embodiment of the present invention, a cleaning process is first performed on a repair region of a substrate on which a soldering process is not performed, and then a soldering process is performed on a clean region of the cleaning process. As a result, foreign substances or the like that may exist in the repair region of the substrate can be effectively removed, and as a result, a burn phenomenon or an explosion phenomenon, which may be caused by contamination of foreign matter, can be prevented. Further, by performing the cleaning process using the laser, the time and cost required for the cleaning process can be reduced. In addition, since the cleaning laser beam and the soldering laser beam can be generated from the same laser light source without providing any separate cleaning equipment, the laser soldering system can be constructed more simply.

1A to 1D are views showing a general laser soldering repair process.
2A through 2E are views showing a laser soldering repair process according to an exemplary embodiment of the present invention.
FIG. 3A is a photograph showing a state where contaminants are attached to a repair area of a substrate, FIG. 3B is a photograph showing a burning phenomenon by performing a laser soldering process in the state shown in FIG. It is a photograph.
4A is a photograph showing a state where contaminants are adhered to a repair region of a substrate, and FIG. 4B is a photograph showing a state where soldering is incompletely performed by performing a laser soldering process in a state shown in FIG. 4A.
5A is a photograph showing a state where contaminants are adhered to a repair region of a substrate.
FIG. 5B shows a state in which contaminants are removed in the repair region of the substrate by laser cleaning in the state shown in FIG. 5A according to an exemplary embodiment of the present invention. FIG.
FIG. 5C is a photograph showing a state where the soldering is completely performed by performing the laser soldering process in the state shown in FIG. 5B.
Figure 6 illustrates a laser soldering system in accordance with another exemplary embodiment of the present invention.
FIGS. 7A to 7H are views illustrating a process of performing a laser soldering process using the laser soldering system shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments illustrated below are not intended to limit the scope of the invention, but rather are provided to illustrate the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation. Further, when it is described that a certain material layer is present on a substrate or another layer, the material layer may be present directly on the substrate or another layer, and there may be another third layer in between. In addition, the materials constituting each layer in the following embodiments are illustrative, and other materials may be used.

1A to 1D are views showing a general laser soldering repair process.

FIG. 1A shows a soldering process performed on a substrate W. FIG. A soldering region is provided on the substrate W, and the soldering region includes a pad 50 to which a solder 60 is to be attached by a soldering process using a laser. That is, the solder 60 can be attached onto the pad in the soldering region of the substrate W by this soldering process. On the other hand, a solder 60 may not be attached to a part of the soldering region of the substrate W by the soldering process, and this region may be a repair region 65 which requires soldering repair later.

In order to perform the soldering repair process on the repair region 65 of the substrate W, first, a solder ball 61 is provided on the repair region 65 of the substrate W as shown in FIG. 1B, The solder ball 61 is irradiated with a soldering laser beam L as shown in FIG. Accordingly, solder 60 may be attached to the pad 50 in the repair region 65 of the substrate W as shown in FIG. 1D.

However, in the above process, if the substrate W is transported or stored before the laser soldering repair process is performed after the soldering process, there is a fear that the repair area 65 of the substrate W is contaminated with a foreign substance have. If the soldering repair process using laser is performed in a state where the substance is adhered to the repair region 65 of the substrate W, the burning phenomenon or the explosion phenomenon due to the contaminants acting as the ignition material There is a possibility of occurrence.

2A through 2E are views showing a laser soldering repair process according to an exemplary embodiment of the present invention.

Referring to FIG. 2A, a soldering process is performed on the substrate W. FIG. Here, the substrate W may include, for example, a printed circuit board (PCB) or the like. The substrate W is provided with a soldering region, which includes a pad 50 to which the solder 60 is to be attached by a soldering process using a laser. Accordingly, the solder 60 can be attached to the pad 50 of the substrate by the soldering process. On the other hand, the solder 60 may not be attached to a part of the soldering area of the substrate W by the soldering process, and this area may be a repair area 65 that requires soldering repair in a subsequent process.

Referring to FIG. 2B, a laser cleaning process is performed on the repair region 65 of the substrate W. FIG. This laser cleaning process can be performed by defocusing and irradiating the cleaning laser beam L 'to the repair region 65 of the substrate W. [ Here, the cleaning laser beam L 'may have a wavelength in the near-infrared range, for example. As a specific example, the cleaning laser beam L 'may have a wavelength of approximately 915 nm. However, the present invention is not limited thereto.

The cleaning laser beam L 'may have a smaller output than the soldering laser beam L described later. For example, the cleaning laser beam L 'may have an output of approximately 2 W, but is not limited thereto. This cleaning laser beam L 'can be defocused and irradiated onto the repair region of the substrate W. [ For example, the defocusing distance (d2 in FIG. 7D) of the cleaning laser beam L 'may be approximately 15 mm, but is not limited thereto.

As described above, when the cleaning laser beam L 'having a predetermined wavelength and power is defocused and irradiated onto the repair region 65 of the substrate W, foreign substances or the like, which may be present in the repair region 65, have.

Referring to FIG. 2C, a solder ball 61 is provided on the pad 50 in the repair region 65 of the substrate W cleaned by the above-described laser cleaning process. Such a solder ball 61 may include, for example, a Sn component. On the other hand, a step of applying a flux (not shown) on the pad 50 may be further performed to prevent the solder ball 61 heated by the soldering laser beam L described later from being oxidized have.

2D, a solder ball 61 provided in a repair region 65 of the substrate W is irradiated with a soldering laser beam L and heated. The solder ball 61 heated in this way is melted and adheres on the pad 50 in the repair region 65 of the substrate W to form the solder 60. Here, the soldering laser beam L for heating the solder ball 61 may have the same wavelength as the above-described cleaning laser beam L '. Specifically, the soldering laser beam L may have a wavelength in the near-infrared range. For example, the cleaning laser beam L 'may have a wavelength of approximately 915 nm, but is not limited thereto.

The soldering laser beam L may have a higher output than the cleaning laser beam L '. For example, when the cleaning laser beam L 'has an output of approximately 2 W, the soldering laser beam L may have an output of approximately 5 W, but is not necessarily limited thereto.

The soldering laser beam L can be defocused and irradiated onto the solder ball 61 like the cleaning laser beam L '. Here, the defocusing distance (d1 in FIG. 7B) of the soldering laser beam L may be smaller than the defocusing distance (d2 in FIG. 7D) of the cleaning laser beam L '. For example, when the defocusing distance d2 of the cleaning laser beam L 'is approximately 15 mm, the defocusing distance d1 of the soldering laser beam I may be approximately 4 mm, Do not.

As described above, when the soldering laser beam L having a predetermined wavelength and power is defocused and irradiated onto the solder ball 61, the solder ball 61 is melted by heating and is irradiated onto the substrate W on the pad 50 in the repair area 65 to form the solder 60. [ On the other hand, referring to FIG. 2E, a water cleaning process may be further performed on the substrate W. FIG. In the water cleaning process, the cleaning water is sprayed onto the substrate W, so that the flux and foreign matter remaining on the substrate W can be removed using the washing water.

According to the exemplary embodiment of the present invention, a cleaning process is first performed on the repair area 65 of the substrate W on which the soldering process is not performed, and then a soldering operation is performed on the cleaned repair area 65 . Accordingly, foreign matter or the like which may be present in the repair region 65 of the substrate W can be effectively removed, and as a result, a burn phenomenon or an explosion phenomenon which may be caused by the contamination of the foreign matter can be prevented . Further, by performing the cleaning process using the laser, the time and cost required for the cleaning process can be reduced. Since the cleaning laser beam L 'and the soldering laser beam L can be generated from the same laser light source without providing any separate cleaning equipment as described later, the laser soldering system can be constructed more simply.

FIG. 3A is a photograph showing a state where contaminants are adhered on a pad in a repair area of a substrate, FIG. 3B is a photograph showing a state in which a laser soldering operation is performed in a state where a repair area is contaminated as shown in FIG. to be. Referring to FIGS. 3A and 3B, it can be seen that a burning phenomenon may occur when the soldering operation using the laser is performed while the repair region of the substrate is contaminated.

FIG. 4A is a photograph showing a state where contaminants are adhered to the repair region of the substrate, and FIG. 4B is a photograph showing a state where laser repairing is performed in a state where the repair region is contaminated as shown in FIG. 4A. Referring to FIGS. 4A and 4B, it can be seen that the soldering process is incompletely completed when the laser is used for soldering in a state where the repair region of the substrate is contaminated.

5A is a photograph showing a state where contaminants are adhered to a repair region of a substrate. 5B is a photograph showing a state in which laser cleaning is performed according to an exemplary embodiment of the present invention in the state shown in FIG. 5A. Referring to FIG. 5B, it can be seen that the material has been removed in the repair region of the substrate by the laser cleaning process. 5C is a photograph showing a laser soldering operation in a state where the repair region of the substrate is cleaned as shown in FIG. 5B. Referring to FIG. 5C, it can be seen that soldering is completely completed in the repair region of the substrate.

Figure 6 illustrates a laser soldering system in accordance with another exemplary embodiment of the present invention.

6, a laser soldering system according to the present embodiment performs a soldering process using a soldering laser beam L1 on a soldering region of a substrate W, and the soldering process of the soldering region of the substrate W A laser soldering repair process is performed on the unrepaired repair area 65. Here, the laser soldering repair process may include a laser cleaning process for cleaning the (W) repair region 65 of the substrate by using the cleaning laser beam L2. The substrate W may include, for example, a printed circuit board or the like, and such a substrate W may be mounted on a stage S which is movably provided.

The laser soldering system includes a solder ball supply unit 150 and a laser irradiation device. The solder ball supply unit 150 supplies a solder ball (61 in FIG. 7A) onto a pad (50 in FIG. 7A) located in the soldering region of the substrate W loaded on the stage S in the soldering process. Here, the solder ball 61 may include, for example, a Sn component. In addition, the laser soldering system may further include a flux application unit 160. The flux application unit 160 may apply a flux (not shown) on the pad 50 before the solder ball supply unit 150 supplies the solder ball 61 onto the pad 50. [ Here, the flux may serve to prevent the solder ball 61 from being oxidized when heated by the soldering laser beam L1 and melted.

The laser irradiation device irradiates the soldering laser beam L1 and the cleaning laser beam L2 to the soldering area and the repair area 65 of FIG. 7A of the substrate W in the soldering process and the laser cleaning process, respectively. For this purpose, the laser irradiation apparatus may include a laser light source 110, a mirror 120, a focusing lens 140, and a control unit 115.

The laser light source 110 emits the first laser beam L1 in the soldering process and emits the second laser beam L2 in the laser cleaning process. Here, the first laser beam L1 may be a soldering laser beam for heating and melting the solder ball 61 provided in the soldering region of the substrate W. The second laser beam L2 may be a cleaning laser beam used for cleaning the repair region 65 of the substrate W. [

The first and second laser beams L1 and L2 may have the same wavelength. For example, the first and second laser beams L1 and L2 may have wavelengths in the near-infrared region. As a specific example, the first and second laser beams L1.L2 may have a wavelength of approximately 915 nm, but are not limited thereto. In addition, the first laser beam L1, which is a soldering laser beam, may have a larger output than the second laser beam L2 which is a cleaning laser beam. For example, the first and second laser beams L1 and L2 may have an output of approximately 5W and 2W, respectively, but are not limited thereto.

The path of the first and second laser beams L1 and L2 emitted from the laser light source 110 can be changed by the mirror 120 to a desired position. The first and second laser beams L1 and L2 reflected from the mirror 120 are irradiated onto the soldering region of the substrate W mounted on the stage S via the focusing lens 140. [ Here, a beam expanding telescope (BET) 130 for enlarging the size of the first and second laser beams L1 and L2 may be further provided on the optical path between the mirror 120 and the focusing lens 140 have.

The first and second laser beams L1 and L2 passing through the focusing lens 140 can be irradiated to the soldering region of the substrate W in a defocused state. Here, the defocusing distance (d1 in Fig. 7B) of the first laser beam L1 as the soldering laser beam may be smaller than the defocusing distance (d2 in Fig. 7D) of the second laser beam L2 as the cleaning laser beam. For example, the defocusing distances d1 and d2 of the first and second laser beams L1 and L2 may be about 4 mm and 15 mm, respectively, but are not limited thereto.

The controller 115 controls the laser light source 110 and the mirror 120. [ do. Specifically, the control unit 115 may control the output of the laser light source 110, and may control the movement of the mirror 120.

On the other hand, the laser soldering system may further include a cleaning water supply unit 170. The rinse water supply unit 170 may perform a water cleaning process of cleaning the substrate W by supplying rinse water onto the substrate W after the soldering process is completed.

Hereinafter, a process of performing the laser soldering process using the laser soldering system shown in FIG. 6 will be described in detail. 7A to 7H are views for explaining a laser soldering process according to another exemplary embodiment of the present invention. The laser soldering process shown in FIGS. 7A to 7H may include a first soldering process, a laser cleaning process, and a second soldering process.

First, a first soldering process is performed on the soldering region of the substrate W. Here, the soldering region includes a pad 50 to which a solder 60 formed by melting a solder ball 61 is to be attached by a soldering process using a laser, which will be described later.

7A, the solder ball 61 is supplied to the pads 50 located in the soldering region of the substrate W using the solder ball supply unit 150 shown in FIG. Here, the solder ball 61 may include, for example, a Sn component. On the other hand, it is possible to further include the step of applying the flux on the pads 50 using the flux applying unit 160 shown in Fig. 6 before supplying the solder ball 61. [ In this case, a part of the pads 50 provided in the soldering region of the substrate W may not be supplied with the solder ball 61, and this may be a repair area (for example, 65).

Referring to FIG. 7B, the first laser beam L1 is irradiated to the solder ball 61 provided on the pad 50 by using the laser irradiation apparatus shown in FIG. 6, and heated to form the solder 60. FIG. The first laser beam L1 may be emitted from the laser light source 110 as a soldering laser beam and may be irradiated onto the solder ball 61 via the mirror 120, the focusing lens 140, and the like.

The first laser beam L1 may have a wavelength in the near infrared region. For example, the first laser beam L1 may have a wavelength of approximately 915 nm, but is not limited thereto. The first laser beam L1 may have a higher output than the second laser beam L2, which is a cleaning laser beam described later. For example, the first laser beam L1 may have an output of approximately 5 W, but is not limited thereto.

The first laser beam L1, which is a soldering laser beam, passes through the focusing lens 140 and then is defocused by a predetermined distance d1 to irradiate the solder ball 61. [ Here, the defocusing distance d1 of the first laser beam L1 may be, for example, about 4 mm, but is not limited thereto.

As described above, when the first laser beam L1, which is a soldering laser beam, is irradiated to the solder ball 61 using the laser irradiation apparatus, the solder ball 61 is melted and attached on the pad 50, . The first soldering process is completed by irradiating the solder ball 61 on the pads 50 while moving the first laser beam L1 relative to the substrate W. [

FIG. 7C shows a state where the first soldering process is completed in the soldering region of the substrate W. FIG. Referring to FIG. 7C, a portion of the soldering region of the substrate W may be a repair region 65 requiring a soldering repair process because the first soldering process is not performed.

After the first soldering process is performed, a laser cleaning process may be performed.

7D, the repair area 65 is cleaned by irradiating the pad 50 in the repair area 65 with the second laser beam L2 using the laser irradiation apparatus shown in Fig. 6 (step < RTI ID = 0.0 > . Here, the second laser beam L2 can be emitted as a cleaning laser beam from the laser light source 110 and passed through the mirror 120, the focusing lens 140, and the like, and then irradiated onto the repair region 65.

The second laser beam L2, which is a cleaning laser beam, may have the same wavelength as the first laser beam L1. The second laser beam L2 may have a wavelength in the near infrared region. For example, the second laser beam L2 may have a wavelength of approximately 915 nm, but is not limited thereto. The second laser beam L2 may have a lower output than the first laser beam L1 which is the soldering laser beam. For example, when the output of the first laser beam L1 is 5 W, the output of the second laser beam L2 may be approximately 2 W, but is not limited thereto.

The second laser beam L2 which is a cleaning laser beam can be defocused by a predetermined distance d2 through the focusing lens 140 and irradiated onto the repair area 65. [ Here, the defocusing distance d2 of the second laser beam L2 may be larger than the defocusing distance d1 of the first laser beam L1 described above. For example, when the defocusing distance d1 of the first laser beam L1 is approximately 4 mm, the defocusing distance d2 of the second laser beam L2 may be approximately 15 mm. However, the present invention is not limited thereto, and the defocusing distances d1 and d2 of the first and second laser beams L1 and L2 may be variously modified.

As described above, when the second laser beam L2, which is the cleaning laser beam, is irradiated to the pad 50 in the repair area 65 of the substrate W by using the laser irradiation device, Can be removed. The laser cleaning process is completed by irradiating the pads 50 in the repair area 65 while moving the second laser beam L with respect to the substrate W. [

After the above-described laser cleaning process is completed, a second soldering process is performed on the cleaned repair area 65 of the substrate W. [

7E, the solder ball supply unit 150 shown in FIG. 6 is used to supply the solder ball 61 to the pads 50 located in the repair area 65 of the substrate W. In this case, do. On the other hand, a step of applying a flux (not shown) on the pads 50 using the flux applying unit 160 shown in Fig. 6 before supplying the solder ball 61 may be further included.

Referring to FIG. 7F, the first laser beam L1 is irradiated to the solder ball 61 provided on the pad 50 of the repair area 65 using the laser irradiation apparatus shown in FIG. 6, 60 are formed. Here, the first laser beam L1 may be a soldering laser beam. The first laser beam L1 may have the same wavelength as the second laser beam L2 as described above. For example, And may have a wavelength in the near infrared region. The first laser beam L1 may have a higher output than the second laser beam L2, which is a cleaning laser beam.

The first laser beam L1 which is a soldering laser beam is defocused by a predetermined distance d1 after passing through the focusing lens 140 to irradiate the solder ball 61 on the pad 50 of the repair region 65 . Here, the defocusing distance d1 of the first laser beam L1 may be smaller than the defocusing distance d2 of the second laser beam L2 as described above.

As described above, when the first laser beam L1, which is a soldering laser beam, is irradiated to the solder ball 61 on the pad 50 of the repair region 65 using the laser irradiation apparatus, the solder ball 61 is melted, (50) to form the solder (60). The second soldering process is completed by irradiating the solder ball 61 on the pads 50 of the repair area 65 while moving the first laser beam L1 relative to the substrate W. [ Through this second soldering process, the solder 60 can be provided on all the pads 50 in the soldering region of the substrate W. [

After the above-described second soldering process is completed, foreign matter such as flux may remain on the substrate W. Therefore, a water cleaning process may be further performed in which the substrate W is cleaned with the cleaning water in order to remove such foreign matter .

7G, when washing water is sprayed onto the substrate W having been subjected to the soldering process through the washing water supply unit 170 shown in FIG. 6, foreign substances such as flux and the like remaining on the substrate W And a state in which such a water cleaning process is completed is shown in Fig. 7H.

According to the embodiments of the present invention described above, a cleaning process is first performed using a laser in a repair region of a substrate on which a soldering process has not been performed, and then soldering is performed on a clean repair region. As a result, foreign substances or the like that may exist in the repair region of the substrate can be effectively removed, and as a result, a burn phenomenon or an explosion phenomenon, which may be caused by contamination of foreign matter, can be prevented. Further, by performing the cleaning process using the laser, the time and cost required for the cleaning process can be reduced. As described later, since the cleaning laser beam and the soldering laser beam can be generated from the same laser light source without providing any separate cleaning equipment, the laser soldering system can be constructed more simply.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

50 .. Pads
60 .. Solder
61 .. Solder Ball
65 .. Repair area
110 .. Laser light source
115. Control unit
120 .. mirror
130 .. beam expander
140. Focusing lens
150 .. Solder Ball Supply Unit
160. Flux application unit
170 .. Cleaning water supply unit
S .. Stage
W .. Substrate
The first laser beam (soldering laser beam)
L2. The second laser beam (cleaning laser beam)

Claims (20)

In a laser soldering repair process for repairing a repair region using a laser in a solder region not subjected to a soldering process,
Performing a laser cleaning process by irradiating a cleaning laser beam emitted from a laser light source to defocus the defective area on the substrate;
Providing a solder ball in the cleaned repair area of the substrate; And
And heating the solder ball to adhere to the repair region by irradiating the solder ball to defocus the soldering laser beam emitted from the laser light source on the solder ball,
Wherein a defocusing distance d2 of the cleaning laser beam is greater than a defocusing distance d1 of the soldering laser beam. The method according to claim 1,
Performing a laser cleaning process on the repair region of the substrate, and then applying a flux. The method according to claim 1,
Attaching the solder ball to the repair region using the soldering laser beam, and then performing a water cleaning process on the substrate. The method according to claim 1,
Wherein the cleaning laser beam and the soldering laser beam have the same wavelength. 5. The method of claim 4,
Wherein the cleaning laser beam and the soldering laser beam have a wavelength in the near-infrared range. 6. The method of claim 5,
Wherein the cleaning laser beam and the soldering laser beam have a wavelength of 915 nm. The method according to claim 1,
Wherein the cleaning laser beam has an output less than the soldering laser beam. 8. The method of claim 7,
Wherein the cleaning laser beam and the soldering laser beam have outputs of 2W and 5W, respectively. delete Performing a first soldering process on the soldering area on the substrate:
Performing a laser cleaning process on a repair region of the soldering region on the substrate where the soldering process is not performed; And
And performing a second soldering process on the cleaned repair region of the substrate,
The first soldering process comprising: providing a solder ball in a soldering area on the substrate; And attaching the solder ball to the soldering area by irradiating the soldering ball with a defocusing distance d1 and heating the soldering ball,
The laser cleaning process is performed by irradiating a cleaning laser beam to a repair region of the substrate so as to have a defocusing distance d2,
And the defocusing distance d2 is larger than the defocusing distance d1. delete delete 11. The method of claim 10,
The second soldering process comprising: providing a solder ball in a cleaned repair area on the substrate; And attaching the solder ball to the repair region by irradiating and heating the solder ball with a soldering laser beam. 14. The method of claim 13,
And performing a water cleaning process on the substrate after the second soldering process. 14. The method of claim 13,
Wherein the cleaning laser beam and the soldering laser beam have the same wavelength. 14. The method of claim 13,
Wherein the cleaning laser beam has an output that is less than the soldering laser beam. delete 1. A laser soldering system for performing a soldering process using a soldering laser beam on a soldering area of a substrate and performing a laser soldering repair process on a repair area of the soldering area of the substrate on which the soldering process is not performed,
A solder ball supply unit for supplying a solder ball to a soldering region of the substrate; And
And a laser irradiation device for irradiating the soldering laser beam to defocus the solder ball and irradiating the cleaning laser beam to be defocused to the repair region of the substrate,
Wherein a defocusing distance d2 of the cleaning laser beam is greater than a defocusing distance d1 of the soldering laser beam. 19. The method of claim 18,
Further comprising a flux application unit for applying a flux to a soldering region of the substrate. 19. The method of claim 18,
And a cleaning water supply unit for supplying a cleaning water to the substrate to perform a water cleaning process.
KR1020160017192A 2016-02-15 2016-02-15 Laser soldering repair process, laser soldering process and laser soldering system KR101935518B1 (en)

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