JPH01195269A - Metal-coated plastic film - Google Patents
Metal-coated plastic filmInfo
- Publication number
- JPH01195269A JPH01195269A JP1725388A JP1725388A JPH01195269A JP H01195269 A JPH01195269 A JP H01195269A JP 1725388 A JP1725388 A JP 1725388A JP 1725388 A JP1725388 A JP 1725388A JP H01195269 A JPH01195269 A JP H01195269A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thin film
- film layer
- metal thin
- thin metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002985 plastic film Substances 0.000 title claims abstract description 38
- 229920006255 plastic film Polymers 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims description 75
- 229910052751 metal Inorganic materials 0.000 title claims description 75
- 238000004544 sputter deposition Methods 0.000 claims abstract description 24
- 239000010409 thin film Substances 0.000 claims description 65
- 239000010408 film Substances 0.000 claims description 21
- 238000007738 vacuum evaporation Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 13
- 239000010949 copper Substances 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 9
- 230000001590 oxidative effect Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- -1 Polyethylene terephthalate Polymers 0.000 description 4
- 235000013405 beer Nutrition 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 241000254032 Acrididae Species 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、フレキシブルプリント基板（ＦＰＣ）、フ
ィルムコンデンサー、磁気テープなどの電気機器部品か
ら、透明導電膜、選択吸収膜、さらには、装飾品等に用
いらる金属薄膜層とプラスチック層の密着力及び耐湿熱
性を向上させた金属被覆プラスチックフィルムに関する
ものである。[Detailed Description of the Invention] [Industrial Application Field] This invention is applicable to electrical equipment parts such as flexible printed circuit boards (FPC), film capacitors, and magnetic tapes, transparent conductive films, selective absorption films, and even decorative items. The present invention relates to a metal-coated plastic film that has improved adhesion between a metal thin film layer and a plastic layer and moisture and heat resistance, and is used in applications such as the following.
［従来の技術］
近年プラスチックフィルムのメタライジングが盛゛んに
行われており、金属被覆プラスチックフィルムはフレキ
シブルプリント基板（ＦＰＣ）、フィルムコンデンサー
、磁気テープなどの電気機器部品から、透明導電膜、選
択吸収膜、さらには、装飾品等としても使用されるなど
、ますますその用途が拡大している。[Prior art] Metallizing of plastic films has been actively carried out in recent years, and metal-coated plastic films are used for various purposes such as transparent conductive films, selective materials, etc. Its uses are expanding more and more, including use as absorbent membranes and even decorative items.
以上に挙げたような多くの分野で用いられている金属被
膜プラスチックフィルムを得る方法の一つとしては、圧
延銅箔や電解銅箔を接着剤を用いてプラスチックフィル
ムに貼り合わせて金属薄膜を形成するという方法が従来
から行われている。One way to obtain metal-coated plastic films, which are used in many of the fields listed above, is to bond rolled copper foil or electrolytic copper foil to a plastic film using an adhesive to form a thin metal film. This method has traditionally been used.
例えばフレキシブルプリント基板においては、可撓性の
点から圧延銅箔を接着剤層を介して熱圧着されることが
多い。しかし、この方法では銅箔厚をある程度厚くする
ことが必要で、近年の電子部品の「軽薄短小化」の要求
に必ずしも答えきれておらず、用途によっては接着剤層
部分の耐熱性や電気特性が問題となることもある。また
、銅箔の圧延方向によって屈曲性が異なるため設計時に
留意を必要とする。For example, in flexible printed circuit boards, rolled copper foil is often bonded by thermocompression via an adhesive layer for flexibility. However, this method requires increasing the thickness of the copper foil to a certain extent, and cannot necessarily meet the recent demands for "lighter, thinner, shorter, and smaller" electronic components. can sometimes be a problem. In addition, since the flexibility varies depending on the rolling direction of the copper foil, care must be taken at the time of design.
これに対して、数μｍ以下の薄い金属薄膜が要求される
場合に注目されている方法としては、プラスチックフィ
ルム上に直接、真空蒸着法やスパッタリング法により、
金属薄膜を形成する方法がある。On the other hand, when a thin metal film of several μm or less is required, methods that are attracting attention include direct vacuum deposition or sputtering on the plastic film.
There is a method of forming a metal thin film.
［発明が解決しようとする課題］
上記のような従来の金属被膜プラスチックフィルムにお
いて、金属薄膜が真空蒸着法により直接プラスチックフ
ィルム上に形成されている場合、金属薄膜とプラスチッ
クフィルムの密着性が不充分で、実用に耐え得ないこと
が多い。さらに真空蒸着法で形成された金属薄膜は、一
般に緻密性に劣るため、結晶粒界からの酸素や水分の拡
散により酸化劣化しやすいという欠点も有している。[Problem to be solved by the invention] In the conventional metal-coated plastic film as described above, when the metal thin film is directly formed on the plastic film by vacuum deposition, the adhesion between the metal thin film and the plastic film is insufficient. However, it is often impractical for practical use. Furthermore, metal thin films formed by vacuum evaporation generally have poor density, and therefore have the disadvantage of being susceptible to oxidative deterioration due to the diffusion of oxygen and moisture from grain boundaries.
一方、スパッタリング法により形成された金属薄膜は、
基板との密着性に優れ、また、緻密であるなどの点で優
れている。しかしながら、薄膜の成長速度が遅いため生
産性の点で劣りている。On the other hand, metal thin films formed by sputtering method are
It has excellent adhesion to the substrate and is also dense. However, the growth rate of the thin film is slow, resulting in poor productivity.
木発明は、以上のような現状に鑑み、本発明者らが鋭意
研究の未達成したものであり、金属薄膜とプラスチック
フィルムとの密着性が優れ、金属薄膜の酸化劣化が起こ
りにくく、かつ生産性も高い金属被膜プラスチックフィ
ルムを提供することを目的としている。In view of the above-mentioned current situation, the inventors of the present invention have made the invention of wood, which has not yet been achieved through intensive research.It has excellent adhesion between the metal thin film and plastic film, is less prone to oxidative deterioration of the metal thin film, and is easy to manufacture. The objective is to provide a metal-coated plastic film with high properties.
［課題を解決するための手段］
この発明においては、プラスチックフィルム上にスパッ
タリング法によって直接少なくとも膜厚５０人の第１９
金属薄膜層を形成し、しかるのち、該第１の金属薄膜層
上に所望の膜厚の真空蒸着法による金属薄膜層を形成し
、この上にスパッタリング法により少なくとも膜厚５０
人の第２の金属薄膜を形成することによって、上記の課
題を解決したものである。[Means for Solving the Problems] In the present invention, the 19th film is directly deposited onto a plastic film with a film thickness of at least 50% by sputtering.
A metal thin film layer is formed, and then a metal thin film layer of a desired thickness is formed by vacuum evaporation on the first metal thin film layer, and a film thickness of at least 50 mm is formed on this by sputtering.
The above problem was solved by forming a second metal thin film.
［作用］
この発明にかかる金属被膜プラスチックフィルムにおい
ては、プラスチックフィルム上にスパッタリング法によ
って直接に形成された少なくとも膜厚５０人の第１の金
属薄膜層によって金属薄膜とプラスチックフィルムは良
好な密着性が確保されており、さらにこの金属薄膜層は
緻密性に優れているため、フィルム側からの酸素あるい
は水分の拡散による酸化劣化を防ぐことになる。[Function] In the metal-coated plastic film according to the present invention, the first metal thin film layer with a thickness of at least 50 layers is formed directly on the plastic film by sputtering, so that the metal thin film and the plastic film have good adhesion. Furthermore, since this metal thin film layer has excellent density, it prevents oxidative deterioration due to diffusion of oxygen or moisture from the film side.
次にこの第１の金属薄膜層の上には真空蒸着法によって
所望の厚さの金属薄膜層が形成されている。この金属薄
膜は前述したように緻密性にはあまり優れていないが、
前記スパッタリングによる第１の金属薄膜層と後述する
スパッタリングによる第２の金属薄膜層との間に形成さ
れた中間層であるので、この欠点はほとんど問題になら
なす、反面、金属薄膜の成長速度が比較的速いという利
点が生かされ、製品の生産性を向上させることができる
。Next, a metal thin film layer having a desired thickness is formed on this first metal thin film layer by vacuum evaporation. As mentioned above, this metal thin film is not very dense, but
Since this is an intermediate layer formed between the first metal thin film layer formed by sputtering and the second metal thin film layer formed by sputtering, which will be described later, this drawback is hardly a problem, but on the other hand, the growth rate of the metal thin film is Taking advantage of its relatively high speed, product productivity can be improved.
さらに最表面には結晶構造が緻密なスパッタリングによ
る第２の金属薄膜層が前記第１の金属薄膜層と同様に少
なくとも５０人の膜厚に形成されており、この層は金属
薄膜の酸化劣化等を防ぐ役割りをになっている。Further, on the outermost surface, a second metal thin film layer with a dense crystal structure is formed by sputtering to a thickness of at least 50 mm, similar to the first metal thin film layer, and this layer is free from oxidative deterioration of the metal thin film. The role is to prevent this.
ここで、本発明においてスパッタリング法による第１お
よび第２の金属薄膜層の膜厚を少なくとも５０人とした
のは、５０人よりも薄い場合は、スパッタリングによる
膜がまだ島状構造をとっており、比較的隙間が多いため
充分な耐湿熱性等が得られないためである。Here, in the present invention, the thickness of the first and second metal thin film layers formed by the sputtering method is set to at least 50 layers, because if the thickness is less than 50 layers, the film formed by sputtering still has an island-like structure. This is because sufficient heat and humidity resistance cannot be obtained due to the relatively large number of gaps.
なお、上限は５０００人より厚すると生産性が悪くなり
量産に適さなくなる。Note that if the upper limit is more than 5,000 people, productivity will deteriorate and it will not be suitable for mass production.
［実施例］
実施例：１
第２図に概略図を示した実験装置を用いて木発明にかか
る金属被覆プラスチックフィルムを試作した。[Examples] Example: 1 A metal-coated plastic film according to the invention was produced as a trial using the experimental apparatus schematically shown in FIG.
まず、所定のガスτ囲気になるように構成された真空槽
１０６内にポリイミドフィルム（厚さ２５μｍ、長さ５
０ｍ、東しく株）製、商品名カプトン）１０５を送りだ
し、送りだしロール１０７からキャンロール１０９に周
接して巻取りロール１０８に至るようにセットし、真空
槽１０６内が１０−’Ｔｏｒｒ台になるまで排気した。First, a polyimide film (thickness 25 μm, length 5
0 m, manufactured by Toshiki Co., Ltd. (trade name: Kapton) 105, and set it so that it runs from the feed roll 107, circumferentially touching the can roll 109, and reaches the take-up roll 108, so that the inside of the vacuum chamber 106 becomes on the 10-' Torr level. Exhausted until.
その後スパッタ室１１０および１１０゛にＡｒガスを導
入し、Ｃｕ薄膜を膜成長速度８３人／ｓｅｃとなるよう
にスパッタ形成するとともに、蒸着室１１１において膜
成長速度８３０人／ｓｅｃで電子ビーム（ＥＢ）蒸着を
行った。その際、フィルムは、送りだしロール１０７か
ら、巻き取りロール１０８へ線速１、Ｏｍ／ｍｉｎで走
行させ、所望の膜厚が得られるように防着板１３の間隔
を調節した。Thereafter, Ar gas is introduced into the sputtering chambers 110 and 110, and a Cu thin film is formed by sputtering at a film growth rate of 83 people/sec, and an electron beam (EB) is used in the deposition chamber 111 at a film growth rate of 830 people/sec. Vapor deposition was performed. At that time, the film was run from the delivery roll 107 to the take-up roll 108 at a linear speed of 1 Om/min, and the interval between the adhesion prevention plates 13 was adjusted so as to obtain the desired film thickness.
このようにして、第１図の如き構造の金属被膜プラスチ
ックフィルムを製造し、第１の金属薄膜層１．蒸着法に
よる金属薄膜層２．第２の金属薄膜層３の膜厚がそれぞ
れ０．１ μｍ 、０．８μｍ、０．１μｍとなるよう
にした。In this way, a metal-coated plastic film having the structure as shown in FIG. 1 is manufactured, and the first metal thin film layer 1. Metal thin film layer by vapor deposition method2. The thicknesses of the second metal thin film layer 3 were set to 0.1 μm, 0.8 μm, and 0.1 μm, respectively.
実施例：２
実施例１におけるポリイミドフィルムの代わりにポリエ
チレンテレフタレート（ＰＥＴ）フィルム（厚さ５０μ
ｍ、東しく株）製、商品名ルミラー）をセットした以外
は実施例１と全く同じ条件で１μｍ厚のＣｕ薄膜を形成
して、金属被膜プラスチックフィルムを得た。Example: 2 Polyethylene terephthalate (PET) film (thickness 50 μm) was used instead of the polyimide film in Example 1.
A 1 μm thick Cu thin film was formed under the same conditions as in Example 1, except that a 1 μm-thick Cu thin film was set, except that a 1 μm-thick Cu thin film was used, except that a metal-coated plastic film was set.
実施例；３
実施例１におけるスパッタターゲツト材１１４．１１４
°をＣｕの代わりにＣｒとした以外は実施例１と全く同
じ条件で、１μｍのＣｒ／ｃ ｕ ／ ｃ ｒ Ｒ膜を
形成した。Example; 3 Sputter target material 114, 114 in Example 1
A 1 μm Cr/cu/cr R film was formed under the same conditions as in Example 1 except that Cr was used instead of Cu.
比較例＝１
実施例１において、走行線速０．１ｍ／ｍｉｎでのスパ
ッタリング法のみにより１μｍ厚のｃ ｕ ＲＩｌｉを
形成した。Comparative Example = 1 In Example 1, a 1 μm thick cu RIli was formed only by sputtering at a running linear speed of 0.1 m/min.
比較例：２
実施例１において、走行線速１．０ｍ／ｌｌ１ｉｎでの
蒸着法のみにより１μｍのｃｕｆｉｌｌＭを形成した。Comparative Example: 2 In Example 1, a 1 μm cufill M was formed only by the vapor deposition method at a running linear velocity of 1.0 m/11 inch.
比較例：３
実施例２において、走行線速０．Ｉｎ＋／ｍｊｎでのス
パッタリング法のみにより１μｍのＣｕ薄膜を形成した
。Comparative example: 3 In Example 2, the running line speed was 0. A 1 μm thick Cu thin film was formed only by sputtering using In+/mjn.
比較例：４
実施例２において、走行線速１．０ｍ／ｍｉｎでの蒸着
法のみにより１μｍのＣｕ薄膜を形成した。Comparative Example: 4 In Example 2, a 1 μm thick Cu thin film was formed only by vapor deposition at a running linear velocity of 1.0 m/min.
以上の、実施例、比較例において得られた各々の金属被
覆プラスチックフィルムにおける金属薄膜とプラスチッ
クフィルムの密着力を測定し、また目視による金属薄膜
の表面観測を薄膜形成実験直後と温熱サイクル試験後に
行った。第１表にこれらの試験の結果と、上記の実施例
および比較例において５０ｍ長のプラスチックフィルム
上に連続的に薄膜作成するのに要した時間を示す。The adhesion between the metal thin film and the plastic film in each of the metal-coated plastic films obtained in the Examples and Comparative Examples above was measured, and the surface of the metal thin film was visually observed immediately after the thin film formation experiment and after the thermal cycle test. Ta. Table 1 shows the results of these tests and the time required to continuously form a thin film on a 50 m long plastic film in the above examples and comparative examples.
なお、密着力の測定は、第３図に示すように１ｃｍ Ｘ
１０ｃｍに切り取ったサンプルの金属薄膜２０４面を
エポキシ系接着剤２１６を用いてアルミ補強板２１５に
貼り合わせたのち、プラスチックフィルム２０５を１８
０度方向に線速５０ｍｍ／ｍｉｎで引き剥す際の力を測
定し、温熱サイクルは、ＪＩＳＣ５０１２の９．４に従
い、１０サイクル行った。The adhesion force was measured using a 1cm x
After pasting the metal thin film 204 surface of the sample cut into 10 cm pieces onto the aluminum reinforcing plate 215 using an epoxy adhesive 216, the plastic film 205 was glued onto the aluminum reinforcing plate 215.
The force when peeling off in the 0 degree direction at a linear speed of 50 mm/min was measured, and 10 thermal cycles were performed in accordance with JISC5012 9.4.
第１表においてプラスチックフィルムの素材が同じ場合
について本発明実施例と比較例を比較すると（実施例１
と比較例１および２、実施例２と比較例３および４）、
蒸着法のみによりＣｕ ｌｉを形成した比較例（２およ
び４）に対して実施例は約５倍程度のビール強度を有し
ており、温熱サイクル試験後においても密着性がほとん
ど低下していない。Table 1 shows a comparison of the inventive examples and comparative examples when the plastic film is made of the same material (Example 1).
and Comparative Examples 1 and 2, Example 2 and Comparative Examples 3 and 4),
Compared to Comparative Examples (2 and 4) in which Cu li was formed only by the vapor deposition method, the beer strength of the Examples was about 5 times higher, and the adhesion hardly decreased even after the thermal cycle test.
また、スパッタリング法のみにより膜を形成した比較例
（１および３）は、ビール強度は実施例と同等程度であ
るものの、薄膜形成に要した時間は実施例の１０倍にも
なっており、現実の量産には適用しがたい。In addition, in Comparative Examples (1 and 3) in which films were formed only by sputtering, although the beer strength was about the same as in the Examples, the time required to form the thin films was 10 times longer than in the Examples. It is difficult to apply it to mass production.
さらに、金属薄膜の酸化劣化の問題についても、蒸着法
のみによりＣｕ ｌ］＠を形成した比較例（２および４
）が温熱サイクル試験後に大部分が酸化劣化してしまっ
たのに対し、実施例では酸化劣化が認められない。Furthermore, regarding the problem of oxidative deterioration of metal thin films, comparative examples (2 and 4) in which Cu l]@ were formed only by vapor deposition
) was mostly oxidized and deteriorated after the thermal cycle test, whereas no oxidative deterioration was observed in the examples.
なお、実施例のなかでも最も高いビール強度を 。In addition, the beer strength is the highest among the examples.
示したのは、スパッタ用ターゲツト材をＣｕの代わりに
Ｃｒとした実施例３であるが、本発明における金属薄膜
を形成する金属は特に限定されるものではなく、用途に
応じて適宜選択されるものである。また、第１の金属薄
膜層、蒸着法による金属薄膜層および第２の金属薄膜層
は、同種の金属または合金から成っていても良いし、場
合によっては実施例の如く異種の金属または合金から成
っていてもよい。さらに、必要に応して、プラスチック
フィルムに例えばプラズマ処理などの前処理□ を施せ
ば、より密着性を上げることもできる。What is shown is Example 3 in which the target material for sputtering was Cr instead of Cu, but the metal forming the metal thin film in the present invention is not particularly limited and may be appropriately selected depending on the application. It is something. Further, the first metal thin film layer, the metal thin film layer formed by vapor deposition, and the second metal thin film layer may be made of the same kind of metal or alloy, or in some cases, they may be made of different kinds of metals or alloys as in the embodiment. It may consist of Furthermore, if necessary, the plastic film can be subjected to pretreatment such as plasma treatment to further improve its adhesion.
また、本発明において用いられるプラスチックフィルム
も特に限定されるものではなく、実施例で用いたポリイ
ミド、ポリエチレンテレフタレート（ＰＥＴ）の他にも
、例えばポリカーボネート、ポリプロピレン、ポリエー
テルサルフォン、ポリフェニレンサルファイド、ポリア
ミド、ポリエーテルイミド、ポリアミドイミド、ポリエ
チレンナフタレート、液晶ポリマーなどが用いられる。Furthermore, the plastic film used in the present invention is not particularly limited, and in addition to the polyimide and polyethylene terephthalate (PET) used in the examples, for example, polycarbonate, polypropylene, polyether sulfone, polyphenylene sulfide, polyamide, Polyetherimide, polyamideimide, polyethylene naphthalate, liquid crystal polymer, etc. are used.
また、本発明における金属薄膜の厚さは実施例および比
較例では１μｍ （１０００人）としたが、前述した
ようにスパッタリングによる金属薄膜層の厚さは少なく
とも５０人あれば良く、膜の特性と生産性の両方を考慮
するとスパッタリングによる金属薄膜層は１００〜１０
００人あることがより好ましい。In addition, the thickness of the metal thin film in the present invention was 1 μm (1000 people) in the examples and comparative examples, but as mentioned above, the thickness of the metal thin film layer formed by sputtering should be at least 50 people, and the thickness depends on the characteristics of the film. Considering both productivity, the metal thin film layer by sputtering is 100 to 10
It is more preferable that there be 00 people.
以上から明らかなように、本発明にかかる金属被覆プラ
スチックフィルムは密着性及び耐湿熱性に優れ、かつ効
率よく生産することができ、産業上きわめて有益である
。As is clear from the above, the metal-coated plastic film according to the present invention has excellent adhesion and heat-and-moisture resistance, can be produced efficiently, and is extremely useful industrially.
第１表
＊Ａ・・・薄膜形成に要した時間（ｍｉｎ）Ｂ・１８０
度ビール強度（ｇ／ｃｍ）
Ｃ・・・外観 Ｏ二酸化劣化無し
△：部分的に酸化劣化
×：大部分が酸化劣化
＊いずれもＮ＝５の平均を示す。Table 1 *A: Time required to form a thin film (min) B・180
Degree Beer Strength (g/cm) C... Appearance No deterioration due to O2 oxidation △: Partially oxidative deterioration ×: Mostly oxidative deterioration *All indicate the average of N=5.
［発明の効果］
この発明においては、プラスチックフィルム上に形成さ
れる第１のスパッタリングによる金属薄膜層と、最表面
に形成される第２のスパッタリングによる金属薄膜層と
、これら第１および第２のスパッタリングによる金属薄
膜層の間に形成され備えたことにより、金属被膜プラス
チックフィルムの密着性および耐湿熱性を高め、同時に
生産性も向上させることができるという極めて優れた効
果を有している。[Effects of the Invention] In this invention, a first sputtered metal thin film layer formed on a plastic film, a second sputtered metal thin film layer formed on the outermost surface, and these first and second metal thin film layers are formed on a plastic film. By being formed between the metal thin film layers by sputtering, it has an extremely excellent effect of increasing the adhesion and heat-and-moisture resistance of the metal-coated plastic film, and improving productivity at the same time.
かかる金属被覆プラスチックフィルムは高密度化、高精
度化が進む電気機器部品等において、信頼性を高め、か
つコスト低減を図る上で非常に有益である。Such metal-coated plastic films are extremely useful in increasing reliability and reducing costs in electrical equipment parts, etc., which are becoming increasingly dense and precise.
第１図は本発明にかかる金属薄膜付プラスチックフィル
ムの構成模式図、第２図は実施例に用いた装置の概略図
、第３図はビール試験の説明図である。
１：第１の金属薄膜層、２：蒸着法による金属薄膜層、
３：第２の金属薄膜層、４，２０４：金属薄膜、５，１
０５，２０５ニブラスチツクフイルム、１０６：真空槽
、１０７：送りだしロール、１０８二巻取りロール、１
ｏ９：キャンロール、１１０，１１０° ニスバッタ室
、１１１：蒸ル、１１０，１１０’ ニスバッタ室、
１１１：蒸着室、１１２：仕切り板、１１３：防着板、
１１４．１１４° ニスバッタターゲット、１１５：蒸
着源、２１５ニアルミ補強板、２１６：接着材。FIG. 1 is a schematic diagram of the structure of a plastic film with a metal thin film according to the present invention, FIG. 2 is a schematic diagram of an apparatus used in an example, and FIG. 3 is an explanatory diagram of a beer test. 1: first metal thin film layer, 2: metal thin film layer by vapor deposition method,
3: Second metal thin film layer, 4,204: Metal thin film, 5,1
05,205 Niblast film, 106: Vacuum chamber, 107: Delivery roll, 108 Two take-up rolls, 1
o9: Can roll, 110, 110° Varnish grasshopper room, 111: Steam, 110, 110' Varnish grasshopper room,
111: Vapor deposition chamber, 112: Partition plate, 113: Deposition prevention plate,
114.114° Varnish batter target, 115: Vapor deposition source, 215 Ni-aluminum reinforcing plate, 216: Adhesive material.
Claims (1)
チックフィルムにおいて、プラスチックフィルム上にス
パッタリング法によって直接形成された少なくとも膜厚
５０Åの第１の金属薄膜層と、最表面にスパッタリング
法によって形成された少なくとも膜厚５０Åの第２の金
属薄膜層と、前記第１および第２の金属薄膜層の間の真
空蒸着法による所望の膜厚の金属薄膜層とからなる金属
薄膜を備えたことを特徴とする金属被覆プラスチックフ
ィルム。In a metal-coated plastic film with a metal thin film formed on one or both sides, a first metal thin film layer with a thickness of at least 50 Å formed directly on the plastic film by a sputtering method, and at least a film formed on the outermost surface by a sputtering method. A metal comprising a metal thin film consisting of a second metal thin film layer with a thickness of 50 Å and a metal thin film layer with a desired thickness formed by vacuum evaporation between the first and second metal thin film layers. Coated plastic film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1725388A JPH01195269A (en) | 1988-01-29 | 1988-01-29 | Metal-coated plastic film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1725388A JPH01195269A (en) | 1988-01-29 | 1988-01-29 | Metal-coated plastic film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01195269A true JPH01195269A (en) | 1989-08-07 |
Family
ID=11938791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1725388A Pending JPH01195269A (en) | 1988-01-29 | 1988-01-29 | Metal-coated plastic film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01195269A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8179936B2 (en) | 2007-06-14 | 2012-05-15 | Trumpf Laser Marking Systems Ag | Gas-cooled laser device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225868A (en) * | 1975-08-20 | 1977-02-26 | Sekisui Chemical Co Ltd | Method of producing thermoplastic resin bend |
| JPS61128593A (en) * | 1984-11-27 | 1986-06-16 | 株式会社 麗光 | Evaporation film for printed circuit |
-
1988
- 1988-01-29 JP JP1725388A patent/JPH01195269A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225868A (en) * | 1975-08-20 | 1977-02-26 | Sekisui Chemical Co Ltd | Method of producing thermoplastic resin bend |
| JPS61128593A (en) * | 1984-11-27 | 1986-06-16 | 株式会社 麗光 | Evaporation film for printed circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8179936B2 (en) | 2007-06-14 | 2012-05-15 | Trumpf Laser Marking Systems Ag | Gas-cooled laser device |
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