JPH01175104A - Conductive material - Google Patents
Conductive materialInfo
- Publication number
- JPH01175104A JPH01175104A JP33003587A JP33003587A JPH01175104A JP H01175104 A JPH01175104 A JP H01175104A JP 33003587 A JP33003587 A JP 33003587A JP 33003587 A JP33003587 A JP 33003587A JP H01175104 A JPH01175104 A JP H01175104A
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- powder
- mica
- parts
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 19
- 239000010445 mica Substances 0.000 claims abstract description 32
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 239000000945 filler Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 239000000843 powder Substances 0.000 description 40
- 230000000052 comparative effect Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 101100481408 Danio rerio tie2 gene Proteins 0.000 description 1
- 101100481410 Mus musculus Tek gene Proteins 0.000 description 1
- 229910008046 SnC14 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000003823 mortar mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910009112 xH2O Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂組成物等に導電性を付与するために該樹
脂に混入される充填材等として好適な導電性物質に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive substance suitable as a filler or the like that is mixed into a resin composition or the like to impart conductivity to the resin composition.
樹脂組成物等の帯電を防止するため、導電性の充填材を
樹脂に混入して樹脂組成物等に導電性を付与することが
行なわれている。In order to prevent charging of resin compositions, etc., conductive fillers are mixed into the resin to impart conductivity to the resin compositions.
従来、導電性物質として当初は金属粉末、金属繊維など
が用いられていたが、これらは比重が大きく樹脂組成物
の重量を増す欠点があるため、比重の小さい雲母やチタ
ン酸アルカリ繊維などに金属被覆を設けたもの、或いは
金属酸化物からなる導電性物質が開発された。金属酸化
物からなる充填材の一例として酸化Ｓｎ粉末が知られて
いる。酸化Ｓｎ粉末は比重が小さい上に白色であり、樹
脂に混入した際に樹脂の色調を損なわない利点を有する
ので広く利用されている。また酸化ＳｎにＳｂを含有さ
せることにより導電性を高めた酸化Ｓｎ粉末も知られて
いる（特開昭５７−７１８２２号）。Conventionally, metal powders, metal fibers, etc. were initially used as conductive materials, but these have the disadvantage of having a high specific gravity and increasing the weight of the resin composition. Conductive materials have been developed that are coated or made of metal oxides. Sn oxide powder is known as an example of a filler made of metal oxide. Sn oxide powder has a small specific gravity and is white, and has the advantage that when mixed into a resin, it does not impair the color tone of the resin, so it is widely used. Also known is Sn oxide powder whose conductivity is improved by incorporating Sb into Sn oxide (Japanese Patent Application Laid-Open No. 71822/1983).
更に、雲母やチタン酸アルカリ繊維の表面に上記Ｓｂ含
有酸化Ｓｎを被覆した導電性物質も試みられティる（特
公昭６１−２６９３３号）が、 Ｓｂ含有酸化Ｓｎ被覆
が雲母表面に均一に付着し難い問題があり、また導電性
も不十分である。Furthermore, attempts have been made to use conductive materials in which the surface of mica or alkali titanate fibers is coated with the above-mentioned Sb-containing Sn oxide (Japanese Patent Publication No. 61-26933), but the Sb-containing Sn oxide coating does not adhere uniformly to the mica surface. There are difficult problems, and the conductivity is also insufficient.
本発明者は、酸化Ｓｂ含有酸化Ｓｎを雲母に施す際、従
来、酸化Ｓｂの最適含有量と考えられていた量以上に酸
化Ｓｂ量を増加すれば、雲母表面への密着性も改善され
且つ同時に充填材自体の導電性も向上することを見出し
た。The present inventor has discovered that when applying Sn oxide containing Sb oxide to mica, if the amount of Sb oxide is increased beyond the amount conventionally considered to be the optimum content of Sb oxide, the adhesion to the mica surface will be improved. At the same time, it has been found that the conductivity of the filler itself is improved.
本発明によれば、雲母を担体とし、該雲母表面に酸化Ｓ
ｎ １００重量部に対して酸化Ｓｂ ２０〜１００重量
部からなる酸化Ｓｂ含有酸化Ｓｎ被覆が施された導電性
物質が提供される。According to the present invention, mica is used as a carrier, and oxidized S is added to the surface of the mica.
There is provided a conductive material coated with Sn oxide containing Sb oxide and comprising 20 to 100 parts by weight of Sb oxide based on 100 parts by weight of n.
また、その好適な実施態様として、雲母１００重量部に
対して酸化Ｓｂ含有酸化Ｓｎ被覆が２０〜５０重量部で
ある導電性物質が提供される。Further, in a preferred embodiment thereof, there is provided a conductive material in which the amount of the Sb oxide-containing Sn oxide coating is 20 to 50 parts by weight based on 100 parts by weight of mica.
酸化Ｓｂを含有する酸化Ｓｎ粉末（Ａ）、酸化Ｓｂ含有
酸化ＳｎをＴｉＯ□粉末に被覆した粉末（Ｂ）、 酸化
Ｓｂ含有酸化Ｓｎを雲母に被覆した粉末（Ｃ）の夫々に
ついて酸化Ｓｂ含有量と比抵抗（Ω・Ｃｌ１１）との変
化を調べた。この結果を図に示す。図示するように、上
記酸化Ｓｎ粉末（Ａ）と、Ｔｉｅ２粉末担体粉末（Ｂ）
については、酸化Ｓｂ含有量（酸化Ｓｎ １００重量部
に対する酸化Ｓｂの部数）が約１５重量部である場合に
これら粉末（Ａ）、 （Ｂ）自体の比抵抗が極小となる
。従って雲母等の酸化Ｓｂ含有酸化Ｓｎ被覆を施す場合
にも上記酸化Ｓｂが最適量であると従来考えられていた
。ところが、酸化Ｓｂ含有酸化Ｓｎを雲母に被覆した粉
末（Ｃ）について実際にその酸化５ｂｆｉｔ と比抵抗
との関係を調べると、図示するように意外にも該粉末（
Ｃ）の比抵抗が極小となる酸化５ｂｆｔは上記粉末（Ａ
）、（Ｂ）と大幅に異なり３０〜４０重量部である。Sb oxide content for each of Sn oxide powder (A) containing Sb oxide, powder (B) in which TiO□ powder is coated with Sn oxide containing Sb oxide, and powder (C) in which mica is coated with Sn oxide containing Sb oxide. The change in specific resistance (Ω·Cl11) was investigated. The results are shown in the figure. As shown in the figure, the Sn oxide powder (A) and the Tie2 powder carrier powder (B)
When the Sb oxide content (the number of parts of Sb oxide relative to 100 parts by weight of Sn oxide) is about 15 parts by weight, the specific resistance of these powders (A) and (B) themselves becomes minimum. Therefore, it was conventionally thought that the above-mentioned Sb oxide was the optimum amount even when applying a Sn oxide coating containing Sb oxide such as mica. However, when we actually investigated the relationship between the oxidation 5bfit and specific resistance of powder (C) in which mica was coated with Sn oxide containing Sb oxide, we found that the powder (C) unexpectedly
The oxidized 5bft with which the specific resistance of C) is minimal is the above powder (A).
) and (B), it is 30 to 40 parts by weight.
また、酸化Ｓｂ含有量と上記被覆の密着性についてみる
と、酸化Ｓｂ含有量が３０〜４０重量部の酸化Ｓｎ被覆
は酸化Ｓｂ含有量が１０〜１５重量部の酸化Ｓｎ被覆よ
り雲母表面への密着性が良い。In addition, regarding the Sb oxide content and the adhesion of the above-mentioned coatings, the Sn oxide coating with an Sb oxide content of 30 to 40 parts by weight has a higher adhesion to the mica surface than the Sn oxide coating with an Sb oxide content of 10 to 15 parts by weight. Good adhesion.
本発明においては、上記知見に基づき且つ実用性を考慮
し、酸化Ｓｂの含有量を、酸化Ｓｎ １００重量部に対
して酸化Ｓｂ ２０〜１００重量部とする。酸化Ｓｂが
２０重量部より少ないと、粉末自体の比抵抗が高くなり
、導電性が低下する。酸化Ｓｂ量が１００重量部を超え
ると灰青色が強くなる。In the present invention, based on the above findings and considering practicality, the content of Sb oxide is set to 20 to 100 parts by weight per 100 parts by weight of Sn oxide. When the amount of Sb oxide is less than 20 parts by weight, the specific resistance of the powder itself becomes high and the conductivity decreases. When the amount of Sb oxide exceeds 100 parts by weight, the gray-blue color becomes stronger.
雲母に対する上記被覆の量は、雲母１００重量部に対し
て２０〜５０重量部が好ましい。被覆の量が２０重量部
より少ないと、導電性が低下する。被覆の量が５０重量
部を超えると、Ｓｂ含有酸化Ｓｎ粉末との混合粉と変ら
なくなる。The amount of the above-mentioned coating on mica is preferably 20 to 50 parts by weight per 100 parts by weight of mica. If the amount of coating is less than 20 parts by weight, the conductivity will decrease. When the amount of coating exceeds 50 parts by weight, it is no different from a mixed powder with Sb-containing Sn oxide powder.
本発明にかかる導電性物質は既知の方法（特公昭６０−
４９１３６号等）を利用して製造することが出来る。The conductive material according to the present invention can be prepared by a known method (Japanese Patent Publication No. 1983-
No. 49136, etc.).
（発明の効果〕
本発明の導′貨性物質は、従来の酸化Ｓｎ被覆を有する
充填材や、酸化Ｓｂ含有酸化Ｓｎ被覆を有する充填材に
比へて平板状であり、従って本発明の導電性物質を樹脂
に混練する場合、従来の充填材より少ない量で足りる。(Effects of the Invention) The conductive substance of the present invention has a tabular shape compared to the conventional filler having an Sn oxide coating or the filler having an Sb oxide-containing Sn oxide coating. When kneading the chemical substance into the resin, a smaller amount is required than with conventional fillers.
また本発明の８亀性物質は被覆の密着性が良いので、樹
脂に混入する際にも被覆が剥離する虞が無い。In addition, since the 8-mercury substance of the present invention has good coating adhesion, there is no fear that the coating will peel off when mixed into the resin.
本発明の実施例および比較例を以下に示す。尚、原料は
いずれも市販品を用いる。Examples and comparative examples of the present invention are shown below. All raw materials used are commercially available products.
実施例−１
雲母粉末４５０ｇを水４Ωに分散し攪拌しながら９０℃
に保持した。６Ｎ−ＨＣＩに６０％溶解した塩化第二Ｓ
ｎおよび三塩化Ｓｂを各々３２６ｇ、８４ｇ計量し混合
した。Example-1 450g of mica powder was dispersed in 4Ω of water and heated to 90°C with stirring.
was held at 60% S chloride dissolved in 6N-HCI
326 g and 84 g of Sb trichloride and Sb trichloride were weighed and mixed.
ＮａＯＨ］、４６ｇを水５００ｎ＋Ｑに溶解した。各溶
液をｐＨが５以上にならないように同時に滴下し、滴下
後、懸濁液を１０分間攪拌し、雲母粉末表面に被覆を析
出させ攪拌終了時のｐＨは１．４であった。続いて該懸
濁液を濾過、洗浄し、乾燥した後に６００℃で２時間焼
成して、５ｂｏ２含有ＳｎＯ２被覆を有する雲母粉末か
らなる本発明の導電性物質を得た。該粉末を１００ｋｇ
／ｃｉの圧力でプレスして圧粉体とし、その比抵抗を求
めた。この結果を表１に示す。尚、上記析出皮膜をＸ線
回折により調べたところ、５ｎ０２のブロードな回折ピ
ークがみられるが５ｂｏ２の回折ピ−クは認められなか
った。従ってＳｂＯ□はＳｎＯ２に固溶しているものと
考えられる。NaOH], 46 g was dissolved in 500 n+Q of water. Each solution was added dropwise at the same time so that the pH did not exceed 5. After the addition, the suspension was stirred for 10 minutes to deposit a coating on the surface of the mica powder, and the pH at the end of stirring was 1.4. Subsequently, the suspension was filtered, washed, dried and then calcined at 600° C. for 2 hours to obtain the conductive material of the present invention consisting of mica powder with a 5bo2-containing SnO2 coating. 100kg of the powder
A green compact was obtained by pressing at a pressure of /ci, and its specific resistance was determined. The results are shown in Table 1. When the deposited film was examined by X-ray diffraction, a broad diffraction peak of 5n02 was observed, but no diffraction peak of 5bo2 was observed. Therefore, it is considered that SbO□ is dissolved in SnO2.
実施例−２
雲母粉末４０ｇを水４００ｍＱに分散した。塩化第一５
ｎ（ＳｎＣ１□・２Ｈ２０） １３ｇと三塩化Ｓｂ５．
２ｇをＨＣＩ ＩＩＪに溶解した。これを雲母分散液に
滴下し、続けてＫＯＨ１７，６ｇを水５０ｍＵに溶解し
た液を雲母分散液に滴下した。両液滴下後のＰＨは５．
０であった。滴下後１０分間懸濁液を攪拌した後に３５
％Ｈ２０□液７ｇを添加し８０℃に昇温後、１時間攪拌
を続は反応を終了した。この時のｐＨは２．６であった
。その後、実施例１と同様の処理工程を経て本発明に係
る導電性物質を得た。該導電性物質からなる圧粉体の比
抵抗を表１に示す。Example-2 40 g of mica powder was dispersed in 400 mQ of water. Daiichichloride 5
n(SnC1□・2H20) 13g and Sb trichloride5.
2g was dissolved in HCI IIJ. This was added dropwise to the mica dispersion, and then a solution prepared by dissolving 17.6 g of KOH in 50 mU of water was added dropwise to the mica dispersion. The pH after dropping both liquids was 5.
It was 0. After stirring the suspension for 10 minutes after dropping,
After adding 7 g of %H20□ solution and raising the temperature to 80°C, stirring was continued for 1 hour, and the reaction was completed. The pH at this time was 2.6. Thereafter, the same treatment steps as in Example 1 were carried out to obtain a conductive material according to the present invention. Table 1 shows the specific resistance of the green compact made of the conductive material.
実施例−３
ＮａＯ８１３，１ｇを水３００ｍＱに溶解し５５℃に保
持した。Example-3 813.1 g of NaO was dissolved in 300 mQ of water and kept at 55°C.
この溶液に雲母粉末３０ｇを分散した。塩化第二５ｎ（
ＳｎＣ１４・ｘＨ２Ｏ）２３．３ｇ、三塩化Ｓｂ ４．
７ｇをエタノール７５ｍΩに溶解した液を滴下し反応を
行った。滴下終了後２０分間攪拌を継続し、反応を終了
した。この時のＰＨは２．８であった。この後実施例１
と同様の処理工程を経て本発明に係る導電性物質を得た
。30 g of mica powder was dispersed in this solution. 5n chloride (
SnC14.xH2O) 23.3g, Sb trichloride 4.
A solution prepared by dissolving 7 g of ethanol in 75 mΩ was added dropwise to carry out a reaction. After the dropwise addition was completed, stirring was continued for 20 minutes to complete the reaction. The pH at this time was 2.8. After this Example 1
A conductive material according to the present invention was obtained through the same treatment steps as described above.
該導電性物質からなる圧粉体の比抵抗を表１に示す。Table 1 shows the specific resistance of the green compact made of the conductive material.
実施例４．５
ＳｂＯｚ ／ ＳｎＯ□比を変えた以外は実施例１又は
２と同様の処理工程を経て本発明の導電性物質を製造し
た。該導電性物質からなる圧粉体の比抵抗を表１に示す
。Example 4.5 A conductive material of the present invention was produced through the same processing steps as in Example 1 or 2, except that the SbOz/SnO□ ratio was changed. Table 1 shows the specific resistance of the green compact made of the conductive material.
比較例ｌ
ＳｂＯ２／５ｎＯｚの比を変えた以外は実施例１と同様
の処理工程を経て導電性物質を製造した。組成比および
粉末比抵抗を表１に示す。Comparative Example 1 A conductive material was manufactured through the same processing steps as in Example 1 except that the ratio of SbO2/5nOz was changed. Table 1 shows the composition ratio and powder specific resistance.
比較例２
三菱金属製Ｓｂ含有ＳｎＯ□燻電粉、粉末比抵抗１．３
Ω・Ｃ１１ｌの粉末１１２．５ｇと雲母粉末２００を水
１Ｑ中に分散して１０分間時間攪拌した。続いて該’Ｉ
ＦＥ液を濾過、乾燥した。該粉末を１００ｋｇ／ａ＆の
圧力でプレスし圧粉体とし、その比抵抗を求めた。組成
比および粉末比抵抗を表１に示す。Comparative Example 2 Mitsubishi Metals Sb-containing SnO□ smoked electric powder, powder specific resistance 1.3
112.5 g of 11 l of Ω·C powder and 200 g of mica powder were dispersed in 1 Q of water and stirred for 10 minutes. Then the 'I'
The FE solution was filtered and dried. The powder was pressed at a pressure of 100 kg/a to form a green compact, and its specific resistance was determined. Table 1 shows the composition ratio and powder specific resistance.
比較例３
比較例２と同じ導電粉１１．２ｇと雲母粉末１０ｇを乳
鉢混合径小型サンプルミルで１分間づつ２回処理した。Comparative Example 3 11.2 g of the same conductive powder and 10 g of mica powder as in Comparative Example 2 were processed twice for 1 minute each in a mortar mixing diameter small sample mill.
該粉末を１００ｋｇ／ｃｌの圧力でプレスし圧粉体とし
、その比抵抗を求めた。組成比および粉末比抵抗を表１
に示す。The powder was pressed at a pressure of 100 kg/cl to form a green compact, and its specific resistance was determined. Table 1 shows the composition ratio and powder specific resistance.
Shown below.
ＯＳｂｏ□量比は５ｎ０２１００重量部に対するＳｂＯ
□の重量部数（Ｓｂ０２／５ｎＯｚ ）○被覆量比は雲
母１００重量部に対するＳｂ／ＳｎＯ□の重量部数実施
例６、比較例４
アクリル樹脂７ｇを溶剤２１ｇに溶解した。これに実施
例１で得た導電性粉末３ｇを加えホモミキサーで５分間
分散し、アプリケーターでポリエステルフィルムに塗工
した。乾燥膜厚は４７μｍであった。The amount ratio of OSbo□ is 5n02100 parts by weight of SbO
Parts by weight of □ (Sb02/5nOz) ○ Coverage ratio is parts by weight of Sb/SnO□ relative to 100 parts by weight of mica Example 6, Comparative Example 4 7 g of acrylic resin was dissolved in 21 g of solvent. 3 g of the conductive powder obtained in Example 1 was added to this and dispersed for 5 minutes using a homomixer, and then applied to a polyester film using an applicator. The dry film thickness was 47 μm.
表面抵抗は１．４ Ｘ １０７Ω／Δであった。The surface resistance was 1.4×107Ω/Δ.
Ｔｉｅ、にＳｂ含有ＳｎＯ□を被覆した１、９Ω・ｃｍ
の白色導電粉７ｇをアクリル樹脂７ｇを溶剤２１ｇに溶
解した塗料とをホモミキサーで５分間分散した。アプリ
ケーターでポリエステルフィルムを塗工し、乾燥膜厚７
１．４μｍを得た。この塗膜の表面抵抗は１．１×１０
’Ω／Δであった。Tie, coated with Sb-containing SnO□ 1.9Ω・cm
7 g of white conductive powder was dispersed with a paint prepared by dissolving 7 g of acrylic resin in 21 g of solvent using a homomixer for 5 minutes. Apply polyester film with applicator, dry film thickness 7
1.4 μm was obtained. The surface resistance of this coating is 1.1×10
'Ω/Δ.
以上の結果から明らかなように本発明に係る雪母担体導
＠粉を樹脂に固型分比３０％混入した場合の表面抵抗と
同程度の表面抵抗をＴｉＯ□担体Ｓｂ含有ＳｎＯ□粉末
を用いて得ようとすれば、約１．５倍量、即ち固型分比
５０％まで用いなければならない。As is clear from the above results, using the TiO□ carrier Sb-containing SnO□ powder, the surface resistance was comparable to the surface resistance when the snow matrix carrier conductive powder according to the present invention was mixed into the resin at a solid content ratio of 30%. If you want to obtain the same amount, you have to use up to about 1.5 times the amount, that is, up to 50% solid content.
図面は酸化Ｓｂ含有酸化Ｓｎ粉末、及び該酸化Ｓｎ被覆
を有する粉末について酸化Ｓｂ量と比抵抗との関係を示
すグラフである。
特許呂願人三菱金属株式会社
代理人弁理士松井政広（化１名）
剛ｉＳｎ １００ｑ＋ｒＲ＊ｂ碌ＩＬＳｂｔｒ９ｐｆｊ
−手続補正書
昭和６３年２月７２日
特許庁長官 小 川 邦 夫 殿
１、事件の表示
昭和６２年 特 許 願 第３３００３５号２、発明の
名称
導電性物質
３、補正をする者
事件との関係 特許呂原人
名称（６２６）三菱金属−式会社
４、代理人（〒１６４）
住 所 東京都中野区本町１丁目３１番４号シティーハ
イムゴスモ１００３号室
電話（０３）３７３−５５７１（代）
６、補正により増加する発明の数 なし７、補正の対
象 明細書の発明の詳細な説明の欄８、補正の内容 別
紙のとおり
×３−一
補正の内容
明細書の詳細な説明の欄の記載を次のとおり訂正する。
１、明細書の第９頁表１
」
□□□□ｌ
」
と訂正する。
２、明ａ書の第１０頁第２行目の「Δ」を「口二と訂正
する。
３、明細書の第１０頁第８行目の「△」をｒ口」と訂正
する。The drawing is a graph showing the relationship between the amount of Sb oxide and the specific resistance of a Sn oxide powder containing Sb oxide and a powder coated with Sn oxide. Patent applicant Masahiro Matsui (1 person) Patent attorney Mitsubishi Metals Corporation Tsuyoshi iSn 100q+rR*b 碌ILSbtr9pfj
- Procedural amendment February 72, 1988 Kunio Ogawa, Commissioner of the Patent Office 1, Indication of the case 1988 Patent Application No. 330035 2, Name of the invention Conductive substance 3, Person making the amendment Relationship Patent Rogen Name (626) Mitsubishi Metals - Shiki Kaisha 4, Agent (164) Address City Heim Gosmo Room 1003, 1-31-4 Honmachi, Nakano-ku, Tokyo Telephone (03) 373-5571 (Main) ) 6. Number of inventions increased by amendment None 7. Subject of amendment Column 8: Detailed explanation of the invention in the description 8. Contents of the amendment As shown in the attached document The description is corrected as follows. 1. Table 1 on page 9 of the specification is corrected as "□□□□l". 2. Correct ``Δ'' on page 10, line 2 of Book A to ``kuchi 2''. 3. Correct ``△'' on page 10, line 8 of the specification to read ``r ku''.
Claims (2)
量部に対して酸化Ｓｂ２０〜１００重量部からなる酸化
Ｓｂ含有酸化Ｓｎ被覆が施された導電性物質。(1) An electrically conductive material using mica as a carrier and having the surface of the mica coated with an Sb oxide-containing Sn oxide coating consisting of 20 to 100 parts by weight of Sb oxide based on 100 parts by weight of Sn oxide.
被覆が２０〜５０重量部である特許請求の範囲第１項記
載の導電性物質。(2) Sn oxide containing Sb oxide based on 100 parts by weight of mica
The conductive material according to claim 1, wherein the coating is 20 to 50 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33003587A JPH01175104A (en) | 1987-12-28 | 1987-12-28 | Conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33003587A JPH01175104A (en) | 1987-12-28 | 1987-12-28 | Conductive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01175104A true JPH01175104A (en) | 1989-07-11 |
Family
ID=18228043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33003587A Pending JPH01175104A (en) | 1987-12-28 | 1987-12-28 | Conductive material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01175104A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112008002324T5 (en) | 2007-08-30 | 2010-07-22 | Kyocera Corporation | Cutting tool and cutting method |
-
1987
- 1987-12-28 JP JP33003587A patent/JPH01175104A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112008002324T5 (en) | 2007-08-30 | 2010-07-22 | Kyocera Corporation | Cutting tool and cutting method |
| DE112008002324B4 (en) | 2007-08-30 | 2017-11-02 | Kyocera Corporation | Cutting tool and cutting method |
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