JPH01143292A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH01143292A JPH01143292A JP30071987A JP30071987A JPH01143292A JP H01143292 A JPH01143292 A JP H01143292A JP 30071987 A JP30071987 A JP 30071987A JP 30071987 A JP30071987 A JP 30071987A JP H01143292 A JPH01143292 A JP H01143292A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- hole
- copper
- electron beam
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 238000010894 electron beam technology Methods 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 6
- 239000010409 thin film Substances 0.000 claims abstract description 6
- 238000011049 filling Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 abstract description 8
- 239000003973 paint Substances 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical compound COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- USAYMJGCALIGIG-UHFFFAOYSA-N 2,3-dichlorocyclohexa-2,5-diene-1,4-dione Chemical compound ClC1=C(Cl)C(=O)C=CC1=O USAYMJGCALIGIG-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical compound CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- -1 amino alcohol esters Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- PUHAKHQMSBQAKT-UHFFFAOYSA-L copper;butanoate Chemical compound [Cu+2].CCCC([O-])=O.CCCC([O-])=O PUHAKHQMSBQAKT-UHFFFAOYSA-L 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229960001867 guaiacol Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical class OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- HEKQWIORQJRILW-UHFFFAOYSA-N tetrakis(prop-2-enyl) benzene-1,2,4,5-tetracarboxylate Chemical compound C=CCOC(=O)C1=CC(C(=O)OCC=C)=C(C(=O)OCC=C)C=C1C(=O)OCC=C HEKQWIORQJRILW-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器に使用されるプリント配線板の製造方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing printed wiring boards used in electronic equipment.
従来の技術
近年、電子機器は軽薄短少の言葉で象徴されるよう小型
軽量化、高密度実装化、省エネルギー化が増々進んでい
る。それら電子機器に使用されるプリント配線板に対す
るニーズも多様化し、多くの製造方法および技術が紹介
されている。その中で高密度化、軽量化、省電力化等に
適した導電ペーストで表裏導電回路を電気的に接続した
両面スルホールプリント配線板が大量に使用されている
。BACKGROUND OF THE INVENTION In recent years, electronic devices have become increasingly smaller and lighter, more densely packaged, and more energy efficient, as symbolized by the words "light, thin, short, and small." Needs for printed wiring boards used in these electronic devices are diversifying, and many manufacturing methods and techniques have been introduced. Among these, double-sided through-hole printed wiring boards, in which front and back conductive circuits are electrically connected using conductive paste, are being used in large quantities because they are suitable for higher density, lighter weight, and lower power consumption.
以下、上述したような導電ペーストによる両面スルホー
ルプリント配線板の製造方法について説明する。Hereinafter, a method for manufacturing a double-sided through-hole printed wiring board using the conductive paste as described above will be described.
第２図ａ〜ｆならびに第３図に示すように紙−フェノー
ル樹脂をベースとした両面鋼張積層板を・アークサイズ
に切断した後、所定の位置に銅はくパターン１１を周知
のエツチング技術で積層板１２の両面に形成し、上記表
裏の銅はくパターン１１および積層板１２を貫通するよ
うに貫通穴１３を設ける。次に貫通穴１３の周辺の表裏
の銅はくパターン１１上および貫通穴１３内にスクリー
ン印刷またはピンで熱硬化タイプの導電ペースト１４を
塗布する。次いで、北記導亀ペースト４中の溶剤を敗り
除くため１００″Ｃ以下の低温乾燥または自然放置乾燥
等、少なくとも数十分間を行う。次に１６０〜１７０”
Ｃの高品乾燥機で数十分間加熱し、導電ペースト１４を
硬化させることにより、導電ペースト１４による両面ス
ルホールプリント配線板が得られていた。As shown in FIGS. 2a-f and 3, a paper-phenolic resin-based double-sided steel clad laminate is cut to arc size, and then a copper foil pattern 11 is formed at a predetermined position using a well-known etching technique. are formed on both sides of the laminate 12, and through holes 13 are provided so as to pass through the copper foil pattern 11 on the front and back sides and the laminate 12. Next, a thermosetting conductive paste 14 is applied on the front and back copper foil patterns 11 around the through hole 13 and inside the through hole 13 by screen printing or pins. Next, in order to remove the solvent in the Beki Douki Paste 4, drying at a low temperature of 100"C or less or leaving it to dry naturally for at least several minutes is performed. Next, the paste is dried at a temperature of 160 to 170" C.
A double-sided through-hole printed wiring board made of the conductive paste 14 was obtained by heating the conductive paste 14 for several tens of minutes in a high-quality dryer (C) to harden the conductive paste 14.
発明が解決しようとする問題点
しかしながら、上記のように、従来の導電ペースト１４
は熱硬化樹脂をベースとし溶剤で粘度調整スる銀ペース
ト、銅ペースト、カーボンペースト等が使用されており
、導電ペースト１４の塗布後急激に高温で硬化させると
導電ペースト１４中の溶剤が気化し、第３図に示すよう
に導電ペースト１４中に気泡１５が発生し、硬化後導電
ペースト１４中に気泡１５が残った状態となり、表裏の
銅はくパターン１１の眠気的接続の信頼性が著しく低下
するため、前述のように１００’Ｃ以下の低温乾燥また
は自然放置による乾燥工程を必要としていた。しかしな
がら、完全に気泡を除去した状態にすることは困難であ
った。まだ、この乾燥工程は導電ペースト１４が液状で
あるため積層板１２を重ねることができず、積層板１２
を間隔を置き大量に乾燥させるか、導電ペースト１４と
接触しないような治具により順次乾燥させる必要があり
、前者の場合、積層板１２を１枚１枚重ね合せないよう
に取り扱うための工数が大きく、後者の場合、順次乾燥
させるためのコンベアーとしては非常に長いものが必要
となり製造スペースが非常に大きくなる。Problems to be Solved by the Invention However, as mentioned above, the conventional conductive paste 14
Silver paste, copper paste, carbon paste, etc., which are based on thermosetting resin and whose viscosity is adjusted with a solvent, are used.If the conductive paste 14 is rapidly hardened at high temperature after being applied, the solvent in the conductive paste 14 will vaporize. As shown in FIG. 3, air bubbles 15 are generated in the conductive paste 14, and after curing, the air bubbles 15 remain in the conductive paste 14, significantly reducing the reliability of the drowsy connection between the front and back copper foil patterns 11. Therefore, as mentioned above, a drying process by low-temperature drying at 100'C or less or by leaving to stand naturally was required. However, it was difficult to completely remove air bubbles. However, in this drying process, since the conductive paste 14 is liquid, the laminates 12 cannot be stacked on top of each other, and the laminates 12 cannot be stacked together.
It is necessary to dry a large amount of the conductive paste 12 at intervals, or to dry it sequentially using a jig that does not come into contact with the conductive paste 14. In the former case, it takes a lot of man-hours to handle the laminates 12 one by one so that they do not overlap. In the latter case, a very long conveyor is required for sequential drying, and the manufacturing space becomes very large.
さらに、完全硬化させるために１６０〜１７０°Ｃの高
温で数十分硬化させるための工数が大きく、しかも積層
板１２の熱劣化をもたらし積層板１２がもろくなるとい
う欠点を有していた７、さらに、導電ペースト１４と銅
はくパターン１１と電気的に確実に接続するだめには貫
通穴１３に４屯ペースト１４を塗布するとともに、銅は
くパターン１１上にも４電ペースト１４を塗布形成する
必要であった。そのためには貫通穴１３周辺の銅はくパ
ターン１１、いわゆるランド１６は通常２．５〜３．０
′Ｉｍ以上の寸法を敗る必要があった。最近のように高
密度化が増々進む中でこのランド径が大きいことが、導
電ペースト１４を利用したプリント配線板の高密度化の
ための壁になっていた。Furthermore, it requires a large number of man-hours to cure at a high temperature of 160 to 170 degrees Celsius for complete curing, and also has the drawback that it causes thermal deterioration of the laminate 12 and makes the laminate 12 brittle7. Furthermore, in order to ensure electrical connection between the conductive paste 14 and the copper foil pattern 11, the 4-ton paste 14 is applied to the through hole 13, and the 4-conductor paste 14 is also applied on the copper foil pattern 11. It was necessary to do so. For this purpose, the copper foil pattern 11 around the through hole 13, the so-called land 16, usually has a diameter of 2.5 to 3.
'Im or more dimensions were required. With the recent trend toward higher densification, the large land diameter has become a barrier to higher densification of printed wiring boards using conductive paste 14.
また、銀ペーストを利用したプリント配線板の場合には
、銀のマイグレーションが発生し易いから、貫通穴１３
上及びランド１６上の銀ペーストをマイグレーション防
止のために、例えばエポキシ樹脂を主成分とする保護被
１模１８を形成する必要があった。そのため、製造工程
が多くなり、コストアンプとなっていた。In addition, in the case of a printed wiring board using silver paste, silver migration is likely to occur, so the through holes 13
In order to prevent migration of the silver paste on the top and lands 16, it was necessary to form a protective covering 18 mainly composed of, for example, epoxy resin. As a result, the number of manufacturing steps increases, resulting in increased costs.
問題点を解決するだめの手段
上記のような問題点を解決するために本発明のプリント
配線板の製造方法は、両面に銅はくを有する絶縁基板に
貫通穴を設ける工程と、その貫通穴に導電ペーストを充
填する工程と、その導電ペーストを電子線照明で硬化さ
せる工程と、貫通穴の導電ペースト表面にめっきにより
銅薄膜を形成する工程と、絶縁基板上の銅はくの配線パ
ターンを形成する工程からなる。Means for Solving the Problems In order to solve the above-mentioned problems, the printed wiring board manufacturing method of the present invention includes the steps of providing through holes in an insulating substrate having copper foil on both sides, and A process of filling the conductive paste into the conductive paste, a process of curing the conductive paste with electron beam illumination, a process of forming a copper thin film by plating on the surface of the conductive paste in the through hole, and a process of forming the wiring pattern of the copper foil on the insulating substrate. It consists of a process of forming.
作用
本発明によるプリント配線板の製造方法では、電子線照
射により導電ペーストの硬化を行うために非常に短時間
に硬化が完了し、従来例のように予備乾燥のための工数
が不要となり、生産性が高く、しかも気泡のない導電ペ
ーストの硬化および積層板の熱劣化のない信頼性の高い
プリント配線板が得られる。Function: In the printed wiring board manufacturing method according to the present invention, since the conductive paste is cured by electron beam irradiation, curing is completed in a very short time, eliminating the need for pre-drying steps as in conventional methods, and reducing production costs. It is possible to obtain a highly reliable printed wiring board that has high properties and is free from bubbles and has no curing of the conductive paste and no thermal deterioration of the laminate.
さらに、本発明によれば、導電ペーストは貫通穴のみに
塗布し、その上にはめっき銅で絶縁基板上の銅はくと接
続するため、絶縁基板表面の平滑性が得られ、従来の量
産性に向いたスクリーン印刷・エツチング法あるいは高
密度パターン形成に適した、ホトレジスト・エツチング
法のいずれも使用することができる。Furthermore, according to the present invention, the conductive paste is applied only to the through holes, and plated copper is applied on top of the conductive paste to connect it to the copper foil on the insulating substrate. Either a screen printing/etching method suitable for high density patterning or a photoresist etching method suitable for high density pattern formation can be used.
また、貫通穴に銀ペーストを塗布した場合には上記のめ
っき銅が銀マイグレーションを防止する保護被１漢とな
るため、従来例の保護被膜形成工程は不要となる。Furthermore, when silver paste is applied to the through holes, the plated copper serves as a protective layer that prevents silver migration, so the conventional protective layer forming step is not necessary.
実施例 以下、本発明の実施例について説明する。Example Examples of the present invention will be described below.
本発明の特徴とするところは、貫通穴に電子線照射によ
り硬化する導電ペーストを充填する点にある１、
ここで、電子線照射により硬化可能な導電性ペーストと
しては分子の末端または側鎖にアクリル基、メタクリル
基などの官能基を含む重合性オリゴマーおよびモノマー
に銀、鋼、カーボン等の粉末を含有させたものが使用で
きる。The feature of the present invention is that the through hole is filled with a conductive paste that can be cured by electron beam irradiation. Polymerizable oligomers and monomers containing functional groups such as acrylic and methacrylic groups containing powders of silver, steel, carbon, etc. can be used.
電子線照射により硬化し得るオリゴマーとしてはエポキ
シアクリレート、ウレタンアクリレート。Epoxy acrylate and urethane acrylate are examples of oligomers that can be cured by electron beam irradiation.
ポリエステルアクリレート、ポリエーテルアクリレート
、スピロアセタールアクリレート等が使用できる。Polyester acrylate, polyether acrylate, spiroacetal acrylate, etc. can be used.
マタ七ツマ−としては、スチレン、ジビニルベンゼン、
ビニルトルエン、ビニルピリジン、ビニルナフタレン、
アクリル酸エチル、メタクリル酸メチル等のアクリル酸
エステルまたはメタクリル酸エステル類、酢酸ビニル、
プロピオン酸ビニル。Styrene, divinylbenzene,
vinyl toluene, vinyl pyridine, vinyl naphthalene,
Acrylic esters or methacrylic esters such as ethyl acrylate and methyl methacrylate, vinyl acetate,
Vinyl propionate.
ジアリルフタレート、ジアリルマレエート、Ｎ−ビニル
ピロリドン、Ｎ−ビニルイミダゾール、トリメチロール
プロパントリアクリレート、エチレングリコールジアク
リレート、トリエチレングリコールジアクリレート、ネ
オペンチルグリコールジアクリレートおよびプロピレン
グリコールジアジエチルアミノエチルアクリレート、ジ
エチルアミノエチルメタクリレート、 ｔａｒｔ−ブチ
ルアミノエチルメタクリレート等のアミノアルコールエ
ステル、テトラヒドロフルフリルアクリレート。Diallyl phthalate, diallyl maleate, N-vinylpyrrolidone, N-vinylimidazole, trimethylolpropane triacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, neopentyl glycol diacrylate and propylene glycol diadiethylaminoethyl acrylate, diethylaminoethyl methacrylate , amino alcohol esters such as tart-butylaminoethyl methacrylate, and tetrahydrofurfuryl acrylate.
テトラヒドロフルフリルメタクリレート等のテトラヒド
ロフルフリルアルコールエステル、メチルアクリレート
、メチルメタアクリレート、トリアリルイノシアスレー
ト、トリアクルシアヌレート。Tetrahydrofurfuryl alcohol esters such as tetrahydrofurfuryl methacrylate, methyl acrylate, methyl methacrylate, triallylinocyanurate, triallyl inocyanurate.
トリアリルトリメリテートおよびテトラアリルピロメリ
テート等の１種または２種以上を組合せて使用される。One or a combination of two or more of triallyl trimellitate and tetraallyl pyromellitate are used.
これら電子線照射により架橋し得るオリゴマーと重合し
得るモノマーの重量比はオリゴマー３０〜９０重量％で
モノマーが１０〜７０重量％が適当である。The appropriate weight ratio of these oligomers that can be crosslinked by electron beam irradiation to the monomers that can be polymerized is 30 to 90% by weight of oligomers and 10 to 70% by weight of monomers.
１記オリゴマーとモノマーの池に熱重合インヒビターと
して、アントラキノン、ｐ−ベンゾキノン、２．３−ジ
クロル−ｐ−ベンゾキノン、２゜６−ジクロル−ｐ−ベ
ンゾキノン等のキノン類。Quinones such as anthraquinone, p-benzoquinone, 2,3-dichloro-p-benzoquinone, and 2°6-dichloro-p-benzoquinone are used as thermal polymerization inhibitors in the oligomer and monomer ponds.
ハイドロキノン、ハイドロキノンモノメチルエーテル、
２− ｔａｒｔブチルカテコール、グアヤコール、レ
ゾルシン等のハイドロキノン類、フェノチアジン、セミ
チオルバジド、クペロン、安息香酸銅、ナフテン酸銅、
酪酸銅等を１種または２種以上組み合わせて使用される
。hydroquinone, hydroquinone monomethyl ether,
2-tart butylcatechol, guaiacol, hydroquinones such as resorcinol, phenothiazine, semithiorbazide, cuperone, copper benzoate, copper naphthenate,
Copper butyrate etc. are used singly or in combination of two or more.
さらに、電子線硬化樹脂の粘度、チクソトロフィ性の調
整、接着性１機械的強度の確保のためにエアロシール、
シリカ、炭酸カルシウム、炭酸マグネンウム、炭酸バリ
ウム、クレー、タルク、マイカ、硫酸バリウム、イミダ
ゾール、チアゾール。Furthermore, in order to adjust the viscosity and thixotrophic properties of the electron beam cured resin, and to ensure adhesiveness and mechanical strength, we used Aeroseal,
Silica, calcium carbonate, magnenium carbonate, barium carbonate, clay, talc, mica, barium sulfate, imidazole, thiazole.
ベンズイミダゾール、ベンズチアゾール、ベンズトリア
ゾール、ポリ酢酸ビニルポリメタクリル酸エステル等を
必要に応じて添加してもよい。Benzimidazole, benzthiazole, benztriazole, polyvinyl acetate polymethacrylate, etc. may be added as necessary.
さらに、導電性ペーストとするために、粒度１０μｍ以
下の銅粉、銀粉、カーボン粉等を３０〜８０重量係含有
するように上記電子線硬化型樹脂に混合させることによ
り、電子線硬化型導電性ペーストが得られる。Furthermore, in order to make a conductive paste, by mixing copper powder, silver powder, carbon powder, etc. with a particle size of 10 μm or less with the electron beam curable resin to a content of 30 to 80% by weight, electron beam curable conductive paste can be obtained. A paste is obtained.
ここで、前述のようにして得られた導電性ペーストに適
当な線量の電子線を照射してやれば、電子線は銅粉、銀
粉、カーボン粉等すら透過し、樹脂そのものを硬化させ
ることができる。Here, if the conductive paste obtained as described above is irradiated with an appropriate dose of electron beam, the electron beam can penetrate even copper powder, silver powder, carbon powder, etc., and can harden the resin itself.
次に本発明の集体的な実施例について第１図ａ〜ｆを用
いて説明する。Next, an integrated embodiment of the present invention will be described using FIGS. 1a to 1f.
第１図ａに示すように、両面に３５μｍの銅はく１を有
する紙−フェノールからなる積層板２で板厚０．８１１
１のもののをワークサイズに切断し、第１図すに示すよ
うに所定の位置にドリル加工またはパンチング加工によ
り貫通穴３を設けた。As shown in FIG.
1 was cut to the work size, and as shown in FIG. 1, a through hole 3 was formed at a predetermined position by drilling or punching.
次に第１図Ｃに示すようにエポキシアクリレート（大阪
有機化学社製、［５４０）２０部、テトラヒドロフルフ
リルメタクリレート２０部、ハイドロキノン１０部、０
．６〜１０μｍの銀粉７６部からなる導電ペースト４を
貫通穴３にロールコータで塗布するとともに銅はぐ上に
付着した導電ペーストはスキージにてかき取ることによ
り、貫通穴３に４准ペースト４を充填した。Next, as shown in FIG.
．． A conductive paste 4 consisting of 76 parts of silver powder of 6 to 10 μm is applied to the through hole 3 using a roll coater, and the conductive paste adhering to the copper strip is scraped off with a squeegee, thereby filling the through hole 3 with the paste 4. did.
引き続き、電子線加速装置を使用しｙｓｏｖで加速した
２ｏメガラドの電子線を瞬時照射した結果、導電ペース
ト４を完全に硬化させることができた。銅はく１の面に
導電ペーストの残査がある場合には研摩等で除去すれば
良い。Subsequently, the conductive paste 4 was able to be completely cured as a result of instantaneous irradiation with an electron beam of 20 megarads accelerated at ysov using an electron beam accelerator. If there is any residual conductive paste on the surface of the copper foil 1, it can be removed by polishing or the like.
次に、第１図ｄに示すように貫通穴３に充填した導電ペ
ースト４の表面および銅はく１の表面に電気銅めっきを
施こし、６〜１０μｍの銅薄膜６を形成し、その表面に
第１図６に示すようにエツチングレジスト６をスクリー
ン印刷で形成し、エツチングを施こすことにより、第１
図ｒに示すように所定の配線パターンが得られた。Next, as shown in FIG. 1d, the surface of the conductive paste 4 filled in the through hole 3 and the surface of the copper foil 1 are electrolytically plated to form a thin copper film 6 of 6 to 10 μm. As shown in FIG. 1, an etching resist 6 is formed by screen printing and etching is performed to form the first
A predetermined wiring pattern was obtained as shown in Figure r.
丑記のようにして得た導電ペースト４による両面スルー
ホールプリント配線板は電子線照射により硬化を行うた
め、１秒以下の瞬時に硬化されるので硬化工程の工数が
小さく、しかも積層板２の熱劣化も少ない。Since the double-sided through-hole printed wiring board made of the conductive paste 4 obtained as described above is cured by electron beam irradiation, it is cured instantly in less than 1 second, so the number of man-hours for the curing process is small. There is also less thermal deterioration.
また、導電ペースト４は従来例のように有機溶剤を含ま
ないので第３図のような導電ペーストの凹みや、気泡が
発生しないから、導電ペースト４の端面が銅は〈１の面
とほぼ同一面となるから、工、フチングレジスト形成時
のスクリーン印刷を精度よく、しかも高速度で実施する
ことができる。In addition, since the conductive paste 4 does not contain an organic solvent unlike the conventional example, there are no dents or bubbles in the conductive paste as shown in Fig. 3, so the end surface of the conductive paste 4 is almost the same as the surface of the copper surface in <1. Since it is a surface, screen printing during machining and edge resist formation can be performed with high precision and at high speed.
従来例では導電ペーストのスルーホールピッチは少なく
とも２．６腸は必要であったため、例えば基本格子２．
５ＭＩｈピッチの導電ペーストスルーホールの場合には
そのスルーホール間にもう一本の配線を通すことは困難
であった。しかしながら、本発明によれば、導電ペース
ト４は貫通穴３のみに塗布するため、表面の配線パター
ン形成の範囲は従来例のように貫通穴とランド径に限定
を受けることにはならず、貫通穴３にのみ限定を受ける
ため、配線の可能範囲が広くなる。したがって、本発明
によれば、従来困難であった、導電ペースト間の表面に
配線を例えば２．６鵡ピフチの場合でも１本。In the conventional example, the through-hole pitch of the conductive paste was required to be at least 2.6 mm, so for example, the basic grid 2.6 mm was required.
In the case of conductive paste through holes with a pitch of 5 MIh, it was difficult to pass another wire between the through holes. However, according to the present invention, since the conductive paste 4 is applied only to the through hole 3, the range of wiring pattern formation on the surface is not limited to the diameter of the through hole and the land as in the conventional example; Since it is limited only to hole 3, the possible wiring range is widened. Therefore, according to the present invention, even in the case of 2.6 square centimeters, one wire can be placed on the surface between the conductive pastes, which was difficult in the past.
２本、３本と増やすことが可能である。It is possible to increase the number by two or three.
さらに、本発明によれば、貫通穴３に銀の導電ペースト
４を塗布してその上に銅薄膜６を形成しており、この銅
薄膜５が銀マイグレーションの防止をする保護被膜とな
るため、従来のように保護破膜を形成する工程が不要と
なる。Furthermore, according to the present invention, a silver conductive paste 4 is applied to the through hole 3 and a copper thin film 6 is formed thereon, and this copper thin film 5 serves as a protective film to prevent silver migration. The conventional step of forming a protective membrane rupture is not necessary.
なお、本発明の製造方法を説明するに当り、第１図ａ
−ｙ ｒの順番で説明したが、エツチング工程ｅ、ｆば
、貫通穴３を設ける工程すの前後に行っても良い。In addition, in explaining the manufacturing method of the present invention, FIG.
Although the explanation has been made in the order of -y r, the etching steps e and f may be performed before or after the step of providing the through hole 3.
また、導電ペースト４上へのめつきは電気鋼めっきとし
たが、無電解銅めつさを施こしても良い。Further, although the conductive paste 4 is plated with electric steel plating, electroless copper plating may be applied.
さらに、エツチングレジスト形成をスクリーン印刷で説
明したが、液状ホトレジスト、ドライフィルムを使用し
た、ホトレジストを使用しても良い。Furthermore, although the etching resist formation has been described using screen printing, a liquid photoresist, a photoresist using a dry film, or a photoresist may also be used.
発明の効果
以上のように本発明は両面の配線パターンを接続する導
電ペイントを貫通穴のみに充填し、電子線照射により硬
化させ、その上にめっきした後表面が平滑性を有するか
ら高精度のプリント配線板を高速度に製造することが可
能となり、工業と利用価値は大なるものである。Effects of the Invention As described above, in the present invention, only the through holes are filled with conductive paint that connects the wiring patterns on both sides, cured by electron beam irradiation, and plated on top of the conductive paint, so that the surface is smooth and has high precision. It has become possible to manufacture printed wiring boards at high speed, and it has great industrial and utility value.
リント配線板の製造方法を示す各工程の断面図、第３図
は従来例の欠点の一例を示す断面図である。
１・・・・・・銅はく、２・・・・・・積層板、３・・
・・・・貫通穴、４・・・・・・専心ペースト、６・・
・・・・めっき銅。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
０
第２図FIG. 3 is a cross-sectional view of each step showing a method for manufacturing a lint wiring board, and FIG. 3 is a cross-sectional view showing an example of the drawbacks of the conventional example. 1...Copper foil, 2...Laminated board, 3...
...Through hole, 4...Special paste, 6...
...Plated copper. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
0 Figure 2
Claims (1)
と、その貫通穴に導電ペーストを充填する工程と、その
導電ペーストを電子線照射で硬化させる工程と、少なく
とも貫通穴の導電ペースト表面にめっきにより銅薄膜を
形成する工程と、絶縁基板上の銅はくの配線パターンを
選択形成する工程からなるプリント配線板の製造方法。A step of providing a through hole in an insulating substrate having copper foil on both sides, a step of filling the through hole with a conductive paste, a step of curing the conductive paste with electron beam irradiation, and a step of at least applying the conductive paste to the surface of the through hole. A method for manufacturing a printed wiring board, which comprises a step of forming a copper thin film by plating and a step of selectively forming a copper foil wiring pattern on an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30071987A JPH01143292A (en) | 1987-11-27 | 1987-11-27 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30071987A JPH01143292A (en) | 1987-11-27 | 1987-11-27 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143292A true JPH01143292A (en) | 1989-06-05 |
Family
ID=17888278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30071987A Pending JPH01143292A (en) | 1987-11-27 | 1987-11-27 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143292A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243142A (en) * | 1990-08-03 | 1993-09-07 | Hitachi Aic Inc. | Printed wiring board and process for producing the same |
| US5319159A (en) * | 1992-12-15 | 1994-06-07 | Sony Corporation | Double-sided printed wiring board and method of manufacture thereof |
| US5507403A (en) * | 1994-01-21 | 1996-04-16 | Hitachi, Ltd. | Process for producing an electronic part and the electronic part produced by the process |
| EP0820217A1 (en) * | 1996-07-18 | 1998-01-21 | E.I. Du Pont De Nemours And Company | Composition and process for filling vias |
| US6376049B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| JP2016063077A (en) * | 2014-09-18 | 2016-04-25 | 大日本印刷株式会社 | Conductive material through hole substrate and method of manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130895A (en) * | 1983-12-20 | 1985-07-12 | 松下電器産業株式会社 | Method of producing printed circuit board |
| JPS62193197A (en) * | 1986-02-19 | 1987-08-25 | 株式会社東芝 | Manufacture of through-hole printed wiring board |
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1987
- 1987-11-27 JP JP30071987A patent/JPH01143292A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130895A (en) * | 1983-12-20 | 1985-07-12 | 松下電器産業株式会社 | Method of producing printed circuit board |
| JPS62193197A (en) * | 1986-02-19 | 1987-08-25 | 株式会社東芝 | Manufacture of through-hole printed wiring board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243142A (en) * | 1990-08-03 | 1993-09-07 | Hitachi Aic Inc. | Printed wiring board and process for producing the same |
| US5319159A (en) * | 1992-12-15 | 1994-06-07 | Sony Corporation | Double-sided printed wiring board and method of manufacture thereof |
| US5507403A (en) * | 1994-01-21 | 1996-04-16 | Hitachi, Ltd. | Process for producing an electronic part and the electronic part produced by the process |
| EP0820217A1 (en) * | 1996-07-18 | 1998-01-21 | E.I. Du Pont De Nemours And Company | Composition and process for filling vias |
| US6376049B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| US6376052B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its production process, resin composition for filling through-hole |
| EP2015624A2 (en) | 1997-10-14 | 2009-01-14 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| USRE40947E1 (en) | 1997-10-14 | 2009-10-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| JP2016063077A (en) * | 2014-09-18 | 2016-04-25 | 大日本印刷株式会社 | Conductive material through hole substrate and method of manufacturing the same |
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