JPH01162256U - - Google Patents
Info
- Publication number
- JPH01162256U JPH01162256U JP5519488U JP5519488U JPH01162256U JP H01162256 U JPH01162256 U JP H01162256U JP 5519488 U JP5519488 U JP 5519488U JP 5519488 U JP5519488 U JP 5519488U JP H01162256 U JPH01162256 U JP H01162256U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- groove
- soldering
- conductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図、第３図はそれぞれ第１図の実施例の端子の形
状を示す斜視図、断面図である。
１……本体部、２……端子、２１……溝。なお
図中同一符号は同一部分を示す。
Figure 1 is a front view showing one embodiment of the present invention;
3 are a perspective view and a sectional view showing the shape of the terminal of the embodiment shown in FIG. 1, respectively. 1... Main body, 2... Terminal, 21... Groove. Note that the same reference numerals in the figures indicate the same parts.
Claims (1)
導体装置において、各端子の半田が付着する面に
溝などにより段差を設けたことを特徴とする半導
体装置。 1. A semiconductor device in which a terminal is attached to a conductor of a connecting portion by soldering, characterized in that a step is provided by a groove or the like on the surface of each terminal to which the solder adheres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5519488U JPH01162256U (en) | 1988-04-26 | 1988-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5519488U JPH01162256U (en) | 1988-04-26 | 1988-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162256U true JPH01162256U (en) | 1989-11-10 |
Family
ID=31281091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5519488U Pending JPH01162256U (en) | 1988-04-26 | 1988-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162256U (en) |
-
1988
- 1988-04-26 JP JP5519488U patent/JPH01162256U/ja active Pending