JPH01104733U - - Google Patents
Info
- Publication number
- JPH01104733U JPH01104733U JP41288U JP41288U JPH01104733U JP H01104733 U JPH01104733 U JP H01104733U JP 41288 U JP41288 U JP 41288U JP 41288 U JP41288 U JP 41288U JP H01104733 U JPH01104733 U JP H01104733U
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- integrated circuit
- expose
- heat dissipation
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。 １……基板、２……基板に形成される素子、３
……フイールド酸化膜、４……ゲートポリシリ、
５……ポリシリ配線、６，７，８，９……Ａｌ配
線、１０……基板コンタクト、１１……保護被膜
。
図は従来例を示す断面図である。 １……基板、２……基板に形成される素子、３
……フイールド酸化膜、４……ゲートポリシリ、
５……ポリシリ配線、６，７，８，９……Ａｌ配
線、１０……基板コンタクト、１１……保護被膜
。
Claims (1)
- 保護被膜に覆われた集積回路に於いて、前記保
護被膜に穴を開けて配線金属の表面を露出させ、
放熱させることを特徴とする集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41288U JPH01104733U (ja) | 1988-01-05 | 1988-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41288U JPH01104733U (ja) | 1988-01-05 | 1988-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104733U true JPH01104733U (ja) | 1989-07-14 |
Family
ID=31199415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP41288U Pending JPH01104733U (ja) | 1988-01-05 | 1988-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104733U (ja) |
-
1988
- 1988-01-05 JP JP41288U patent/JPH01104733U/ja active Pending