JP7507974B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- JP7507974B2 JP7507974B2 JP2023528829A JP2023528829A JP7507974B2 JP 7507974 B2 JP7507974 B2 JP 7507974B2 JP 2023528829 A JP2023528829 A JP 2023528829A JP 2023528829 A JP2023528829 A JP 2023528829A JP 7507974 B2 JP7507974 B2 JP 7507974B2
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- 238000005192 partition Methods 0.000 claims description 242
- 238000006243 chemical reaction Methods 0.000 claims description 58
- 239000003990 capacitor Substances 0.000 claims description 45
- 238000001816 cooling Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 description 29
- 239000002184 metal Substances 0.000 description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 26
- 239000012634 fragment Substances 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000003507 refrigerant Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 5
- 230000003466 anti-cipated effect Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/493—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode the static converters being arranged for operation in parallel
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
電子機器の一例として、鉄道車両に搭載されて、直流電源から供給される直流電力を三相交流電力に変換して電動機に供給する直流-三相変換装置がある。2つの電力変換部を有し、一方の電力変換部が稼動系に設定され、他方の電力変換部が待機系に設定される待機二重系の直流-三相変換装置を例にして、実施の形態1に係る電子機器1について説明する。
接触器MC1は、例えば、直流電磁接触器を有し、第1電力変換部11およびコンデンサユニットCU1を、電源に電気的に接続し、または、電源から電気的に切り離す。
接触器MC2は、例えば、直流電磁接触器を有し、第2電力変換部21およびコンデンサユニットCU2を、電源に電気的に接続し、または、電源から電気的に切り離す。
隔壁部30の形状は、上述の例に限られず、電子部品が飛散して他の電子部品に接触することを抑制することができる形状であれば任意である。一例として、形状の異なる2つの第2隔壁部材を備える電子機器2について実施の形態2で説明する。図8、図8におけるIX-IX線での矢視断面図である図9、および、図9におけるX-X線での矢視断面図である図10に示す電子機器2は、隔壁部31を備える点で実施の形態1に係る電子機器1と異なる。電子機器1との相違点を中心に、電子機器2の構成について以下に説明する。
隔壁部30,31の形状は、上述の例に限られず、第1隔壁部材および第2隔壁部材は一体に形成されてもよい。第1隔壁部材と第2隔壁部材が一体に形成された隔壁部32を備える電子機器3について実施の形態3で説明する。図11、図11におけるXII-XII線での矢視断面図である図12、図11におけるXIII-XIII線での矢視断面図である図13、および図14に示す電子機器3は、隔壁部32を備える点で実施の形態1に係る電子機器1と異なる。電子機器1との相違点を中心に、電子機器3の構成について以下に説明する。
Claims (14)
- 複数の電子部品を収容する筐体と、
前記筐体に着脱可能に取り付けられ、前記複数の電子部品の内、少なくとも2つの前記電子部品が取り付けられるベースと、
前記ベースに取り付けられる前記少なくとも2つの電子部品の一部と前記ベースに取り付けられる前記少なくとも2つの電子部品の他の一部とを隔てる隔壁部と、を備え、
前記隔壁部は、一方の主面が前記少なくとも2つの電子部品の一部に向き、他方の主面が前記少なくとも2つの電子部品の他の一部に向く第1隔壁部材と、前記第1隔壁部材に隣接した位置で前記第1隔壁部材の側面と前記筐体の間の隙間の少なくとも一部を塞ぐ第2隔壁部材と、を有し、
前記第2隔壁部材の少なくともいずれかは、主面が前記第1隔壁部材の主面に平行になる向きで設けられる板状部材である、
電子機器。 - 前記ベースに取り付けられる前記少なくとも2つの電子部品から伝達された熱を放熱する冷却部をさらに備え、
前記筐体に開口が形成され、
前記ベースは、前記少なくとも2つの電子部品が第1主面に取り付けられて、前記第1主面と反対に位置する第2主面に前記冷却部が取り付けられて、前記第1主面が前記筐体の前記開口を塞いだ状態で前記筐体に取り付けられる伝熱性の板状部材である、
請求項1に記載の電子機器。 - 前記第1隔壁部材は、前記ベースに取り付けられる、
請求項1または2に記載の電子機器。 - 前記隔壁部は、
前記ベースから離隔する方向に延伸する板状部材である前記第1隔壁部材と、
前記第1隔壁部材を前記第1隔壁部材の主面に沿う方向に挟んで位置する板状部材である2つの前記第2隔壁部材と、を有する
請求項3に記載の電子機器。 - 前記第1隔壁部材の主面は、前記2つの第2隔壁部材のそれぞれの主面に面する、
請求項4に記載の電子機器。 - 前記第1隔壁部材の主面は、前記2つの第2隔壁部材のそれぞれの主面に当接する、
請求項4に記載の電子機器。 - 前記第1隔壁部材は、前記2つの第2隔壁部材に嵌合する、
請求項4に記載の電子機器。 - 前記2つの第2隔壁部材は、前記第1隔壁部材を鉛直方向に挟んで位置し、
前記鉛直方向の上部に位置する前記第2隔壁部材は、前記複数の電子部品の内、前記ベースに取り付けられる前記少なくとも2つの電子部品と、前記複数の電子部品の内、他の前記電子部品とを隔てる、
請求項4に記載の電子機器。 - 前記鉛直方向の上部に位置する前記第2隔壁部材の主面は、開口が形成される前記筐体の一面に面する、
請求項8に記載の電子機器。 - 前記鉛直方向の下部に位置する前記第2隔壁部材の主面は、前記第1隔壁部材の主面に面する、
請求項8または9に記載の電子機器。 - 前記第1隔壁部材および前記第2隔壁部材は一体に形成されている、
請求項1または2に記載の電子機器。 - 複数の電子部品を収容する筐体と、
前記筐体に着脱可能に取り付けられ、前記複数の電子部品の内、少なくとも2つの前記電子部品が取り付けられるベースと、
前記ベースに取り付けられる前記少なくとも2つの電子部品の一部と前記ベースに取り付けられる前記少なくとも2つの電子部品の他の一部とを隔てる隔壁部と、を備え、
前記隔壁部は、前記少なくとも2つの電子部品の一部と前記少なくとも2つの電子部品の他の一部とを隔てる位置に設けられる第1隔壁部材と、前記第1隔壁部材に隣接した位置で前記第1隔壁部材と前記筐体の間の隙間の少なくとも一部を塞ぐ第2隔壁部材と、を有し、
前記第1隔壁部材および前記第2隔壁部材は一体に形成されている、
電子機器。 - 互いに並列に接続されていて、電子部品を有する複数の電子回路を備え、
前記電子回路のそれぞれの前記電子部品は前記ベースに取り付けられ、
前記隔壁部は、前記複数の電子回路の一部が有する前記電子部品と前記複数の電子部品の他の一部が有する前記電子部品とを隔てる、
請求項1から12のいずれか1項に記載の電子機器。 - 前記複数の電子回路は、コンデンサユニットおよび複数のスイッチング素子を有して電力変換を行う第1電力変換部と、前記第1電力変換部に並列に接続されて、コンデンサユニットおよび複数のスイッチング素子を有して電力変換を行う第2電力変換部と、を含み、
前記第1電力変換部が有する前記複数のスイッチング素子および前記第2電力変換部が有する前記複数のスイッチング素子は前記ベースに直接的に取り付けられ、
前記第1電力変換部が有する前記コンデンサユニットは前記ベースとの間に前記複数のスイッチング素子を挟んだ状態で第1取付部材によって前記ベースに取り付けられ、
前記第2電力変換部が有する前記コンデンサユニットは前記ベースとの間に前記複数のスイッチング素子を挟んだ状態で第2取付部材によって前記ベースに取り付けられ、
前記第1隔壁部材の一方の主面は、前記第1電力変換部が有する前記複数のスイッチング素子に面し、前記第1隔壁部材の他方の主面は、前記第2電力変換部が有する前記複数のスイッチング素子に面する、
請求項13に記載の電子機器。
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PCT/JP2021/022789 WO2022264297A1 (ja) | 2021-06-16 | 2021-06-16 | 電子機器 |
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JPWO2022264297A1 JPWO2022264297A1 (ja) | 2022-12-22 |
JPWO2022264297A5 JPWO2022264297A5 (ja) | 2023-08-09 |
JP7507974B2 true JP7507974B2 (ja) | 2024-06-28 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000150776A (ja) | 1998-11-17 | 2000-05-30 | Toshiba Corp | 半導体モジュール |
JP2006121847A (ja) | 2004-10-22 | 2006-05-11 | Toshiba Corp | 半導体冷却装置 |
JP2010182840A (ja) | 2009-02-05 | 2010-08-19 | Toyo Electric Mfg Co Ltd | 鉄道車両用半導体冷却装置 |
JP2011218462A (ja) | 2010-04-06 | 2011-11-04 | Seiko Epson Corp | Mems装置 |
JP2013163503A (ja) | 2012-02-13 | 2013-08-22 | Toshiba Corp | 車両用駆動制御装置 |
WO2021009856A1 (ja) | 2019-07-16 | 2021-01-21 | 株式会社 東芝 | 半導体装置 |
-
2021
- 2021-06-16 JP JP2023528829A patent/JP7507974B2/ja active Active
- 2021-06-16 WO PCT/JP2021/022789 patent/WO2022264297A1/ja active Application Filing
- 2021-06-16 DE DE112021007823.2T patent/DE112021007823T5/de active Pending
- 2021-06-16 US US18/556,712 patent/US20240244765A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000150776A (ja) | 1998-11-17 | 2000-05-30 | Toshiba Corp | 半導体モジュール |
JP2006121847A (ja) | 2004-10-22 | 2006-05-11 | Toshiba Corp | 半導体冷却装置 |
JP2010182840A (ja) | 2009-02-05 | 2010-08-19 | Toyo Electric Mfg Co Ltd | 鉄道車両用半導体冷却装置 |
JP2011218462A (ja) | 2010-04-06 | 2011-11-04 | Seiko Epson Corp | Mems装置 |
JP2013163503A (ja) | 2012-02-13 | 2013-08-22 | Toshiba Corp | 車両用駆動制御装置 |
WO2021009856A1 (ja) | 2019-07-16 | 2021-01-21 | 株式会社 東芝 | 半導体装置 |
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WO2022264297A1 (ja) | 2022-12-22 |
JPWO2022264297A1 (ja) | 2022-12-22 |
DE112021007823T5 (de) | 2024-03-28 |
US20240244765A1 (en) | 2024-07-18 |
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