JP7507599B2 - レーザー加工方法 - Google Patents
レーザー加工方法 Download PDFInfo
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- JP7507599B2 JP7507599B2 JP2020084041A JP2020084041A JP7507599B2 JP 7507599 B2 JP7507599 B2 JP 7507599B2 JP 2020084041 A JP2020084041 A JP 2020084041A JP 2020084041 A JP2020084041 A JP 2020084041A JP 7507599 B2 JP7507599 B2 JP 7507599B2
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- 238000003672 processing method Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000003685 thermal hair damage Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
本発明の実施形態に係る被加工物100の加工方法について、図面に基づいて説明する。まず、実施形態の加工対象の被加工物100の構成について説明する。図1は、実施形態に係るレーザー加工方法の加工対象の被加工物100を示す斜視図である。以下の説明において、X軸方向は、水平面における一方向である。Y軸方向は、水平面において、X軸方向に直交する方向である。
分岐数:2~32
分岐間隔:10~400μm
スポット径:3~10μm
波長:355nm
周波数:100kHz
パワー:7.5kW
パス数:30pass
加工送り速度:10~2000mm/s
10 チャックテーブル
14 加工送りユニット
20 レーザービーム照射ユニット
21 レーザービーム
22 レーザー発振器
23 ミラー
24 分岐ユニット
25 集光レンズ
30、31、32、33、34、35 集光スポット
36 分岐間隔
37 ショット間隔
38 ビーム径
39 重なり幅
100 被加工物
Claims (2)
- 被加工物に対して吸収性を有する波長のレーザービームを発振するレーザー発振器と、
該レーザービームを集光する集光ユニットと、
該レーザー発振器と該集光ユニットとの間に配設され、該レーザービームを少なくとも2以上に分岐する分岐ユニットと、
を含むレーザービーム照射ユニットと、
該被加工物を保持するチャックテーブルと、
該チャックテーブルと該レーザービームとを加工送り方向に相対的に移動させる加工送りユニットと、
を備えたレーザー加工装置を用いて、被加工物を加工する被加工物のレーザー加工方法であって、
被加工物の表面における該レーザービームの分岐間隔をLとし、分岐された該レーザービームのそれぞれの集光スポットのビーム径をDとし、該加工送りユニットの加工送り速度を加工点における該レーザービームの周波数で除算した値をSとし、nを任意の整数とした場合、L>D>S、かつ、L≠n×Sとなるように、該分岐間隔、該加工送り速度および該周波数を設定することを特徴とする、被加工物のレーザー加工方法。 - (n-1)×S<L<n×Sであって、nショット目における1分岐目の集光スポットと、1ショット目における2分岐目の集光スポットと、の加工送り方向の重なり幅をWとした場合、0≦W/D<0.8となるように、該分岐間隔、該加工送り速度および該周波数を設定することを特徴とする、請求項1に記載の被加工物のレーザー加工方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020084041A JP7507599B2 (ja) | 2020-05-12 | 2020-05-12 | レーザー加工方法 |
KR1020210048870A KR20210138486A (ko) | 2020-05-12 | 2021-04-15 | 레이저 가공 방법 |
US17/236,175 US20210354238A1 (en) | 2020-05-12 | 2021-04-21 | Laser processing method |
SG10202104230VA SG10202104230VA (en) | 2020-05-12 | 2021-04-26 | Laser processing method |
TW110115391A TW202142341A (zh) | 2020-05-12 | 2021-04-28 | 雷射加工方法 |
CN202110494157.4A CN113664364A (zh) | 2020-05-12 | 2021-05-07 | 被加工物的激光加工方法 |
DE102021204839.0A DE102021204839A1 (de) | 2020-05-12 | 2021-05-12 | Laserbearbeitungsverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020084041A JP7507599B2 (ja) | 2020-05-12 | 2020-05-12 | レーザー加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021178338A JP2021178338A (ja) | 2021-11-18 |
JP7507599B2 true JP7507599B2 (ja) | 2024-06-28 |
Family
ID=78280729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020084041A Active JP7507599B2 (ja) | 2020-05-12 | 2020-05-12 | レーザー加工方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210354238A1 (ja) |
JP (1) | JP7507599B2 (ja) |
KR (1) | KR20210138486A (ja) |
CN (1) | CN113664364A (ja) |
DE (1) | DE102021204839A1 (ja) |
SG (1) | SG10202104230VA (ja) |
TW (1) | TW202142341A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023067265A (ja) | 2021-10-29 | 2023-05-16 | 株式会社豊田中央研究所 | 地図作成装置、地図作成方法、及び地図作成プログラム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004188475A (ja) | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
JP2017208445A (ja) | 2016-05-18 | 2017-11-24 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
JP2019217527A (ja) | 2018-06-20 | 2019-12-26 | 株式会社ディスコ | レーザー加工装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2892459B2 (ja) | 1990-08-20 | 1999-05-17 | 株式会社ディスコ | 精密切削装置におけるブレードの位置調整方法 |
JP3789802B2 (ja) * | 2001-10-19 | 2006-06-28 | 富士通株式会社 | 半導体装置の製造方法 |
JP2003320466A (ja) * | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | レーザビームを使用した加工機 |
JP4471627B2 (ja) * | 2003-11-06 | 2010-06-02 | 株式会社ディスコ | ウエーハの分割方法 |
JP2005209719A (ja) * | 2004-01-20 | 2005-08-04 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工方法 |
JP2006319198A (ja) * | 2005-05-13 | 2006-11-24 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法およびレーザー加工装置 |
JP4599243B2 (ja) * | 2005-07-12 | 2010-12-15 | 株式会社ディスコ | レーザー加工装置 |
JP5410250B2 (ja) * | 2009-11-25 | 2014-02-05 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
KR20130059337A (ko) * | 2010-03-30 | 2013-06-05 | 아이엠알에이 아메리카, 인코포레이티드. | 레이저 기반 재료 가공 장치 및 방법들 |
US8969220B2 (en) * | 2012-01-13 | 2015-03-03 | Imra America, Inc. | Methods and systems for laser processing of coated substrates |
JP6935126B2 (ja) * | 2017-04-05 | 2021-09-15 | 株式会社ディスコ | ウェーハのレーザ加工方法 |
DE102017212858A1 (de) * | 2017-07-26 | 2019-01-31 | Disco Corporation | Verfahren zum Bearbeiten eines Substrats |
JP6925745B2 (ja) * | 2017-11-30 | 2021-08-25 | 株式会社ディスコ | ウェーハのレーザー加工方法 |
JP7169062B2 (ja) * | 2017-12-14 | 2022-11-10 | 株式会社キーエンス | レーザ加工装置及びレーザ発振器 |
US11069537B2 (en) * | 2019-10-18 | 2021-07-20 | Hamilton Sundstrand Corporation | Method for delidding a hermetically sealed circuit package |
-
2020
- 2020-05-12 JP JP2020084041A patent/JP7507599B2/ja active Active
-
2021
- 2021-04-15 KR KR1020210048870A patent/KR20210138486A/ko active Search and Examination
- 2021-04-21 US US17/236,175 patent/US20210354238A1/en active Pending
- 2021-04-26 SG SG10202104230VA patent/SG10202104230VA/en unknown
- 2021-04-28 TW TW110115391A patent/TW202142341A/zh unknown
- 2021-05-07 CN CN202110494157.4A patent/CN113664364A/zh active Pending
- 2021-05-12 DE DE102021204839.0A patent/DE102021204839A1/de active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004188475A (ja) | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
JP2017208445A (ja) | 2016-05-18 | 2017-11-24 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
JP2019217527A (ja) | 2018-06-20 | 2019-12-26 | 株式会社ディスコ | レーザー加工装置 |
Also Published As
Publication number | Publication date |
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TW202142341A (zh) | 2021-11-16 |
JP2021178338A (ja) | 2021-11-18 |
KR20210138486A (ko) | 2021-11-19 |
SG10202104230VA (en) | 2021-12-30 |
CN113664364A (zh) | 2021-11-19 |
DE102021204839A1 (de) | 2021-11-18 |
US20210354238A1 (en) | 2021-11-18 |
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