JP7463037B2 - 検査用基板及び検査方法 - Google Patents
検査用基板及び検査方法 Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims description 62
- 238000005520 cutting process Methods 0.000 claims description 167
- 239000003973 paint Substances 0.000 claims description 47
- 238000007689 inspection Methods 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000049 pigment Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000004088 simulation Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 31
- 238000005192 partition Methods 0.000 description 25
- 235000012431 wafers Nutrition 0.000 description 22
- 230000032258 transport Effects 0.000 description 19
- 238000003384 imaging method Methods 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 10
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000010802 sludge Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
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- 229920000515 polycarbonate Polymers 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0675—Grinders for cutting-off methods therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/40—Investigating hardness or rebound hardness
- G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
- G01N3/46—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid the indentors performing a scratching movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0076—Hardness, compressibility or resistance to crushing
- G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0262—Shape of the specimen
- G01N2203/0278—Thin specimens
- G01N2203/0282—Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
10:カセットテーブル
11:検査用基板、11a:表面、11b:裏面
12:カセットエレベータ
13:ウェーハ、13a:表面、15:塗料層
17:溝部、17a:幅、17b:深さ、17c:底
14:プッシュプルアーム、16:位置決め部材、18:第1の搬送ユニット
20:チャックテーブル、20a:保持面、20b:クランプユニット
21:被加工物、21a:表面、21b:裏面
22a:カバー部材、22b:蛇腹
23:ダイシングテープ、25:フレーム、27:フレームユニット
24:支持部材、24a:撮像ユニット
26:切削ユニット、28:スピンドルハウジング、30:スピンドル
32:切削ブレード、32a:切り刃
34:ブレードカバー、36:切削水供給ノズル、38:パイプ
44:着脱カバー、46:切削水供給ノズル、48:パイプ
50:ブレード破損検出ユニット
52:仕切板、54:筐体、56:扉部、58:扉部
60:仕切壁、60a:開口部
62:エアシリンダ、64:支持部材
66:第2の搬送ユニット
68:洗浄ユニット、70:制御部
RA:着脱領域、RB:切削領域
Claims (3)
- 被加工物を切削ブレードで切削するときに切削装置の構成要素によって該被加工物の表面に傷が形成されるか否かを検査するために使用される検査用基板であって、
該検査用基板の該表面側に設けられ、切削ブレードが通過可能な幅を有する模擬切削用の溝部と、
該検査用基板の該表面側に設けられ、該表面側に形成される傷の視認性を向上させるための塗料層と、を備えることを特徴とする検査用基板。 - 該塗料層の顔料は、炭素、酸化シリコン、又は、酸化チタンを有することを特徴とする請求項1記載の検査用基板。
- 被加工物を切削ブレードで切削するときに切削装置の構成要素によって該被加工物の表面に傷が形成されるか否かを、検査用基板を用いて検査する検査方法であって、
該検査用基板は、
該検査用基板の該表面側に設けられ、該切削ブレードが通過可能な幅を有する模擬切削用の溝部と、
該検査用基板の該表面側に設けられ、該表面側に形成される傷の視認性を向上させるための塗料層と、を備え、
該検査用基板の該表面を上にして、該検査用基板の裏面側を、該検査用基板を着脱する着脱領域に配置されたチャックテーブルで保持する保持ステップと、
該保持ステップの後、該着脱領域から該検査用基板を模擬切削する切削領域に、該チャックテーブルを移動する移動ステップと、
該溝部の底よりも高い所定の高さに該切削ブレードの下端を位置付けて、該溝部の中において該切削ブレードの一部を通過させることで、模擬切削を行う模擬切削ステップと、
該検査用基板の該表面側の画像を取得する画像取得ステップと、
を備えることを特徴とする検査方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020142767A JP7463037B2 (ja) | 2020-08-26 | 2020-08-26 | 検査用基板及び検査方法 |
KR1020210094559A KR20220027013A (ko) | 2020-08-26 | 2021-07-20 | 검사용 기판 및 검사 방법 |
US17/398,289 US20220063134A1 (en) | 2020-08-26 | 2021-08-10 | Inspection substrate |
DE102021209004.4A DE102021209004A1 (de) | 2020-08-26 | 2021-08-17 | Prüfsubstrat |
CN202110948683.3A CN114102399A (zh) | 2020-08-26 | 2021-08-18 | 检查用基板和检查方法 |
TW110131000A TW202209463A (zh) | 2020-08-26 | 2021-08-23 | 檢查用基板以及檢查方法 |
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JP2020142767A JP7463037B2 (ja) | 2020-08-26 | 2020-08-26 | 検査用基板及び検査方法 |
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JP2022038329A JP2022038329A (ja) | 2022-03-10 |
JP7463037B2 true JP7463037B2 (ja) | 2024-04-08 |
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JP2020142767A Active JP7463037B2 (ja) | 2020-08-26 | 2020-08-26 | 検査用基板及び検査方法 |
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US (1) | US20220063134A1 (ja) |
JP (1) | JP7463037B2 (ja) |
KR (1) | KR20220027013A (ja) |
CN (1) | CN114102399A (ja) |
DE (1) | DE102021209004A1 (ja) |
TW (1) | TW202209463A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017164857A (ja) | 2016-03-17 | 2017-09-21 | 株式会社ディスコ | 調節治具 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3562383A (en) * | 1968-09-09 | 1971-02-09 | Fortin Plastics Inc | Method for preventing edge defects in compression stretched acrylic sheets |
JP3257968B2 (ja) | 1997-07-22 | 2002-02-18 | 株式会社ディスコ | 切削装置のブレードカバー |
JPH11237345A (ja) * | 1998-02-24 | 1999-08-31 | Hitachi Ltd | 表面計測装置 |
US6578254B2 (en) * | 2000-12-08 | 2003-06-17 | Sandia Corporation | Damascene fabrication of nonplanar microcoils |
JP4009623B2 (ja) * | 2004-08-16 | 2007-11-21 | 埼玉日本電気株式会社 | 水濡れ検出シール、これを用いた携帯電話機および電子機器 |
KR100698363B1 (ko) * | 2005-01-05 | 2007-03-23 | 유니온스틸 주식회사 | 프린트성이 가미된 편면 엠보스 칼라강판 및 그 제조방법 |
JP5794791B2 (ja) | 2011-02-28 | 2015-10-14 | 株式会社ディスコ | 切削装置 |
US11440141B2 (en) * | 2013-09-13 | 2022-09-13 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Devices and methods for monitoring, in particular for regulating, a cutting process |
WO2015080074A1 (ja) * | 2013-11-26 | 2015-06-04 | 矢崎総業株式会社 | 旭光文字板及び当該旭光文字板を備えた自動車用メータ |
DE102014117255B3 (de) * | 2014-11-25 | 2016-05-25 | Rattunde & Co Gmbh | Vermessung von Materialabmessungen |
JP2017092125A (ja) * | 2015-11-05 | 2017-05-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP6607639B2 (ja) * | 2015-12-24 | 2019-11-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP6404957B2 (ja) * | 2017-01-20 | 2018-10-17 | ファナック株式会社 | 加工機にワークを搬送するロボットを備える加工システム |
JP6899270B2 (ja) * | 2017-07-12 | 2021-07-07 | 株式会社ディスコ | 板状ワークの分割方法 |
KR101860140B1 (ko) * | 2017-07-12 | 2018-05-23 | 코오롱글로텍주식회사 | 발포 프린팅 방법 |
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