JP7454385B2 - ウェハ搬送ユニット及びウェハ搬送方法 - Google Patents
ウェハ搬送ユニット及びウェハ搬送方法 Download PDFInfo
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- JP7454385B2 JP7454385B2 JP2020009273A JP2020009273A JP7454385B2 JP 7454385 B2 JP7454385 B2 JP 7454385B2 JP 2020009273 A JP2020009273 A JP 2020009273A JP 2020009273 A JP2020009273 A JP 2020009273A JP 7454385 B2 JP7454385 B2 JP 7454385B2
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- 230000032258 transport Effects 0.000 claims description 50
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- 235000012431 wafers Nutrition 0.000 description 399
- 230000007246 mechanism Effects 0.000 description 21
- 238000010586 diagram Methods 0.000 description 14
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- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Environmental & Geological Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Description
Claims (8)
- 半導体故障解析装置においてウェハを保持しながら搬送するウェハ搬送ユニットであって、
所定の観察位置にウェハを固定する固定部と、
前記観察位置まで前記ウェハを保持しながら搬送する搬送部と、を備え、
前記搬送部は、前記ウェハの側面と対向するように設けられた複数の保持部材を有し、前記複数の保持部材によって前記ウェハの側面から前記ウェハの周部を挟持することにより前記ウェハを保持する、ウェハ搬送ユニット。 - 前記複数の保持部材は、前記ウェハの周部に当接する少なくとも3つの突出部を含んで構成されている、請求項1記載のウェハ搬送ユニット。
- 前記複数の保持部材は、少なくとも4つの前記突出部を含んで構成されている、請求項2記載のウェハ搬送ユニット。
- 前記複数の保持部材は、前記ウェハの周部に当接する一又は複数の突出部を含む第1の保持部材と、一又は複数の前記突出部を含む第2の保持部材とを有し、
前記ウェハを挟持する前記第1の保持部材が前記ウェハに与える力の方向と、前記ウェハを挟持する前記第2の保持部材が前記ウェハに与える力の方向とは互いに反対の方向である、請求項1~3のいずれか一項記載のウェハ搬送ユニット。 - 前記第1の保持部材及び前記第2の保持部材のいずれか一方のみの位置を固定することにより、前記第1の保持部材及び前記第2の保持部材間の離間距離を変化させ、前記第1の保持部材及び前記第2の保持部材による前記ウェハの挟持状態を解除可能に構成された歯止め部を更に備える、請求項4記載のウェハ搬送ユニット。
- 前記搬送部は、
ベース部と、
弾性部材を介して前記ベース部に接続された第1部分と、前記第1部分に連続すると共に互いに対向しながら第1方向に延びる一対の第2部分と、前記一対の第2部分の先端に連続すると共にウェハを収容する収容スペースを区画するようにリング状に形成された第3部分と、を含むリング部と、
前記ベース部に連続すると共に前記一対の第2部分間において第1方向に延びるコア部と、を有し、
前記リング部の前記第3部分には、前記収容スペースに向かって突出した前記第1の保持部材が設けられており、
前記コア部の先端には、前記収容スペースに向かって突出した前記第2の保持部材が設けられており、
前記リング部の前記一対の第2部分には、前記歯止め部と係合可能に構成された孔部が形成されており、
前記歯止め部は、前記孔部と係合することにより、前記リング部の位置を固定して前記第1の保持部材の位置を固定する、請求項5記載のウェハ搬送ユニット。 - 前記搬送部は、前記ウェハを収容する平面視略円形の収容スペースを区画するようにリング状に形成された第3部分を有する、請求項1記載のウェハ搬送ユニット。
- 半導体故障解析装置においてウェハを保持しながら搬送するウェハ搬送方法であって、
前記ウェハの側面と対向するように設けられた複数の保持部材によって前記ウェハの周部を挟持する工程と、
前記複数の保持部材によって前記ウェハの周部を挟持した状態で、前記ウェハを所定の観察位置まで搬送する工程と、を含むウェハ搬送方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020009273A JP7454385B2 (ja) | 2020-01-23 | 2020-01-23 | ウェハ搬送ユニット及びウェハ搬送方法 |
PCT/JP2020/041755 WO2021149330A1 (ja) | 2020-01-23 | 2020-11-09 | ウェハ搬送ユニット及びウェハ搬送方法 |
US17/772,596 US20220406644A1 (en) | 2020-01-23 | 2020-11-09 | Wafer conveyance unit and wafer conveyance method |
CN202080094175.7A CN115023799A (zh) | 2020-01-23 | 2020-11-09 | 晶圆搬送单元及晶圆搬送方法 |
KR1020227012221A KR20220131890A (ko) | 2020-01-23 | 2020-11-09 | 웨이퍼 반송 유닛 및 웨이퍼 반송 방법 |
EP20914993.9A EP4044215A4 (en) | 2020-01-23 | 2020-11-09 | WAFER TRANSPORT UNIT AND WAFER TRANSPORT METHOD |
TW109141698A TWI849263B (zh) | 2020-01-23 | 2020-11-27 | 晶圓搬送單元及晶圓搬送方法 |
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JP2020009273A JP7454385B2 (ja) | 2020-01-23 | 2020-01-23 | ウェハ搬送ユニット及びウェハ搬送方法 |
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JP2021118224A JP2021118224A (ja) | 2021-08-10 |
JP7454385B2 true JP7454385B2 (ja) | 2024-03-22 |
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JP2020009273A Active JP7454385B2 (ja) | 2020-01-23 | 2020-01-23 | ウェハ搬送ユニット及びウェハ搬送方法 |
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Country | Link |
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US (1) | US20220406644A1 (ja) |
EP (1) | EP4044215A4 (ja) |
JP (1) | JP7454385B2 (ja) |
KR (1) | KR20220131890A (ja) |
CN (1) | CN115023799A (ja) |
WO (1) | WO2021149330A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006057050A1 (ja) | 2004-11-29 | 2006-06-01 | Hirata Corporation | 基板把持装置 |
JP2008305905A (ja) | 2007-06-06 | 2008-12-18 | Hitachi High-Technologies Corp | 異物・欠陥検査・観察システム |
JP2011119348A (ja) | 2009-12-01 | 2011-06-16 | Kawasaki Heavy Ind Ltd | エッジグリップ装置、及びそれを備えるロボット。 |
JP2018111200A (ja) | 2016-12-06 | 2018-07-19 | ジャビル インク | エンドエフェクターを供給するための器具、システム、及び方法 |
JP2018170418A (ja) | 2017-03-30 | 2018-11-01 | 東京エレクトロン株式会社 | 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7281741B2 (en) * | 2001-07-13 | 2007-10-16 | Semitool, Inc. | End-effectors for handling microelectronic workpieces |
US7226269B2 (en) * | 2004-01-15 | 2007-06-05 | Applied Materials, Inc. | Substrate edge grip apparatus |
JP5244566B2 (ja) * | 2008-12-02 | 2013-07-24 | 株式会社東芝 | テンプレート洗浄方法、洗浄システム、及び洗浄装置 |
US8436631B2 (en) | 2009-06-12 | 2013-05-07 | Semicaps Pte Ltd | Wafer stage |
-
2020
- 2020-01-23 JP JP2020009273A patent/JP7454385B2/ja active Active
- 2020-11-09 KR KR1020227012221A patent/KR20220131890A/ko unknown
- 2020-11-09 WO PCT/JP2020/041755 patent/WO2021149330A1/ja unknown
- 2020-11-09 US US17/772,596 patent/US20220406644A1/en active Pending
- 2020-11-09 EP EP20914993.9A patent/EP4044215A4/en active Pending
- 2020-11-09 CN CN202080094175.7A patent/CN115023799A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006057050A1 (ja) | 2004-11-29 | 2006-06-01 | Hirata Corporation | 基板把持装置 |
JP2008305905A (ja) | 2007-06-06 | 2008-12-18 | Hitachi High-Technologies Corp | 異物・欠陥検査・観察システム |
JP2011119348A (ja) | 2009-12-01 | 2011-06-16 | Kawasaki Heavy Ind Ltd | エッジグリップ装置、及びそれを備えるロボット。 |
JP2018111200A (ja) | 2016-12-06 | 2018-07-19 | ジャビル インク | エンドエフェクターを供給するための器具、システム、及び方法 |
JP2018170418A (ja) | 2017-03-30 | 2018-11-01 | 東京エレクトロン株式会社 | 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム |
Also Published As
Publication number | Publication date |
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KR20220131890A (ko) | 2022-09-29 |
CN115023799A (zh) | 2022-09-06 |
TW202129821A (zh) | 2021-08-01 |
WO2021149330A1 (ja) | 2021-07-29 |
EP4044215A1 (en) | 2022-08-17 |
EP4044215A4 (en) | 2024-01-24 |
JP2021118224A (ja) | 2021-08-10 |
US20220406644A1 (en) | 2022-12-22 |
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