JP7451241B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP7451241B2 JP7451241B2 JP2020044142A JP2020044142A JP7451241B2 JP 7451241 B2 JP7451241 B2 JP 7451241B2 JP 2020044142 A JP2020044142 A JP 2020044142A JP 2020044142 A JP2020044142 A JP 2020044142A JP 7451241 B2 JP7451241 B2 JP 7451241B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- grindstone
- grinding
- rotary table
- spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000011144 upstream manufacturing Methods 0.000 claims description 16
- 239000003463 adsorbent Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
2 :メインユニット
21 :砥石
22 :コラム
22a :前面
22b :溝
23 :砥石スピンドル
23a :サドル
24 :リニアガイド
24a :前方リニアガイド
24b :後方リニアガイド
25 :スピンドル送り機構
25a :ナット
25b :ボールネジ
25c :モータ
26 :エアシリンダ
3 :搬送ユニット
31 :チャック
32 :スライダ
33 :吸着体
34 :回転テーブル
35 :レール
4 :インプロセスゲージ
5 :制御装置
W :ワーク
Claims (1)
- ワークを砥石で平面加工する加工装置であって、
前記ワークを吸着保持可能な吸着体と、
前記吸着体を上面に設けた回転テーブルと、
を備え、
前記吸着体の中心が、前記回転テーブルの回転中心から所定距離だけオフセットして配置され、
前記ワークが、前記回転テーブルの回転中心から前記ワークのオフセット方向の上流側に偏心した状態で前記吸着体に吸着保持され、
前記砥石及び前記ワークをそれぞれ回転させながら前記砥石を前記ワークに押し付けて前記ワークを平面加工する際に、前記ワークが、前記回転テーブルの回転中心に対してオフセット方向の上流側に偏心した状態で前記回転テーブルの回転中心回りに回転することを特徴とする加工装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020044142A JP7451241B2 (ja) | 2020-03-13 | 2020-03-13 | 加工装置 |
JP2024033684A JP2024059984A (ja) | 2020-03-13 | 2024-03-06 | 加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020044142A JP7451241B2 (ja) | 2020-03-13 | 2020-03-13 | 加工装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024033684A Division JP2024059984A (ja) | 2020-03-13 | 2024-03-06 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021142627A JP2021142627A (ja) | 2021-09-24 |
JP7451241B2 true JP7451241B2 (ja) | 2024-03-18 |
Family
ID=77766733
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020044142A Active JP7451241B2 (ja) | 2020-03-13 | 2020-03-13 | 加工装置 |
JP2024033684A Pending JP2024059984A (ja) | 2020-03-13 | 2024-03-06 | 加工装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024033684A Pending JP2024059984A (ja) | 2020-03-13 | 2024-03-06 | 加工装置 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP7451241B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001025961A (ja) | 1999-07-12 | 2001-01-30 | Hitachi Cable Ltd | 半導体ウエハの貼付方法 |
JP2012040653A (ja) | 2010-08-20 | 2012-03-01 | Murata Mfg Co Ltd | ワークの研削方法 |
JP2017092412A (ja) | 2015-11-17 | 2017-05-25 | 株式会社ディスコ | 円板状ワークの研削方法 |
-
2020
- 2020-03-13 JP JP2020044142A patent/JP7451241B2/ja active Active
-
2024
- 2024-03-06 JP JP2024033684A patent/JP2024059984A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001025961A (ja) | 1999-07-12 | 2001-01-30 | Hitachi Cable Ltd | 半導体ウエハの貼付方法 |
JP2012040653A (ja) | 2010-08-20 | 2012-03-01 | Murata Mfg Co Ltd | ワークの研削方法 |
JP2017092412A (ja) | 2015-11-17 | 2017-05-25 | 株式会社ディスコ | 円板状ワークの研削方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2024059984A (ja) | 2024-05-01 |
JP2021142627A (ja) | 2021-09-24 |
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