JP7431920B2 - 液供給ユニット、基板処理装置及びボトル交替方法 - Google Patents
液供給ユニット、基板処理装置及びボトル交替方法 Download PDFInfo
- Publication number
- JP7431920B2 JP7431920B2 JP2022168109A JP2022168109A JP7431920B2 JP 7431920 B2 JP7431920 B2 JP 7431920B2 JP 2022168109 A JP2022168109 A JP 2022168109A JP 2022168109 A JP2022168109 A JP 2022168109A JP 7431920 B2 JP7431920 B2 JP 7431920B2
- Authority
- JP
- Japan
- Prior art keywords
- bottle
- liquid
- cabinet
- substrate
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims description 271
- 238000012545 processing Methods 0.000 title claims description 249
- 239000000758 substrate Substances 0.000 title claims description 143
- 238000000034 method Methods 0.000 title claims description 59
- 230000008569 process Effects 0.000 claims description 45
- 230000033001 locomotion Effects 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 19
- 239000012535 impurity Substances 0.000 claims description 7
- 239000000872 buffer Substances 0.000 description 46
- 238000010438 heat treatment Methods 0.000 description 37
- 238000000576 coating method Methods 0.000 description 32
- 239000011248 coating agent Substances 0.000 description 29
- 239000007789 gas Substances 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 17
- 238000001816 cooling Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 13
- 239000011261 inert gas Substances 0.000 description 13
- 229940079593 drug Drugs 0.000 description 7
- 239000003814 drug Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
1000 液処理チャンバに提供される基板処理装置
1500 液吐出ユニット
2000 液供給装置
2100 液供給ユニット
2110 キャビネット
2120 第1シャフト
2122 シャフト溝
2130 第2シャフト
2140 交差軸連結部
2142 ギアボックス
2144 ベベルギア
2144a 駆動ギア
2144b 被動ギア
2150 ガイド部
2151 第1ガイド
2152 第2ガイド
2160 フレーム
2162 内部空間
2170 回転発生部
2172 回転溝
2180 キャップ
2190 薬液ライン
2192 ガスライン
2194 ガスバルブ
2200 ボトル
2202 斜線溝
2204 垂直溝
2300 トラップユニット
2500 ポンプユニット
Claims (11)
- 基板を処理する装置において、
基板に処理液を供給して基板を液処理する液処理チャンバと、及び
前記液処理チャンバに前記処理液を供給する液供給ユニットを含み、
前記液供給ユニットは、
前記処理液を収容するボトルを装着可能に構成されるキャビネットと、
前記キャビネットに装着された前記ボトルの入口の向かう方向が変更されるように、前記ボトルを回転可能に構成される回転発生部と、
内部空間を有するフレームと、を含み、
前記キャビネットは、
前記内部空間に挿入可能になるように構成され、
前記回転発生部は、
前記キャビネットに装着された前記ボトルが前記内部空間に提供される第1位置にある時前記ボトルの入口が下の方向を眺めるように前記ボトルを回転させ、
前記キャビネットに装着された前記ボトルが前記内部空間から脱する第2位置にある時前記ボトルの入口が上の方向を眺めるように前記ボトルを回転させ、
前記第1位置、そして、前記第2位置の間で移動する前記キャビネットの直線運動から前記ボトルを回転させる回転運動を発生させるように構成される、基板処理装置。 - 前記液供給ユニットは、
前記回転発生部が発生させる回転力の伝達を受ける第1シャフトと、及び
前記ボトルが装着され、前記第1シャフトの回転に従属して回転される第2シャフトを含むが、
前記第1シャフト及び前記第2シャフトは前記キャビネットに設置される、ことを特徴とする請求項1に記載の基板処理装置。 - 前記第1シャフト、そして前記第2シャフトの回転軸はお互いに交差し、
前記液供給ユニットは、
交差軸である前記第1シャフト、そして、前記第2シャフトの間の運動を伝達する交差軸連結部を含む、ことを特徴とする請求項2に記載の基板処理装置。 - 前記交差軸連結部は、
前記第1シャフトの一端に設置される駆動ギアと、及び
前記第2シャフトの一端に設置される被動ギアを含む、ことを特徴とする請求項3に記載の基板処理装置。 - 前記液供給ユニットは、
前記第2シャフトに設置され、前記ボトルが装着されるキャップと、及び
前記キャップに連結され、前記キャップに装着された前記ボトル内の前記処理液を前記液処理チャンバに移動させる薬液ラインを含む、ことを特徴とする請求項4に記載の基板処理装置。 - 前記液供給ユニットは、
前記キャップに連結され、前記ボトル内の空間を加圧するガスを供給するガスラインと、及び
前記ガスラインに設置されるガスバルブをさらに含む、ことを特徴とする請求項5に記載の基板処理装置。 - 制御機をさらに含み、
前記制御機は、
使用者の設定によって前記ガスラインが前記ボトル内の空間にガスを選択的に供給するように前記ガスバルブの開閉を制御する、ことを特徴とする請求項6に記載の基板処理装置。 - 前記キャビネットに装着された前記ボトルから前記薬液ラインを通じて引き出しされて前記液処理チャンバに伝達される前記処理液の不純物または前記処理液内の気泡または不純物を除去するトラップユニットをさらに含む、ことを特徴とする請求項5に記載の基板処理装置。
- 前記トラップユニットは、
前記キャビネットに装着された前記ボトルの入口が下の方向を眺める時、前記ボトルより下に位置する、ことを特徴とする請求項8に記載の基板処理装置。 - 液処理チャンバに処理液を供給する液供給ユニットにおいて、
ボトルが交替可能に装着されるキャビネットと、
前記ボトルの入口が下に向けて前記液処理チャンバに前記ボトル内の処理液を供給する姿勢である供給姿勢、そして、前記ボトルの入口が上に向ける姿勢である交替姿勢の間で前記ボトルの姿勢が変更されるように前記ボトルを回転させる回転発生部と、
内部空間を有するフレームと、を含み、
前記キャビネットは、
前記内部空間に挿入可能になるように構成され、
前記回転発生部は、
前記キャビネットに装着された前記ボトルが前記内部空間に提供される第1位置にある時前記ボトルの入口が下の方向を眺めるように前記ボトルを回転させ、
前記キャビネットに装着された前記ボトルが前記内部空間から脱する第2位置にある時前記ボトルの入口が上の方向を眺めるように前記ボトルを回転させ、
前記第1位置、そして、前記第2位置の間で移動する前記キャビネットの直線運動から前記ボトルを回転させる回転運動を発生させるように構成される、液供給ユニット。 - 液処理チャンバに処理液を供給するボトルを交替する方法において、
前記液処理チャンバに前記処理液を供給する液供給ユニットのキャビネットから第1ボトルを分離する第1段階と、
前記液供給ユニットの前記キャビネットに前記第1ボトルと相異な第2ボトルを装着する第2段階と、
前記第2ボトルの入口が下に向ける状態で、前記第2ボトル内の前記処理液を前記液処理チャンバに供給する第3段階と、を含み、
前記第1段階は、前記キャビネットに装着された前記第1ボトルが内部空間を有するフレームの前記内部空間から脱する第2位置にある時前記第1ボトルの入口が上の方向を眺めるように前記ボトルを回転させた状態で前記第1ボトルを分離し、
前記第3段階は、前記キャビネットに装着された前記第2ボトルが前記内部空間に提供される第1位置にある時前記第2ボトルの入口が下の方向を眺めるように前記第2ボトルを回転させることにより前記処理液を前記液処理チャンバに供給し、
前記第1段階および前記第3段階は、それぞれ、前記第2位置、そして、前記第1位置の間で移動する前記キャビネットの直線運動から前記第1ボトルおよび前記第2ボトルを回転させる回転運動を発生させる、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210142876A KR102666442B1 (ko) | 2021-10-25 | 2021-10-25 | 액 공급 유닛, 기판 처리 장치 및 바틀 교체 방법 |
KR10-2021-0142876 | 2021-10-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023064075A JP2023064075A (ja) | 2023-05-10 |
JP7431920B2 true JP7431920B2 (ja) | 2024-02-15 |
Family
ID=86055847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022168109A Active JP7431920B2 (ja) | 2021-10-25 | 2022-10-20 | 液供給ユニット、基板処理装置及びボトル交替方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230131562A1 (ja) |
JP (1) | JP7431920B2 (ja) |
KR (1) | KR102666442B1 (ja) |
CN (1) | CN116027637A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013247276A (ja) | 2012-05-28 | 2013-12-09 | Sokudo Co Ltd | 薬液供給方法と薬液供給装置と基板処理装置 |
CN103645606A (zh) | 2013-12-09 | 2014-03-19 | 京东方科技集团股份有限公司 | 光刻胶供给装置 |
US20140083557A1 (en) | 2012-09-24 | 2014-03-27 | Stmicroelectronics Pte Ltd. | Photoresist delivery system including control valve and associated methods |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100952068B1 (ko) * | 2008-07-28 | 2010-04-13 | 한국해양연구원 | 쉐이커를 구비한 헤드 스페이서 |
JP4879253B2 (ja) * | 2008-12-04 | 2012-02-22 | 東京エレクトロン株式会社 | 処理液供給装置 |
KR101065627B1 (ko) * | 2011-01-06 | 2011-09-19 | (주)엠앤에스시스템 | 스핀 코터 |
-
2021
- 2021-10-25 KR KR1020210142876A patent/KR102666442B1/ko active IP Right Grant
-
2022
- 2022-10-19 US US17/969,171 patent/US20230131562A1/en active Pending
- 2022-10-20 JP JP2022168109A patent/JP7431920B2/ja active Active
- 2022-10-24 CN CN202211306693.8A patent/CN116027637A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013247276A (ja) | 2012-05-28 | 2013-12-09 | Sokudo Co Ltd | 薬液供給方法と薬液供給装置と基板処理装置 |
US20140083557A1 (en) | 2012-09-24 | 2014-03-27 | Stmicroelectronics Pte Ltd. | Photoresist delivery system including control valve and associated methods |
CN103645606A (zh) | 2013-12-09 | 2014-03-19 | 京东方科技集团股份有限公司 | 光刻胶供给装置 |
Also Published As
Publication number | Publication date |
---|---|
CN116027637A (zh) | 2023-04-28 |
JP2023064075A (ja) | 2023-05-10 |
KR20230058970A (ko) | 2023-05-03 |
KR102666442B1 (ko) | 2024-05-17 |
US20230131562A1 (en) | 2023-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100894888B1 (ko) | 회전식 분배 아암을 갖는 액체 분배용 장치 및 액체 분배방법 | |
JP4845463B2 (ja) | 基板処理装置 | |
US8496761B2 (en) | Substrate processing apparatus and substrate processing method | |
JP5645796B2 (ja) | 液処理装置及び液処理方法 | |
US20100129526A1 (en) | Substrate processing apparatus | |
US20220075280A1 (en) | Cleaning jig, substrate treating apparatus including the same, cleaning method of substrate treating apparatus | |
US7690853B2 (en) | Substrate processing apparatus | |
JP6016514B2 (ja) | 基板処理装置 | |
KR102606575B1 (ko) | 액 공급 장치, 그리고 이를 포함하는 기판 처리 장치 | |
JP7431920B2 (ja) | 液供給ユニット、基板処理装置及びボトル交替方法 | |
JP6684191B2 (ja) | 基板洗浄装置およびそれを備える基板処理装置 | |
JP2008235302A (ja) | 基板処理装置および基板処理方法 | |
JP7432664B2 (ja) | 支持ユニット及びこれを含む基板処理装置 | |
KR102288984B1 (ko) | 기판 처리 장치 및 방법 | |
JP2009094521A (ja) | 薬液供給装置 | |
JP7304932B2 (ja) | ノズル待機ポートとこれを含む基板処理装置及びこれを利用したノズル洗浄方法 | |
JP6101023B2 (ja) | 基板処理装置および基板処理方法 | |
KR20170134879A (ko) | 기판 처리 장치 및 보틀 교체 방법 | |
KR102677969B1 (ko) | 노즐 대기 포트와 이를 포함하는 기판 처리 장치 및 이를 이용한 노즐 세정 방법 | |
JP7476273B2 (ja) | 基板処理装置及び基板処理方法 | |
US20240100572A1 (en) | Apparatus for treating substrate and method for treating a substrate | |
KR102324407B1 (ko) | 액 공급 유닛 및 이를 가지는 기판 처리 장치 및 방법 | |
US20230207342A1 (en) | Home port, and apparatus for treating substrate with the same | |
CN118197949A (zh) | 用于处理基板的装置和用于处理基板的方法 | |
CN113495431A (zh) | 喷嘴装置及基板处理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221020 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230829 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231127 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240130 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240202 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7431920 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |