JP7413372B2 - 対向配置チャネルを有する三次元センサ - Google Patents
対向配置チャネルを有する三次元センサ Download PDFInfo
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- JP7413372B2 JP7413372B2 JP2021521106A JP2021521106A JP7413372B2 JP 7413372 B2 JP7413372 B2 JP 7413372B2 JP 2021521106 A JP2021521106 A JP 2021521106A JP 2021521106 A JP2021521106 A JP 2021521106A JP 7413372 B2 JP7413372 B2 JP 7413372B2
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- 238000005286 illumination Methods 0.000 claims description 171
- 238000003384 imaging method Methods 0.000 claims description 170
- 238000005259 measurement Methods 0.000 claims description 108
- 238000000034 method Methods 0.000 claims description 93
- 230000003287 optical effect Effects 0.000 description 97
- 238000010586 diagram Methods 0.000 description 73
- 239000000463 material Substances 0.000 description 26
- 230000009466 transformation Effects 0.000 description 16
- 230000006870 function Effects 0.000 description 11
- 238000007689 inspection Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 8
- 210000001747 pupil Anatomy 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000004075 alteration Effects 0.000 description 6
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- -1 but not limited to Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 238000000844 transformation Methods 0.000 description 4
- 238000013519 translation Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000649 phase profilometry Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000847 optical profilometry Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000013455 disruptive technology Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
- G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
- G06T2207/20221—Image fusion; Image merging
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- Computer Vision & Pattern Recognition (AREA)
- Biochemistry (AREA)
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
表面又は物体に関する精密な寸法情報を得ることは、多くの産業及びプロセスにとって不可欠である。例えば、エレクトロニクス組立産業では、回路基板上の電気部品に関する精密な寸法情報を使用して、その部品が適切に配置されているかどうかを判定することができる。さらに、寸法情報は、適切な量のはんだペーストが回路基板上の適切な位置に確実に付着されるようにするための部品実装前の回路基板上のはんだペースト付着物の検査においても有用である。さらに、寸法情報は、半導体ウエハ及びフラット・パネル・ディスプレイの検査においても有用である。
式中、mは、撮像システム702の倍率であり、30°は図16の角度718である。
式中、αは0~1の定数である。
トリガ時間1:照明源1410が撮像システム1414を露光する、
トリガ時間2:照明源1416が撮像システム1420を露光する、
トリガ時間3:照明源1422が撮像システム1408を露光する、
トリガ時間4:照明源1422が撮像システム1414を露光する、
トリガ時間5:照明源1410が撮像システム1420を露光する、
トリガ時間6:照明源1416が撮像システム1408を露光する
Claims (7)
- ターゲット面の寸法情報を決定する方法であって、
第1の対向配置チャネルを有する位相形状測定システムの第1の撮像システム・照明源対によって生成された前記ターゲット面の第1の複数の再構成表面点に対応する第1の点群を生成することと、
第2の対向配置チャネルを有する位相形状測定システムの第2の撮像システム・照明源対によって生成された前記ターゲット面の第2の複数の再構成表面点に対応する第2の点群を生成することと、
前記ターゲット面に対応する体積を、ボクセルのセットに分割することと、
前記第1の点群及び前記第2の点群内の再構成表面点ごとに、表面点の符号付き距離関数(SDF)及び対応する重みを、前記第1の点群及び前記第2の点群内の各再構成表面点の撮像システム光線に沿った前記ボクセルのセットに付加することと、
前記第1の点群及び前記第2の点群の前記SDFのレベルセットを識別することと、
第1及び第2の複数の再構成表面点、前記SDFのレベルセット、及び前記第1の撮像システム・照明源対及び前記第2の撮像システム・照明源対の幾何学的配置に基づき最終的な点群を生成すること、
を含む、方法。 - 前記最終的な点群を生成することが、鏡面反射グリントによって引き起こされる測定誤差を低減する、請求項1に記載の方法。
- 前記最終的な点群を生成することが、前記ターゲット面の反射率勾配によって引き起こされる測定誤差を低減する、請求項1に記載の方法。
- 前記最終的な点群を生成することが、前記ターゲット面の傾斜によって引き起こされる測定誤差を低減する、請求項1に記載の方法。
- 前記第1の撮像システム・照明源対が、第1の動作同軸カメラ・プロジェクタ対からの第1のカメラと、第2の動作同軸カメラ・プロジェクタ対からの第1のプロジェクタとを含み、
前記第2の撮像システム・照明源対が、前記第2の動作同軸カメラ・プロジェクタ対からの第2のカメラと、前記第1の動作同軸カメラ・プロジェクタ対からの第2のプロジェクタとを含む、請求項1に記載の方法。 - 前記第1の動作同軸カメラ・プロジェクタ対又は前記第2の動作同軸カメラ・プロジェクタ対の少なくとも一方が、前記ターゲット面及びターゲット面法線に対して斜角で位置合わせされる、請求項5に記載の方法。
- 前記第1の動作同軸カメラ・プロジェクタ対又は前記第2の動作同軸カメラ・プロジェクタ対の少なくとも一方が、前記ターゲット面に対して垂直に位置合わせされる、請求項6に記載の方法。
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JP2023220700A JP2024029135A (ja) | 2018-10-18 | 2023-12-27 | 対向配置チャネルを有する三次元センサ |
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US201862747350P | 2018-10-18 | 2018-10-18 | |
US201862747353P | 2018-10-18 | 2018-10-18 | |
US62/747,350 | 2018-10-18 | ||
US62/747,353 | 2018-10-18 | ||
US16/655,674 US10883823B2 (en) | 2018-10-18 | 2019-10-17 | Three-dimensional sensor with counterposed channels |
US16/655,674 | 2019-10-17 | ||
PCT/US2019/056921 WO2020081927A1 (en) | 2018-10-18 | 2019-10-18 | Three-dimensional sensor with counterposed channels |
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JP7413372B2 true JP7413372B2 (ja) | 2024-01-15 |
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JP2021521272A Active JP7228690B2 (ja) | 2018-10-18 | 2019-10-18 | 対向配置チャネルを有する三次元センサ |
JP2023220700A Pending JP2024029135A (ja) | 2018-10-18 | 2023-12-27 | 対向配置チャネルを有する三次元センサ |
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US (3) | US10883823B2 (ja) |
EP (3) | EP3867597B1 (ja) |
JP (3) | JP7413372B2 (ja) |
KR (3) | KR20210058978A (ja) |
CN (2) | CN112912688B (ja) |
SG (2) | SG11202103748UA (ja) |
TW (2) | TWI740237B (ja) |
WO (2) | WO2020081925A1 (ja) |
Families Citing this family (5)
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US10883823B2 (en) | 2018-10-18 | 2021-01-05 | Cyberoptics Corporation | Three-dimensional sensor with counterposed channels |
US20210262787A1 (en) * | 2020-02-21 | 2021-08-26 | Hamamatsu Photonics K.K. | Three-dimensional measurement device |
CN113223135B (zh) * | 2021-04-15 | 2023-04-11 | 中山大学 | 一种基于特殊复合平面镜虚像成像的三维重建装置和方法 |
CN114119553B (zh) * | 2021-11-28 | 2024-05-10 | 长春理工大学 | 一种以十字激光为基准的双目视觉异面圆孔检测方法 |
CN117330568A (zh) * | 2023-08-22 | 2024-01-02 | 江苏天钧精密技术有限公司 | 一种电池箱体视觉检测***及方法 |
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