JP7407714B2 - リフロー対応ダイシングテープ - Google Patents

リフロー対応ダイシングテープ Download PDF

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Publication number
JP7407714B2
JP7407714B2 JP2020537799A JP2020537799A JP7407714B2 JP 7407714 B2 JP7407714 B2 JP 7407714B2 JP 2020537799 A JP2020537799 A JP 2020537799A JP 2020537799 A JP2020537799 A JP 2020537799A JP 7407714 B2 JP7407714 B2 JP 7407714B2
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JP
Japan
Prior art keywords
group
carbon atoms
radiation
meth
adhesive layer
Prior art date
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JP2020537799A
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English (en)
Japanese (ja)
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JPWO2020116448A1 (ja
Inventor
匠 浅沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of JPWO2020116448A1 publication Critical patent/JPWO2020116448A1/ja
Application granted granted Critical
Publication of JP7407714B2 publication Critical patent/JP7407714B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2020537799A 2018-12-04 2019-12-03 リフロー対応ダイシングテープ Active JP7407714B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018226963 2018-12-04
JP2018226963 2018-12-04
PCT/JP2019/047232 WO2020116448A1 (ja) 2018-12-04 2019-12-03 リフロー対応ダイシングテープ

Publications (2)

Publication Number Publication Date
JPWO2020116448A1 JPWO2020116448A1 (ja) 2021-10-14
JP7407714B2 true JP7407714B2 (ja) 2024-01-04

Family

ID=70975451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020537799A Active JP7407714B2 (ja) 2018-12-04 2019-12-03 リフロー対応ダイシングテープ

Country Status (5)

Country Link
JP (1) JP7407714B2 (zh)
KR (1) KR102403288B1 (zh)
CN (1) CN111868887A (zh)
TW (1) TWI753328B (zh)
WO (1) WO2020116448A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095994A1 (ja) 2018-11-08 2020-05-14 三菱ケミカル株式会社 粘着剤樹脂組成物、粘着シート、活性エネルギー線硬化性粘着シート、光学部材、画像表示装置用積層体及び画像表示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027960A (ja) 2006-07-18 2008-02-07 Nitto Denko Corp 耐熱ダイシングテープ又はシート
JP2010129701A (ja) 2008-11-26 2010-06-10 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2011054953A (ja) 2009-08-05 2011-03-17 Furukawa Electric Co Ltd:The 粘着フィルム及び半導体ウエハ加工用テープ
JP2012033636A (ja) 2010-07-29 2012-02-16 Nitto Denko Corp 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100910672B1 (ko) 2007-08-03 2009-08-04 도레이새한 주식회사 내열성 점착시트
JP5737185B2 (ja) * 2009-11-13 2015-06-17 日立化成株式会社 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ
KR101143109B1 (ko) * 2010-08-05 2012-05-08 후루카와 덴키 고교 가부시키가이샤 점착 필름 및 반도체 웨이퍼 가공용 테이프
JP5834606B2 (ja) * 2011-08-05 2015-12-24 Dic株式会社 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体
CN106574164A (zh) * 2014-08-29 2017-04-19 古河电气工业株式会社 导电性接合剂组合物
JP2016204406A (ja) * 2015-04-15 2016-12-08 藤森工業株式会社 粘着剤層及び粘着フィルム
CN107531016B (zh) * 2015-05-01 2019-08-09 柯尼卡美能达株式会社 长条状气体阻隔性膜及其制造方法以及短条状气体阻隔性膜及其制造方法
JP2017125093A (ja) * 2016-01-12 2017-07-20 積水化学工業株式会社 半導体保護テープ及びウエハの処理方法
JP6827877B2 (ja) * 2017-04-28 2021-02-10 サンアロマー株式会社 中空成形用ポリプロピレン系樹脂組成物、その製造方法及び中空成形品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027960A (ja) 2006-07-18 2008-02-07 Nitto Denko Corp 耐熱ダイシングテープ又はシート
JP2010129701A (ja) 2008-11-26 2010-06-10 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2011054953A (ja) 2009-08-05 2011-03-17 Furukawa Electric Co Ltd:The 粘着フィルム及び半導体ウエハ加工用テープ
JP2012033636A (ja) 2010-07-29 2012-02-16 Nitto Denko Corp 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN111868887A (zh) 2020-10-30
JPWO2020116448A1 (ja) 2021-10-14
KR102403288B1 (ko) 2022-05-30
TWI753328B (zh) 2022-01-21
TW202028395A (zh) 2020-08-01
WO2020116448A1 (ja) 2020-06-11
KR20200138374A (ko) 2020-12-09

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