JP7382405B2 - 入力と出力が分離された、パッケージングされたトランジスタ・デバイス、及び入力と出力が分離された、パッケージングされたトランジスタ・デバイスを形成する方法 - Google Patents
入力と出力が分離された、パッケージングされたトランジスタ・デバイス、及び入力と出力が分離された、パッケージングされたトランジスタ・デバイスを形成する方法 Download PDFInfo
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Description
Claims (9)
- パッケージングされたトランジスタ・デバイスであって、
前記パッケージングされたトランジスタ・デバイスのベース上の、制御端子及び出力端子を備えるトランジスタと、
入力リードと前記トランジスタの前記制御端子との間に電気的に結合された第1のボンド・ワイヤと、
出力リードと前記トランジスタの前記出力端子との間に電気的に結合された第2のボンド・ワイヤと、
前記第1のボンド・ワイヤと前記第2のボンド・ワイヤとの間に物理的に存在する分離材料であって、前記第1のボンド・ワイヤと前記第2のボンド・ワイヤとの間の結合を低減するように構成された分離材料と、
前記トランジスタ上のプラスチック・オーバーモールドであって、当該プラスチック・オーバーモールドの外面から内側に延びる凹部を有し、前記分離材料が前記凹部内にある、プラスチック・オーバーモールドと、
を備える、パッケージングされたトランジスタ・デバイス。 - 前記分離材料が、導電性分離材料、磁性分離材料、又は損失性誘電分離材料である、請求項1に記載のパッケージングされたトランジスタ・デバイス。
- 前記入力リード及び前記出力リードが前記プラスチック・オーバーモールドから延在し、
前記分離材料の一部分が、前記プラスチック・オーバーモールドに接触する、請求項1または2に記載のパッケージングされたトランジスタ・デバイス。 - 前記分離材料が、第3のボンド・ワイヤを備える、請求項1から3までのいずれか一項に記載のパッケージングされたトランジスタ・デバイス。
- 前記分離材料が、前記トランジスタの頂面に実質的に垂直の方向に延在する複数の金属セグメントを含む、請求項1から4までのいずれか一項に記載のパッケージングされたトランジスタ・デバイス。
- 前記分離材料が、前記トランジスタの頂面に実質的に垂直の方向に延在する金属壁を備える、請求項1から4までのいずれか一項に記載のパッケージングされたトランジスタ・デバイス。
- 前記分離材料が、アース信号に接続されるように構成された、請求項1から6までのいずれか一項に記載のパッケージングされたトランジスタ・デバイス。
- 前記入力リードと前記制御端子との間に電気的に結合された入力整合回路をさらに備え、
前記第1のボンド・ワイヤが、前記入力整合回路内の誘導性要素である、請求項1から7までのいずれか一項に記載のパッケージングされたトランジスタ・デバイス。 - 前記分離材料が、電気的にフローティング状態であるように構成された、請求項1から6までのいずれか一項に記載のパッケージングされたトランジスタ・デバイス。
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