JP7357567B2 - ウェーハの加工方法 - Google Patents

ウェーハの加工方法 Download PDF

Info

Publication number: JP7357567B2
Authority: JP; Japan
Prior art keywords: wafer; grinding; grinding wheel; circular; unit
Prior art date: 2020-02-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2020027491A

Other languages

English (en)

Japanese (ja)

Other versions

JP2021132164A (ja

Inventor

祐介藤井

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-02-20

Filing date

2020-02-20

Publication date

2023-10-06

2020-02-20 Application filed by Disco Corp filed Critical Disco Corp

2020-02-20 Priority to JP2020027491A priority Critical patent/JP7357567B2/ja

2021-01-19 Priority to KR1020210007138A priority patent/KR20210106343A/ko

2021-02-08 Priority to TW110104710A priority patent/TW202133254A/zh

2021-02-18 Priority to CN202110187572.5A priority patent/CN113352204A/zh

2021-09-09 Publication of JP2021132164A publication Critical patent/JP2021132164A/ja

2023-10-06 Application granted granted Critical

2023-10-06 Publication of JP7357567B2 publication Critical patent/JP7357567B2/ja

Status Active legal-status Critical Current

2040-02-20 Anticipated expiration legal-status Critical

Links

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238000003754 machining Methods 0.000 description 7
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150000004767 nitrides Chemical class 0.000 description 2
229910052594 sapphire Inorganic materials 0.000 description 2
239000010980 sapphire Substances 0.000 description 2
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
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ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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238000006467 substitution reaction Methods 0.000 description 1
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Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02035—Shaping
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Computer Hardware Design (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Inorganic Chemistry (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Grinding Of Cylindrical And Plane Surfaces (AREA)
Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

JP2020027491A 2020-02-20 2020-02-20 ウェーハの加工方法 Active JP7357567B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2020027491A JP7357567B2 (ja)	2020-02-20	2020-02-20	ウェーハの加工方法
KR1020210007138A KR20210106343A (ko)	2020-02-20	2021-01-19	웨이퍼의 가공 방법
TW110104710A TW202133254A (zh)	2020-02-20	2021-02-08	晶圓之加工方法
CN202110187572.5A CN113352204A (zh)	2020-02-20	2021-02-18	晶片的加工方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2020027491A JP7357567B2 (ja)	2020-02-20	2020-02-20	ウェーハの加工方法

Publications (2)

Publication Number	Publication Date
JP2021132164A JP2021132164A (ja)	2021-09-09
JP7357567B2 true JP7357567B2 (ja)	2023-10-06

Family

ID=77502234

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2020027491A Active JP7357567B2 (ja)	2020-02-20	2020-02-20	ウェーハの加工方法

Country Status (4)

Country	Link
JP (1)	JP7357567B2 (zh)
KR (1)	KR20210106343A (zh)
CN (1)	CN113352204A (zh)
TW (1)	TW202133254A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2020099783A (ja) *	2020-03-31	2020-07-02	株式会社三洋物産	遊技機
CN114582713B (zh) *	2022-03-11	2023-01-24	江苏京创先进电子科技有限公司	晶圆加工方法及晶圆加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2007208145A (ja)	2006-02-03	2007-08-16	Sanken Electric Co Ltd	半導体装置の製造方法
JP2010199336A (ja)	2009-02-25	2010-09-09	Disco Abrasive Syst Ltd	ワーク加工方法およびワーク加工装置
WO2016056124A1 (ja)	2014-10-10	2016-04-14	三菱電機株式会社	半導体装置の製造方法
JP2017157750A (ja)	2016-03-03	2017-09-07	株式会社ディスコ	ウェーハの加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5390740B2 (ja)	2005-04-27	2014-01-15	株式会社ディスコ	ウェーハの加工方法
JP4758222B2 (ja)	2005-12-21	2011-08-24	株式会社ディスコ	ウエーハの加工方法および装置

2020
- 2020-02-20 JP JP2020027491A patent/JP7357567B2/ja active Active
2021
- 2021-01-19 KR KR1020210007138A patent/KR20210106343A/ko unknown
- 2021-02-08 TW TW110104710A patent/TW202133254A/zh unknown
- 2021-02-18 CN CN202110187572.5A patent/CN113352204A/zh active Pending

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2007208145A (ja)	2006-02-03	2007-08-16	Sanken Electric Co Ltd	半導体装置の製造方法
JP2010199336A (ja)	2009-02-25	2010-09-09	Disco Abrasive Syst Ltd	ワーク加工方法およびワーク加工装置
WO2016056124A1 (ja)	2014-10-10	2016-04-14	三菱電機株式会社	半導体装置の製造方法
JP2017157750A (ja)	2016-03-03	2017-09-07	株式会社ディスコ	ウェーハの加工方法

Also Published As

Publication number	Publication date
JP2021132164A (ja)	2021-09-09
KR20210106343A (ko)	2021-08-30
CN113352204A (zh)	2021-09-07
TW202133254A (zh)	2021-09-01

Legal Events

Date	Code	Title	Description
2022-12-16	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221216
2023-09-06	TRDD	Decision of grant or rejection written
2023-09-07	A977	Report on retrieval	Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230907
2023-09-12	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230912
2023-09-28	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230926
2023-09-28	R150	Certificate of patent or registration of utility model	Ref document number: 7357567 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150

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