JP7297136B1 - 露光装置、露光装置の制御方法、情報処理装置、情報処理方法、および物品製造方法 - Google Patents

露光装置、露光装置の制御方法、情報処理装置、情報処理方法、および物品製造方法 Download PDF

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JP7297136B1
JP7297136B1 JP2022165019A JP2022165019A JP7297136B1 JP 7297136 B1 JP7297136 B1 JP 7297136B1 JP 2022165019 A JP2022165019 A JP 2022165019A JP 2022165019 A JP2022165019 A JP 2022165019A JP 7297136 B1 JP7297136 B1 JP 7297136B1
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Prior art keywords
prediction
exposure
substrate
lots
optical system
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JP2022165019A
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English (en)
Japanese (ja)
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JP2024057976A (ja
Inventor
純 茂泉
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2022165019A priority Critical patent/JP7297136B1/ja
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Publication of JP7297136B1 publication Critical patent/JP7297136B1/ja
Priority to KR1020230128719A priority patent/KR20240051826A/ko
Priority to US18/483,918 priority patent/US20240126182A1/en
Priority to CN202311332998.0A priority patent/CN117891137A/zh
Publication of JP2024057976A publication Critical patent/JP2024057976A/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70641Focus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G03F7/70504Optical system modelling, e.g. lens heating models
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70258Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706845Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2022165019A 2022-10-13 2022-10-13 露光装置、露光装置の制御方法、情報処理装置、情報処理方法、および物品製造方法 Active JP7297136B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022165019A JP7297136B1 (ja) 2022-10-13 2022-10-13 露光装置、露光装置の制御方法、情報処理装置、情報処理方法、および物品製造方法
KR1020230128719A KR20240051826A (ko) 2022-10-13 2023-09-26 노광장치, 노광장치의 제어방법, 정보 처리장치, 정보 처리방법, 및 물품 제조방법
US18/483,918 US20240126182A1 (en) 2022-10-13 2023-10-10 Exposure apparatus, control method of exposure apparatus, information processing apparatus, information processing method, and article manufacturing method
CN202311332998.0A CN117891137A (zh) 2022-10-13 2023-10-13 装置、装置的控制方法、信息处理装置、信息处理方法、以及物品制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022165019A JP7297136B1 (ja) 2022-10-13 2022-10-13 露光装置、露光装置の制御方法、情報処理装置、情報処理方法、および物品製造方法

Publications (2)

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JP7297136B1 true JP7297136B1 (ja) 2023-06-23
JP2024057976A JP2024057976A (ja) 2024-04-25

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JP2022165019A Active JP7297136B1 (ja) 2022-10-13 2022-10-13 露光装置、露光装置の制御方法、情報処理装置、情報処理方法、および物品製造方法

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US (1) US20240126182A1 (zh)
JP (1) JP7297136B1 (zh)
KR (1) KR20240051826A (zh)
CN (1) CN117891137A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018116300A (ja) 2012-03-07 2018-07-26 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ方法および装置
JP2018200390A (ja) 2017-05-26 2018-12-20 キヤノン株式会社 決定方法、露光方法、情報処理装置、プログラム及び物品の製造方法
US20210033979A1 (en) 2018-02-27 2021-02-04 Asml Netherlands B.V. Measurement Apparatus and Method for Predicting Aberrations in a Projection System

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018116300A (ja) 2012-03-07 2018-07-26 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ方法および装置
JP2018200390A (ja) 2017-05-26 2018-12-20 キヤノン株式会社 決定方法、露光方法、情報処理装置、プログラム及び物品の製造方法
US20210033979A1 (en) 2018-02-27 2021-02-04 Asml Netherlands B.V. Measurement Apparatus and Method for Predicting Aberrations in a Projection System

Also Published As

Publication number Publication date
CN117891137A (zh) 2024-04-16
KR20240051826A (ko) 2024-04-22
US20240126182A1 (en) 2024-04-18
JP2024057976A (ja) 2024-04-25

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