JP7272445B2 - 移載システム、移載装置及び移載方法 - Google Patents
移載システム、移載装置及び移載方法 Download PDFInfo
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- JP7272445B2 JP7272445B2 JP2021542030A JP2021542030A JP7272445B2 JP 7272445 B2 JP7272445 B2 JP 7272445B2 JP 2021542030 A JP2021542030 A JP 2021542030A JP 2021542030 A JP2021542030 A JP 2021542030A JP 7272445 B2 JP7272445 B2 JP 7272445B2
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Description
[収納システムの構成]
[移載システム及び移載装置の構成]
[移載方法]
[作用及び効果]
[変形例]
Claims (8)
- 上下方向に配列され且つ水平な一方向における一方の側から物品が移載される複数の棚を有し、前記複数の棚のそれぞれが、前記上下方向及び前記一方の側に開口する開口領域が形成され且つ前記物品が載置される載置部と、前記上下方向における前記載置部の位置に応じて設けられた取付部と、を含む収納装置と、
前記複数の棚のそれぞれを移載対象の棚とし、前記移載対象の棚に対して前記一方の側から前記物品を移載するために用いられる移載装置と、を備え、
前記移載装置は、
前記移載対象の棚の前記取付部に前記一方の側から取り付けられる本体部と、
作業者が把持して前記一方向に沿って力を作用させることが可能な把持部を含み、前記物品を支持可能であり、前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記一方向に沿って前記本体部と前記移載対象の棚との間で移動する移動部と、
前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記移載対象の棚の前記開口領域を通って前記移動部を昇降させる昇降部と、
1対のアタッチメントと、
を有し、
前記1対のアタッチメントのそれぞれは、
前記移載対象の棚の前記取付部に取り付けられる接続部と、
前記接続部から前記一方の側に延在し、前記本体部を支持する延在部と、を含み、
前記本体部は、前記1対のアタッチメントを介して前記取付部に取り付けられる、
移載システム。 - 前記接続部は、前記上下方向に沿って延在し、
前記1対のアタッチメントのそれぞれは、前記接続部と前記延在部との間に掛け渡された補強部を更に含む、請求項1に記載の移載システム。 - 前記昇降部は、エアジャッキである、請求項1又は2に記載の移載システム。
- 前記移載装置は、前記一方向に沿って前記移動部を案内するガイドを更に有し、
前記ガイドは、前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記本体部から前記移載対象の棚の前記開口領域の直下に延在するように、構成されている、請求項1~3のいずれか一項に記載の移載システム。 - 前記ガイドは、リニアガイドである、請求項4に記載の移載システム。
- 前記物品は、半導体ウエハを格納した容器である、請求項1~5のいずれか一項に記載の移載システム。
- 上下方向に配列され且つ水平な一方向における一方の側から物品が移載される複数の棚を有し、前記複数の棚のそれぞれが、前記上下方向及び前記一方の側に開口する開口領域が形成され且つ前記物品が載置される載置部と、前記上下方向における前記載置部の位置に応じて設けられた取付部と、を含む収納装置において、前記複数の棚のそれぞれを移載対象の棚とし、前記移載対象の棚に対して前記一方の側から前記物品を移載するために用いられる移載装置であって、
前記移載対象の棚の前記取付部に前記一方の側から取り付けられる本体部と、
作業者が把持して前記一方向に沿って力を作用させることが可能な把持部を含み、前記物品を支持可能であり、前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記一方向に沿って前記本体部と前記移載対象の棚との間で移動する移動部と、
前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記移載対象の棚の前記開口領域を通って前記移動部を昇降させる昇降部と、
1対のアタッチメントと、
を備え、
前記1対のアタッチメントのそれぞれは、
前記移載対象の棚の前記取付部に取り付けられる接続部と、
前記接続部から前記一方の側に延在し、前記本体部を支持する延在部と、を含み、
前記本体部は、前記1対のアタッチメントを介して前記取付部に取り付けられる、
移載装置。 - 請求項1~6のいずれか一項に記載の移載システムにおいて実施される移載方法であって、
作業者が前記移載装置を準備する第1ステップと、
前記第1ステップの後に、作業者が前記移載対象の棚の前記取付部に前記1対のアタッチメントを介して前記一方の側から前記本体部を取り付ける第2ステップと、
前記第2ステップの後に、前記移動部を下降させた状態で、作業者が前記把持部を把持して前記一方向に沿って力を作用させることで前記一方向に沿って前記移載対象の棚の前記開口領域の直下に前記移動部を移動させる第3ステップと、
前記第3ステップの後に、作業者が前記昇降部を用いることで、前記移載対象の棚の前記開口領域を通って前記移動部を上昇させ、前記移動部に前記物品を支持させる第4ステップと、
前記第4ステップの後に、前記移動部を上昇させた状態で、作業者が前記把持部を把持して前記一方向に沿って力を作用させることで前記一方向に沿って前記本体部に前記移動部を移動させる第5ステップと、を含む、
移載方法。
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JP2019154520 | 2019-08-27 | ||
JP2019154520 | 2019-08-27 | ||
PCT/JP2020/023646 WO2021039040A1 (ja) | 2019-08-27 | 2020-06-16 | 移載システム、移載装置及び移載方法 |
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JPWO2021039040A1 JPWO2021039040A1 (ja) | 2021-03-04 |
JPWO2021039040A5 JPWO2021039040A5 (ja) | 2022-06-01 |
JP7272445B2 true JP7272445B2 (ja) | 2023-05-12 |
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US (1) | US11776832B2 (ja) |
EP (1) | EP4023569A4 (ja) |
JP (1) | JP7272445B2 (ja) |
CN (1) | CN114270493A (ja) |
WO (1) | WO2021039040A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2592760Y2 (ja) | 1992-08-28 | 1999-03-24 | 川崎重工業株式会社 | 伸縮フォーク |
WO2012060146A1 (ja) | 2010-11-04 | 2012-05-10 | ムラテックオートメーション株式会社 | スタッカークレーン及び物品の搬出入方法 |
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JPS5011278U (ja) * | 1973-05-30 | 1975-02-05 | ||
JPS5228698B2 (ja) | 1973-05-30 | 1977-07-28 | ||
US4926545A (en) | 1989-05-17 | 1990-05-22 | At&T Bell Laboratories | Method of manufacturing optical assemblies |
JPH11106007A (ja) | 1997-10-06 | 1999-04-20 | Hirokazu Dezuki | 荷物やパレットを収納棚に搬入搬出する方法 |
US7793906B2 (en) * | 2008-03-31 | 2010-09-14 | Shinko Electric Co., Ltd. | Clamping mechanism |
WO2012164994A1 (ja) * | 2011-05-31 | 2012-12-06 | 村田機械株式会社 | 引出し装置及び保管装置 |
US10023385B2 (en) * | 2013-11-12 | 2018-07-17 | Daifuku Co., Ltd. | Article storage facility |
JP6784277B2 (ja) * | 2018-06-11 | 2020-11-11 | 村田機械株式会社 | ストッカ及び搬送車システム |
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- 2020-06-16 JP JP2021542030A patent/JP7272445B2/ja active Active
- 2020-06-16 US US17/635,251 patent/US11776832B2/en active Active
- 2020-06-16 CN CN202080059470.9A patent/CN114270493A/zh active Pending
- 2020-06-16 WO PCT/JP2020/023646 patent/WO2021039040A1/ja unknown
- 2020-06-16 EP EP20855981.5A patent/EP4023569A4/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2592760Y2 (ja) | 1992-08-28 | 1999-03-24 | 川崎重工業株式会社 | 伸縮フォーク |
WO2012060146A1 (ja) | 2010-11-04 | 2012-05-10 | ムラテックオートメーション株式会社 | スタッカークレーン及び物品の搬出入方法 |
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Publication number | Publication date |
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WO2021039040A1 (ja) | 2021-03-04 |
JPWO2021039040A1 (ja) | 2021-03-04 |
EP4023569A4 (en) | 2023-11-08 |
US11776832B2 (en) | 2023-10-03 |
TW202120404A (zh) | 2021-06-01 |
CN114270493A (zh) | 2022-04-01 |
US20220293445A1 (en) | 2022-09-15 |
EP4023569A1 (en) | 2022-07-06 |
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