JP7242557B2 - 低粘度及び低処理温度を有する銀分子インク - Google Patents
低粘度及び低処理温度を有する銀分子インク Download PDFInfo
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- JP7242557B2 JP7242557B2 JP2019563711A JP2019563711A JP7242557B2 JP 7242557 B2 JP7242557 B2 JP 7242557B2 JP 2019563711 A JP2019563711 A JP 2019563711A JP 2019563711 A JP2019563711 A JP 2019563711A JP 7242557 B2 JP7242557 B2 JP 7242557B2
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/22—Metallic printing; Printing with powdered inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Description
一連のネオデカン酸銀(AgND)系インクを、表1に記載のように配合した。インクI1、I2及びI3は本発明に従って配合され、インクC1及びC2はAgND系インクの他の配合物の比較試料である。インクは、インクの分解温度に影響を与える様々な種類の担体を有する。各インクは、担体の最大重量分率を構成する異なる成分、すなわちオクタノール(インクI1及びインクC2)、アルキルアミン(インクI2)、オキサゾリン(インクI3)並びにテルペンアルコール(インクC1)を有する。
Claims (15)
- 分子インクであって、
インクの総重量を基準として、インク中に23重量%以上の銀充填量をもたらす量でインク中に存在する、カルボン酸銀;
インクの総重量を基準として5重量%~50重量%の有機アミンであって、アルキルアミン、ヒドロキシアルキルアミン又は環状アミンを含む、有機アミン;並びに
インクの総重量を基準として0.1重量%~10重量%の高分子バインダーであって、ポリエステル、ポリイミド、ポリエーテルイミド又はそれらの任意の混合物を含み、当該高分子バインダーを前記有機アミンと相溶性にする官能基を有し、当該官能基は、ヒドロキシル基、カルボキシル基、アミノ基及びスルホニル基のうちの1つ又は複数である、高分子バインダー、
を含み、前記カルボン酸銀はネオデカン酸銀である、分子インク。 - 前記ネオデカン酸銀が、前記インクの総重量を基準として70重量%以上の量で存在する、請求項1に記載のインク。
- 前記有機アミンが、ピリジン、ピリミジン、ピロール、ピロリジン、オキサゾリン、ピペリジン、イソオキサゾール又はモルホリンを含む、請求項1又は2に記載のインク。
- 前記有機アミンが、アミノ-2-プロパノール、2-エチル-1-ヘキシルアミン又は2-エチル-2-オキサゾリンを含む、請求項1又は2に記載のインク。
- 前記高分子バインダーが、ヒドロキシル末端及び/又はカルボキシル末端ポリエステルを含む、請求項1~4のいずれか一項に記載のインク。
- 前記高分子バインダーが、前記インクの総重量を基準として0.5重量%~10重量%の量で存在する、請求項1~5のいずれか一項に記載のインク。
- 溶媒を、前記インクの総重量を基準として5重量%から40重量%の範囲内の量でさらに含む、請求項1~6のいずれか一項に記載のインク。
- 前記溶媒が、オクタノールを含む、請求項7に記載のインク。
- 20.5℃でULアダプターを有するBrookfield RV-DV-IIIウルトラレオメータを使用して測定された、1cP~15,000cPの粘度を有する、請求項1~8のいずれか一項に記載のインク。
- 基板上に導電性銀トレースを製造する方法であって、請求項1~9のいずれか一項に定義のインクを基板上に堆積させて、前記基板上に前記インクの非導電性トレースを形成する工程と、前記基板上の前記インクの前記非導電性トレースを焼結して、前記導電性銀トレースを形成する工程とを含む方法。
- 前記焼結が、150℃~175℃の範囲内の温度で、1分~120分の範囲内の時間にわたって行われる、請求項10に記載の方法。
- 前記基板が、ポリエチレンテレフタラート、ポリオレフィン、ポリジメチルシロキサン、ポリスチレン、アクリロニトリル/ブタジエン/スチレン、ポリカーボネート、ポリイミド、熱可塑性ポリウレタン、シリコーン膜、ウール、シルク、綿、亜麻、ジュート、モーダル、竹、ナイロン、ポリエステル、アクリル、アラミド、スパンデックス、ポリラクチド、紙、ガラス、コーティングガラス、金属又は誘電体コーティングを含む、請求項10又は11に記載の方法。
- 前記堆積が、印刷を含む、請求項10~12のいずれか一項に記載の方法。
- 請求項1~9のいずれか一項に定義のインクから製造された導電性銀トレースを備える基板。
- 請求項14に定義の基板を備える電子デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762456322P | 2017-02-08 | 2017-02-08 | |
US62/456,322 | 2017-02-08 | ||
PCT/IB2018/050791 WO2018146619A2 (en) | 2017-02-08 | 2018-02-08 | Silver molecular ink with low viscosity and low processing temperature |
Publications (3)
Publication Number | Publication Date |
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JP2020510740A JP2020510740A (ja) | 2020-04-09 |
JP2020510740A5 JP2020510740A5 (ja) | 2021-03-18 |
JP7242557B2 true JP7242557B2 (ja) | 2023-03-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2019563711A Active JP7242557B2 (ja) | 2017-02-08 | 2018-02-08 | 低粘度及び低処理温度を有する銀分子インク |
Country Status (8)
Country | Link |
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US (1) | US11746246B2 (ja) |
EP (1) | EP3580285B1 (ja) |
JP (1) | JP7242557B2 (ja) |
KR (1) | KR102568858B1 (ja) |
CN (1) | CN110382638A (ja) |
CA (1) | CA3052747A1 (ja) |
FI (1) | FI3580285T3 (ja) |
WO (1) | WO2018146619A2 (ja) |
Families Citing this family (2)
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TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
KR102218363B1 (ko) * | 2019-11-26 | 2021-02-19 | 백운석 | Ehd 잉크젯 프린팅용 실버계 잉크 조성물 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005537386A (ja) | 2001-10-05 | 2005-12-08 | スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー | 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法 |
WO2012133767A1 (ja) | 2011-03-31 | 2012-10-04 | ナミックス株式会社 | 熱伝導性組成物及び熱伝導体 |
CN104263082A (zh) | 2014-08-29 | 2015-01-07 | 南京航空航天大学 | 一种石墨烯有机银导电油墨及其制备方法 |
JP2015109273A (ja) | 2013-11-13 | 2015-06-11 | ゼロックス コーポレイションXerox Corporation | 金属カルボン酸塩を含む導電性組成物 |
WO2015192248A1 (en) | 2014-06-19 | 2015-12-23 | National Research Council Of Canada | Molecular inks |
US20160168408A1 (en) | 2014-08-05 | 2016-06-16 | Pesolve Co., Ltd. | Silver ink |
Family Cites Families (119)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4099376A (en) | 1955-06-29 | 1978-07-11 | The B.F. Goodrich Company | Gas generator and solid propellant with a silicon-oxygen compound as a burning rate modifier, and method for making the same |
US3228897A (en) | 1961-10-26 | 1966-01-11 | Minnesota Mining & Mfg | Reflective coating compositions containing glass beads, metal flake pigment and binder |
US3729339A (en) * | 1970-11-25 | 1973-04-24 | Owens Illinois Inc | Hydroxy functional acrylic ink |
US3702259A (en) | 1970-12-02 | 1972-11-07 | Shell Oil Co | Chemical production of metallic silver deposits |
JPS5413260B2 (ja) | 1973-09-04 | 1979-05-29 | ||
US3989644A (en) | 1974-09-27 | 1976-11-02 | General Electric Company | Radiation curable inks |
US4088801A (en) | 1976-04-29 | 1978-05-09 | General Electric Company | U.V. Radiation curable electrically conductive ink and circuit boards made therewith |
US4180407A (en) | 1977-03-28 | 1979-12-25 | Gibson Donald M | Ink for application to unglazed paper surfaces |
DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
US4487811A (en) | 1980-12-29 | 1984-12-11 | General Electric Company | Electrical conductor |
US4396666A (en) | 1981-11-02 | 1983-08-02 | Cts Corporation | Solderable conductive employing an organic binder |
JPS604552A (ja) | 1983-06-23 | 1985-01-11 | Mitsubishi Gas Chem Co Inc | 導電性組成物 |
JPS61136978A (ja) | 1984-12-06 | 1986-06-24 | アルプス電気株式会社 | 厚膜回路形成用導電ペ−スト |
US4687597A (en) | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
US4775594A (en) | 1986-06-20 | 1988-10-04 | James River Graphics, Inc. | Ink jet transparency with improved wetting properties |
DE3706860A1 (de) | 1987-03-04 | 1988-09-15 | Byk Chemie Gmbh | Thixotrope zubereitungen, verwendung von polycarbonsaeureamiden zu ihrer herstellung und mit polycarbonsaeureamiden beschichtetes siliciumdioxid |
JPS63278983A (ja) | 1987-05-09 | 1988-11-16 | Toyota Autom Loom Works Ltd | 金属有機物インク |
DE3810958A1 (de) | 1988-03-31 | 1989-10-12 | Basf Ag | Tinten fuer ink-jet-aufzeichnungsverfahren |
US5064921A (en) * | 1989-06-07 | 1991-11-12 | Bayer Aktiengesellschaft | Hydroxy functional copolymers, a process for the preparation and their use as binders or binder components |
JP2619289B2 (ja) | 1989-06-20 | 1997-06-11 | 三井金属鉱業株式会社 | 銅導電性組成物 |
JP2660937B2 (ja) | 1990-07-16 | 1997-10-08 | 三井金属鉱業株式会社 | 銅導電性組成物 |
CN1071182A (zh) | 1991-09-28 | 1993-04-21 | 胡贵友 | 热敏变色油墨 |
US5306590A (en) * | 1991-12-23 | 1994-04-26 | Xerox Corporation | High solids liquid developer containing carboxyl terminated polyester toner resin |
JPH08113696A (ja) * | 1994-10-14 | 1996-05-07 | Toray Dow Corning Silicone Co Ltd | 粉体塗料用樹脂組成物 |
US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
US5989700A (en) | 1996-01-05 | 1999-11-23 | Tekscan Incorporated | Pressure sensitive ink means, and methods of use |
EP0885461B1 (en) | 1996-03-04 | 2003-08-13 | DuPont Displays, Inc. | Polyfluorenes as materials for photoluminescence and electroluminescence |
AU5561696A (en) | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
JP3912844B2 (ja) | 1997-04-09 | 2007-05-09 | キヤノン株式会社 | 有機金属を含有するインク並びに電極、電子放出素子および画像形成装置の製造方法 |
US5980622A (en) | 1997-08-29 | 1999-11-09 | Hewlett-Packard Company | Magenta dyes for ink-jet inks |
US6048389A (en) | 1998-02-18 | 2000-04-11 | Eastman Kodak Company | Ink jet inks containing modifiers for improved drop formation |
US20030148024A1 (en) | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
JP3813750B2 (ja) | 1998-08-27 | 2006-08-23 | 大日精化工業株式会社 | カラーフィルターの製造方法及びカラーフィルター |
ES2185549T3 (es) | 1999-09-27 | 2003-05-01 | Ciba Sc Holding Ag | Tintas de color rojo carmesi (magenta) que contienen colorantes azoicos de complejo de cobre basados en acidos 1-naftol-di- o -trisulfonicos. |
US6663799B2 (en) | 2000-09-28 | 2003-12-16 | Jsr Corporation | Conductive metal particles, conductive composite metal particles and applied products using the same |
US7629017B2 (en) | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
IL162005A0 (en) | 2001-12-12 | 2005-11-20 | Du Pont | Copper deposition using copper formate complexes |
US6939578B2 (en) | 2002-01-18 | 2005-09-06 | E. I. Du Pont De Nemours And Company | Volatile copper(II) complexes for deposition of copper films by atomic layer deposition |
TW200416261A (en) | 2002-10-18 | 2004-09-01 | Nippon Kayaku Kk | Phthalocyanine compound for ink-jet printing, water-soluble green ink composition containing such compound and coloring substance using such composition |
JP2004162110A (ja) | 2002-11-12 | 2004-06-10 | Mitsubishi Paper Mills Ltd | 銅/アミン組成物 |
US7211205B2 (en) | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
US7141104B2 (en) | 2003-06-05 | 2006-11-28 | Agfa-Gevaert | UV-absorbing ink composition for ink-jet printing |
US20050070629A1 (en) | 2003-08-06 | 2005-03-31 | Roberts C. Chad | Inkjet ink |
US7731812B2 (en) | 2004-10-19 | 2010-06-08 | E.I. Du Pont De Nemours And Company | Thick film conductor case compositions for LTCC tape |
US7960037B2 (en) | 2004-12-03 | 2011-06-14 | The Regents Of The University Of California | Carbon nanotube polymer composition and devices |
JP4799881B2 (ja) | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006093398A1 (en) | 2005-03-04 | 2006-09-08 | Inktec Co., Ltd. | Conductive inks and manufacturing method thereof |
CN101237952B (zh) | 2005-04-20 | 2012-08-15 | 法布罗技术有限公司 | 微粒铜粉的制备 |
KR100815028B1 (ko) | 2005-10-05 | 2008-03-18 | 삼성전자주식회사 | 탄소나노튜브용 분산제 및 이를 포함하는 조성물 |
US8017863B2 (en) | 2005-11-02 | 2011-09-13 | The Regents Of The University Of Michigan | Polymer wrapped carbon nanotube near-infrared photoactive devices |
TWI312799B (en) | 2005-12-30 | 2009-08-01 | Ind Tech Res Inst | Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern |
JP5205717B2 (ja) | 2006-07-04 | 2013-06-05 | セイコーエプソン株式会社 | ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法 |
JP5045015B2 (ja) | 2006-07-28 | 2012-10-10 | セイコーエプソン株式会社 | ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法 |
EP2752470A1 (en) | 2006-08-07 | 2014-07-09 | Inktec Co., Ltd. | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
CN101583650B (zh) * | 2006-11-14 | 2012-01-18 | 巴斯夫欧洲公司 | 高度支化或超支化聚酯及其生产和应用 |
JP2008205430A (ja) | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
KR20080083790A (ko) | 2007-03-13 | 2008-09-19 | 삼성전자주식회사 | 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법 |
EP2042536A1 (en) * | 2007-09-20 | 2009-04-01 | Hexion Specialty Chemicals Research Belgium S.A. | Hydroxyl polyester resins for dye ink sublimation |
WO2009079004A1 (en) | 2007-12-18 | 2009-06-25 | Lumimove, Inc., Dba Crosslink | Flexible electroluminescent devices and systems |
CN101519356A (zh) | 2008-02-28 | 2009-09-02 | 华东理工大学 | 螺环双亚胺和制备方法及其应用 |
JP5292857B2 (ja) | 2008-03-03 | 2013-09-18 | 東レ株式会社 | 有機半導体コンポジット、有機トランジスタ材料ならびに有機電界効果型トランジスタ |
US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
CN102850728B (zh) | 2008-04-11 | 2015-07-22 | 索尔维美国有限公司 | 掺杂共轭聚合物、器件及器件的制造方法 |
JP2009256218A (ja) | 2008-04-14 | 2009-11-05 | Toray Ind Inc | 銅前駆体組成物およびそれを用いた銅膜の製造方法。 |
CN101271929B (zh) | 2008-05-04 | 2012-02-01 | 常州亿晶光电科技有限公司 | 无铅太阳能电池银浆及其制备方法 |
JP5470763B2 (ja) | 2008-07-10 | 2014-04-16 | 東レ株式会社 | カーボンナノチューブ分散溶液、有機半導体コンポジット溶液、有機半導体薄膜ならびに有機電界効果型トランジスタ |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
WO2010128107A1 (en) | 2009-05-07 | 2010-11-11 | Neodec B.V. | Process for manufacturing conductive tracks |
SG10201500985UA (en) | 2009-11-09 | 2015-04-29 | Univ Carnegie Mellon | Metal ink compositions, conductive patterns, methods, and devices |
WO2011156095A2 (en) | 2010-06-10 | 2011-12-15 | The Regents Of The University Of California | Textile-based printable electrodes for electrochemical sensing |
JP5906027B2 (ja) | 2010-07-30 | 2016-04-20 | トッパン・フォームズ株式会社 | 装飾用又は鏡面用インク組成物、基材及び金属銀層を表面に供えた基材の製造方法 |
WO2012026791A2 (ko) | 2010-08-27 | 2012-03-01 | 주식회사 엘지화학 | 전도성 금속 잉크 조성물 및 전도성 패턴의 형성방법 |
KR20120046457A (ko) | 2010-11-02 | 2012-05-10 | 삼성전자주식회사 | 금속 잉크 조성물, 이를 이용한 전도성 금속막 형성방법 및 이를 이용한 전도성 금속막 |
KR101276237B1 (ko) | 2010-12-02 | 2013-06-20 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
WO2012135551A1 (en) | 2011-03-29 | 2012-10-04 | Sun Chemical Corporation | High-aspect ratio screen printable thick film paste compositions containing wax thixotropes |
JP6041517B2 (ja) | 2011-04-22 | 2016-12-07 | トッパン・フォームズ株式会社 | 銀インク組成物 |
CN102270514A (zh) | 2011-05-03 | 2011-12-07 | 华中科技大学 | 一种均相导电浆料 |
JP2012236870A (ja) | 2011-05-10 | 2012-12-06 | Seiko Epson Corp | インクジェット記録方法、記録物およびインクセット |
KR20120132424A (ko) | 2011-05-27 | 2012-12-05 | 한양대학교 산학협력단 | 전도성 구리 나노잉크의 광소결 방법 |
KR102020914B1 (ko) | 2011-09-06 | 2019-09-11 | 헨켈 아이피 앤드 홀딩 게엠베하 | 전도성 물질 및 방법 |
WO2013063320A1 (en) | 2011-10-28 | 2013-05-02 | Liquid X Printed Metals, Inc. | Transparent conductive- and ito-replacement materials and structures |
CN103946419B (zh) | 2011-11-15 | 2016-04-13 | 日油株式会社 | 用于形成铜图形的组合物及铜图形的制备方法 |
WO2013073331A1 (ja) | 2011-11-17 | 2013-05-23 | Jsr株式会社 | 銅膜形成方法、銅膜、回路基板および銅膜形成組成物溶液 |
KR101151366B1 (ko) * | 2011-11-24 | 2012-06-08 | 한화케미칼 주식회사 | 도전성 입자 및 이의 제조방법 |
US9039942B2 (en) | 2011-12-21 | 2015-05-26 | E I Du Pont De Nemours And Company | Lead-free conductive paste composition and semiconductor devices made therewith |
KR102109390B1 (ko) | 2011-12-23 | 2020-05-12 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | 전도성 은 구조체 제조용 잉크 조성물 |
EP2820093A2 (en) | 2012-02-29 | 2015-01-07 | Yissum Research Development Company of the Hebrew University of Jerusalem Ltd. | Inks containing metal precursors nanoparticles |
JP5923351B2 (ja) | 2012-03-16 | 2016-05-24 | 株式会社Adeka | 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法 |
CN102618033B (zh) | 2012-03-28 | 2013-09-11 | 成都多吉昌新材料有限公司 | 一种组合物、含该组合物的led线路板基材和制作方法 |
IN2015DN00149A (ja) | 2012-07-09 | 2015-06-12 | Shikoku Chem | |
KR101941450B1 (ko) | 2012-08-02 | 2019-01-23 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
US8948839B1 (en) | 2013-08-06 | 2015-02-03 | L.I.F.E. Corporation S.A. | Compression garments having stretchable and conductive ink |
US8945328B2 (en) | 2012-09-11 | 2015-02-03 | L.I.F.E. Corporation S.A. | Methods of making garments having stretchable and conductive ink |
US10040960B2 (en) | 2012-09-28 | 2018-08-07 | Toppan Forms Co., Ltd. | Silver ink composition, conductor and communication device |
KR20140044743A (ko) | 2012-10-04 | 2014-04-15 | 한양대학교 산학협력단 | 전도성 하이브리드 구리잉크 및 이를 이용한 광소결 방법 |
CN102863845A (zh) | 2012-10-11 | 2013-01-09 | 复旦大学 | 印制电子用银有机导电油墨 |
CN103084581B (zh) | 2013-01-08 | 2015-02-04 | 河南大学 | 一种铜纳米线的制备方法 |
KR101350507B1 (ko) | 2013-01-09 | 2014-01-17 | (주)쎄미시스코 | 금속 나노입자를 포함하는 전기전도성 잉크 및 이의 광 소결 방법 |
JP2014148732A (ja) | 2013-02-04 | 2014-08-21 | Yamagata Univ | 新規被覆銅微粒子及びその製造方法 |
JP2014182913A (ja) | 2013-03-19 | 2014-09-29 | Fujifilm Corp | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
US9283618B2 (en) * | 2013-05-15 | 2016-03-15 | Xerox Corporation | Conductive pastes containing silver carboxylates |
US9198288B2 (en) | 2013-05-15 | 2015-11-24 | Xerox Corporation | Method of making silver carboxylates for conductive ink |
US20140349025A1 (en) | 2013-05-23 | 2014-11-27 | E I Du Pont De Nemours And Company | Conductive compositions and methods relating thereto |
WO2015024115A1 (en) | 2013-08-20 | 2015-02-26 | National Research Council Of Canada | Process for purifying semiconducting single-walled carbon nanotubes |
KR20150045605A (ko) | 2013-10-21 | 2015-04-29 | 전자부품연구원 | 구리 잉크 조성물 및 이를 이용한 도전 패턴 형성 방법 |
KR101597651B1 (ko) | 2013-12-30 | 2016-02-25 | 전자부품연구원 | 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법 |
KR102233293B1 (ko) | 2014-01-15 | 2021-03-29 | (주)창성 | 구리포메이트-아민 컴플렉스를 포함하는 잉크 조성물의 제조방법 |
EP2918371A1 (en) | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
JP6468889B2 (ja) | 2014-03-11 | 2019-02-13 | 三井金属鉱業株式会社 | 導電性組成物、及びそれを用いた導電体の製造方法 |
US20150298248A1 (en) | 2014-04-17 | 2015-10-22 | Electroninks Incorporated | Bonded structure including a conductive bonding layer and low-temperature method of forming a bonded structure |
US10301497B2 (en) | 2014-04-17 | 2019-05-28 | Electroninks Incorporated | Conductive ink compositions |
US9982154B2 (en) | 2014-04-17 | 2018-05-29 | Electroninks Incorporated | Solid ink composition |
US9460824B2 (en) | 2014-04-23 | 2016-10-04 | Xerox Corporation | Stretchable conductive film based on silver nanoparticles |
KR20170017908A (ko) | 2014-05-30 | 2017-02-15 | 일렉트로닌크스 라이트에이블스, 인코포레이티드 | 롤러볼펜용 전도성 잉크 및 기판 상에 형성된 전도성 트레이스 |
EP3172739B1 (en) | 2014-07-22 | 2020-01-08 | Alpha Assembly Solutions Inc. | Stretchable interconnects for flexible electronic surfaces |
US9809489B2 (en) | 2014-09-12 | 2017-11-07 | Jsr Corporation | Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device |
CN104479463B (zh) | 2015-01-09 | 2017-07-21 | 东北大学 | 一种含有草酸银的透明导电无颗粒银基墨水及其制备方法 |
CN106147405A (zh) | 2016-07-06 | 2016-11-23 | 复旦大学 | 铜导电油墨及铜导电油墨、铜导电薄膜的制备方法 |
-
2018
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005537386A (ja) | 2001-10-05 | 2005-12-08 | スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー | 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法 |
WO2012133767A1 (ja) | 2011-03-31 | 2012-10-04 | ナミックス株式会社 | 熱伝導性組成物及び熱伝導体 |
JP2015109273A (ja) | 2013-11-13 | 2015-06-11 | ゼロックス コーポレイションXerox Corporation | 金属カルボン酸塩を含む導電性組成物 |
WO2015192248A1 (en) | 2014-06-19 | 2015-12-23 | National Research Council Of Canada | Molecular inks |
US20160168408A1 (en) | 2014-08-05 | 2016-06-16 | Pesolve Co., Ltd. | Silver ink |
CN104263082A (zh) | 2014-08-29 | 2015-01-07 | 南京航空航天大学 | 一种石墨烯有机银导电油墨及其制备方法 |
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