JP7229093B2 - ブレード脱着補助装置 - Google Patents
ブレード脱着補助装置 Download PDFInfo
- Publication number
- JP7229093B2 JP7229093B2 JP2019090878A JP2019090878A JP7229093B2 JP 7229093 B2 JP7229093 B2 JP 7229093B2 JP 2019090878 A JP2019090878 A JP 2019090878A JP 2019090878 A JP2019090878 A JP 2019090878A JP 7229093 B2 JP7229093 B2 JP 7229093B2
- Authority
- JP
- Japan
- Prior art keywords
- nut
- blade
- spindle
- detachment
- gripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/06—Features relating to the removal of tools; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
- B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
- B23B31/18—Chucks with simultaneously-acting jaws, whether or not also individually adjustable pivotally movable in planes containing the axis of the chuck
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
- B27B5/00—Sawing machines working with circular or cylindrical saw blades; Components or equipment therefor
- B27B5/29—Details; Component parts; Accessories
- B27B5/30—Details; Component parts; Accessories for mounting or securing saw blades or saw spindles
- B27B5/32—Devices for securing circular saw blades to the saw spindle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
- B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
- B23B31/1261—Chucks with simultaneously-acting jaws, whether or not also individually adjustable pivotally movable in a radial plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/003—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B33/00—Hand tools not covered by any other group in this subclass
- B25B33/005—Chuck keys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/18—Pivoted jaw
- Y10T279/182—Cam-sleeve actuated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/34—Accessory or component
- Y10T279/3431—Chuck key
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T483/00—Tool changing
- Y10T483/17—Tool changing including machine tool or component
- Y10T483/1733—Rotary spindle machine tool [e.g., milling machine, boring, machine, grinding machine, etc.]
- Y10T483/1736—Tool having specific mounting or work treating feature
- Y10T483/174—Abrading wheel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明の実施形態1に係るブレード脱着補助装置を図面に基づいて説明する。図1は、実施形態1に係るブレード脱着補助装置の構成を示す斜視図である。図2は、図1に示されたブレード脱着補助装置を備える切削装置の構成例を示す斜視図である。図3は、図2に示された切削装置の切削ユニットの一部を分解して示す斜視図である。図4は、図2に示された切削装置のブレード脱着機構の構成例を示す斜視図である。図5は、図1中のV-V線に沿う断面図である。図6は、図1中のVI-VI線に沿う断面図である。
図1に示す実施形態1に係るブレード脱着補助装置1は、図2に示す切削装置100を構成する。切削装置100は、図1に示す被加工物200を切削(加工)する装置である。実施形態1では、被加工物200は、シリコン、サファイア、ガリウムなどを母材とする円板状の半導体ウエーハや光デバイスウエーハ等のウエーハである。被加工物200は、表面201に格子状に形成された複数の分割予定ライン202によって格子状に区画された領域にデバイス203が形成されている。
ブレード脱着補助装置1は、切削装置100に使用する装置である。ブレード脱着補助装置1は、図1、図4及び図5に示すように、回転軸部2と、ナット回転部10と、ナット把持部50と、ハウジング部30と、ロック機構60とを備える。
本発明の実施形態1の変形例に係るブレード脱着補助装置を図面に基づいて説明する。図21は、実施形態1の変形例に係るブレード脱着補助装置の断面図である。なお、図21は、実施形態1と同一部分に同一符号を付し説明を省略する。
2 回転軸部
10 ナット回転部
12 係合ピン(係合部)
23,23-2 ばね(付勢部、弾性部材)
30 ハウジング部
38 内側面(突出規制部)
50 ナット把持部
60 ロック機構
100 切削装置
121 ブレード
123 スピンドル
126 ナット
127 回転停止部
134 表面
135 係合穴(被係合部)
136 環状溝(外周部)
182 ブレードチャック(ブレード保持部)
183 進退ユニット
301 一方向(緩む方向)
Claims (4)
- スピンドルに装着されるブレードと、該ブレードを前記スピンドルに固定するためのナットと、該スピンドルの回転を規制する回転停止部と、を含む切削装置に使用するブレード脱着補助装置であって、
該ナットの表面の被係合部に係合する係合部を備えるナット回転部と、
該ナット回転部に配置され、該ナットの外周部を把持するナット把持部と、
該ナット回転部を所定角度回転可能に支持しつつ囲繞するハウジング部と、
該ナット把持部が該ナットの外周部に係合した状態を維持するロック機構と、を備え、
該ナット回転部は、
該ナット把持部が該ナットの外周部に脱着可能な突出位置と、該ナット把持部が該ハウジング部に収容され該ナット把持部と該ナットとの係合が維持される固定位置とに、該ハウジング部に対し進退可能に配置され、
該ナット回転部を該突出位置に押し出す付勢部を介して該ハウジング部に固定され、
該ロック機構は、
該ナット回転部が押し込まれ該固定位置で、該ナットが緩む方向へ該ハウジング部を回転させると、該ハウジング部が該ナット回転部に対し回転し所定の向きに位置付けられると、該ナット回転部と該ハウジング部が係合し、該ナット回転部の進退が規制される突出規制部と、を備えるブレード脱着補助装置。 - 該ナット回転部は、該ハウジング部に遊嵌し、回転軸部または該ハウジング部に弾性部材で傾き自在に支持されている請求項1に記載のブレード脱着補助装置。
- 該ナットの表面の被係合部は係合穴であり、該ナット回転部の係合部は係合ピンであり、係合する方向に進退可能に配置される請求項1又は請求項2に記載のブレード脱着補助装置。
- 該ブレード脱着補助装置は、該スピンドルに固定したブレードを保持するブレード保持部と共に、該切削装置の該スピンドルに対して進退する進退ユニットに固定される請求項1、請求項2又は請求項3に記載のブレード脱着補助装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019090878A JP7229093B2 (ja) | 2019-05-13 | 2019-05-13 | ブレード脱着補助装置 |
SG10202003591TA SG10202003591TA (en) | 2019-05-13 | 2020-04-20 | Blade attachment-detachment assisting apparatus |
MYPI2020001986A MY197790A (en) | 2019-05-13 | 2020-04-21 | Blade attachment-detachment assisting apparatus |
CN202010355469.2A CN111923257B (zh) | 2019-05-13 | 2020-04-29 | 刀具装卸辅助装置 |
KR1020200056073A KR20200131177A (ko) | 2019-05-13 | 2020-05-11 | 블레이드 탈착 보조 장치 |
TW109115577A TWI826688B (zh) | 2019-05-13 | 2020-05-11 | 刀片裝卸輔助裝置 |
US16/872,905 US11192190B2 (en) | 2019-05-13 | 2020-05-12 | Blade attachment-detachment assisting apparatus |
DE102020206017.7A DE102020206017A1 (de) | 2019-05-13 | 2020-05-13 | Klingen-anbring-abnehm-unterstützungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019090878A JP7229093B2 (ja) | 2019-05-13 | 2019-05-13 | ブレード脱着補助装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020185633A JP2020185633A (ja) | 2020-11-19 |
JP7229093B2 true JP7229093B2 (ja) | 2023-02-27 |
Family
ID=73019220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019090878A Active JP7229093B2 (ja) | 2019-05-13 | 2019-05-13 | ブレード脱着補助装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11192190B2 (ja) |
JP (1) | JP7229093B2 (ja) |
KR (1) | KR20200131177A (ja) |
CN (1) | CN111923257B (ja) |
DE (1) | DE102020206017A1 (ja) |
MY (1) | MY197790A (ja) |
SG (1) | SG10202003591TA (ja) |
TW (1) | TWI826688B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019115386A1 (de) * | 2019-06-06 | 2020-12-10 | Wto Vermögensverwaltung Gmbh | Bedienschlüssel für stehende und angetriebene Werkzeughalter |
CN112428024B (zh) * | 2020-11-16 | 2022-03-29 | 湖北毅兴智能装备股份有限公司 | 机床的进刀锁紧机构 |
CN112677349A (zh) * | 2020-12-18 | 2021-04-20 | 江苏汇成光电有限公司 | 一种切割机换刀治具 |
CN115351699B (zh) * | 2022-07-05 | 2024-01-12 | 苏州信能精密机械有限公司 | 一种薄壁盘状柔轮珩磨用装夹装置及珩磨机床 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004281700A (ja) | 2003-03-14 | 2004-10-07 | Disco Abrasive Syst Ltd | ブレード着脱補助装置 |
JP2009269131A (ja) | 2008-05-08 | 2009-11-19 | Disco Abrasive Syst Ltd | ブレード脱着補助装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US2613943A (en) * | 1950-07-20 | 1952-10-14 | Morey Machinery Co Inc | Chucking device for lathes |
US4604787A (en) * | 1984-08-15 | 1986-08-12 | Transamerica Delaval Inc. | Tool changer for manipulator arm |
DE3532903A1 (de) * | 1985-09-14 | 1987-03-26 | Waldrich Werkzeugmasch | Portalschleifmaschine mit schleifscheiben-wechselvorrichtung |
DE3533090A1 (de) * | 1985-09-17 | 1987-03-26 | Salje Ernst | Vorrichtung zum wechseln von werkzeugen bei schleifoperationen |
US4924738A (en) * | 1988-11-25 | 1990-05-15 | Hue Nguyen Che | Bar puller with adjustable jaw-opening |
US5067376A (en) * | 1989-08-10 | 1991-11-26 | Gregory Fosella | Adjustable extension wrench for ratchet drive |
JP3183367B2 (ja) * | 1993-03-08 | 2001-07-09 | 豊和工業株式会社 | フィンガーチャック |
JP4481667B2 (ja) * | 2004-02-02 | 2010-06-16 | 株式会社ディスコ | 切削方法 |
JP4837970B2 (ja) * | 2005-10-06 | 2011-12-14 | 株式会社ディスコ | 切削ブレードの交換装置 |
JP2007208114A (ja) * | 2006-02-03 | 2007-08-16 | Disco Abrasive Syst Ltd | 切削装置 |
DE102007044275A1 (de) * | 2007-09-17 | 2009-03-19 | Reform Maschinenfabrik Adolf Rabenseifner Gmbh & Co. Kg | Schleifmaschine, insbesondere Hochgeschwindigkeitsschleifmaschine |
US8591389B2 (en) * | 2009-10-23 | 2013-11-26 | Fuji Seiko Limited | Tool transfer system |
JP5216075B2 (ja) * | 2010-12-22 | 2013-06-19 | Towa株式会社 | ブレード着脱装置 |
JP5723837B2 (ja) * | 2012-07-18 | 2015-05-27 | Towa株式会社 | ブレード着脱装置 |
JP6501815B2 (ja) * | 2017-04-04 | 2019-04-17 | Dmg森精機株式会社 | 主軸回転速度制御装置 |
JP6560714B2 (ja) * | 2017-06-26 | 2019-08-14 | Towa株式会社 | ブレード交換機構、切断装置およびブレード交換方法 |
JP6966883B2 (ja) * | 2017-07-04 | 2021-11-17 | 株式会社ディスコ | ブレード脱着治具、ブレード脱着方法、ブレード取り出し方法、及び切削装置 |
JP7206065B2 (ja) * | 2018-07-26 | 2023-01-17 | 株式会社ディスコ | 切削装置 |
-
2019
- 2019-05-13 JP JP2019090878A patent/JP7229093B2/ja active Active
-
2020
- 2020-04-20 SG SG10202003591TA patent/SG10202003591TA/en unknown
- 2020-04-21 MY MYPI2020001986A patent/MY197790A/en unknown
- 2020-04-29 CN CN202010355469.2A patent/CN111923257B/zh active Active
- 2020-05-11 KR KR1020200056073A patent/KR20200131177A/ko active Search and Examination
- 2020-05-11 TW TW109115577A patent/TWI826688B/zh active
- 2020-05-12 US US16/872,905 patent/US11192190B2/en active Active
- 2020-05-13 DE DE102020206017.7A patent/DE102020206017A1/de active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004281700A (ja) | 2003-03-14 | 2004-10-07 | Disco Abrasive Syst Ltd | ブレード着脱補助装置 |
JP2009269131A (ja) | 2008-05-08 | 2009-11-19 | Disco Abrasive Syst Ltd | ブレード脱着補助装置 |
Also Published As
Publication number | Publication date |
---|---|
US11192190B2 (en) | 2021-12-07 |
US20200361006A1 (en) | 2020-11-19 |
CN111923257A (zh) | 2020-11-13 |
MY197790A (en) | 2023-07-14 |
DE102020206017A1 (de) | 2020-11-19 |
TW202041316A (zh) | 2020-11-16 |
TWI826688B (zh) | 2023-12-21 |
SG10202003591TA (en) | 2020-12-30 |
JP2020185633A (ja) | 2020-11-19 |
KR20200131177A (ko) | 2020-11-23 |
CN111923257B (zh) | 2023-03-28 |
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