JP7227318B2 - Icダイ、プローブ、及び超音波システム - Google Patents
Icダイ、プローブ、及び超音波システム Download PDFInfo
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- JP7227318B2 JP7227318B2 JP2021122857A JP2021122857A JP7227318B2 JP 7227318 B2 JP7227318 B2 JP 7227318B2 JP 2021122857 A JP2021122857 A JP 2021122857A JP 2021122857 A JP2021122857 A JP 2021122857A JP 7227318 B2 JP7227318 B2 JP 7227318B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
- H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medical Informatics (AREA)
- General Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Biophysics (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Mechanical Engineering (AREA)
- Gynecology & Obstetrics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Surgical Instruments (AREA)
Description
Claims (17)
- 集積回路ダイであって、
複数の回路要素を画成する基板と、
前記基板上に形成されたセンサ領域であり、複数の超音波トランスデューサセルを画成するレイヤスタックを有するセンサ領域と、
前記センサ領域の単一の辺に隣接して前記基板上に形成された唯一のインターポーザ領域であり、当該インターポーザ領域は、前記回路要素及び前記超音波トランスデューサセルへの導電接続を含む更なるレイヤスタックを有し、前記導電接続は、当該インターポーザ領域の上面上の複数の導電コンタクト領域に接続されており、前記導電コンタクト領域は、当該集積回路ダイを外部接続ケーブルに接触させるための外部コンタクトと、前記上面に受動コンポーネントをマウントするためのマウントパッドとを含む、インターポーザ領域と、
を有し、
前記外部コンタクトは、前記センサ領域と前記インターポーザ領域との間の境界とは反対側の前記インターポーザ領域の前記上面のエッジに沿って配置された第1の外部コンタクト領域を有し、前記マウントパッドは、前記境界と前記第1の外部コンタクト領域との間に配置されている、
集積回路ダイ。 - 前記基板と、前記センサ領域及び前記インターポーザ領域と、の間のメタライゼーションスタック、を更に有する請求項1に記載の集積回路ダイ。
- 前記上面の前記マウントパッドにマウントされた少なくとも1つの受動コンポーネント、を更に有する請求項1又は2に記載の集積回路ダイ。
- 前記少なくとも1つの受動コンポーネントは、デカップリングキャパシタ又はバイパスキャパシタを有する、請求項3に記載の集積回路ダイ。
- 前記インターポーザ領域は、前記センサ領域に対してリセス化されている、請求項1乃至4の何れかに記載の集積回路ダイ。
- 前記外部コンタクトは更に、
前記第1の外部コンタクト領域と前記境界との間の第2の外部コンタクト領域と
を有する、請求項1乃至5の何れかに記載の集積回路ダイ。 - 前記第1の外部コンタクト領域は、当該集積回路ダイを接地するための少なくとも1つの外部コンタクトを有し、前記第2の外部コンタクト領域は、当該集積回路ダイを外部接続ケーブルに接触させるための外部コンタクトのアレイを有する、請求項6に記載の集積回路ダイ。
- 前記第2の外部コンタクト領域は、当該集積回路ダイを前記外部接続ケーブルに接触させるための外部コンタクトの更なるアレイを有し、該更なるアレイは、前記アレイと前記境界との間に位置する、請求項7に記載の集積回路ダイ。
- 前記外部コンタクトは、アレイ状の外部コンタクトを有し、前記上面は更に、前記アレイ状の外部コンタクトと、前記センサ領域と前記インターポーザ領域との間の境界と、の間のアレイ状のアライメント部材を有し、前記アレイ状の外部コンタクトの各外部コンタクトが、前記アレイ状のアライメント部材内の一対の隣接するアライメント部材の間に位置し、前記アレイ状のアライメント部材の各アライメント部材が、前記インターポーザ領域の前記上面から延在する突起を形成する、請求項1乃至8の何れかに記載の集積回路ダイ。
- 前記導電コンタクト領域は、金及びニッケルのうちの少なくとも一方でめっきされている、請求項1乃至9の何れかに記載の集積回路ダイ。
- 前記外部接続ケーブルは、同軸ケーブル又はストリップラインを有する、請求項1乃至10の何れかに記載の集積回路ダイ。
- 請求項1乃至11の何れかに記載の集積回路ダイであり、少なくとも1つの受動コンポーネントが前記マウントパッド上にマウントされている集積回路ダイと、
前記外部コンタクトに取り付けられた外部接続ケーブルと、
を有するプローブ。 - 前記集積回路ダイと、前記外部コンタクトに取り付けられた前記外部接続ケーブルの少なくとも一部とが、樹脂封止内に封入されている、請求項12に記載のプローブ。
- 前記樹脂封止は、前記センサ領域の上に凹部を有する、請求項13に記載のプローブ。
- 当該プローブは、インターポーザ基板を有しない、請求項12乃至14の何れかに記載のプローブ。
- 請求項12乃至15の何れかに記載のプローブと、前記外部接続ケーブルによって前記プローブに接続された、前記プローブの外部の制御インタフェースと、を有する超音波システム。
- 当該超音波システムは超音波診断撮像システム又は超音波治療システムである、請求項16に記載の超音波システム。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562213811P | 2015-09-03 | 2015-09-03 | |
US62/213,811 | 2015-09-03 | ||
EP15198399 | 2015-12-08 | ||
EP15198399.6 | 2015-12-08 | ||
JP2018511238A JP6949829B2 (ja) | 2015-09-03 | 2016-08-19 | Icダイ、プローブ、及び超音波システム |
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JP2018511238A Division JP6949829B2 (ja) | 2015-09-03 | 2016-08-19 | Icダイ、プローブ、及び超音波システム |
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JP2021176565A JP2021176565A (ja) | 2021-11-11 |
JP7227318B2 true JP7227318B2 (ja) | 2023-02-21 |
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JP2018511238A Active JP6949829B2 (ja) | 2015-09-03 | 2016-08-19 | Icダイ、プローブ、及び超音波システム |
JP2021122857A Active JP7227318B2 (ja) | 2015-09-03 | 2021-07-28 | Icダイ、プローブ、及び超音波システム |
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Country Status (5)
Country | Link |
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US (2) | US11161146B2 (ja) |
EP (1) | EP3344401B1 (ja) |
JP (2) | JP6949829B2 (ja) |
CN (1) | CN108136440B (ja) |
WO (1) | WO2017036827A1 (ja) |
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2016
- 2016-08-19 US US15/757,170 patent/US11161146B2/en active Active
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EP3344401B1 (en) | 2022-04-06 |
US20220048071A1 (en) | 2022-02-17 |
CN108136440A (zh) | 2018-06-08 |
EP3344401A1 (en) | 2018-07-11 |
JP2021176565A (ja) | 2021-11-11 |
CN108136440B (zh) | 2021-06-15 |
WO2017036827A1 (en) | 2017-03-09 |
JP6949829B2 (ja) | 2021-10-13 |
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