JP7226580B2 - 半導体装置とその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 153
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 150000004767 nitrides Chemical class 0.000 claims description 91
- 210000000746 body region Anatomy 0.000 claims description 56
- 230000015556 catabolic process Effects 0.000 claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 238000001312 dry etching Methods 0.000 claims description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 11
- 239000013078 crystal Substances 0.000 description 9
- 239000012535 impurity Substances 0.000 description 9
- 230000005684 electric field Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- 229910002601 GaN Inorganic materials 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Description
次に、半導体装置1の製造方法を説明する。まず、図3に示されるように、エピタキシャル成長技術を利用して、GaN基板であるドレイン領域21の表面からn型GaNのドリフト領域22及びp型GaNのボディ領域24をこの順で積層し、窒化物半導体層20を準備する。なお、窒化物半導体層20には、第1溝TR1、第2溝TR2及びソース領域25の形成予定範囲を破線で示す。
Claims (7)
- 素子部と、前記素子部の周囲に配置されている周辺耐圧部と、に区画されている窒化物半導体層と、
前記窒化物半導体層の一方の主面に設けられているソース電極と、
前記窒化物半導体層の他方の主面に設けられているドレイン電極と、
絶縁ゲート部と、を備えており、
前記窒化物半導体層は、
前記素子部と前記周辺耐圧部に配置されている第1導電型のドリフト領域と、
前記素子部に配置されており、前記ドリフト領域上に設けられており、前記一方の主面に設けられた第1溝内に埋め込まれている第1導電型のJFET領域であって、前記JFET領域は前記窒化物半導体層の前記一方の主面から深さ方向に沿って先細りとなるテーパ形状を有している、JFET領域と、
前記素子部に配置されており、前記ドリフト領域上に設けられており、前記JFET領域に隣接している第2導電型のボディ領域と、
前記素子部に配置されており、前記ボディ領域によって前記JFET領域から隔てられている第1導電型のソース領域と、を有しており、
前記絶縁ゲート部は、前記素子部に配置されており、前記JFET領域と前記ソース領域を隔てている前記ボディ領域のチャネル部に対向しており、
前記窒化物半導体層の前記周辺耐圧部には、前記窒化物半導体層の前記一方の主面に第2溝が設けられており、
前記チャネル部に隣接する前記第1溝の側面の傾斜角が、前記第2溝の側面の傾斜角よりも小さく、
前記チャネル部に隣接する前記第1溝の側面の傾斜角は、前記ドリフト領域と前記ボディ領域のpn接合面と前記第1溝の側面との成す角度であり、
前記第2溝の側面の傾斜角は、前記第2溝の底面を前記第2溝の外に延長した仮想面と前記第2溝の側面との成す角度である、半導体装置。 - 前記第2溝の前記側面の前記傾斜角が、85~90°の範囲である、請求項1に記載の半導体装置。
- 前記チャネル部に隣接する前記第1溝の前記側面が前記窒化物半導体層の前記一方の主面に露出する輪郭が、m面に対して平行であり、
前記第2溝の前記側面が前記窒化物半導体層の前記一方の主面に露出する輪郭が、a面に対して平行である、請求項1又は2に記載の半導体装置。 - 前記ドリフト領域と前記ボディ領域の前記pn接合面が、前記第2溝の前記側面に露出している、請求項1~3のいずれか一項に記載の半導体装置。
- 第1導電型のドリフト領域と第2導電型のボディ領域が積層しており、一方の主面に前記ボディ領域が露出している窒化物半導体層を準備する工程と、
ドライエッチング技術を利用して、前記窒化物半導体層の前記一方の主面から前記ボディ領域を超えて前記ドリフト領域に達する溝を形成する工程であって、前記窒化物半導体層の素子部の一部に形成される第1溝と前記窒化物半導体層の周辺耐圧部に形成される第2溝が同時に形成される、溝を形成する工程と、
前記第1溝を埋め込むように第1導電型のJFET領域を形成する工程と、
前記ボディ領域によって前記JFET領域から隔てられている第1導電型のソース領域を形成する工程と、
前記JFET領域と前記ソース領域を隔てている前記ボディ領域のチャネル部に対向する絶縁ゲート部を形成する工程と、を備えており、
前記溝を形成する工程では、
前記チャネル部に隣接する前記第1溝の側面が前記窒化物半導体層の前記一方の主面に露出する輪郭をm面に対して平行とし、前記第2溝の側面が前記窒化物半導体層の前記一方の主面に露出する輪郭をa面に対して平行とし、前記第1溝と前記第2溝を同時に形成する、又は、
前記チャネル部に隣接する前記第1溝の側面が前記窒化物半導体層の前記一方の主面に露出する輪郭をa面に対して平行とし、前記第2溝の側面が前記窒化物半導体層の前記一方の主面に露出する輪郭をm面に対して平行とし、前記第1溝と前記第2溝を同時に形成する、
のいずれか一方を実施する、半導体装置の製造方法。 - 前記溝を形成する工程では、前記チャネル部に隣接する前記第1溝の前記側面が前記窒化物半導体層の前記一方の主面に露出する輪郭をm面に対して平行とし、前記第2溝の前記側面が前記窒化物半導体層の前記一方の主面に露出する輪郭をa面に対して平行とし、前記第1溝と前記第2溝を同時に形成する、請求項5に記載の半導体装置の製造方法。
- 前記溝を形成する工程では、アンテナ電力/バイアス電力の電力比が、4.3以上且つ6.9以下である、請求項6に記載の半導体装置の製造方法。
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WO2016104264A1 (ja) | 2014-12-25 | 2016-06-30 | 富士電機株式会社 | 半導体装置 |
JP2018182197A (ja) | 2017-04-19 | 2018-11-15 | 株式会社豊田中央研究所 | 窒化物半導体装置とその製造方法 |
JP2019071338A (ja) | 2017-10-06 | 2019-05-09 | トヨタ自動車株式会社 | 窒化物半導体装置 |
JP2019165165A (ja) | 2018-03-20 | 2019-09-26 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
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WO2016104264A1 (ja) | 2014-12-25 | 2016-06-30 | 富士電機株式会社 | 半導体装置 |
JP2018182197A (ja) | 2017-04-19 | 2018-11-15 | 株式会社豊田中央研究所 | 窒化物半導体装置とその製造方法 |
JP2019071338A (ja) | 2017-10-06 | 2019-05-09 | トヨタ自動車株式会社 | 窒化物半導体装置 |
JP2019165165A (ja) | 2018-03-20 | 2019-09-26 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
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