JP7221091B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP7221091B2 JP7221091B2 JP2019044907A JP2019044907A JP7221091B2 JP 7221091 B2 JP7221091 B2 JP 7221091B2 JP 2019044907 A JP2019044907 A JP 2019044907A JP 2019044907 A JP2019044907 A JP 2019044907A JP 7221091 B2 JP7221091 B2 JP 7221091B2
- Authority
- JP
- Japan
- Prior art keywords
- optical module
- frequency component
- electromagnetic wave
- optical
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2589—Bidirectional transmission
- H04B10/25891—Transmission components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Semiconductor Lasers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
Claims (6)
- 光信号の伝送に用いる光モジュールであって、
電子部品が配置される回路基板と、
前記回路基板の一方の主面に実装され、前記光信号の周波数に応じた所定の基準値以上の周波数で動作する高周波部品と、
前記回路基板の他方の主面に、平面視にて前記高周波部品と少なくとも一部が重畳して実装され、前記基準値未満の周波数で動作する低周波部品と、
前記低周波部品の、前記回路基板を向く第2面とは反対の第1面のみに配置された電磁波吸収体と、
を有することを特徴とする光モジュール。 - 請求項1に記載の光モジュールにおいて、
前記電磁波吸収体は、前記低周波部品の前記第1面のうち前記高周波部品と重畳する領域を覆って配置されていること、を特徴とする光モジュール。 - 請求項1に記載の光モジュールにおいて、
前記電磁波吸収体は、前記低周波部品の前記第1面の全体に配置されていること、を特徴とする光モジュール。 - 請求項1に記載の光モジュールにおいて、
前記電磁波吸収体は、前記低周波部品の前記第1面のうち、前記回路基板に接続される前記高周波部品の端子と重畳する領域に配置されていること、を特徴とする光モジュール。 - 請求項1から請求項4のいずれか1つに記載の光モジュールにおいて、
前記低周波部品は、マイクロプロセッサ及び電源回路の少なくともいずれかを含む集積回路であること、を特徴とする光モジュール。 - 請求項1から請求項5のいずれか1つに記載の光モジュールにおいて、
前記高周波部品は、前記光信号から電気信号に変換する光サブアセンブリ、前記電気信号を増幅する増幅回路、前記光信号を生成する半導体光素子を駆動する駆動回路、及びクロック・データ・リカバリ回路の少なくともいずれかを含む集積回路であること、を特徴とする光モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019044907A JP7221091B2 (ja) | 2019-03-12 | 2019-03-12 | 光モジュール |
US16/814,686 US10948670B2 (en) | 2019-03-12 | 2020-03-10 | Optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019044907A JP7221091B2 (ja) | 2019-03-12 | 2019-03-12 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020148853A JP2020148853A (ja) | 2020-09-17 |
JP7221091B2 true JP7221091B2 (ja) | 2023-02-13 |
Family
ID=72424069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019044907A Active JP7221091B2 (ja) | 2019-03-12 | 2019-03-12 | 光モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US10948670B2 (ja) |
JP (1) | JP7221091B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7484464B2 (ja) * | 2020-06-12 | 2024-05-16 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050152701A1 (en) | 2004-01-05 | 2005-07-14 | Linda Liu | Internal EMI shield for an optoelectronic module |
US20070237464A1 (en) | 2006-04-10 | 2007-10-11 | Aronson Lewis B | Electrical-optical active optical cable |
JP2008249856A (ja) | 2007-03-29 | 2008-10-16 | Fujitsu Ltd | 光送受信モジュール |
WO2016051800A2 (en) | 2014-10-01 | 2016-04-07 | Sumitomo Electric Industries, Ltd. | Optical transcevier and a method to assemble the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7013088B1 (en) * | 1999-05-26 | 2006-03-14 | Jds Uniphase Corporation | Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers |
US6755578B1 (en) * | 2000-12-08 | 2004-06-29 | Optical Communication Products, Inc. | Optical subassembly enclosure |
US20040218848A1 (en) * | 2003-04-30 | 2004-11-04 | Industrial Technology Research Institute | Flexible electronic/optical interconnection film assembly and method for manufacturing |
US7623360B2 (en) * | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
US10440799B2 (en) * | 2017-04-06 | 2019-10-08 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
-
2019
- 2019-03-12 JP JP2019044907A patent/JP7221091B2/ja active Active
-
2020
- 2020-03-10 US US16/814,686 patent/US10948670B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050152701A1 (en) | 2004-01-05 | 2005-07-14 | Linda Liu | Internal EMI shield for an optoelectronic module |
US20070237464A1 (en) | 2006-04-10 | 2007-10-11 | Aronson Lewis B | Electrical-optical active optical cable |
JP2008249856A (ja) | 2007-03-29 | 2008-10-16 | Fujitsu Ltd | 光送受信モジュール |
WO2016051800A2 (en) | 2014-10-01 | 2016-04-07 | Sumitomo Electric Industries, Ltd. | Optical transcevier and a method to assemble the same |
Also Published As
Publication number | Publication date |
---|---|
US10948670B2 (en) | 2021-03-16 |
US20200292768A1 (en) | 2020-09-17 |
JP2020148853A (ja) | 2020-09-17 |
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