JP7208954B2 - 柔軟なマイクロ加工のトランスジューサ装置及びその製造方法 - Google Patents
柔軟なマイクロ加工のトランスジューサ装置及びその製造方法 Download PDFInfo
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- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
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- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
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- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
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- H10N30/01—Manufacture or treatment
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- H10N30/2047—Membrane type
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- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
- B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
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Description
100b:トランスジューサ装置
100c:トランスジューサ装置
100d:トランスジューサ装置
104:取手部分
106:トランスジューサアレイ
108:遠方端
110:ワイヤ
124:取手
126:横向きのトランスジューサアレイ
128:遠方端
134:取手部分
136:二次元トランスジューサアレイ
138:遠方端
150:トランスジューサ素子
160:柔軟な基板
170:ワイヤ
172:患者
182:組織
184:結合流体
201:装置ウェハ
203:別のウェハ
204a、204b:***構造体
205:表面
216、230:空洞
224:第2の誘電体層
228:基準相互接続部
232:圧電素子
234:頂部電極
236:底部電極
238:ドライブ/センス相互接続部
240:サブアッセンブリ
241:変更されたサブアッセンブリ
244、254:犠牲的ウェハ
246:薄膜誘電体層
250、252:サブアッセンブリ
256:ポリマー層
258:接着材
260:導電性フィラー
262a、262b:接地接触部
264a、264b:ドライブ/センス接触部
266a、266b:接地相互接続部
268a、268b:ドライブ/センス相互接続部
280、282:開口
Claims (15)
- マイクロ加工のトランスジューサアレイを製造する方法において、
支持層(201)の第1の側に複数のトランスジューサ素子(214a、214b)を形成し、これは、
前記支持層の第1の側に第1の電極(236又は234)を形成すること、
前記支持層の第1の側に圧電素子(232)を形成すること、及び
前記支持層に第1の相互接続部(228又は238)を形成して前記第1の電極に接続すること、
を含み;
前記支持層を薄化して、一対の前記複数のトランスジューサ素子の間に撓み構造体(270)として働くチャネルへの第1の開口(282)を含む、前記支持層の第2の側(284)を露出させ、
前記複数のトランスジューサ素子の第1の相互接続部(228、238)は、前記支持層の第1の側と第2の側との間に延び;及び
前記第2の側を、第1の表面の反対側に第2の表面を含む、柔軟な層(256)の前記第1の表面に結合し、
前記柔軟な層は、ポリマー材料を含み、かつ、前記第1の表面と第2の表面の間に延び第2の相互接続部(266、268)を含む、方法。 - 前記支持層は、35ミクロン以下の厚みに薄化される、請求項1に記載の方法。
- 前記ポリマー材料は、ポリイミドを含む、請求項1に記載の方法。
- 前記複数のトランスジューサ素子の各々に対して、
前記支持層の第1の側に第2の電極(234又は236)を形成し、
前記支持層に第3の相互接続部(238又は228)を形成して前記第2の電極に接続すること、を更に含む、請求項1に記載の方法。 - 前記支持層を薄化して、前記支持層の第2の側を露出させることは、前記複数のトランスジューサ素子の各々に対して、前記第1の相互接続部(228)と第2の開口(280a)を、前記支持層を貫通して延びるスパン空所に露出させることを含む、請求項1に記載の方法。
- 前記支持層の第2の側を、導電性フィラー(260)を含む接着材(258)を用いて結合して、前記第2の相互接続部(266、268)と第1の相互接続部(228、238)とを接続する、請求項1に記載の方法。
- 前記支持層の第2の側を、共融接合を用いて前記柔軟な層の第1の表面に結合する、請求項1に記載の方法。
- マイクロ加工のトランスジューサアレイにおいて、
支持層(201)の第1の側に配置された複数のトランスジューサ素子(214a、214b)を備え、該複数のトランスジューサ素子の各々は、
前記支持層の第1の側に配置された第1の電極(236又は234);
前記支持層の第1の側に配置された圧電素子(232);及び
前記第1の電極に結合された前記支持層における第1の相互接続部(228又は238);を含み、
前記複数のトランスジューサ素子の第1の相互接続部は、前記支持層の第1の側と、前記複数のトランスジューサ素子の対の間で撓み構造体(270)として働くチャネルへの第1の開口(282)を含む、第2の側との間に、延びており、及び、
前記複数のトランスジューサ素子の各々は、更に、
前記支持層の前記第2の側に結合された第1の表面を有し、ポリマー材料を含む柔軟な層(256)を含み、及び
前記柔軟な層は、該柔軟な層の前記第1の表面と柔軟な層の第2の表面の間に延びて、前記第1の相互接続部(228、238)に接続するための複数の第2の相互接続部(266、268)を含む、マイクロ加工のトランスジューサアレイ。 - 前記第1の側と第2の側との間の支持層の厚みは、35ミクロン以下である、請求項8に記載のマイクロ加工のトランスジューサアレイ。
- 前記柔軟な層は、前記第2の相互接続部(266、268)表面の間に延びて、前記第1の相互接続部に接続された前記柔軟な層の第2の表面上に接触部(262、264)を含み、かつ、前記第2の相互接続部は前記柔軟な層に沿って信号を横方向に搬送するための部分(290)を含む、請求項8に記載のマイクロ加工のトランスジューサアレイ。
- 前記ポリマー材料は、ポリイミドを含む、請求項8に記載のマイクロ加工のトランスジューサアレイ。
- 前記複数のトランスジューサ素子の各々は、
前記支持層の前記第1の側に配置された第2の電極(234又は236);
前記第2の電極(234又は236)接続された、前記支持層に配置された第3の相互接続部(238又は228)を含む、請求項8に記載のマイクロ加工のトランスジューサアレイ。 - 前記柔軟な層の前記第1の表面を前記支持層の前記第2の側に結合し、前記第2の相互接続部(266、268)と第1の相互接続部(228、238)の導電性フィラー(260)を含む、接着材(258)を含む、請求項8に記載のマイクロ加工のトランスジューサアレイ。
- 前記支持層の前記第2の側上のAu層と、共融接合を用いて前記Au層に接合するために前記柔軟な層の前記第1の表面のAuSn層と、を更に含む、請求項8に記載のマイクロ加工のトランスジューサアレイ。
- 媒体に圧力波を発生し及び感知する装置において、
請求項8から14のいずれかに記載のマイクロ加工のトランスジューサアレイ;
前記第1の電極である、少なくとも1つのドライブ/センス電極に電気的ドライブ信号を印加するために前記マイクロ加工のトランスジューサアレイに結合された発生手段;
前記少なくとも1つのドライブ/センス電極から電気的応答信号を受信するために前記マイクロ加工のトランスジューサアレイに結合された受信手段;及び
前記少なくとも1つのドライブ/センス電極から受信した電気的応答信号を処理するため前記受信手段に結合された信号処理手段;
を備えた装置。
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