JP7206198B2 - 表面が粗化された粒子を有するパッケージングされた半導体デバイス - Google Patents
表面が粗化された粒子を有するパッケージングされた半導体デバイス Download PDFInfo
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- JP7206198B2 JP7206198B2 JP2019536063A JP2019536063A JP7206198B2 JP 7206198 B2 JP7206198 B2 JP 7206198B2 JP 2019536063 A JP2019536063 A JP 2019536063A JP 2019536063 A JP2019536063 A JP 2019536063A JP 7206198 B2 JP7206198 B2 JP 7206198B2
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Description
Claims (20)
- パッケージングされた半導体デバイスであって、
リードフレームと、
半導体デバイスと、
前記リードフレームと前記半導体デバイス上の端子との間に結合されるはんだ接合と、
前記リードフレームの表面の一部上にあり、第1の粒子を含む第1のポリマーで構成される、粒子粗面化表面と、
前記半導体デバイスと前記リードフレームと前記粒子粗面化表面との一部を覆うモールディング化合物と、
を含む、パッケージングされた半導体デバイス。 - 請求項1に記載のパッケージングされた半導体デバイスであって、
前記第1のポリマーが、ポリイミドとエポキシとポリエステルポリマーとで構成される群から選択される、パッケージングされた半導体デバイス。 - 請求項1に記載のパッケージングされた半導体デバイスであって、
前記第1の粒子が非金属粒子である、パッケージングされた半導体デバイス。 - 請求項1に記載のパッケージングされた半導体デバイスであって、
前記粒子粗面化表面が、前記はんだ接合に隣接する前記リードフレームの表面の一部を覆う、パッケージングされた半導体デバイス。 - 請求項1に記載のパッケージングされた半導体デバイスであって、
はんだ接合を囲むリフロー壁であって、ポリイミドとエポキシとポリエステルとで構成される群から選択される第2のポリマーで構成される、前記リフロー壁を更に含む、パッケージングされた半導体デバイス。 - 請求項5に記載のパッケージングされた半導体デバイスであって、
前記リフロー壁が、前記はんだ接合の少なくとも対向する2つの側部上の前記はんだ接合を囲む、パッケージングされた半導体デバイス。 - 請求項5に記載のパッケージングされた半導体デバイスであって、
前記リフロー壁が前記はんだ接合を完全に囲む、パッケージングされた半導体デバイス。 - 請求項5に記載のパッケージングされた半導体デバイスであって、
前記第2のポリマーが第2の粒子を含む、パッケージングされた半導体デバイス。 - 請求項5に記載のパッケージングされた半導体デバイスであって、
前記はんだ接合の高さが、前記リフロー壁の高さと少なくとも同じ程度の高さである、パッケージングされた半導体デバイス。 - 請求項1に記載のパッケージングされた半導体デバイスであって、
パッケージングされた半導体デバイスの底部上の印刷回路基板はんだパッドを更に含む、パッケージングされた半導体デバイス。 - 請求項10に記載のパッケージングされた半導体デバイスであって、
前記印刷回路基板はんだパッドがはんだペーストである、パッケージングされた半導体デバイス。 - 請求項10に記載のパッケージングされた半導体デバイスであって、
前記印刷回路基板はんだパッドが、銀と銅とニッケルとパラジウムと白金とスズと金とそれらの合金とで構成される群から選択される金属で形成されるはんだ付け可能な粒子を含むはんだペーストである、パッケージングされた半導体デバイス。 - 請求項1に記載のパッケージングされた半導体デバイスであって、
前記はんだ接合と前記端子との間に結合される金属性ポストを更に含む、パッケージングされた半導体デバイス。 - パッケージングされた半導体デバイスであって、
リードフレームと、
半導体デバイスと、
前記リードフレームと前記半導体デバイス上の端子との間に結合されるはんだ接合と、
前記リードフレームの表面の一部上にあり、第1の粒子を含む第1のポリマーで構成される、粒子粗面化表面と、
前記はんだ接合を囲み、第2の粒子を含む第2のポリマーで構成されるリフロー壁と、
前記半導体デバイスと前記リードフレームと前記リフロー壁と前記粒子粗面化表面との一部を覆うモールディング化合物と、
を含む、パッケージングされた半導体デバイス。 - 請求項14に記載のパッケージングされた半導体デバイスであって、
前記第1のポリマーと前記第2のポリマーとが、ポリイミドとエポキシとポリエステルポリマーとで構成される群から選択される、パッケージングされた半導体デバイス。 - 請求項14に記載のパッケージングされた半導体デバイスであって、
前記第1のポリマーと前記第2のポリマーとが、ポリイミドとエポキシとポリエステルポリマーとで構成される群から選択され、前記第1及び第2の粒子が非金属粒子である、パッケージングされた半導体デバイス。 - 請求項14に記載のパッケージングされた半導体デバイスであって、
前記第1のポリマーと前記第2のポリマーとが同一のポリマーであり、前記第1の粒子と前記第2の粒子とが同一の非金属粒子である、パッケージングされた半導体デバイス。 - 請求項14に記載のパッケージングされた半導体デバイスであって、
前記第1のポリマーと前記第2のポリマーとが、ポリイミドとエポキシとポリエステルポリマーとで構成される群から選択され、前記第1の粒子が非金属粒子であり、前記第2の粒子が、銀と銅とニッケルとパラジウムと白金とスズと金とそれらの合金とで構成される群から選択されるはんだ付け可能な金属で構成される金属粒子である、パッケージングされた半導体デバイス。 - 請求項14に記載のパッケージングされた半導体デバイスであって、
前記リフロー壁が、前記はんだ接合の少なくとも2つの対向する側部を囲む、パッケージングされた半導体デバイス。 - 請求項14に記載のパッケージングされた半導体デバイスであって、
パッケージングされた半導体デバイスの底部上のはんだペーストで構成される印刷回路基板はんだパッドを更に含む、パッケージングされた半導体デバイス。
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US11264314B2 (en) | 2019-09-27 | 2022-03-01 | International Business Machines Corporation | Interconnection with side connection to substrate |
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