JP7172991B2 - 接着剤組成物及び構造体 - Google Patents
接着剤組成物及び構造体 Download PDFInfo
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- JP7172991B2 JP7172991B2 JP2019510051A JP2019510051A JP7172991B2 JP 7172991 B2 JP7172991 B2 JP 7172991B2 JP 2019510051 A JP2019510051 A JP 2019510051A JP 2019510051 A JP2019510051 A JP 2019510051A JP 7172991 B2 JP7172991 B2 JP 7172991B2
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
本実施形態の接着剤組成物は、(a)ウレタン結合を有する熱可塑性樹脂(以下、(a)成分ともいう)、(b)ラジカル重合性化合物(以下、(b)成分ともいう)、(c)ラジカル重合開始剤(以下、(c)成分ともいう)、(d)ポリウレタンビーズ(以下、(d)成分ともいう)、及び、(e)非導電性無機微粒子(以下、(e)成分ともいう)を含有する接着剤組成物である。本実施形態の接着剤組成物は、(f)導電粒子(以下、(f)成分ともいう)を更に含有していてもよい。本実施形態の接着剤組成物は、回路接続用接着剤組成物として好適に用いることができる。以下、各成分について説明する。
本実施形態で用いる(a)ウレタン結合を有する熱可塑性樹脂(以下、ポリウレタン樹脂と呼ぶ)は、例えば、ポリオールとジイソシアネート等のイソシアネート成分との反応により得ることができる。ポリウレタン樹脂の重量平均分子量としては、5,000~150,000が好ましく、10,000~80,000がより好ましい。この値が5,000以上であると、接着剤組成物をフィルム状で用いる場合にフィルム形成性が良好となる傾向があり、また150,000以下であると他の成分との相溶性が良好となる傾向がある。
(b)ラジカル重合性化合物は、ラジカル重合可能な官能基を有する化合物である。このようなラジカル重合性化合物としては、(メタ)アクリレート化合物、マレイミド化合物、シトラコンイミド樹脂、ナジイミド樹脂等が挙げられる。「(メタ)アクリレート化合物」とは、(メタ)アクリロイル基を有する化合物を意味する。ラジカル重合性化合物は、モノマー又はオリゴマーの状態で用いてもよく、モノマーとオリゴマーとを併用することもできる。ラジカル重合性化合物は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
(c)ラジカル重合開始剤としては、熱(加熱)により遊離ラジカルを発生する開始剤、光により遊離ラジカルを発生する開始剤、超音波、電磁波等により遊離ラジカルを発生する開始剤などを用いることができる。
本実施形態で用いる(d)ポリウレタンビーズは、架橋されたウレタン樹脂からなる球状の有機微粒子である。
(e)成分の非導電性無機微粒子としては、公知の非導電性無機微粒子を特に制限無く用いることができる。非導電性無機微粒子としては、例えば、シリカ微粒子、アルミナ微粒子、シリカ-アルミナ微粒子、チタニア微粒子、ジルコニア微粒子等の金属酸化物微粒子などの非導電性無機微粒子が挙げられる。これらは1種を単独で又は2種以上を混合して用いることができる。なお、本実施形態において、(e)非導電性無機微粒子は導電性を有さないものであり、後述する(f)導電粒子には属さないものである。
本実施形態の接着剤組成物は、(f)導電粒子を更に含有していてもよい。導電粒子の構成材料としては、金(Au)、銀(Ag)、ニッケル(Ni)、銅(Cu)、はんだ等の金属、カーボンなどが挙げられる。また、非導電性の樹脂、ガラス、セラミック、プラスチック等を核とし、この核に上記金属(金属粒子等)又はカーボンを被覆した被覆導電粒子でもよい。被覆導電粒子又は熱溶融金属粒子は、加熱加圧により変形性を有するため、接続時に回路電極の高さのばらつきを解消し、接続時に電極との接触面積が増加することから信頼性が向上するため好ましい。
本実施形態に係る接着剤組成物は、シランカップリング剤を含有していてもよい。シランカップリング剤は、好ましくは、下記式(2)で表される化合物である。
本実施形態の接着剤組成物は、必要に応じて、ハイドロキノン、メチルエーテルハイドロキノン類等の重合禁止剤を適宜含有してもよい。
本実施形態の構造体は、本実施形態の接着剤組成物又はその硬化物を備える。本実施形態の構造体は、例えば、回路接続構造体等の半導体装置である。本実施形態の構造体の一態様として、回路接続構造体は、第一の回路電極を有する第一の回路部材と、第二の回路電極を有する第二の回路部材と、第一の回路部材及び第二の回路部材の間に配置された回路接続部材と、を備える。第一の回路部材は、例えば、第一の基板と、当該第一の基板上に配置された第一の回路電極と、を有する。第二の回路部材は、例えば、第二の基板と、当該第二の基板上に配置された第二の回路電極と、を有する。第一の回路電極及び第二の回路電極は、相対向すると共に電気的に接続されている。回路接続部材は、本実施形態の接着剤組成物又はその硬化物を含んでいる。本実施形態に係る構造体は、本実施形態に係る接着剤組成物又はその硬化物を備えていればよく、上記回路接続構造体の回路部材に代えて、回路電極を有していない部材(基板等)を用いてもよい。
還流冷却器、温度計及び撹拌機を備えたセパラブルフラスコに、エーテル結合を有するジオールであるポリプロピレングリコール(和光純薬工業株式会社製、数平均分子量Mn=2000)1000質量部、及び、メチルエチルケトン(溶剤)4000質量部を加えた後、40℃で30分間撹拌して反応液を調製した。上記反応液を70℃まで昇温した後、ジメチル錫ラウレート(触媒)0.0127質量部を加えた。次いで、この反応液に対して、4,4’-ジフェニルメタンジイソシアネート125質量部をメチルエチルケトン125質量部に溶解して調製した溶液を、1時間かけて滴下した。その後、赤外分光光度計(日本分光株式会社製)によってイソシアネート基由来の吸収ピーク(2270cm-1)が見られなくなるまで上記温度で撹拌を続けて、ポリウレタンのメチルエチルケトン溶液を得た。次いで、この溶液の固形分濃度(ポリウレタンの濃度)が30質量%となるように溶剤量を調整した。得られたポリウレタン(ポリウレタン樹脂)の重量平均分子量は、GPC(ゲルパーミエーションクロマトグラフィー)による測定の結果、320000(標準ポリスチレン換算値)であった。GPCの測定条件を表1に示す。
温度計、撹拌機、不活性ガス導入口及び還流冷却器を装着した2L(リットル)の四つ口フラスコに、ポリカーボネートジオール(アルドリッチ社製、数平均分子量2000)4000質量部と、2-ヒドロキシエチルアクリレート238質量部と、ハイドロキノンモノメチルエーテル0.49質量部と、スズ系触媒4.9質量部とを仕込んで反応液を調製した。70℃に加熱した反応液に対して、イソホロンジイソシアネート(IPDI)666質量部を3時間かけて均一に滴下し、反応させた。滴下完了後、15時間反応を継続し、NCO%(NCO含有量)が0.2質量%以下となった時点を反応終了とみなし、ウレタンアクリレートを得た。NCO%は、電位差自動滴定装置(商品名:AT-510、京都電子工業株式会社製)によって確認した。GPCによる分析の結果、ウレタンアクリレートの重量平均分子量は8500(標準ポリスチレン換算値)であった。なお、GPCによる分析は、上記ポリウレタン樹脂の重量平均分子量の分析と同様の条件で行った。
ポリスチレン粒子の表面に厚さ0.2μmのニッケル層を形成した。更に、このニッケル層の外側に厚さ0.04μmの金層を形成させた。これにより、平均粒径4μmの導電粒子を作製した。
(フィルム状接着剤の作製)
表2に示す成分を、表2に示す質量比(固形分)で混合して混合物を得た。この混合物に上記導電粒子を1.5体積部の割合(基準:接着剤組成物の接着剤成分の全体積100体積部に対する割合)で分散させて、フィルム状接着剤を形成するための塗工液を得た。この塗工液を厚さ50μmのポリエチレンテレフタレート(PET)フィルムに、塗工装置を用いて塗布した。塗膜を70℃で10分熱風乾燥して、厚さ18μmのフィルム状接着剤を形成させた。
ポリウレタン樹脂:上記のとおり合成したポリウレタン樹脂を用いた。
フェノキシ樹脂:PKHC(ユニオンカーバイド株式会社製、商品名、重量平均分子量45000)40gをメチルエチルケトン60gに溶解して調製した40質量%溶液の形態で用いた。
ラジカル重合性化合物A:上記のとおり合成したウレタンアクリレートを用いた。
ラジカル重合性化合物B:イソシアヌル酸EO変性ジアクリレート(商品名:M-215、東亜合成株式会社製)を用いた。
ラジカル重合性化合物C(リン酸エステル):2-メタクリロイルオキシエチルアシッドフォスフェート(商品名:ライトエステルP-2M、共栄社化学株式会社製)を用いた。
過酸化物(ラジカル重合開始剤):1,1,3,3-テトラメチルブチルパーオキシ-2-エチルヘキサノエート(商品名:パーオクタO、日油株式会社製、1分間半減期温度:124.3℃)を用いた。
ポリウレタンビーズA:P-800T(根上工業株式会社製、商品名、平均粒子径:6μm、ガラス転移温度:-34℃)10gをメチルエチルケトン90gに分散した10質量%溶液の形態で用いた。
ポリウレタンビーズB:JB-800T(根上工業株式会社製、商品名、平均粒子径:6μm、ガラス転移温度:-52℃)10gをメチルエチルケトン90gに分散した10質量%溶液の形態で用いた。
シリカ微粒子(非導電性無機微粒子):R104(日本アエロジル株式会社製、商品名)10gをトルエン45g及び酢酸エチル45gの混合溶剤に分散させた10質量%の分散液の形態で用いた。
実施例1~7及び比較例1~4のフィルム状接着剤を用いて、ライン幅75μm、ピッチ150μm(スペース75μm)及び厚さ18μmの銅回路を2200本有するフレキシブル回路基板(FPC)と、ガラス基板、及び、ガラス基板上に形成された厚さ0.2μmの窒化珪素(SiNx)の薄層を有するSiNx基板(厚さ0.7mm)とを接続した。接続は、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用い、170℃、3MPaで5秒間の加熱及び加圧により行った。これにより、幅1.5mm及び幅1.0mmにわたりFPCとSiNx基板とがフィルム状接着剤の硬化物により接続された接続体(構造体)を作製した。加圧の圧力は、圧着面積を、幅1.5mmの場合は0.495cm2、幅1.0mmの場合は0.330cm2として計算した。
得られた接続体の接着強度を、JIS-Z0237に準じて90度剥離法で測定した。接着強度の測定装置として、テンシロンUTM-4(東洋ボールドウィン株式会社製、商品名、剥離強度50mm/min、25℃)を使用した。結果を表2に示す。
Claims (6)
- 前記(a)ウレタン結合を有する熱可塑性樹脂の含有量が、質量基準で、前記(d)ポリウレタンビーズの含有量以上である、請求項1に記載の接着剤組成物。
- (f)導電粒子を更に含有する、請求項1又は2に記載の接着剤組成物。
- 回路接続用である、請求項1~3のいずれか一項に記載の接着剤組成物。
- 請求項1~4のいずれか一項に記載の接着剤組成物又はその硬化物を備える、構造体。
- 第一の回路電極を有する第一の回路部材と、
第二の回路電極を有する第二の回路部材と、
前記第一の回路部材及び前記第二の回路部材の間に配置された回路接続部材と、を備え、
前記第一の回路電極及び前記第二の回路電極が電気的に接続されており、
前記回路接続部材が、請求項1~4のいずれか一項に記載の接着剤組成物又はその硬化物を含む、構造体。
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000040418A (ja) | 1998-07-22 | 2000-02-08 | Sony Chem Corp | 異方導電性接着フィルム |
JP2001323249A (ja) | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 回路接続用接着剤 |
JP2009277682A (ja) | 2008-05-12 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP2010157746A (ja) | 2010-01-27 | 2010-07-15 | Hitachi Chem Co Ltd | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
JP2011080033A (ja) | 2009-05-29 | 2011-04-21 | Hitachi Chem Co Ltd | 接着剤組成物、接着剤シート及び半導体装置の製造方法 |
JP2012140594A (ja) | 2010-12-31 | 2012-07-26 | Cheil Industries Inc | 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置 |
WO2013005831A1 (ja) | 2011-07-07 | 2013-01-10 | 日立化成工業株式会社 | 回路接続材料及び回路基板の接続構造体 |
JP2013181131A (ja) | 2012-03-02 | 2013-09-12 | Dexerials Corp | 回路接続材料、及びそれを用いた実装体の製造方法 |
JP2016189334A (ja) | 2010-12-29 | 2016-11-04 | チェイル インダストリーズ インコーポレイテッド | 異方導電性フィルム、これに含まれる異方導電性フィルム組成物およびこれを含む装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1036404C (zh) * | 1990-05-22 | 1997-11-12 | 中国兵器工业第五三研究所 | 聚氨酯互贯网络胶粘剂及制备方法 |
JP2006022231A (ja) | 2004-07-08 | 2006-01-26 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤および異方導電性接着剤フィルム |
KR100590820B1 (ko) * | 2005-10-17 | 2006-06-19 | 주식회사 에코세라 | 아스팔트-폴리우레탄 수지를 이용한 접착제 조성물 및 그제조방법 |
JP5023901B2 (ja) | 2007-05-23 | 2012-09-12 | 日立化成工業株式会社 | 接着剤組成物、回路接続構造体及び半導体装置 |
KR20100080628A (ko) | 2007-11-12 | 2010-07-09 | 히다치 가세고교 가부시끼가이샤 | 회로 접속 재료, 및 회로 부재의 접속 구조 |
CN101864266A (zh) * | 2010-05-18 | 2010-10-20 | 上海鼎道科技发展有限公司 | 一种用于玻璃与金属粘接的光固化粘合剂及其制备方法 |
-
2018
- 2018-03-28 CN CN201880021694.3A patent/CN110461984A/zh active Pending
- 2018-03-28 KR KR1020197030920A patent/KR102577181B1/ko active IP Right Grant
- 2018-03-28 WO PCT/JP2018/012994 patent/WO2018181589A1/ja active Application Filing
- 2018-03-28 JP JP2019510051A patent/JP7172991B2/ja active Active
- 2018-03-29 TW TW107110926A patent/TWI781158B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000040418A (ja) | 1998-07-22 | 2000-02-08 | Sony Chem Corp | 異方導電性接着フィルム |
JP2001323249A (ja) | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 回路接続用接着剤 |
JP2009277682A (ja) | 2008-05-12 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP2011080033A (ja) | 2009-05-29 | 2011-04-21 | Hitachi Chem Co Ltd | 接着剤組成物、接着剤シート及び半導体装置の製造方法 |
JP2010157746A (ja) | 2010-01-27 | 2010-07-15 | Hitachi Chem Co Ltd | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
JP2016189334A (ja) | 2010-12-29 | 2016-11-04 | チェイル インダストリーズ インコーポレイテッド | 異方導電性フィルム、これに含まれる異方導電性フィルム組成物およびこれを含む装置 |
JP2012140594A (ja) | 2010-12-31 | 2012-07-26 | Cheil Industries Inc | 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置 |
WO2013005831A1 (ja) | 2011-07-07 | 2013-01-10 | 日立化成工業株式会社 | 回路接続材料及び回路基板の接続構造体 |
JP2013181131A (ja) | 2012-03-02 | 2013-09-12 | Dexerials Corp | 回路接続材料、及びそれを用いた実装体の製造方法 |
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