JP7104531B2 - 基板保持装置および基板処理装置 - Google Patents
基板保持装置および基板処理装置 Download PDFInfo
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- JP7104531B2 JP7104531B2 JP2018051520A JP2018051520A JP7104531B2 JP 7104531 B2 JP7104531 B2 JP 7104531B2 JP 2018051520 A JP2018051520 A JP 2018051520A JP 2018051520 A JP2018051520 A JP 2018051520A JP 7104531 B2 JP7104531 B2 JP 7104531B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
Claims (8)
- 基板を保持する基板保持装置であって、
鉛直軸周りに回転し、上端から通じる吸引路を有する回転軸と、
回転中心に形成された吸気孔を有し、該吸気孔が前記吸引路に連通するように前記回転軸の上端に固定され、基板を吸引して保持する保持部と、
を有し、
前記保持部の前記回転中心に対して回転対称な位置に、該保持部に載置された前記基板の裏面を臨む角度で、該保持部と該基板との間の空間に外部の気体を導入するための複数の通気孔が形成されており、
前記複数の通気孔のそれぞれのサイズが、前記吸気孔のサイズより小さい、ことを特徴とする基板保持装置。 - 前記保持部は、
前記吸気孔が形成され前記回転軸の前記上端と接続される底壁部と、
前記底壁部の周縁から起立して前記基板を支持する外周壁部と、
前記底壁部から突出して前記基板を支持する複数の支持ピンと、
を有することを特徴とする請求項1に記載の基板保持装置。 - 前記複数の通気孔が、前記底壁部における前記周縁の近傍に形成されていることを特徴とする請求項2に記載の基板保持装置。
- 前記吸引路と気体を吸引する真空源との間の気体流路の開閉を行う開閉弁を有し、
前記開閉弁を開状態にすることで前記真空源により前記空間の気体を吸引して、前記複数の通気孔から前記空間に前記外部の気体を導入しながら前記基板を保持し、前記開閉弁を閉状態にすることにより、前記複数の通気孔から前記空間に前記外部の気体が導入されて前記基板の保持状態を解除する
ことを特徴とする請求項1乃至3のいずれか1項に記載の基板保持装置。 - 基板を保持する基板保持装置であって、
鉛直軸周りに回転し、上端から通じる吸引路を有する回転軸と、
回転中心に形成された吸気孔を有し、該吸気孔が前記吸引路に連通するように前記回転軸の上端に固定され、基板を吸引して保持する保持部と、
を有し、
前記保持部の前記回転中心に対して回転対称な位置に、該保持部に載置された前記基板の裏面を臨む角度で、該保持部と該基板との間の空間に外部の気体を導入するための複数の通気孔が形成されており、
前記吸引路と気体を吸引するための真空源との間の気体流路に設けられ、前記真空源からの吸引を行う吸引状態と大気開放状態とを切り換え可能な制御弁と、
前記吸引路に設けられ、前記空間への気体の流入を阻止する逆止弁と、
を有し、
前記制御弁を前記吸引状態にすることで前記真空源により前記空間の気体を吸引して、前記複数の通気孔から前記空間に前記外部の気体を導入しながら前記基板を保持し、前記制御弁を前記大気開放状態にすることにより前記真空源から前記逆止弁までの間を大気開放し、前記複数の通気孔から前記空間に前記外部の気体が導入されることにより前記基板の保持状態を解除する
ことを特徴とする基板保持装置。 - 前記複数の通気孔のコンダクタンスは、前記吸気孔のコンダクタンスの10%以下であることを特徴とする請求項1乃至5のいずれか1項に記載の基板保持装置。
- 前記基板保持装置は、前記回転軸により前記基板を回転させることにより該基板の回転の偏心成分を求める装置であることを特徴とする請求項1乃至5のいずれか1項に記載の基板保持装置。
- 基板を処理する基板処理装置であって、
請求項1乃至7のいずれか1項に記載の基板保持装置を有することを特徴とする基板処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018051520A JP7104531B2 (ja) | 2018-03-19 | 2018-03-19 | 基板保持装置および基板処理装置 |
US16/351,890 US10535548B2 (en) | 2018-03-19 | 2019-03-13 | Substrate holding apparatus and substrate processing apparatus |
KR1020190030335A KR102432591B1 (ko) | 2018-03-19 | 2019-03-18 | 기판 보유지지 장치 및 기판 처리 장치 |
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---|---|---|---|
JP2018051520A JP7104531B2 (ja) | 2018-03-19 | 2018-03-19 | 基板保持装置および基板処理装置 |
Publications (2)
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JP2019165092A JP2019165092A (ja) | 2019-09-26 |
JP7104531B2 true JP7104531B2 (ja) | 2022-07-21 |
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US (1) | US10535548B2 (ja) |
JP (1) | JP7104531B2 (ja) |
KR (1) | KR102432591B1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020036774A1 (en) | 2000-08-08 | 2002-03-28 | Emil Kamieniecki | Apparatus and method for handling and testing of wafers |
JP2002329769A (ja) | 2001-04-27 | 2002-11-15 | Lintec Corp | アライメント装置 |
JP2006093203A (ja) | 2004-09-21 | 2006-04-06 | Nitto Denko Corp | 円形平面基板の吸着支持装置 |
JP2006319093A (ja) | 2005-05-12 | 2006-11-24 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置 |
JP2013207128A (ja) | 2012-03-29 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | 基板保持装置、および、基板処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08172047A (ja) | 1994-12-19 | 1996-07-02 | Dainippon Screen Mfg Co Ltd | 基板の回転処理装置 |
JPH11170169A (ja) * | 1997-12-12 | 1999-06-29 | Toshiba Ceramics Co Ltd | 半導体ウェーハの製造方法およびその装置 |
US7019820B2 (en) * | 2003-12-16 | 2006-03-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US6897945B1 (en) * | 2003-12-15 | 2005-05-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7547181B2 (en) * | 2004-11-15 | 2009-06-16 | Dainippon Screen Mfg. Co., Ltd. | Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum |
KR100689843B1 (ko) * | 2006-01-03 | 2007-03-08 | 삼성전자주식회사 | 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법 |
JP4933948B2 (ja) | 2007-04-27 | 2012-05-16 | シャープ株式会社 | Led駆動回路及び発光装置 |
JP5867462B2 (ja) * | 2013-07-26 | 2016-02-24 | 東京エレクトロン株式会社 | 液処理装置 |
-
2018
- 2018-03-19 JP JP2018051520A patent/JP7104531B2/ja active Active
-
2019
- 2019-03-13 US US16/351,890 patent/US10535548B2/en active Active
- 2019-03-18 KR KR1020190030335A patent/KR102432591B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020036774A1 (en) | 2000-08-08 | 2002-03-28 | Emil Kamieniecki | Apparatus and method for handling and testing of wafers |
JP2002329769A (ja) | 2001-04-27 | 2002-11-15 | Lintec Corp | アライメント装置 |
JP2006093203A (ja) | 2004-09-21 | 2006-04-06 | Nitto Denko Corp | 円形平面基板の吸着支持装置 |
JP2006319093A (ja) | 2005-05-12 | 2006-11-24 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置 |
JP2013207128A (ja) | 2012-03-29 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | 基板保持装置、および、基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR102432591B1 (ko) | 2022-08-17 |
US10535548B2 (en) | 2020-01-14 |
JP2019165092A (ja) | 2019-09-26 |
KR20190110047A (ko) | 2019-09-27 |
US20190287842A1 (en) | 2019-09-19 |
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