JP7098157B2 - 温度計測装置、及び、体温計 - Google Patents
温度計測装置、及び、体温計 Download PDFInfo
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- JP7098157B2 JP7098157B2 JP2019124871A JP2019124871A JP7098157B2 JP 7098157 B2 JP7098157 B2 JP 7098157B2 JP 2019124871 A JP2019124871 A JP 2019124871A JP 2019124871 A JP2019124871 A JP 2019124871A JP 7098157 B2 JP7098157 B2 JP 7098157B2
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- sensor
- temperature measuring
- measuring device
- thin film
- temperature
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- 239000010408 film Substances 0.000 description 46
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- 230000001070 adhesive effect Effects 0.000 description 12
- 239000010410 layer Substances 0.000 description 10
- 230000004043 responsiveness Effects 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000009529 body temperature measurement Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 239000004642 Polyimide Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 229920001721 polyimide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Images
Description
本実施形態の温度計測装置において、接着剤97は支持体960よりも熱伝達率が低い。このため、接着剤97によりフィルム状装置と筐体92とを固定しても、センサ10が筐体92の温度の影響(外乱)を受け難くなる
20 配線部
80 電気回路部
91 回路基板
30 フィルム部材
92 筐体
Claims (1)
- センサ信号を出力するセンサと、
前記センサ信号を用いて演算を行い温度情報を出力する電気回路部と、
前記電気回路部が搭載された回路基板と、
一端側に前記センサが接続され、他端側に前記電気回路部が接続され、可撓性を有し、前記センサ信号を前記電気回路部に供給する可撓性部材と、
前記電気回路部と、前記回路基板とを収容する筐体と、
防湿性を有する防湿性部材とを有し、
前記可撓性部材は、前記一端側が前記筐体から露出し、前記他端側が前記筐体に収容され、
前記筐体は、前記可撓性部材の一方側の面に対向する第1面と、前記可撓性部材の他方側の面に対向する第2面と、前記可撓性部材の前記一端側に近づくほど前記第1面と前記第2面との間隔が狭くなるように窄んでいる部分である窄み部とを有し、
前記防湿性部材は、前記窄み部における前記第1面と前記第2面との間隔が最も狭くなる部分に備えられ、前記可撓性部材を前記筐体に固定している、温度計測装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2019124871A JP7098157B2 (ja) | 2019-07-04 | 2019-07-04 | 温度計測装置、及び、体温計 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2019124871A JP7098157B2 (ja) | 2019-07-04 | 2019-07-04 | 温度計測装置、及び、体温計 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018189413A Division JP6565014B1 (ja) | 2018-10-04 | 2018-10-04 | 温度計測装置、及び、体温計 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020060549A JP2020060549A (ja) | 2020-04-16 |
JP2020060549A5 JP2020060549A5 (ja) | 2021-09-09 |
JP7098157B2 true JP7098157B2 (ja) | 2022-07-11 |
Family
ID=70219667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019124871A Active JP7098157B2 (ja) | 2019-07-04 | 2019-07-04 | 温度計測装置、及び、体温計 |
Country Status (1)
Country | Link |
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JP (1) | JP7098157B2 (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6388415B2 (ja) | 2012-03-16 | 2018-09-12 | エム・テクニック株式会社 | 固体金ニッケル合金ナノ粒子及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS603531A (ja) * | 1983-06-22 | 1985-01-09 | Kyushu Hitachi Maxell Ltd | 体温計 |
JPS6388415A (ja) * | 1986-09-30 | 1988-04-19 | Toshiba Corp | 電子体温計 |
JPH07333073A (ja) * | 1994-06-07 | 1995-12-22 | Casio Comput Co Ltd | 温度センサおよびこれを用いた温度測定器 |
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2019
- 2019-07-04 JP JP2019124871A patent/JP7098157B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6388415B2 (ja) | 2012-03-16 | 2018-09-12 | エム・テクニック株式会社 | 固体金ニッケル合金ナノ粒子及びその製造方法 |
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JP2020060549A (ja) | 2020-04-16 |
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