JP7060210B2 - アレイ基板、表示装置およびアレイ基板の製造方法 - Google Patents
アレイ基板、表示装置およびアレイ基板の製造方法 Download PDFInfo
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Description
複数の第2薄膜トランジスタの各々は、第2活性層と、第2ゲート電極と、第2ソース電極と、第2ドレイン電極とを含み、
第2活性層は、第2半導体チャネル部と、第2ソース電極に電気的に接続された第3導電部と、第2ドレイン電極に電気的に接続された第4導電部とを備え、
ベース基板上の第2半導体チャネル部の正投影は、ベース基板上の第2ゲート電極の正投影と少なくとも部分的に重なっており、
複数のコンデンサ電極のうちの1つのコンデンサ電極は、第2ドレイン電極を介して複数の薄膜トランジスタのうちの1つの薄膜トランジスタの第1ゲート電極に電気的に接続される。
Claims (22)
- 複数のサブピクセル領域を有するアレイ基板であって、
ベース基板と、
前記ベース基板の前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ形成される複数の第1薄膜トランジスタと、
前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ形成される複数のコンデンサ電極と、
を備え
前記複数の第1薄膜トランジスタの各々は、第1活性層と、第1ゲート電極と、第1ソース電極と、第1ドレイン電極とを含み、
前記第1活性層は、第1半導体チャネル部と、前記第1ドレイン電極に電気的に接続される第1導電部と、前記第1ソース電極に電気的に接続される第2導電部と、を含み、
前記複数のコンデンサ電極の各々は、前記複数の第1薄膜トランジスタのうちの1つの薄膜トランジスタの第1ゲート電極に電気的に接続され、絶縁層によって前記第1活性層と絶縁され、
前記複数のコンデンサ電極の各々、前記絶縁層、および前記複数の第1薄膜トランジスタのうちの1つの薄膜トランジスタの前記第1導電部は、前記複数のサブピクセル領域のうちの1つに第1蓄積コンデンサを構成し、
前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ設けられる複数の第2薄膜トランジスタをさらに備え、
前記複数の第2薄膜トランジスタの各々は、第2活性層と、第2ゲート電極と、第2ソース電極と、第2ドレイン電極とを含み、
前記第2活性層は、第2半導体チャネル部と、前記第2ソース電極に電気的に接続された第3導電部と、前記第2ドレイン電極に電気的に接続された第4導電部とを備え、
前記ベース基板上の前記第2半導体チャネル部の正投影は、前記ベース基板上の前記第2ゲート電極の正投影と少なくとも部分的に重なっており、
前記複数のコンデンサ電極のうちの1つのコンデンサ電極は、前記第2ドレイン電極を介して前記複数の第1薄膜トランジスタのうちの1つの薄膜トランジスタの前記第1ゲート電極に電気的に接続される
ことを特徴とするアレイ基板。 - 請求項1に記載のアレイ基板において、
前記ベース基板上の前記第1半導体チャネル部の正投影は、前記ベース基板上の前記第1ゲート電極の正投影と少なくとも部分的に重なっており、
前記ベース基板上の複数のコンデンサ電極のうちの1つのコンデンサ電極の正投影は、前記ベース基板上の複数の第1薄膜トランジスタのうちの1つの薄膜トランジスタの第1導電部の正投影と少なくとも部分的に重なる
ことを特徴とするアレイ基板。 - 請求項2に記載のアレイ基板において、
ベース基板上の複数のコンデンサ電極のうちの1つのコンデンサ電極の正投影は、ベース基板上の複数の第1薄膜トランジスタのうちの1つの薄膜トランジスタの第1導電部の正投影と実質的に重なる
ことを特徴とするアレイ基板。 - 請求項1に記載のアレイ基板において、
前記第1導電部は、前記第2導電部よりも大きい面積を有する
ことを特徴とするアレイ基板。 - 請求項1に記載のアレイ基板において、
前記絶縁層は、前記第1活性層と前記第1ゲート電極との間、及び前記複数のコンデンサ電極と前記第1導電部との間のゲート絶縁層である
ことを特徴とするアレイ基板。 - 請求項5に記載のアレイ基板において、
前記ゲート絶縁層は、約1500Å~約2000Åの範囲の厚さを有する
ことを特徴とするアレイ基板。 - 請求項5に記載のアレイ基板において、
前記複数のコンデンサ電極と前記第1ゲート電極とは同一層に形成される
ことを特徴とするアレイ基板。 - 請求項5に記載のアレイ基板において、
前記複数の第1薄膜トランジスタの各々はトップゲート型の薄膜トランジスタであり、
前記ゲート絶縁層は、前記第1活性層の前記ベース基板から遠い側にあり、
前記第1ゲート電極は、前記ゲート絶縁層の前記第1活性層から遠い側にある
ことを特徴とするアレイ基板。 - 請求項1乃至8のいずれか1つに記載のアレイ基板において、
前記第1ゲート電極の前記ベース基板から遠い側に層間誘電体層をさらに備え、
前記第1ソース電極および前記第1ドレイン電極は、前記層間誘電体層の前記ベース基板から遠い側にあり、
前記複数のコンデンサ電極の各々、前記第1ドレイン電極及び前記層間誘電体層は、第2蓄積コンデンサを構成し、
複数のサブピクセル領域のうちの1つのサブピクセル領域に蓄積コンデンサを構成するように、前記第1蓄積コンデンサと前記第2蓄積コンデンサとが互いに並列に接続される
ことを特徴とするアレイ基板。 - 請求項9に記載のアレイ基板において、
前記層間誘電体層は、約5000Å~約7000Åの範囲の厚さを有する
ことを特徴とするアレイ基板。 - 請求項9に記載のアレイ基板において、
前記ベース基板上の前記第1ドレイン電極の正投影は、前記ベース基板上の前記複数のコンデンサ電極の1つのコンデンサ電極の正投影と少なくとも部分的に重なる
ことを特徴とするアレイ基板。 - 請求項11に記載のアレイ基板において、
前記ベース基板上の前記第1ドレイン電極の正投影は、前記ベース基板上の前記複数のコンデンサ電極のうちの1つのコンデンサ電極の正投影と実質的に重なる
ことを特徴とするアレイ基板。 - 請求項1に記載のアレイ基板において、
前記第1活性層は、前記第2活性層よりも大きい面積を有し、
前記第1活性層と前記第2活性層とは互いに絶縁される
ことを特徴とするアレイ基板。 - 請求項13に記載のアレイ基板において、
前記第1活性層と前記第2活性層は同一層にあり、互いに離間している
ことを特徴とするアレイ基板。 - 請求項14に記載のアレイ基板において、
前記第1活性層と前記第2活性層とは同一層にあり、
前記第1ゲート電極、前記第2ゲート電極、および前記複数のコンデンサ電極は同一層にあり、
前記第1ソース電極、前記第1ドレイン電極、前記第2ソース電極、および前記第2ドレイン電極は、同一層にある
ことを特徴とするアレイ基板。 - 請求項1乃至15のいずれか1項に記載のアレイ基板において、
前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ形成される複数の有機発光ダイオードをさらに備え、
前記複数の有機発光ダイオードの各々は、第1電極と、第2電極と、前記第1電極と前記第2電極との間の有機発光層とを含み、
前記第1電極は前記第1ドレイン電極に電気的に接続される
ことを特徴とするアレイ基板。 - 請求項1乃至16のいずれか1項に記載のアレイ基板を備える
ことを特徴とする表示装置。 - 複数のサブピクセル領域を有するアレイ基板を製造する方法であって、
前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ形成される複数の第1薄膜トランジスタをベース基板上に形成するステップと、
前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ複数のコンデンサ電極を形成するステップと、
前記複数の第1薄膜トランジスタの各々を形成するステップは、第1活性層を形成するステップと、第1ゲート電極を形成するステップと、第1ソース電極を形成するステップ
と、第1ドレイン電極を形成するステップとを含み、
前記第1活性層を形成するステップは、第1半導体チャネル部を形成するステップと、前記第1ドレイン電極に電気的に接続される第1導電部を形成するするステップと、前記第1ソース電極に電気的に接続される第2導電部を形成するするステップとを含み、
前記第1半導体チャネル部と前記第1ゲート電極は、前記ベース基板上の前記第1半導体チャネル部の正投影が、前記ベース基板上の前記第1ゲート電極の正投影と少なくとも部分的に重なるように形成され、
前記複数のコンデンサ電極の各々は、前記複数の第1薄膜トランジスタのうちの1つの薄膜トランジスタの第1ゲート電極に電気的に接続され、絶縁層によって前記第1活性層と絶縁されるように形成され、
前記複数のコンデンサ電極及び前記複数の第1薄膜トランジスタは、前記ベース基板上の前記複数のコンデンサ電極のうちの1つのコンデンサ電極の正投影が、前記ベース基板上の前記複数の第1薄膜トランジスタのうちの1つの第1薄膜トランジスタの前記第1導電部の正投影と少なくとも部分的に重なるように形成され、
前記複数のコンデンサ電極の各々、前記絶縁層、および前記複数の第1薄膜トランジスタのうちの1つの第1薄膜トランジスタの前記第1導電部は、前記複数のサブピクセル領域のうちの1つのサブピクセル領域に第1蓄積コンデンサを構成し、
前記複数のサブピクセル領域のうちのサブピクセル領域ごとにそれぞれ複数の第2薄膜トランジスタを形成するステップ、をさらに含み、
前記複数の第2薄膜トランジスタの各々を形成するステップは、第2活性層を形成するステップと、第2ゲート電極を形成するステップと、第2ソース電極を形成するステップと、第2ドレイン電極を形成するステップとを含み、
前記第2活性層を形成するステップは、第2半導体チャンネル部を形成するステップと、前記第2ソース電極に電気的に接続される第3導電部を形成するするステップと、前記第2ドレイン電極に電気的に接続される第4導電部を形成するステップとを含み、
前記複数のコンデンサ電極のうちの1つは、前記第2ドレイン電極を介して前記第1ゲート電極に電気的に接続されるように形成される
ことを特徴とするアレイ基板の製造方法。 - 請求項18に記載のアレイ基板の製造方法において、
前記第1活性層を形成するステップは、
前記ベース基板上に第1半導体材料層を形成するステップと、
第1半導体材料層の第1部分および第2部分に導電処理を施すことにより、前記第1導電部および前記第2導電部を形成するステップと、を含み、
第2半導体材料層の第1部分と第2部分との間にある第1半導体材料層の第3部分には実質的に導電処理を施さず、第1チャネル部が形成される
ことを特徴とするアレイ基板の製造方法。 - 請求項19に記載のアレイ基板の製造方法において、
前記導電処理は、プラズマを用いて行われる
ことを特徴とするアレイ基板の製造方法。 - 請求項18に記載のアレイ基板の製造方法において、
前記第2活性層を形成するステップは、
前記ベース基板上に第2半導体材料層を形成するステップと、
前記第2半導体材料層の第1部分および第2部分に導電処理を施すことにより、前記第3導電部および前記第4導電部を形成するステップと、を含み、
前記第2半導体材料層の前記第1部分と前記第2部分との間にある前記第2半導体材料層の第3部分には前記導電処理を実質的に施さず、第2チャネル部が形成される
ことを特徴とするアレイ基板の製造方法。 - 請求項21に記載のアレイ基板の製造方法において、
導電処理はプラズマを用いて行われる
ことを特徴とするアレイ基板の製造方法。
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