JP7053797B2 - フレキシブル回路基板およびその製造方法 - Google Patents
フレキシブル回路基板およびその製造方法 Download PDFInfo
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- JP7053797B2 JP7053797B2 JP2020509509A JP2020509509A JP7053797B2 JP 7053797 B2 JP7053797 B2 JP 7053797B2 JP 2020509509 A JP2020509509 A JP 2020509509A JP 2020509509 A JP2020509509 A JP 2020509509A JP 7053797 B2 JP7053797 B2 JP 7053797B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000010410 layer Substances 0.000 claims description 222
- 238000007747 plating Methods 0.000 claims description 193
- 239000004065 semiconductor Substances 0.000 claims description 66
- 239000011241 protective layer Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 27
- 239000011135 tin Substances 0.000 claims description 27
- 229910052718 tin Inorganic materials 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 description 32
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011344 liquid material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- -1 Polyethylene Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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- Parts Printed On Printed Circuit Boards (AREA)
Description
20 配線パターン
21,22 端子部
25 連結配線
30,31 第1メッキ層
35,55 中間メッキ層
40 保護層
50 第2メッキ層
100 受動素子実装部
110 受動素子
120 半導体素子
200 半導体素子実装部
Claims (15)
- 第1素子実装部と第2素子実装部が定義されたベースフィルムと、
前記ベースフィルム上に、前記第1素子実装部および前記第2素子実装部それぞれに延びて形成された配線パターンであり、前記配線パターンは前記第1素子実装部内の第1端子部と、前記第2素子実装部内の第2端子部、および前記第1端子部と前記第2端子部を連結する連結配線を含む配線パターンと、
前記第2端子部上に形成された第1メッキ層と、を含み、前記第1メッキ層は金属純メッキ層を含み、
前記第1端子部上には前記第1メッキ層が形成されず、
前記第1端子部上に形成された第2メッキ層をさらに有し、前記第2メッキ層は銅-金属合金層を含み、
前記配線パターン上に形成される保護層と、
前記保護層と前記連結配線との間に形成される中間メッキ層とを含み、
前記中間メッキ層は金属純メッキ層または銅-金属合金層を含む、フレキシブル回路基板。 - 前記配線パターンは銅を含む、請求項1に記載のフレキシブル回路基板。
- 前記第1メッキ層は、前記金属純メッキ層の下部に形成された銅-金属合金層をさらに含む、請求項1に記載のフレキシブル回路基板。
- 前記保護層は、前記連結配線を覆う、請求項1に記載のフレキシブル回路基板。
- 前記保護層の境界は、前記第1端子部の接合端子または前記第2端子部の接合端子から100μm以上離隔する、請求項4に記載のフレキシブル回路基板。
- 前記第1端子部上に形成されたソルダ、
前記ソルダと接合された第1素子、および
前記第2端子部と接合された第2素子をさらに含み、前記第2素子は前記配線パターンとフリップチップボンディング(flip chip bonding)される、請求項1に記載のフレキシブル回路基板。 - 前記第1素子は受動素子を含み、
前記第2素子は半導体素子を含む、請求項6に記載のフレキシブル回路基板。 - 前記金属純メッキ層は、スズ、金、パラジウム、ニッケル、クロムのうち少なくとも一つ以上を含む、請求項1に記載のフレキシブル回路基板。
- 第1素子実装部と第2素子実装部が定義されたベースフィルムを提供し、
前記ベースフィルム上に、前記第1素子実装部と前記第2素子実装部それぞれに延びる配線パターンを形成し、前記配線パターンは前記第1素子実装部内の第1端子部と、前記第2素子実装部内の第2端子部、および前記第1端子部と前記第2端子部を連結する連結配線を含み、
前記第2端子部上に金属純メッキ層を含む第1メッキ層を形成し、
前記第1端子部上にソルダにより接合された第1素子をリフロー(reflow)して実装し、
前記第2端子部上に半導体素子を実装することを含み、
前記第1端子部上に第2メッキ層を形成することをさらに含み、前記第2メッキ層は銅-金属合金層を含み、
前記連結配線上に、中間メッキ層を形成し、
前記中間メッキ層は金属純メッキ層または銅-金属合金層を含み、
前記配線パターン上に保護層を形成する、フレキシブル回路基板の製造方法。 - 前記第1メッキ層を形成することは、前記第1端子部および前記第2端子部以外の前記配線パターン上にも前記第1メッキ層を形成することをさらに含む、請求項9に記載のフレキシブル回路基板の製造方法。
- 前記第1素子をリフローして実装することは、前記第1素子実装部に対して局所熱処理することを含む、請求項9に記載のフレキシブル回路基板の製造方法。
- 前記第1素子実装部に対して局所熱処理することは、熱風、レーザー、光、ホットプレートのうちいずれか一つを利用して熱処理することを含む、請求項11に記載のフレキシブル回路基板の製造方法。
- 前記第1メッキ層を形成した後に前記配線パターン上に前記保護層を形成することをさらに含む、請求項9に記載のフレキシブル回路基板の製造方法。
- 前記第1メッキ層を形成することは、前記配線パターン上に前記保護層を形成した以後に形成することを含む、請求項13に記載のフレキシブル回路基板の製造方法。
- 前記第2端子部上に前記第1メッキ層を形成することは、
前記第2端子部を覆う銅-金属合金層上に前記第1メッキ層を形成することを含む、請求項9に記載のフレキシブル回路基板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170106694A KR102123813B1 (ko) | 2017-08-23 | 2017-08-23 | 연성 회로 기판 및 그 제조 방법 |
KR10-2017-0106694 | 2017-08-23 | ||
PCT/KR2018/009671 WO2019039867A1 (ko) | 2017-08-23 | 2018-08-22 | 연성 회로 기판 및 그 제조 방법 |
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JP2020532115A JP2020532115A (ja) | 2020-11-05 |
JP7053797B2 true JP7053797B2 (ja) | 2022-04-12 |
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JP2020509509A Active JP7053797B2 (ja) | 2017-08-23 | 2018-08-22 | フレキシブル回路基板およびその製造方法 |
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Country | Link |
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US (1) | US11197377B2 (ja) |
JP (1) | JP7053797B2 (ja) |
KR (1) | KR102123813B1 (ja) |
CN (1) | CN111034374A (ja) |
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---|---|---|---|---|
KR20210044342A (ko) | 2019-10-14 | 2021-04-23 | 삼성디스플레이 주식회사 | 회로기판의 제조 방법 및 이를 포함한 표시장치 |
TWI705748B (zh) * | 2019-11-21 | 2020-09-21 | 頎邦科技股份有限公司 | 雙面銅之軟性電路板及其佈線結構 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183720A (ja) | 2003-12-19 | 2005-07-07 | Brother Ind Ltd | 素子実装基板の製造方法及びプリント基板 |
JP2007266196A (ja) | 2006-03-28 | 2007-10-11 | Dainippon Printing Co Ltd | 多層プリント配線板及びその製造方法 |
JP2009111307A (ja) | 2007-11-01 | 2009-05-21 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
JP2011233915A (ja) | 2011-07-06 | 2011-11-17 | Panasonic Corp | 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3231225B2 (ja) * | 1995-09-18 | 2001-11-19 | アルプス電気株式会社 | プリント配線基板 |
JP2004158595A (ja) * | 2002-11-06 | 2004-06-03 | Sanyo Electric Co Ltd | 回路装置、回路モジュールおよび回路装置の製造方法 |
JP2004237624A (ja) * | 2003-02-06 | 2004-08-26 | Sony Corp | インク吐出ヘッド及びインク吐出ヘッドの製造方法 |
US7271461B2 (en) * | 2004-02-27 | 2007-09-18 | Banpil Photonics | Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
JP4150977B2 (ja) * | 2004-09-30 | 2008-09-17 | 株式会社村田製作所 | 差動伝送路の配線パターン構造 |
KR20070041032A (ko) * | 2005-10-13 | 2007-04-18 | 삼성전자주식회사 | 인쇄 회로 기판 및 이를 포함하는 액정 표시 장치 |
US8040681B2 (en) * | 2006-09-05 | 2011-10-18 | Atmel Corporation | Circuit arrangement |
CN102612265B (zh) * | 2007-11-01 | 2016-05-11 | 大日本印刷株式会社 | 内置元件电路板、内置元件电路板的制造方法 |
DE102008024480A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
KR101116283B1 (ko) * | 2009-10-23 | 2012-03-12 | 스템코 주식회사 | 연성 회로 기판, 그 제조 방법 및 그를 포함한 반도체 패키지 및 그 제조 방법 |
KR101136395B1 (ko) * | 2010-05-28 | 2012-04-18 | 엘지이노텍 주식회사 | 매립형 인쇄회로기판 및 그 제조방법 |
JP2012160310A (ja) * | 2011-01-31 | 2012-08-23 | Fujitsu Component Ltd | 表面実装部品及び製造方法 |
JP2013145847A (ja) * | 2012-01-16 | 2013-07-25 | Sumitomo Electric Printed Circuit Inc | プリント配線板及び該プリント配線板の製造方法 |
WO2013153717A1 (ja) * | 2012-04-12 | 2013-10-17 | 日本電気株式会社 | 電子機器及びその製造方法 |
JP5754464B2 (ja) * | 2013-05-21 | 2015-07-29 | 株式会社村田製作所 | モジュールおよびその製造方法 |
JP5466785B1 (ja) * | 2013-08-12 | 2014-04-09 | 太陽誘電株式会社 | 回路モジュール及びその製造方法 |
TWI566343B (zh) * | 2015-10-15 | 2017-01-11 | 力成科技股份有限公司 | 保護片服貼於晶片感應面之晶片封裝構造 |
KR20170045948A (ko) * | 2015-10-20 | 2017-04-28 | 삼성전자주식회사 | 휨 영역을 가지는 인쇄회로기판 |
US20180317317A1 (en) * | 2015-10-21 | 2018-11-01 | Sharp Kabushiki Kaisha | Glass wired substrate and power module |
US9673148B2 (en) * | 2015-11-03 | 2017-06-06 | Dyi-chung Hu | System in package |
US10159152B2 (en) * | 2015-12-21 | 2018-12-18 | Intel Corporation | Development of the advanced component in cavity technology |
-
2017
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183720A (ja) | 2003-12-19 | 2005-07-07 | Brother Ind Ltd | 素子実装基板の製造方法及びプリント基板 |
JP2007266196A (ja) | 2006-03-28 | 2007-10-11 | Dainippon Printing Co Ltd | 多層プリント配線板及びその製造方法 |
JP2009111307A (ja) | 2007-11-01 | 2009-05-21 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
JP2011233915A (ja) | 2011-07-06 | 2011-11-17 | Panasonic Corp | 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法 |
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JP2020532115A (ja) | 2020-11-05 |
TWI693866B (zh) | 2020-05-11 |
CN111034374A (zh) | 2020-04-17 |
KR102123813B1 (ko) | 2020-06-18 |
US11197377B2 (en) | 2021-12-07 |
US20200196453A1 (en) | 2020-06-18 |
TW201914379A (zh) | 2019-04-01 |
KR20190021670A (ko) | 2019-03-06 |
WO2019039867A1 (ko) | 2019-02-28 |
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