JP7018779B2 - 基板搬送装置および基板処理システム - Google Patents
基板搬送装置および基板処理システム Download PDFInfo
- Publication number
- JP7018779B2 JP7018779B2 JP2018023070A JP2018023070A JP7018779B2 JP 7018779 B2 JP7018779 B2 JP 7018779B2 JP 2018023070 A JP2018023070 A JP 2018023070A JP 2018023070 A JP2018023070 A JP 2018023070A JP 7018779 B2 JP7018779 B2 JP 7018779B2
- Authority
- JP
- Japan
- Prior art keywords
- connection unit
- substrate
- stage
- foup
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
図1は、基板処理システム10の構成の一例を概略的に示す平面図である。図1では、便宜的に内部の構成要素が透過するように図示されている。
図2は、実施例1におけるLM16の構成の一例を概略的に示す正面図である。図3は、実施例1においてLM16とそれぞれの接続ユニット20との位置関係の一例を概略的に示す図である。
図4は、実施例1における接続ユニット20の動きの一例を示す図である。OHT30によって接続ユニット20にFOUP40が載置される場合、当該接続ユニット20の上方に接続ユニット20が配置されない面169が形成されるように、他の接続ユニット20の位置が制御される。例えば、最下段の右から2個目の接続ユニット20aにFOUP40が載置される場合、例えば図4に示されるように、上から3段目までのそれぞれの段において、右から1個目の接続ユニット20が最も右の位置となるように移動される。また、右から2個目および3個目の接続ユニット20は、隣接して左側に位置するように移動される。これにより、接続ユニット20aの上方に、接続ユニット20が配置されない面169が形成され、OHT30は、接続ユニット20aにFOUP40を直接載置することができる。処理後のウエハが収容されたFOUP40が、OHT30によって接続ユニット20aから回収される場合も同様である。
図5は、接続ユニット20の構成の一例を概略的に示す正面図である。図6は、接続ユニット20の構成の一例を概略的に示す側面図である。図7および図8は、接続ユニット20の構成の一例を概略的に示す斜視図である。図9は、LM16側の接続ユニット20の構成の一例を概略的に示す斜視図である。
図13は、実施例2におけるそれぞれの接続ユニット20の動きの一例を示す図である。図13を参照して、最も左側の列の最下段の接続ユニット20に未処理のウエハが収容されたFOUP40が載置される場合を例に、それぞれの接続ユニット20の動きを説明する。
[その他]
なお、本開示は、上記した実施例に限定されるものではなく、その要旨の範囲内で数々の変形が可能である。
100 制御装置
11 処理ユニット
12 TM
13 搬送ロボット
14 PM
15 LLM
16 LM
160 搬送ロボット
161 レール
162 FFU
163 筐体
164 排気装置
165 ガイド
167 シールベルト
168 巻取部
169 面
20 接続ユニット
200 列
201 フレーム
21 フレーム
22 扉
23 ステージ
24 基台
25 移動機構
26 開口
27 アーム
28 アーム
29 内側フレーム
30 OHT
32 レール
40 FOUP
42 ガイド軸
50 搬送機構
51 把持部
52 フレーム
53 レール
55 待機台
Claims (8)
- 複数の被処理基板を収容する容器が複数接続され、複数の処理装置のいずれかに搬送される前記被処理基板をそれぞれの前記容器から搬出する基板搬送装置において、
複数の前記処理装置のいずれかに搬送される前記被処理基板をそれぞれの前記容器から取り出すアームが配置される搬送室と、
前記搬送室の1つの側面に沿って、上下方向および横方向に並べて配置され、それぞれの前記容器が接続される複数の接続ユニットと、
複数の前記接続ユニットの少なくとも1つを、横方向に移動させる移動機構と
を備え、
それぞれの前記接続ユニットは、
上面に前記容器が載置されるステージと、
前記ステージ上に載置された前記容器と前記搬送室との間に設けられ、前記容器内から前記アームが被処理基板を取り出すための開口が設けられたフレームと、
前記フレームの前記開口を開閉する扉と
を有することを特徴とする基板搬送装置。 - 複数の前記接続ユニットは、
前記搬送室の1つの側面に沿って、上下方向に複数段配置され、
最下段より上のそれぞれの段に配置される前記接続ユニットの数は、最下段に配置される前記接続ユニットの数よりも少ないことを特徴とする請求項1に記載の基板搬送装置。 - 最下段の前記接続ユニットは、前記搬送室に固定されており、
最下段より上のそれぞれの段に配置される前記接続ユニットは、前記移動機構により横方向に移動することを特徴とする請求項2に記載の基板搬送装置。 - 複数の前記接続ユニットは、前記搬送室の1つの側面に沿って、横方向に複数列配置され、
それぞれの前記列には、複数の前記接続ユニットが含まれ、
少なくとも1つの前記列に含まれる複数の前記接続ユニットは、前記移動機構により前記列毎に一体となって横方向に移動することを特徴とする請求項1に記載の基板搬送装置。 - 前記移動機構による前記接続ユニットの移動により空きスペースとなった前記搬送室の前記側面を覆うカバー部材をさらに備えることを特徴とする請求項1から4のいずれか一項に記載の基板搬送装置。
- 前記搬送室内は、大気圧よりも高い圧力であることを特徴とする請求項1から5のいずれか一項に記載の基板搬送装置。
- 前記接続ユニットの数は、前記処理装置の数よりも多いことを特徴とする請求項1から6のいずれか一項に記載の基板搬送装置。
- 被処理基板を処理する複数の処理装置と、
複数の前記被処理基板を収容する容器が複数接続され、複数の前記処理装置のいずれかに搬送される前記被処理基板をそれぞれの前記容器から搬出する基板搬送装置と
を備え、
前記基板搬送装置は、
複数の前記処理装置のいずれかに搬送される前記被処理基板をそれぞれの前記容器から取り出すアームが配置される搬送室と、
前記搬送室の1つの側面に沿って、上下方向および横方向に並べて配置され、それぞれの前記容器が接続される複数の接続ユニットと、
複数の前記接続ユニットの少なくとも1つを、横方向に移動させる移動機構と
を備え、
それぞれの前記接続ユニットは、
上面に前記容器が載置されるステージと、
前記ステージ上に載置された前記容器と前記搬送室との間に設けられ、前記容器内から前記アームが被処理基板を取り出すための開口が設けられたフレームと、
前記フレームの前記開口を開閉する扉と
を有することを特徴とする基板処理システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018023070A JP7018779B2 (ja) | 2018-02-13 | 2018-02-13 | 基板搬送装置および基板処理システム |
KR1020190013602A KR102165706B1 (ko) | 2018-02-13 | 2019-02-01 | 기판 반송 장치 및 기판 처리 시스템 |
US16/272,150 US10811289B2 (en) | 2018-02-13 | 2019-02-11 | Substrate transfer apparatus and substrate processing system comprising plural connection units arranged side by side in a vertical and lateral directions along one side surface of a transfer chamber |
CN201910111384.7A CN110164794B (zh) | 2018-02-13 | 2019-02-12 | 基板输送装置和基板处理*** |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018023070A JP7018779B2 (ja) | 2018-02-13 | 2018-02-13 | 基板搬送装置および基板処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019140275A JP2019140275A (ja) | 2019-08-22 |
JP7018779B2 true JP7018779B2 (ja) | 2022-02-14 |
Family
ID=67540222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018023070A Active JP7018779B2 (ja) | 2018-02-13 | 2018-02-13 | 基板搬送装置および基板処理システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US10811289B2 (ja) |
JP (1) | JP7018779B2 (ja) |
KR (1) | KR102165706B1 (ja) |
CN (1) | CN110164794B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11574510B2 (en) | 2020-03-30 | 2023-02-07 | Innova Electronics Corporation | Multi-functional automotive diagnostic tablet with interchangeable function-specific cartridges |
US11967189B2 (en) | 2020-04-20 | 2024-04-23 | Innova Electronics Corporation | Router for communicating vehicle data to a vehicle resource |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113644005A (zh) * | 2020-05-11 | 2021-11-12 | 中微半导体设备(上海)股份有限公司 | 一种半导体处理*** |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002531941A (ja) | 1998-12-01 | 2002-09-24 | アプライド マテリアルズ インコーポレイテッド | カセットを移動及び貯蔵する装置 |
JP2011233930A (ja) | 2007-09-20 | 2011-11-17 | Tokyo Electron Ltd | 基板の処理装置 |
JP2012138615A (ja) | 2004-07-29 | 2012-07-19 | Kla-Encor Corp | 自動材料ハンドリングシステムの材料加工の間における処理量低減装置及び方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4697192B2 (ja) * | 2007-06-12 | 2011-06-08 | 東京エレクトロン株式会社 | 位置ずれ検出装置及びこれを用いた処理システム |
JP5369419B2 (ja) * | 2007-10-18 | 2013-12-18 | 村田機械株式会社 | 保管庫、保管庫セット及び保管庫付き搬送システム |
JP5212165B2 (ja) * | 2009-02-20 | 2013-06-19 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6006509B2 (ja) | 2012-03-08 | 2016-10-12 | 武蔵エンジニアリング株式会社 | 液体定量吐出装置および塗布装置 |
JP6235294B2 (ja) * | 2013-10-07 | 2017-11-22 | 東京エレクトロン株式会社 | 基板搬送室及び容器接続機構 |
-
2018
- 2018-02-13 JP JP2018023070A patent/JP7018779B2/ja active Active
-
2019
- 2019-02-01 KR KR1020190013602A patent/KR102165706B1/ko active IP Right Grant
- 2019-02-11 US US16/272,150 patent/US10811289B2/en active Active
- 2019-02-12 CN CN201910111384.7A patent/CN110164794B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002531941A (ja) | 1998-12-01 | 2002-09-24 | アプライド マテリアルズ インコーポレイテッド | カセットを移動及び貯蔵する装置 |
JP2012138615A (ja) | 2004-07-29 | 2012-07-19 | Kla-Encor Corp | 自動材料ハンドリングシステムの材料加工の間における処理量低減装置及び方法 |
JP2011233930A (ja) | 2007-09-20 | 2011-11-17 | Tokyo Electron Ltd | 基板の処理装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11574510B2 (en) | 2020-03-30 | 2023-02-07 | Innova Electronics Corporation | Multi-functional automotive diagnostic tablet with interchangeable function-specific cartridges |
US11967189B2 (en) | 2020-04-20 | 2024-04-23 | Innova Electronics Corporation | Router for communicating vehicle data to a vehicle resource |
Also Published As
Publication number | Publication date |
---|---|
US20190252225A1 (en) | 2019-08-15 |
KR102165706B1 (ko) | 2020-10-14 |
CN110164794A (zh) | 2019-08-23 |
JP2019140275A (ja) | 2019-08-22 |
CN110164794B (zh) | 2023-04-18 |
US10811289B2 (en) | 2020-10-20 |
KR20190098056A (ko) | 2019-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11227784B2 (en) | Thin plate substrate-holding device and transfer robot provided with this holding device | |
JP5134575B2 (ja) | マルチ−チャンバーシステムで半導体素子を製造する方法 | |
JP7018779B2 (ja) | 基板搬送装置および基板処理システム | |
US6120229A (en) | Substrate carrier as batchloader | |
KR20090094054A (ko) | 기판 처리 장치, 기판 처리 방법 및, 컴퓨터 판독 가능 기억 매체 | |
KR20070006213A (ko) | 반도체 소자 제조 장치 및 방법 | |
JPH04190840A (ja) | 真空処理装置 | |
US8794896B2 (en) | Vacuum processing apparatus and zonal airflow generating unit | |
KR100819114B1 (ko) | 기판 이송 로봇 및 이를 포함하는 기판 가공 장치 | |
TW202144143A (zh) | 機器人以及包括機器人的基板運送系統 | |
KR20040098329A (ko) | 반도체 기판을 컨테이너로부터 언로딩하는 이송장치 및이송방법 | |
JP2018170347A (ja) | ウェハー搬送装置及びウェハー搬送方法 | |
US20150340260A1 (en) | Wafer transport system and method for operating the same | |
US11862506B2 (en) | Substrate processing system, vacuum substrate transfer module, and substrate transfer method | |
KR100612421B1 (ko) | 기판 이송 시스템 | |
JP5465979B2 (ja) | 半導体製造装置 | |
JP2004119627A (ja) | 半導体製造装置 | |
KR20200093222A (ko) | 웨이퍼 이송 장치 | |
JP7209503B2 (ja) | 基板処理装置および基板処理方法 | |
KR20230017993A (ko) | 인덱스 모듈 및 이를 구비하는 기판 처리 시스템 | |
KR100648279B1 (ko) | 웨이퍼 이송 모듈 및 상기 모듈에서 웨이퍼를 이송하는 방법 | |
JP2023124368A (ja) | 半導体製造装置、ウェハ搬送システム、ウェハ搬送方法、及びウェハ搬送プログラム | |
TW202345274A (zh) | 工件加工設備 | |
KR20230067075A (ko) | 기판 처리 장치 및 이를 포함하는 반도체 제조 설비 | |
JP5491579B6 (ja) | マルチ−チャンバーシステムで半導体素子を製造する方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201020 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20211007 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211019 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211210 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220201 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7018779 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |