JP7014367B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP7014367B2 JP7014367B2 JP2016225073A JP2016225073A JP7014367B2 JP 7014367 B2 JP7014367 B2 JP 7014367B2 JP 2016225073 A JP2016225073 A JP 2016225073A JP 2016225073 A JP2016225073 A JP 2016225073A JP 7014367 B2 JP7014367 B2 JP 7014367B2
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- pattern
- optical
- optical module
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (5)
- 同軸型のハウジング、及び前記ハウジングの側面から光軸に沿った方向に延び出す複数のリードピンを有する光サブアセンブリと、
前記光サブアセンブリと電気信号の送受信を行う回路を主面上に搭載し、前記主面が前記光軸に平行に配置された回路基板と、
裏面に接地パターン、表面に信号配線をそれぞれ備え、前記裏面で前記光サブアセンブリの前記側面と前記回路基板の前記主面を接続し、前記光サブアセンブリの前記ハウジングの前記側面の端部において屈曲するフレキシブルプリント基板(FPC)を備え、
前記FPCは、前記裏面の前記屈曲する部分に前記接地パターンが設けられない抜きパターンを有し、前記表面の前記屈曲する部分と前記接地パターンに電気的に接続される前記複数のリードピンのうち、前記抜きパターンに最も近い第1のリードピンとの間に、前記第1のリードピンと電気的に接続される金属パターンを有する、
光モジュール。 - 前記FPCは、前記表面の前記金属パターンと前記裏面の接地パターンを接続する複数の貫通孔を有する、
請求項1に記載の光モジュール。 - 前記貫通孔には金属が充填されている、
請求項2に記載の光モジュール。 - 前記FPCは、前記裏面の前記抜きパターンに空孔を有する、
請求項1~3のいずれか一項に記載の光モジュール。 - 前記金属パターンは、前記屈曲する部分よりも前記光サブアセンブリ側に設けられる、
請求項1~4のいずれか一項に記載の光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016225073A JP7014367B2 (ja) | 2016-11-18 | 2016-11-18 | 光モジュール |
CN201711135757.1A CN108072943A (zh) | 2016-11-18 | 2017-11-16 | 光学模块 |
US15/815,841 US10243659B2 (en) | 2016-11-18 | 2017-11-17 | Optical transceiver providing flexible printed circuit board connecting optical module with circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016225073A JP7014367B2 (ja) | 2016-11-18 | 2016-11-18 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018082117A JP2018082117A (ja) | 2018-05-24 |
JP7014367B2 true JP7014367B2 (ja) | 2022-02-01 |
Family
ID=62147941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016225073A Active JP7014367B2 (ja) | 2016-11-18 | 2016-11-18 | 光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US10243659B2 (ja) |
JP (1) | JP7014367B2 (ja) |
CN (1) | CN108072943A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10852493B2 (en) * | 2018-08-03 | 2020-12-01 | Lumentum Japan, Inc. | Optical subassembly and optical module |
JP7457497B2 (ja) | 2019-12-20 | 2024-03-28 | CIG Photonics Japan株式会社 | 光モジュール |
CN115693385A (zh) | 2021-07-29 | 2023-02-03 | 住友电气工业株式会社 | 光模块以及光模块的制造方法 |
US20230115731A1 (en) * | 2021-10-13 | 2023-04-13 | Electronics And Telecommunications Research Institute | Optical submodule |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004088020A (ja) | 2002-08-29 | 2004-03-18 | Toshiba Corp | フレキシブルプリント基板及び該基板を備えた電子機器 |
US20050185882A1 (en) | 2004-02-02 | 2005-08-25 | Jds Uniphase Corporation | Compact optical sub-assembly with ceramic package |
JP2007043496A (ja) | 2005-08-03 | 2007-02-15 | Sumitomo Electric Ind Ltd | 光トランシーバ |
JP2007067380A (ja) | 2005-08-04 | 2007-03-15 | Nec Electronics Corp | フレキシブル基板付き光モジュール |
JP2007123428A (ja) | 2005-10-26 | 2007-05-17 | Nec Electronics Corp | フレキシブル基板 |
JP2007281012A (ja) | 2006-04-03 | 2007-10-25 | Nec Electronics Corp | フレキシブル基板及び該フレキシブル基板が実装された実装機器 |
JP2008263122A (ja) | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | 光モジュール装置 |
JP2009105157A (ja) | 2007-10-22 | 2009-05-14 | Sumitomo Electric Ind Ltd | 光トランシーバ |
JP2009177030A (ja) | 2008-01-25 | 2009-08-06 | Opnext Japan Inc | 光送信モジュール及び光伝送装置 |
JP2009252918A (ja) | 2008-04-04 | 2009-10-29 | Sumitomo Electric Ind Ltd | 光データリンク |
JP2009302438A (ja) | 2008-06-17 | 2009-12-24 | Opnext Japan Inc | 光半導体装置 |
CN102436042A (zh) | 2011-10-28 | 2012-05-02 | 江苏奥雷光电有限公司 | 一种灵活耦合的高速光电器件 |
US20120207437A1 (en) | 2011-02-10 | 2012-08-16 | Electronics And Telecommunications Research Institute | Optical module |
JP2013197274A (ja) | 2012-03-19 | 2013-09-30 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュール |
US20140099123A1 (en) | 2012-10-08 | 2014-04-10 | Electronics And Telecommunications Research Institute | Flexible printed circuit board and optical communication module including the same |
JP2015204398A (ja) | 2014-04-15 | 2015-11-16 | 日本オクラロ株式会社 | 光モジュール |
JP2016018862A (ja) | 2014-07-07 | 2016-02-01 | 日本オクラロ株式会社 | 光モジュール及び光モジュールの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS593567U (ja) * | 1982-06-29 | 1984-01-11 | 松下電器産業株式会社 | 両面フレキシブルプリント基板 |
JPH046218Y2 (ja) * | 1985-02-01 | 1992-02-20 | ||
JP2007123740A (ja) | 2005-10-31 | 2007-05-17 | Sony Corp | フレキシブル基板、光送受信モジュール及び光送受信装置 |
JP2007281145A (ja) | 2006-04-05 | 2007-10-25 | Kenwood Corp | フレキシブル配線体 |
EP2456005B1 (en) | 2009-07-13 | 2014-12-17 | Murata Manufacturing Co., Ltd. | Signal line and circuit board |
CN202033497U (zh) * | 2011-03-31 | 2011-11-09 | 索尔思光电(成都)有限公司 | 一种csfp光收发模块 |
JP2014149498A (ja) | 2013-02-04 | 2014-08-21 | Sumitomo Electric Ind Ltd | 光モジュール |
KR102088973B1 (ko) * | 2015-09-17 | 2020-03-13 | 한국전자통신연구원 | 광 모듈용 플렉서블 인쇄회로기판 |
-
2016
- 2016-11-18 JP JP2016225073A patent/JP7014367B2/ja active Active
-
2017
- 2017-11-16 CN CN201711135757.1A patent/CN108072943A/zh active Pending
- 2017-11-17 US US15/815,841 patent/US10243659B2/en active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004088020A (ja) | 2002-08-29 | 2004-03-18 | Toshiba Corp | フレキシブルプリント基板及び該基板を備えた電子機器 |
US20050185882A1 (en) | 2004-02-02 | 2005-08-25 | Jds Uniphase Corporation | Compact optical sub-assembly with ceramic package |
JP2007043496A (ja) | 2005-08-03 | 2007-02-15 | Sumitomo Electric Ind Ltd | 光トランシーバ |
JP2007067380A (ja) | 2005-08-04 | 2007-03-15 | Nec Electronics Corp | フレキシブル基板付き光モジュール |
JP2007123428A (ja) | 2005-10-26 | 2007-05-17 | Nec Electronics Corp | フレキシブル基板 |
JP2007281012A (ja) | 2006-04-03 | 2007-10-25 | Nec Electronics Corp | フレキシブル基板及び該フレキシブル基板が実装された実装機器 |
JP2008263122A (ja) | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | 光モジュール装置 |
JP2009105157A (ja) | 2007-10-22 | 2009-05-14 | Sumitomo Electric Ind Ltd | 光トランシーバ |
JP2009177030A (ja) | 2008-01-25 | 2009-08-06 | Opnext Japan Inc | 光送信モジュール及び光伝送装置 |
JP2009252918A (ja) | 2008-04-04 | 2009-10-29 | Sumitomo Electric Ind Ltd | 光データリンク |
JP2009302438A (ja) | 2008-06-17 | 2009-12-24 | Opnext Japan Inc | 光半導体装置 |
US20120207437A1 (en) | 2011-02-10 | 2012-08-16 | Electronics And Telecommunications Research Institute | Optical module |
CN102436042A (zh) | 2011-10-28 | 2012-05-02 | 江苏奥雷光电有限公司 | 一种灵活耦合的高速光电器件 |
JP2013197274A (ja) | 2012-03-19 | 2013-09-30 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュール |
US20140099123A1 (en) | 2012-10-08 | 2014-04-10 | Electronics And Telecommunications Research Institute | Flexible printed circuit board and optical communication module including the same |
JP2015204398A (ja) | 2014-04-15 | 2015-11-16 | 日本オクラロ株式会社 | 光モジュール |
JP2016018862A (ja) | 2014-07-07 | 2016-02-01 | 日本オクラロ株式会社 | 光モジュール及び光モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US10243659B2 (en) | 2019-03-26 |
JP2018082117A (ja) | 2018-05-24 |
CN108072943A (zh) | 2018-05-25 |
US20180145759A1 (en) | 2018-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7014367B2 (ja) | 光モジュール | |
US9093792B2 (en) | Connector and signal transmission method using the same | |
US20160218455A1 (en) | Hybrid electrical connector for high-frequency signals | |
TWI728527B (zh) | 用於高頻信號之混合式電連接器,相關的堆疊式連接器,及使用其之系統 | |
US9431768B1 (en) | Electrical connector having resonance control | |
JP4825390B2 (ja) | 高速コネクタと回路基板との間の相互接続 | |
JP5780148B2 (ja) | 光送受信器、及び光送受信器の製造方法 | |
JP4852442B2 (ja) | 光送信モジュール | |
JP4816007B2 (ja) | フレキシブル基板用コネクタ、基板接続構造、光送受信モジュール及び光送受信装置 | |
US9577386B2 (en) | Pin cadence for high-speed connectors | |
KR101512816B1 (ko) | 플렉시블 인쇄회로기판 및 이를 포함하는 광통신 모듈 | |
US8545234B2 (en) | Electrical connector for a pluggable transceiver module | |
JP2022132319A (ja) | 光モジュール及び光伝送装置 | |
JP6452327B2 (ja) | 光モジュール | |
US10314162B1 (en) | Apparatuses and methods for improved network connections | |
JP2009004460A (ja) | 光通信モジュールおよび配線パタンの形成方法 | |
WO2016151562A1 (en) | Hybrid electrical connector for high-frequency signals | |
JP2009252918A (ja) | 光データリンク | |
US20150255935A1 (en) | Communication Module and Communication Module Connector | |
US20200052797A1 (en) | Optical transmitter | |
JP6223671B2 (ja) | 光モジュール | |
US9405082B2 (en) | OSA cage with reinforced connection to PCB | |
JP6216902B2 (ja) | 光モジュール | |
CN107924076B (zh) | 带有fpc的光调制器及使用其的光发送装置 | |
JP6424385B2 (ja) | フレキシブルプリント基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20191021 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200916 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201223 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210601 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210727 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20211221 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220107 |