JP7009819B2 - 伸縮性配線基板、及びその製造方法 - Google Patents
伸縮性配線基板、及びその製造方法 Download PDFInfo
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- JP7009819B2 JP7009819B2 JP2017148386A JP2017148386A JP7009819B2 JP 7009819 B2 JP7009819 B2 JP 7009819B2 JP 2017148386 A JP2017148386 A JP 2017148386A JP 2017148386 A JP2017148386 A JP 2017148386A JP 7009819 B2 JP7009819 B2 JP 7009819B2
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- Prior art keywords
- meth
- base material
- acrylate
- elastic
- metal foil
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims description 102
- 229910052751 metal Inorganic materials 0.000 claims description 83
- 239000002184 metal Substances 0.000 claims description 80
- 239000011888 foil Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 238000011084 recovery Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 121
- -1 aromatic vinyl compound Chemical class 0.000 description 50
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- 239000007822 coupling agent Substances 0.000 description 15
- 229920001971 elastomer Polymers 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 13
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 13
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- 125000003118 aryl group Chemical group 0.000 description 7
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
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- 239000005020 polyethylene terephthalate Substances 0.000 description 3
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- 238000012545 processing Methods 0.000 description 3
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
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- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
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Description
Claims (5)
- 長尺の伸縮性基材と該伸縮性基材上に積層された金属箔とを有する金属箔付基材をその長手方向に沿って搬送しながら、前記金属箔の一部を除去することにより、前記伸縮性基材の長手方向に沿って前記伸縮性基材の両端部上にそれぞれ延在する2つのガイド部とそれら2つのガイド部の間に形成された配線パターンとを含む金属箔パターンを形成させる工程を備え、
前記伸縮性基材の、歪み20%まで引張変形した後の回復率が80%以上である、
伸縮性配線基板を製造する方法。 - 前記金属箔パターンを形成させる前記工程が、
前記金属箔上に感光性フィルムを積層することと、
前記感光性フィルムを露光及び現像して、エッチングレジストを形成させることと、
前記エッチングレジストをマスクとして前記金属箔をエッチングすることにより、前記金属箔の一部を除去することとを含む、
請求項1に記載の方法。 - 長尺の前記伸縮性基材上に前記金属箔を積層する、又は、長尺の前記金属箔上に前記伸縮性基材を形成させることにより、前記金属箔付基材を形成させる工程を更に備える、請求項1又は2に記載の方法。
- 前記金属箔パターン及び前記伸縮性基材を有する長尺の伸縮性配線基板をロール状に巻き取る工程を更に備える、請求項1~3のいずれか一項に記載の方法。
- 長尺の伸縮性基材と、該伸縮性基材上に積層された金属箔パターンと、を備え、
前記金属箔パターンが、前記伸縮性基材の長手方向に沿って前記伸縮性基材の両端部上にそれぞれ延在する2つのガイド部と、それら2つのガイド部の間に形成された配線パターンと、を含み、
前記伸縮性基材の、歪み20%まで引張変形した後の回復率が80%以上である、
伸縮性配線基板。
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JP2000223795A (ja) | 1999-02-03 | 2000-08-11 | Casio Comput Co Ltd | フレキシブル配線基板及びその製造方法 |
JP2005101168A (ja) | 2003-09-24 | 2005-04-14 | Seiko Epson Corp | 配線基板の製造方法、エッチング装置並びに配線基板の製造装置 |
WO2016080346A1 (ja) | 2014-11-18 | 2016-05-26 | 日立化成株式会社 | 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物 |
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JP2000223795A (ja) | 1999-02-03 | 2000-08-11 | Casio Comput Co Ltd | フレキシブル配線基板及びその製造方法 |
JP2005101168A (ja) | 2003-09-24 | 2005-04-14 | Seiko Epson Corp | 配線基板の製造方法、エッチング装置並びに配線基板の製造装置 |
WO2016080346A1 (ja) | 2014-11-18 | 2016-05-26 | 日立化成株式会社 | 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物 |
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